CN108336040A - Chip flush mounting - Google Patents
Chip flush mounting Download PDFInfo
- Publication number
- CN108336040A CN108336040A CN201710044666.0A CN201710044666A CN108336040A CN 108336040 A CN108336040 A CN 108336040A CN 201710044666 A CN201710044666 A CN 201710044666A CN 108336040 A CN108336040 A CN 108336040A
- Authority
- CN
- China
- Prior art keywords
- chip
- control unit
- flush mounting
- thermal component
- hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 17
- 239000000758 substrate Substances 0.000 claims description 31
- 239000004065 semiconductor Substances 0.000 claims description 14
- 230000001788 irregular Effects 0.000 claims description 4
- 239000004020 conductor Substances 0.000 claims description 2
- 239000000306 component Substances 0.000 description 22
- 230000003287 optical effect Effects 0.000 description 10
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 description 8
- 241000218202 Coptis Species 0.000 description 5
- 235000002991 Coptis groenlandica Nutrition 0.000 description 5
- 239000000463 material Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 230000007246 mechanism Effects 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 206010037660 Pyrexia Diseases 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 230000006870 function Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000001360 synchronised effect Effects 0.000 description 2
- 241000883990 Flabellum Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 239000008358 core component Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000011120 plywood Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
- 230000000392 somatic effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/12—Mountings, e.g. non-detachable insulating substrates
- H01L23/13—Mountings, e.g. non-detachable insulating substrates characterised by the shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49175—Parallel arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Semiconductor Lasers (AREA)
Abstract
The present invention proposes a kind of chip flush mounting, including：Support member, for carrying chip；Thermal component, the heat loss for being used for generating chip；Control unit, for controlling chip operation；It is provided with hole in the control unit, chip is embedded into described hole and is connected with thermal component, thermal component plays the role of support member at this time, to make device realize small and high heat dissipation.Small size, high heat dissipation and low-power consumption may be implemented, so as to be integrated into miniature computing device in the chip flush mounting of the present invention.
Description
Technical field
The present invention relates to electronics and optical component manufacturing field more particularly to a kind of chip flush mountings.
Background technology
The depth information that depth camera can obtain target realizes 3D scannings, scene modeling, gesture interaction whereby, and current
The RGB camera being widely used is compared, and depth camera is just gradually paid attention to by all trades and professions.Such as utilize depth camera and electricity
It is combined depending on, computer etc. and somatic sensation television game may be implemented to achieve the effect that game and body-building is two-in-one.In addition, the tango projects of Google
It is dedicated to bringing depth camera into mobile device, such as tablet, mobile phone, brings the usage experience overturned completely with this, such as can be with
It realizes very true AR game experiencings, it can be used to carry out the functions such as indoor map establishment, navigation.
Core component in depth camera is laser projection module, and with the continuous extension of application, optical projection module will
It constantly evolves in smaller and smaller volume and higher and higher performance.Usually, optical projection module is by circuit board, light source
Equal components composition, vertical cavity surface emitting laser (VCSEL) array light source of wafer current grade size make optical projection module
Volume can be reduced to and be embedded in the small electronic equipments such as mobile phone.Usually, VSCEL is produced on semiconductor substrate
On, and semiconductor substrate and flexible PCB (FPC) are attached, in order to solve heat dissipation problem, it may be incorporated into semiconductor
Refrigerator (TEC).TEC can be very good to control light source fever, but since the power consumption of itself is higher, and occupy larger
Volume so that the volume and power consumption of the optical projection module of this form are still undesirable.
In addition to the laser projection module in depth camera, in the field that other chips are combined with circuit board, also the same face
Face the problem of volume is with heat dissipation.
Invention content
The problem of volume when being combined with circuit board the purpose of the present invention is to solve prior art chips and heat dissipation,
It proposes a kind of chip flush mounting, the problem of volume is with heat dissipation can be taken into account simultaneously.
