CN108330438B - OLED evaporation coating device and system - Google Patents
OLED evaporation coating device and system Download PDFInfo
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- CN108330438B CN108330438B CN201810226892.5A CN201810226892A CN108330438B CN 108330438 B CN108330438 B CN 108330438B CN 201810226892 A CN201810226892 A CN 201810226892A CN 108330438 B CN108330438 B CN 108330438B
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/04—Coating on selected surface areas, e.g. using masks
- C23C14/042—Coating on selected surface areas, e.g. using masks using masks
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/12—Organic material
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
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- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
The present invention relates to a kind of OLED evaporation coating device and system, OLED evaporation coating device is electrically connected with control device.OLED evaporation coating device includes cavity and is set to two or more intracorporal evaporated devices of the chamber.Two or more are equipped in cavity can accommodate the chamber of evaporated device, and each chamber respectively corresponds the vapor deposition process different stage, and each evaporated device completes that process once is deposited after all chambers.It further include mobile mechanism in cavity.Control device is used to control different evaporated devices by mobile mechanism while entering different chambers, and controls each evaporated device circulation and execute the movement for sequentially entering each chamber.The OLED evaporation coating device and system allow multiple evaporated devices to run simultaneously, so that after the organic material being currently in the evaporated device of evaporation state exhausts, the next evaporated device of replacement can be automatically continued to be deposited, to improve the efficiency of OLED mass production.
Description
Technical field
The present invention relates to display screen technology fields, more particularly to a kind of OLED evaporation coating device and system.
Background technique
Organic luminous layer in OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) display screen
When being prepared, vacuum evaporation technology is generallyd use, i.e., in vacuum chamber, is vapor-deposited with by heating heating source to glass substrate
Machine material, and film thickness is controlled using crystal oscillator.Glass substrate is placed on sample carrier, the FMM (Fine placed below
Metal Mask, high-precision metal mask plate) control vapor deposition pattern.
However, in traditional evaporation process, because of the limited volume of crucible, needs to be deposited after vapor deposition 144 hours and set
It is standby to begin to speak, along with replacement crystal oscillator, more changeable liner, heating etc., to need extra consumption 48 hours to add organic material into crucible,
Can just continue that process is deposited next time, it is lower so as to cause the efficiency of mass production.
Summary of the invention
Based on this, it is necessary to for the lower problem of the efficiency of traditional OLED mass production, provide a kind of OLED vapor deposition
Apparatus and system.
A kind of OLED evaporation coating device, is electrically connected with control device；The OLED evaporation coating device includes cavity and is set to institute
State two or more intracorporal evaporated devices of chamber；Two or more are equipped in the cavity can accommodate the vapor deposition
The chamber of equipment, each chamber respectively corresponds the vapor deposition process different stage, and each evaporated device passes through all institutes
Primary vapor deposition process is completed after stating chamber；It further include mobile mechanism in the cavity；The control device is for passing through the shifting
The different evaporated device of dynamic mechanism controls enters the different chambers simultaneously, and controls each evaporated device circulation and hold
Row sequentially enters the movement of each chamber.
It in one of the embodiments, include the vapor deposition for being deposited for the evaporated device in all chambers
Chamber.
It in one of the embodiments, further include for replacing organic material in the evaporated device in all chambers
The charging chamber of material.
It in one of the embodiments, further include heating chamber in all chambers；The heating chamber is located at described
It feeds between the outlet of chamber and the entrance of the vapor deposition chamber；The control device is used to control adding in the evaporated device
Heat source heats up in the heating chamber.
It in one of the embodiments, further include cooling chamber in all chambers；The cooling chamber is located at described
It is deposited between the outlet of chamber and the entrance of the charging chamber；The control device is used to control adding in the evaporated device
Heat source cools down in the cooling chamber.
The adjacent two chamber connections in one of the embodiments,.
It is separated between two adjacent chambers by door body assembly in one of the embodiments,.
The door body assembly includes slide valve in one of the embodiments,.
In one of the embodiments, between organic material and high-precision metal mask plate in the evaporated device
Position be equipped with baffle plate assembly；The baffle plate assembly is used to be opened so that organic material can be deposited to glass base in vapor deposition
On plate, and it is closed so that the organic material for continuing to evaporate after the completion of vapor deposition is deposited to the baffle group after the completion of vapor deposition
On part.
