CN108329554A - 一种电子器件灌封材料 - Google Patents

一种电子器件灌封材料 Download PDF

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Publication number
CN108329554A
CN108329554A CN201710434950.9A CN201710434950A CN108329554A CN 108329554 A CN108329554 A CN 108329554A CN 201710434950 A CN201710434950 A CN 201710434950A CN 108329554 A CN108329554 A CN 108329554A
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parts
electronic device
polyethylene
epoxy resin
silicon carbide
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    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
    • C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
    • C08L23/04—Homopolymers or copolymers of ethene
    • C08L23/06—Polyethene
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C08K2003/2227—Oxides; Hydroxides of metals of aluminium
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/011—Nanostructured additives
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2203/00—Applications
    • C08L2203/20—Applications use in electrical or conductive gadgets
    • C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L2205/00—Polymer mixtures characterised by other features
    • C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend

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  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Abstract

本发明公开了一种电子器件灌封材料，将聚乙烯、聚乙二醇、环氧树脂、纳米碳化硅和纳米氧化铝混合熔融浇注制成，各原料重量份为：聚乙烯35‑45份、聚乙二醇5‑15份、环氧树脂5‑15份、纳米碳化硅6‑12份和纳米氧化铝4‑8份。本发明提供的材料性能优异，可以用于制备电子器件灌封材料。

Description

一种电子器件灌封材料
技术领域
本发明属于领域，涉及，具体涉及一种电子器件灌封材料。
背景技术
在电子工业中，往往需要对电子元器件或组装部件进行灌封，使其与外界隔绝，以此提高电子器件抗冲击振动、抗恶劣环境、防尘防潮防腐的能力以及电绝缘导热等性能。目前的灌封材料多种多样，但是用得最多的主要是各种合成聚合物。环氧树脂、有机硅、有机硅环氧、聚酰亚胺、液晶聚合物、端羟基聚丁二烯、各类聚氨酯等。其中以环氧树脂和有机硅灌封材料由于其各种优良特性而被广泛应用。
发明内容
本发明的目的在于提供一种电子器件灌封材料。
本发明通过下面技术方案实现：
一种电子器件灌封材料，将聚乙烯、聚乙二醇、环氧树脂、纳米碳化硅和纳米氧化铝混合熔融浇注制成，各原料重量份为：聚乙烯35-45份、聚乙二醇5-15份、环氧树脂5-15份、纳米碳化硅6-12份和纳米氧化铝4-8份。
根据权利要求1所述的电子器件灌封材料，其特征在于，各原料重量份为：聚乙烯40份、聚乙二醇10份、环氧树脂10份、纳米碳化硅9份和纳米氧化铝6份。
本发明技术效果：
本发明提供的材料性能优异，可以用于制备电子器件灌封材料。
具体实施方式
下面结合实施例具体介绍本发明的实质性内容。
实施例1
一种电子器件灌封材料，将聚乙烯、聚乙二醇、环氧树脂、纳米碳化硅和纳米氧化铝混合熔融浇注制成，各原料重量份为：聚乙烯40份、聚乙二醇10份、环氧树脂10份、纳米碳化硅9份和纳米氧化铝6份。
实施例2
一种电子器件灌封材料，将聚乙烯、聚乙二醇、环氧树脂、纳米碳化硅和纳米氧化铝混合熔融浇注制成，各原料重量份为：聚乙烯35份、聚乙二醇5份、环氧树脂5份、纳米碳化硅6份和纳米氧化铝4份。
实施例3
一种电子器件灌封材料，将聚乙烯、聚乙二醇、环氧树脂、纳米碳化硅和纳米氧化铝混合熔融浇注制成，各原料重量份为：聚乙烯45份、聚乙二醇15份、环氧树脂15份、纳米碳化硅12份和纳米氧化铝8份。

Claims (2)

1.一种电子器件灌封材料，其特征在于，将聚乙烯、聚乙二醇、环氧树脂、纳米碳化硅和纳米氧化铝混合熔融浇注制成，各原料重量份为：聚乙烯35-45份、聚乙二醇5-15份、环氧树脂5-15份、纳米碳化硅6-12份和纳米氧化铝4-8份。
2.根据权利要求1所述的电子器件灌封材料，其特征在于，各原料重量份为：聚乙烯40份、聚乙二醇10份、环氧树脂10份、纳米碳化硅9份和纳米氧化铝6份。
CN201710434950.9A 2017-06-10 2017-06-10 一种电子器件灌封材料 Withdrawn CN108329554A (zh)

Priority Applications (1)

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CN201710434950.9A CN108329554A (zh) 2017-06-10 2017-06-10 一种电子器件灌封材料

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Application Number Priority Date Filing Date Title
CN201710434950.9A CN108329554A (zh) 2017-06-10 2017-06-10 一种电子器件灌封材料

Publications (1)

Publication Number Publication Date
CN108329554A true CN108329554A (zh) 2018-07-27

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CN201710434950.9A Withdrawn CN108329554A (zh) 2017-06-10 2017-06-10 一种电子器件灌封材料

Country Status (1)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390522A (zh) * 2018-08-31 2019-02-26 金华安靠电源科技有限公司 一种电动车电池盒

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109390522A (zh) * 2018-08-31 2019-02-26 金华安靠电源科技有限公司 一种电动车电池盒

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Application publication date: 20180727