The chip flush mounting of the present invention, including：Support member, for carrying chip；Thermal component, for producing chip
Raw heat loss；Control unit, for controlling chip operation；It is characterized in that, being provided with hole, chip in the control unit
It is embedded into described hole and is connected with thermal component, thermal component plays the role of support member at this time, to make
Device realizes small and high heat dissipation.
Preferably, the thermal component is provided with groove, and the chip is embedded into the hole of the control unit and places
In the groove, connected with thermal component.
Preferably, the thermal component is connect with the control unit, and covers the hole in the control unit.
Preferably, the control unit is circuit board, by accessing electrode to the chip power supply or the control chip.
Preferably, the circuit board is one kind or group of flexible PCB, hard circuit board and rigid-flexible circuit board
It closes.
Preferably, the also conductive energy of the thermal component, the chip are connect with thermal component conductive and heat-conductive；It is described
Chip is conductively connected with the control unit；The thermal component is conductively connected with control unit.
Preferably, the control unit around hole be equipped with multiple pads, using conductor wire by the pad with it is described
Chip and/or the thermal component are attached.
Preferably, the size of the chip is less than the size of hole, has gap between the chip and the control unit.
Preferably, the chip is located at the center of described hole.
Preferably, the chip includes：Semiconductor substrate；At least one VCSEL light source, is arranged in an array manner
In the semiconductor substrate.
Preferably, the VCSEL light source array includes regular array or irregular array.
Compared with prior art, beneficial effects of the present invention have：
The present invention carries chip flush mounting, is embedded by opening up hole on control unit, and by chip, Ke Yichong
Divide the overall volume for reducing device, while chip is in direct contact with thermal component and connect, thermal component plays support chip simultaneously
Effect, ensure offer to chip radiates to greatest extent.Compared with prior art, chip flush mounting of the invention can be real
Existing small size, high heat dissipation and low-power consumption, so as to be integrated into miniature computing device.
Description of the drawings
Fig. 1 is the side view of the depth camera system in the specific embodiment of the invention.
Fig. 2 is the side view of the optical projection module in the specific embodiment of the invention.
Fig. 3 is the structural schematic diagram of the vertical cavity surface laser emitter in the specific embodiment of the invention.
Fig. 4 is the VCSEL chip front views in the specific embodiment of the invention.
Fig. 5 is the chip flush mounting schematic diagram of the embodiment of the present invention 1.
Fig. 6 is the chip flush mounting front view of the embodiment of the present invention 2 and embodiment 3.
Fig. 7 is the chip flush mounting side view of the embodiment of the present invention 4.
Fig. 8 is the chip flush mounting side view of the embodiment of the present invention 5.
Specific implementation mode
The present invention is described in detail by specific embodiment below in conjunction with the accompanying drawings, for a better understanding of this hair
It is bright, but following embodiments are not intended to limit the scope of the invention.
The present invention proposes a kind of perfect heat-dissipating and small chip flush mounting.It will be with depth in explanation below
It is illustrated for the projection module of degree camera, but is not meant to that this scheme is only capable of applying in depth camera, Ren Heqi
Every direct or indirect utilization program is intended to be included in protection scope of the present invention in his device.
Depth camera
Depth camera side schematic view shown in FIG. 1 based on structure light.10 main building block of depth camera has laser
Module 13, acquisition module 14, mainboard 12 and processor 11 are projected, RGB camera 16 is further provided in some depth cameras.Swash
Light projection module 13, acquisition module 14 and RGB camera 16 are generally mounted in the same depth camera plane, and in same
One baseline, each module or camera correspond to a light portal 17.Usually, processor 11 is integrated on mainboard 12,
And laser projection module 13 is connect by interface 15 with mainboard with collection model 14, the interface is in one embodiment
FPC interfaces.Wherein, laser projection module is for projecting encoded structured light patterns, collection model acquisition into object space
By the processing of processor to obtain the depth image of object space after to the structure light image.In one embodiment, it ties
Structure light image is infrared speckle pattern, and pattern is relatively uniform with distribution of particles but with very high local irrelevance, here
Local irrelevance refer in pattern that each sub-regions all have higher uniqueness.Corresponding acquisition module 14 is to correspond to
Infrared camera.