A kind of OLED deposition system, including control device and the OLED evaporation coating device.
Multiple chambers corresponding with vapor deposition process different phase are equipped in above-mentioned OLED evaporation coating device and system, in cavity,
And different evaporated devices under control of the control means, can be made while entering different chambers, and control each vapor deposition
Equipment circulation executes the movement for sequentially entering each chamber, therefore the OLED evaporation coating device and system allow multiple evaporated devices
It runs simultaneously, such as while one of evaporated device is deposited in a chamber, can control another vapor deposition and set
The standby more conversion materials in another chamber, so that the organic material consumption being currently in the evaporated device of evaporation state
After to the greatest extent, the next evaporated device of replacement can be automatically continued and be deposited, to improve the efficiency of OLED mass production.
Detailed description of the invention
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technical description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
Some embodiments of invention for those of ordinary skill in the art without creative efforts, can be with
The attached drawing of other embodiments is obtained according to these attached drawings.
Fig. 1 is the structural schematic diagram for the OLED evaporation coating device that an embodiment provides；
Fig. 2 is the circuit block diagram of dependency structure and control device in the OLED evaporation coating device of Fig. 1 illustrated embodiment.
Specific embodiment
To facilitate the understanding of the present invention, a more comprehensive description of the invention is given in the following sections with reference to the relevant attached drawings.In attached drawing
Give presently preferred embodiments of the present invention.But the invention can be realized in many different forms, however it is not limited to this paper institute
The embodiment of description.On the contrary, purpose of providing these embodiments is keeps the understanding to the disclosure more thorough
Comprehensively.
Unless otherwise defined, the skill of all technical and scientific terms used herein and the technical field for belonging to invention
The normally understood meaning of art personnel is identical.It is specific that description is intended merely in the term used in the description of invention herein
The purpose of embodiment, it is not intended that the limitation present invention.Term as used herein "and/or" includes one or more relevant institutes
Any and all combinations of list of items.
One embodiment provides a kind of OLED evaporation coating device, for preparing OLED display screen using vacuum evaporation technology
In organic luminous layer.Fig. 1, Fig. 2 are please referred to, which is electrically connected with control device 200.Control device 200 is used
In control OLED evaporation coating device operation.Specifically, control device 200 may include one or more controllers.Wherein, it controls
Device processed is, for example, PLC (Programmable Logic Controller, programmable logic controller (PLC)).It should be noted that this
In embodiment, mechanism operation all in OLED evaporation coating device can be controlled by a controller, or by different controls
Device processed controls mechanism operation different in OLED evaporation coating device respectively, and can be in communication with each other between each controller.
OLED evaporation coating device includes cavity 110 and two or more evaporated devices 120 being set in cavity 110.
Evaporated device 120 includes a closed shell, for example equipped with sample carrier, the high-precision gold for being placed with glass substrate in shell
Belong to mask plate, the crucible for holding organic material, heating source and crystal oscillator.Wherein, glass substrate, high-precision metal mask plate, organic
Material is placed according to sequence from top to bottom.Also, positioning mechanism can also be set, for glass substrate and high-precision metal
Mask plate is aligned.In vapor deposition, heating source heats crucible, so that organic material passes through high-precision metal mask
Plate is deposited to glass substrate.Further, the cavity wall and/or positioning mechanism in evaporated device 120 towards organic material one
Liner can be set in side, so that extra organic material deposits to interior lining, as long as then more changeable liner can be deposited
Equipment continues to use.Specifically, liner can choose material resistant to high temperature, such as stainless steel.Also, the surface of liner can have
There is frosted, to improve the adhesive force of organic material.
Two or more are equipped in cavity 110 can accommodate the chamber of evaporated device 120.Therefore, each chamber
Volume of 120 volume at least more than an evaporated device 120.Specifically, it is established very in each chamber using traditional mode
Altitude, such as vacuum environment is established by vacuum pump.In addition, each chamber respectively corresponds the vapor deposition process different stage, change
Yan Zhi, evaporated device 120 execute the operation of different phase during vapor deposition in different chambers.Each evaporated device 120 passes through
Primary vapor deposition process is completed after crossing all chambers.Wherein, vapor deposition process is heated up for example including heating source, organic material is deposited
Cooled down to glass substrate, heating source, replace the processes such as organic material.