The chief component of depth camera based on time flight method principle (TOF) is also projection module and acquisition mould
Group, it projects module for emitting the light pulse clocked, acquisition module acquisition unlike the depth camera of structure light principle
Can be obtained by the flight time of light in space after to the light pulse, recycle processor calculate corresponding spatial point away from
From.
Depth camera single at present is mostly to pass through the data-interfaces such as USB as independent peripheral hardware since volume is larger
With the information such as the depth for connecting, and being obtained such as other equipment such as computer, mobile phone be transferred to other equipment carry out it is further
Processing.It is more and more extensive with the application of depth camera, depth camera and other equipment are integrated, integrates and will be future
Developing direction.The mainboard, processor and computer cell phone etc. of depth camera can be set at the integrated aspect of mainboard and processor
Standby mainboard, processor are integrated；In the integrated aspect of acquisition module and laser projection module, at present large scale equipments such as computer
There is relevant scheme, however for micromodule equipments such as mobile phones, only small laser projection module can just be met the requirements, separately
Outside since the power consumption of laser projection is larger, fever is more, possessing higher thermal diffusivity is also highly desirable.The weight of the present invention
Point will propose a kind of chip flush mounting that can be used in depth camera projection module possessing high-cooling property and small size,
But it is not limited to depth camera.Next laser projection module is described in detail in scheme according to an embodiment of the invention.
Laser projection module
Fig. 2 is a kind of embodiment of laser projection module 13 in Fig. 1.The projection module 13 include pedestal 131, light source 132,
Upper and lower microscope base 133 and 134, lens 135 and diffraction optical element (DOE) 136.The light beam that light source 132 is sent out is accurate through lens 135
Emitted from DOE136 into space after straight, usually lens 135 are between light source 132 and diffraction optical element 136, lens
The distance between 135 and light source 132 are preferably equal to the focal length of lens.Lens can also be integrated into DOE in other embodiments
One optical element.Can be connected through a screw thread between upper and lower microscope base can also be in direct contact connection, and preceding kind of mode is conveniently adjusted
Focal length, then kind mode, which is adjusted, is more troublesome, but optical axis can also be adjusted other than it can focus.131 1 side of pedestal
Face requires enough hardness to support light source, has on the other hand also needed to higher thermal diffusivity.
The size of the volume influence entire depth camera of laser projection module, and the wherein size of light source 132 and pedestal 131
It is then an important factor for influencing laser projection modular volume.In the selection of light source, vertical cavity surface laser emitter (VCSEL) is gathered around
Have the advantages that small, the light source angle of departure is small, the good light source that can be used as projection module of stability is to reduce whole body
Product.Next VCSEL and its array chip are illustrated first, secondly the embedded equipment of itself and pedestal 131 is explained
It states.
VCSEL array
Fig. 3 is the structural schematic diagram of single VCSEL.In figure 3,301 be single VCSEL, and usually, VCSEL's is active
Layer 305 is in centre, and what is connect with active layer is limiting layer 306, and the effect of limiting layer is for controlling light field and electric current to realize
There is the semiconductor mirror 304 and 307 of p-type and N-type at control to laser shape etc., active layer both ends, speculum 307 it is another
Side is top electrodes 308 (poles P, anode), and the side of speculum 304 is semiconductor substrate 303 and bottom electrode 302 respectively
(poles N, cathode).