In addition, further including mobile mechanism 130 in cavity 110.Mobile mechanism 130 can be such that evaporated device 120 steams in OLED
It is moved in plating appts, also, mobile mechanism 130 can enable evaporated device 120 be moved in different chambers.Specifically
Ground, all chambers are distributed in a ring.Mobile mechanism 130 can design with reference to traditional ring-shaped guide rail automatic cycle line, such as:
Mobile mechanism 130 includes servo motor, synchronous belt, the multiple slides being mounted on synchronous belt, wherein servo motor and control fill
200 electrical connections are set, each evaporated device 120 is mounted on corresponding slide, in this way, under the control of control device 200, servo electricity
Machine controls synchronous belt operation, and then drives evaporated device 120 to be moved by the slide on synchronous belt.
Control device 200 is used to control different evaporated devices 120 by mobile mechanism 130 while entering different chambers
Room, and control each circulation of evaporated device 120 and execute the movement for sequentially entering each chamber.In other words, in the control of control device 200
Under, allow each evaporated device 120 to sequentially enter each chamber, to complete primary vapor deposition process, and continue according to
It is secondary to enter each chamber, to complete that process is deposited next time, circuit sequentially.Meanwhile different evaporated devices 120 is same
Period is respectively in different chambers, and in other words, different evaporated devices 120 intersects in OLED evaporation coating device to be staggered,
Such as: an evaporated device 120 is in execute in a chamber and organic material is deposited to the process of glass substrate, and another
During a evaporated device 120 is in another chamber and is in replacement organic material.
In conclusion the above-mentioned OLED evaporation coating device that present embodiment provides, is equivalent to and establishes a circulation vapor deposition system
System, after the organic material in the evaporated device for being currently at evaporation state 120 can be made to exhaust, can continue to replace next steaming
Coating apparatus 120 is deposited, to improve the efficiency of OLED mass production.
In one of the embodiments, with continued reference to FIG. 1, including for being carried out for evaporated device 120 in all chambers
The vapor deposition chamber 111 of vapor deposition.In other words, after evaporated device 120 enters in vapor deposition chamber 111, in the heat effect of heating source
Under, organic material will be deposited to glass substrate.Specifically, in order to improve efficiency, control device 200 can control vapor deposition and set
When having just enter into vapor deposition chamber 111 for 120, organic material just starts vapor deposition to glass substrate just.Control device 200 can be with
When control evaporated device 120 is removed from vapor deposition chamber 111, organic material exhausts just.In specific control, control device
200 can control the time of the into and out vapor deposition chamber 111 of evaporated device 120 according to preset time value.Alternatively, steaming
Setting is able to detect the senser element of organic material real time status, the information which will test in real time in coating apparatus 120
It is sent to control device 200, so that control device 200 is controlled according to the real time status of organic material by mobile mechanism 130
Evaporated device 120 processed is run.
Further, with continued reference to FIG. 1, further including for replacing organic material in evaporated device 120 in all chambers
The charging chamber 112 of material.The chamber 112 that feeds is, for example, PM (Preventative Maintenance, preventive maintenance maintenance)
Chamber can be opened, so that user carries out corresponding operating.For example, after evaporated device 120 is moved in charging chamber 112,
User can replace organic material, crystal oscillator and liner, after replacement, begin setting up vacuum environment in evaporated device 120.
Further, with continued reference to FIG. 1, further including heating chamber 113 in all chambers.The chamber 113 that heats up, which is located at, to be added
Expect between the outlet of chamber 112 and the entrance of vapor deposition chamber 111.Therefore, evaporated device 120 will after feeding chamber 112 out
It is moved to heating chamber 113, then is moved in vapor deposition chamber 111.Wherein, control device 200 is for controlling in evaporated device 120
Heating source heating chamber 113 in heat up, to carry out the preparation of vapor deposition.
Further, with continued reference to FIG. 1, further including cooling chamber 114 in all chambers.The chamber 114 that cools down, which is located at, to be steamed
It plates between the outlet of chamber 111 and the entrance of charging chamber 112.Wherein, control device 200 is for controlling evaporated device 120
Heating source cools down in cooling chamber 114.