Shown in Fig. 4 is VCSEL array schematic diagram.When application requirement is not achieved in power of single VCSEL light source etc., lead to
It crosses multiple VCSEL403 being arranged in an array manner in the same semiconductor substrate 402 and can improve light source power, in addition
Manufacture efficiency can also be greatly improved by manufacturing multiple VCSEL light sources simultaneously in the same semiconductor substrate.VCSEL array chip
401 can reach the scale of wafer scale at present, you can in 1mm2Chip on arrange hundreds and thousands of a VCSEL light sources.To light
The control in source can have a different patterns, and all VCSEL light sources are in synchronized control opening and close on chip, alternatively, chip
On VCSEL by independent or grouping control to generate different illumination density.In some embodiments, using the first pattern,
That is VCSEL light source all on chip is in synchronized control opening and closes.In further embodiments, second of mould may be used
Formula, i.e. VCSEL on chip are by independent or grouping control to generate different illumination density.
The form of VCSEL403 and arrangement according to specific application demand can there are many, such as be uniformly regularly arranged or
Person carries out irregular alignment with certain uncorrelated pattern.The shape of single VCSEL, area can not also be identical.Formal
Randomization can bring the reduction of manufacture efficiency.In some embodiments, VCSEL403 is uniformly regularly arranged serves as a contrast in semiconductor
On bottom 402, in further embodiments, according to specific application demand, VCSEL403 is irregular with certain uncorrelated pattern
It is arranged in semiconductor substrate 402.
In some embodiments, VCSEL chips can also be packaged by special purposes, be similar to the CPU etc. of computer
Positive and negative anodes are connect in the same side with the external world by chip by being connected to pin.For depth camera embodiment of the present invention
For, it is small due to requiring, thus preferably processing mode is directly to be placed in unencapsulated VCSEL semiconductor slice chips
On pedestal 131.Usually, the bottom cathode connection of chip, the connection of top anode.Core will be sliced with VCSEL in the following description
It is illustrated for piece, it will be appreciated that encapsulation chip is also contained in protection scope of the present invention.
Chip flush mounting
Chip has been required for carrying and bindiny mechanism, to ensure the normal function of chip.Such as its promising independence of computer CPU
The bite type of design connects and fixed mechanism；For the little special chip of some calorific values, it can directly pass through pin and mainboard
It is connected directly；And for chip of the present invention, generally there is higher calorific value, and need firm fixed dress
It sets.For VCSEL array chip due to being for emitting light beam, needing larger power, calorific value is larger, further needs exist for being integrated
Into the micromodule equipment of small volume, heat dissipation problem needs to solve；On the other hand, for depth camera, laser projection mould
The relative position of group requires to consolidate very much, to ensure to have stable, accurate depth image to export.Therefore, VCSEL array chip
Carrying and bindiny mechanism require not only to possess small volume in order to integrated, but also need preferable heat dissipation performance and firm
Connection.
The chip flush mounting of the present invention, including support member, for carrying chip；Thermal component, for producing chip
Raw heat loss；Control unit, for controlling chip operation, the pedestal 131 in Fig. 2 is for carrying and connecting VCSEL
Array chip, in the following embodiments, pedestal 131 is configured to chip flush mounting 501 as shown in figures 5-8.Following
In embodiment 1-5, chip is specially VCSEL chips 506；Control unit is specifically circuit board 503, is connect by its interface 504
Enter electrode to power or control VCSEL chips 506；Support member and thermal component are specially the same component, i.e. substrate 502.
The chip flush mounting of the present invention is described in detail by specific embodiment below in conjunction with the accompanying drawings, so that preferably reason
The solution present invention, but following embodiments are not intended to limit the scope of the invention.
Embodiment 1
In the present embodiment, pedestal 131 is configured to chip flush mounting 501 as shown in Figure 5.In the present embodiment,
Chip is specially VCSEL chips 506；Control unit is specifically circuit board 503, and electrode is accessed to power by its interface 504
Or control VCSEL chips 506；Support member and thermal component are specially the same component, i.e. substrate 502, for placing and holding
Chip is carried, and is connect with chip and plays the role of heat dissipation and/or electrode connection, common material is gold-plated, ceramic etc. for copper.