Therefore, above-mentioned charging chamber 112, heating chamber 113, vapor deposition chamber 111, cooling chamber 114 collectively form one
The circulatory system is deposited, each evaporated device 120 is recycled and executes vapor deposition process.Wherein, evaporated device 120 is once being deposited
Operation logic in the process is for example are as follows: control device 200 controls evaporated device 120 according to setting time value into or out of each
The time of chamber, wherein under the control of control device 200, evaporated device 120 is moved to more conversion materials in charging chamber 112
After finishing and establishing vacuum, it is moved to heating chamber 113, heating source is heated in heating chamber 113.Later, vapor deposition is set
Standby 120 are moved to again in vapor deposition chamber 111, will be deposited in vapor deposition chamber 111, and after vapor deposition, evaporated device 120 is moved
It moves to cooling chamber 114,114 heating sources cool down in cooling chamber, and after cooling, evaporated device 120 moves again
It is circuited sequentially later to charging chamber 112 with more conversion materials of beginning to speak.
Specifically, adjacent two chambers connection.That is, above-mentioned charging chamber 112, heating chamber 113, vapor deposition chamber 111,
Cooling chamber 114 is sequentially connected, and so as to shorten the mobile time of evaporated device 120, further increases the efficiency of vapor deposition.
Further, it is separated between adjacent two chambers by door body assembly 140, so that it is independent for guaranteeing each chamber all
Enclosure space, so as to independently establish vacuum environment, with reduce pollution.Further, control device 200 is for controlling door
Body component 140 opens or closes.After door body assembly 140 is opened, evaporated device 120 can be by the chamber of 140 side of door body assembly
Room is moved to the chamber of 140 other side of door body assembly.After door body assembly 140 is closed, the chamber of 140 two sides of door body assembly then phase
Mutually separate.
Specifically, door body assembly 140 is for example including slide valve.Slide valve can be realized under the control of control device 200
Open and close function.Alternatively, door body assembly 140 can also use other mechanical groups traditional for capable of being automatically opened or closed
Part realizes that for example including driving device, transmission device and door body, also, control device 200 makes by controlling driving device
Transmission device drives door body to open or close.
It is understood that the set-up mode of each chamber is not limited to above situation in cavity 110, as long as making evaporated device
120 can complete primary vapor deposition process after all chambers, such as: heating chamber 113 can with charging chamber 112 or
Vapor deposition chamber 111 merges into a chamber；Alternatively, cooling chamber 114 can merge with charging chamber 112 or vapor deposition chamber 111
For a chamber.
In one of the embodiments, between organic material and high-precision metal mask plate in evaporated device 120
Position be equipped with 121 (not shown in figure 1) of baffle plate assembly.Baffle plate assembly 121 is used to be opened so that organic material in vapor deposition
It can be deposited to glass substrate, and be closed so that after the completion of vapor deposition the organic material deposition for continuing evaporation after the completion of vapor deposition
To baffle plate assembly 121.Wherein, baffle plate assembly 121 can be controlled by control device 200.Such as: when evaporated device 120 enters
Chamber 111 is deposited and glass substrate is with after the completion of the contraposition of high-precision metal mask plate, control device 200 controls baffle plate assembly 121
It opens, at this moment organic material can be deposited by high-precision metal mask plate to glass substrate.Alternatively, baffle plate assembly 121
It can be controlled by positioning mechanism, control signal be sent to baffle plate assembly 121 after positioning mechanism contraposition is completed, to control baffle group
Part 121 is opened.After the completion of organic material vapor deposition, after evaporated device 120 is moved in cooling chamber 114, control device 200 is controlled
Baffle plate assembly 121 processed is closed, and at this moment since the temperature of heating source is still higher, is had a small amount of organic material and is continued to evaporate, but
It is the presence due to baffle plate assembly 121, so that the organic material evaporated later will deposit on baffle plate assembly 121, to subtract
The organic material for depositing to interior lining is lacked, it is possible to reduce the number of more changeable liner.
Specifically, baffle plate assembly 121 can be realized using the mechanical component that tradition can be automatically opened or closed, example
Such as: baffle plate assembly 121 may include driving device, transmission device and baffle, wherein driving device is electrically connected with control device 200
It connects, control device drives baffle open or close by control driving device, and then by transmission device.
Another embodiment provides a kind of OLED deposition system, provides including control device and a upper embodiment
OLED evaporation coating device.
It should be noted that present embodiment provide control device, OLED evaporation coating device respectively with a upper embodiment
In control device 200, the principle of OLED evaporation coating device it is identical, just repeat no more here.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
The embodiments described above only express several embodiments of the present invention, and the description thereof is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to protection of the invention
Range.Therefore, the scope of protection of the patent of the invention shall be subject to the appended claims.
Claims (9)
1. a kind of OLED evaporation coating device, which is characterized in that be electrically connected with control device；The OLED evaporation coating device include cavity and
It is set to two or more intracorporal evaporated devices of the chamber；Two or more are equipped in the cavity to accommodate
The chamber of the evaporated device, each chamber respectively correspond vapor deposition process different stage, and each evaporated device warp
Primary vapor deposition process is completed after crossing all chambers；It include for replacing having in the evaporated device in all chambers
The charging chamber of machine material；It further include mobile mechanism in the cavity；The control device by the mobile mechanism for being controlled
Make the different evaporated devices while entering the different chambers, and control each evaporated device circulation execute successively into
Enter the movement of each chamber.
2. OLED evaporation coating device according to claim 1, which is characterized in that further include for for institute in all chambers
State the vapor deposition chamber that evaporated device is deposited.
3. OLED evaporation coating device according to claim 2, which is characterized in that further include heating chamber in all chambers
Room；The heating chamber is located between the outlet of the charging chamber and the entrance of the vapor deposition chamber；The control device is used
It heats up in the heating chamber in the heating source controlled in the evaporated device.
4. OLED evaporation coating device according to claim 2, which is characterized in that further include cooling chamber in all chambers
Room；The cooling chamber is located between the outlet of the vapor deposition chamber and the entrance of the charging chamber；The control device is used
Cool down in the cooling chamber in the heating source controlled in the evaporated device.
5. according to claim 1 to OLED evaporation coating device described in any one of 4 claims, which is characterized in that adjacent two
A chamber connection.
6. OLED evaporation coating device according to claim 5, which is characterized in that pass through door between two adjacent chambers
Body component separates.
7. OLED evaporation coating device according to claim 6, which is characterized in that the door body assembly includes slide valve.
8. according to claim 1 to OLED evaporation coating device described in any one of 4 claims, which is characterized in that the vapor deposition
Baffle plate assembly is equipped in the position between organic material and high-precision metal mask plate in equipment；The baffle plate assembly is used for
It is opened so that organic material can be deposited to glass substrate in vapor deposition, and is closed so that and has been deposited after the completion of vapor deposition
It deposits at the rear organic material for continuing evaporation to the baffle plate assembly.
9. a kind of OLED deposition system, which is characterized in that including control device and any one of claims 1 to 8 claim
The OLED evaporation coating device.
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| CN201810226892.5A CN108330438B (en) | 2018-03-12 | 2018-03-12 | OLED evaporation coating device and system |
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| CN201810226892.5A CN108330438B (en) | 2018-03-12 | 2018-03-12 | OLED evaporation coating device and system |
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| CN108998764B (en) * | 2018-08-20 | 2020-12-08 | 深圳市华星光电技术有限公司 | Evaporation source device |
| CN114134465A (en) * | 2021-11-24 | 2022-03-04 | 成都中建材光电材料有限公司 | Method and device for improving utilization rate of evaporation equipment for photovoltaic module |
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| US20040123804A1 (en) * | 2002-09-20 | 2004-07-01 | Semiconductor Energy Laboratory Co., Ltd. | Fabrication system and manufacturing method of light emitting device |
| JP2012246534A (en) * | 2011-05-27 | 2012-12-13 | Nec Corp | Vapor deposition apparatus |
| KR101609185B1 (en) * | 2013-12-13 | 2016-04-05 | 주식회사 선익시스템 | Unit for transferring deposition source, apparatus of deposition having the same and method of deposition |
| US9899635B2 (en) * | 2014-02-04 | 2018-02-20 | Applied Materials, Inc. | System for depositing one or more layers on a substrate supported by a carrier and method using the same |
| KR20180007387A (en) * | 2016-07-12 | 2018-01-23 | 삼성디스플레이 주식회사 | Thin film deposition apparatus |
| CN107254673B (en) * | 2017-06-12 | 2019-07-19 | 京东方科技集团股份有限公司 | The evaporation coating method of deposition system and deposition system |
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