The device can be easily attached with other control units such as mainboard, and can steadily support chip.
In the present embodiment, in order to reduce whole volume, what is taken is the shape for increasing hole among circuit board 503
Formula, substrate 502 are glued with circuit board 503, and cover hole (usually, being overlapped among hole center and circuit board 502),
Then chip is placed in hole and is connect with substrate.This set be advantageous in that can take into account simultaneously circuit board and chip it
Between connection and integral thickness control.
Embodiment 2
Chip flush mounting 501 in the present embodiment, as shown in fig. 6, circuit board 503 is flexible PCB (FPC), base
Bottom 502 be copper gilding, VCSEL chips are located at hole center, and are connect with substrate 502 by conductive silver paste, substrate 502 and
Circuit board 503 is glued.Some pads 505 are arranged around the hole of FPC, pad 505 is connect by circuit with interface 504.
In figure 6, positive terminal pad is connect by gold thread 507 with VCSEL chips apex electrode 506, and negative terminal pad is direct by gold thread 508
It is connect with substrate 502, since substrate is connected with the bottom electrode of chip by conductive silver paste, thus is also achieved that pad and bottom
Portion's electrode is indirectly connected with.In addition, since VCSEL chips are connect with substrate 502, and substrate has good thermal conductivity, therefore
The heat dissipation problem of VCSEL chips is also resolved.
Embodiment 3
In the present embodiment, pass through physical connection, such as bolt etc. between circuit board 503 and substrate 502.If utilizing glue
Connection, advantage are to be not take up space, simple operation, but the disadvantage is that the resistance due to glue is larger, thus are unfavorable for radiating, meeting
Increase power consumption.Specific connection type does not limit herein.
Embodiment 4
In the present embodiment, circuit board 503 is the combination of printed circuit board (PCB) and flexible PCB (FPC), i.e., soft or hard
Combined circuit plate, compared with FPC, PCB hardness is high, and load-carrying properties are preferable, but connects then more difficult.Therefore, in this implementation
In example, use the mode that the two combines, i.e., position FPC where interface, and use soft or hard knot at the position being connect with substrate
Plywood.In other embodiments, circuit board 503 can be all using printed circuit board (PCB).
The connection of circuit board and chip and substrate, more clearly visible Fig. 7.In the figure 7, circuit board 503 passes through gold thread 507
It is connect respectively with chip 506 and substrate 502 with 508.Usually, the bore hole size of circuit board should be greater than the size of chip 506,
On the one hand it is easily installed and reserves operation gap for the connection of gold thread 508 and substrate 502, on the other hand further improve base
The heat dissipation performance at bottom 502.Hole it is generally circular or rectangular, do not limit herein.
In other embodiments, the gold thread of connection may be other any materials that may be implemented to be conductively connected.
Embodiment 5
In the present embodiment, can be chip recessing in substrate in order to further reduce volume, as shown in figure 8,
This mode can further decrease whole thickness.It should be noted that when substrate thickness itself with regard to it is relatively thin when it is not recommended that opening
Groove, to avoid the deformation of base material can be caused when chip adstante febre.
In other embodiments, substrate can also be other Heat Conduction Materials, such as ceramics.At this point, VCSEL chips and substrate
Only heat conduction connects, and is conductively connected with the positive and negative electrode of circuit board, connection type can take any other to may be implemented to be conductively connected
Mode, do not limit herein.
In other embodiments, substrate can also be designed to be suitble to the shape of heat dissipation, for example, increase the modes such as flabellum with
Increase heat dissipation area etc..With equipment such as mobile phones substrate and other heat sink materials can also be attached in integrating process
With heat radiation performance.
The present invention carries chip flush mounting, is embedded by opening up hole on control unit, and by chip, Ke Yichong
Divide the overall volume for reducing device, while chip is in direct contact with thermal component and connect, thermal component plays support chip simultaneously
Effect, ensure offer to chip radiates to greatest extent.Compared with prior art, chip flush mounting of the invention can be real
Existing small size, high heat dissipation and low-power consumption, so as to be integrated into miniature computing device.
The above content is a further detailed description of the present invention in conjunction with specific preferred embodiments, and it cannot be said that
The specific implementation of the present invention is confined to these explanations.For those skilled in the art to which the present invention belongs, it is not taking off
Under the premise of from present inventive concept, several equivalent substitute or obvious modifications can also be made, and performance or use is identical, all answered
When being considered as belonging to protection scope of the present invention.
Claims (11)
1. a kind of chip flush mounting, including：Support member, for carrying chip；Thermal component, the heat for being used for generating chip
Amount is scattered and disappeared；Control unit, for controlling chip operation；It is characterized in that, being provided with hole in the control unit, chip is embedded into
It connects in described hole and with thermal component, thermal component plays the role of support member at this time, to keep device real
Existing small and high heat dissipation.
2. chip flush mounting according to claim 1, which is characterized in that the thermal component is provided with groove, the core
Piece is embedded into the hole of the control unit and is placed in the groove, is connected with thermal component.
3. chip flush mounting according to claim 1, which is characterized in that the thermal component connects with the control unit
It connects, and covers the hole in the control unit.
4. chip flush mounting according to claim 1, which is characterized in that the control unit is circuit board, by connecing
Enter electrode to the chip power supply or the control chip.
5. chip flush mounting according to claim 4, which is characterized in that the circuit board is flexible PCB, hard
One kind or combination of circuit board and rigid-flexible circuit board.
6. according to any chip flush mountings of claim 1-5, which is characterized in that the thermal component also has conduction
Performance, the chip are connect with thermal component conductive and heat-conductive；
The chip is conductively connected with the control unit；
The thermal component is conductively connected with control unit.
7. chip flush mounting according to claim 6, which is characterized in that the control unit is equipped with more around hole
The pad and the chip and/or the thermal component are attached by a pad using conductor wire.
8. chip flush mounting according to claim 7, which is characterized in that the size of the chip is less than the ruler of hole
It is very little, there is gap between the chip and the control unit.
9. chip flush mounting according to claim 7 or 8, which is characterized in that the chip is located in described hole
The heart.
10. chip flush mounting according to claim 1, which is characterized in that the chip includes：
Semiconductor substrate；
At least one VCSEL light source is arranged on the semiconductor substrate in an array manner.
11. chip flush mounting according to claim 10, which is characterized in that the VCSEL light source array includes rule
Array or irregular array.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710044666.0A CN108336040A (en) | 2017-01-19 | 2017-01-19 | Chip flush mounting |
| PCT/CN2017/089029 WO2018133319A1 (en) | 2017-01-19 | 2017-06-19 | Chip embedded device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710044666.0A CN108336040A (en) | 2017-01-19 | 2017-01-19 | Chip flush mounting |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108336040A true CN108336040A (en) | 2018-07-27 |
Family
ID=62907743
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710044666.0A Pending CN108336040A (en) | 2017-01-19 | 2017-01-19 | Chip flush mounting |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN108336040A (en) |
| WO (1) | WO2018133319A1 (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200709471A (en) * | 2005-08-29 | 2007-03-01 | Shane Harrah | Bendable high flux LED array |
| CN101770995A (en) * | 2009-01-04 | 2010-07-07 | 台湾沛晶股份有限公司 | Chip module structure assembly |
| CN103309137A (en) * | 2012-03-15 | 2013-09-18 | 普莱姆森斯有限公司 | Projectors Of Structured Light |
| US20150069113A1 (en) * | 2013-09-11 | 2015-03-12 | Princeton Optronics Inc. | VCSEL Packaging |
| CN205213227U (en) * | 2015-10-30 | 2016-05-04 | 武汉电信器件有限公司 | COB's heat radiation structure |
| CN206412341U (en) * | 2017-01-19 | 2017-08-15 | 深圳奥比中光科技有限公司 | Chip flush mounting |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20020124955A1 (en) * | 2001-03-08 | 2002-09-12 | I-Chung Tung | Attachment of a heat spreader for fabricating a cavity down plastic chip carrier |
| CN102082220A (en) * | 2009-11-27 | 2011-06-01 | 李学富 | LED and manufacturing process thereof |
| US8958448B2 (en) * | 2013-02-04 | 2015-02-17 | Microsoft Corporation | Thermal management in laser diode device |
-
2017
- 2017-01-19 CN CN201710044666.0A patent/CN108336040A/en active Pending
- 2017-06-19 WO PCT/CN2017/089029 patent/WO2018133319A1/en active Application Filing
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200709471A (en) * | 2005-08-29 | 2007-03-01 | Shane Harrah | Bendable high flux LED array |
| CN101770995A (en) * | 2009-01-04 | 2010-07-07 | 台湾沛晶股份有限公司 | Chip module structure assembly |
| CN103309137A (en) * | 2012-03-15 | 2013-09-18 | 普莱姆森斯有限公司 | Projectors Of Structured Light |
| US20150069113A1 (en) * | 2013-09-11 | 2015-03-12 | Princeton Optronics Inc. | VCSEL Packaging |
| CN205213227U (en) * | 2015-10-30 | 2016-05-04 | 武汉电信器件有限公司 | COB's heat radiation structure |
| CN206412341U (en) * | 2017-01-19 | 2017-08-15 | 深圳奥比中光科技有限公司 | Chip flush mounting |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2018133319A1 (en) | 2018-07-26 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN206877030U (en) | Light-emitting device and its laser projection module | |
| CN206470523U (en) | Optical projection apparatus and apply its depth camera | |
| CN206877018U (en) | Compact-sized optical projection module | |
| CN106990548A (en) | Array laser projection arrangement and depth camera | |
| CN107132720A (en) | Light-emitting device and its optical projection module | |
| CN206532073U (en) | Light-emitting device and its optical projection module | |
| CN206833079U (en) | Array laser projection arrangement and depth camera | |
| CN106990659A (en) | Laser projection device | |
| CN206412341U (en) | Chip flush mounting | |
| CN108333856A (en) | Optical projection apparatus and apply its depth camera | |
| CN107102506A (en) | Optical projection apparatus and its depth camera | |
| CN107357118A (en) | Optics module with high heat dispersion | |
| CN206532072U (en) | Optical projection apparatus and its depth camera | |
| CN207133560U (en) | Optics module with high heat dispersion | |
| CN206877029U (en) | Laser projection device | |
| CN207133564U (en) | Multi-density pattern projector | |
| CN108495010A (en) | A kind of camera module and mobile terminal | |
| TWM441261U (en) | Laser diode array die structure and has the laser diode array die structure of package device | |
| CN106462033A (en) | A flash module containing an array of reflector cups for phosphor-converted leds | |
| KR20160133426A (en) | Led lighting apparatus, light shade, and circuit manufacturing method for the apparatus | |
| CN111816975A (en) | Phased array antenna heat abstractor and phased array antenna | |
| CN208076909U (en) | Chip flush mounting and projection module | |
| CN108227360A (en) | Chip flush mounting | |
| CN207868606U (en) | A kind of Laser emission module and 3D photographic devices | |
| CN108336040A (en) | Chip flush mounting |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 11-13 / F, joint headquarters building, high tech Zone, 63 Xuefu Road, Yuehai street, Nanshan District, Shenzhen, Guangdong 518000 Applicant after: Obi Zhongguang Technology Group Co., Ltd Address before: A808, Zhongdi building, industry university research base, China University of Geosciences, No.8, Yuexing Third Road, Nanshan District, Shenzhen, Guangdong 518000 Applicant before: SHENZHEN ORBBEC Co.,Ltd. |