CN108327104A - A kind of integrated disk manufacturing equipment of semiconductor - Google Patents

A kind of integrated disk manufacturing equipment of semiconductor Download PDF

Info

Publication number
CN108327104A
CN108327104A CN201810130824.9A CN201810130824A CN108327104A CN 108327104 A CN108327104 A CN 108327104A CN 201810130824 A CN201810130824 A CN 201810130824A CN 108327104 A CN108327104 A CN 108327104A
Authority
CN
China
Prior art keywords
semiconductor
motor
runner
guide runner
circular hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
CN201810130824.9A
Other languages
Chinese (zh)
Inventor
楼碧云
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yinzhou Ningbo Yi Wang Electronic Technology Co Ltd
Original Assignee
Yinzhou Ningbo Yi Wang Electronic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yinzhou Ningbo Yi Wang Electronic Technology Co Ltd filed Critical Yinzhou Ningbo Yi Wang Electronic Technology Co Ltd
Priority to CN201810130824.9A priority Critical patent/CN108327104A/en
Publication of CN108327104A publication Critical patent/CN108327104A/en
Withdrawn legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/02Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
    • B28D5/022Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
    • B28D5/024Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B28WORKING CEMENT, CLAY, OR STONE
    • B28DWORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B28D5/0058Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
    • B28D5/0082Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B15/00Single-crystal growth by pulling from a melt, e.g. Czochralski method
    • CCHEMISTRY; METALLURGY
    • C30CRYSTAL GROWTH
    • C30BSINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
    • C30B29/00Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
    • C30B29/02Elements
    • C30B29/06Silicon

Abstract

The invention discloses a kind of semiconductors to integrate disk manufacturing equipment, body is prepared including engine base and the semiconductor column being arranged at the top of the engine base and is arranged at the top of the engine base and is prepared positioned at the semiconductor disk cutting body of body right end, it is equipped in the engine base and is located at the semiconductor column and prepares between body and disk cutting body and the first guide runner of opening upwards, it is slidably connected with supporting plate in first guide runner, the supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts threaded rod, described first, which adjusts extending end at the top of threaded rod, runs through the supporting plate, first adjusting threaded rod bottom extending end be connected by power has the first motor, first motor outer surface is embedded in first guide runner and connection fixed thereto;The configuration of the present invention is simple, easy to operate, high degree of automation, meanwhile, improve integrated disk manufacture efficiency and effect.

Description

A kind of integrated disk manufacturing equipment of semiconductor
Technical field
The present invention relates to integrated chip preparing technical field, specifically a kind of semiconductor integrates disk manufacturing equipment.
Background technology
Integrated chip becomes the emphasis paid close attention to for producer as most popular electronic product now, processing and manufacturing, Middle semiconductor integrates the substrate that disk is prepared as integrated chip, plays the role of key, current integrated disk manufacture and sets It is standby be all from external import, it is not only expensive but also complicated for operation, it is necessary to which that professional person operates, and keeps early investment cost huge Greatly, such device is individually to separate in the preparation of semiconductor monocrystal cylinder and cutting process, this is operation further complexity, and It takes up a large area, preparation efficiency bottom, therefore, is badly in need of a kind of integrated disk manufacturing equipment of semiconductor at present.
Invention content
Technical problem to be solved by the invention is to provide a kind of semiconductors to integrate disk manufacturing equipment, can solve State the problems in present technology.
The present invention is achieved through the following technical solutions:A kind of semiconductor of the present invention integrates disk manufacturing equipment, Body is prepared including engine base and the semiconductor column being arranged at the top of the engine base and is arranged at the top of the engine base and is located at institute The disk cutting body that semiconductor prepares body right end is stated, is equipped in the engine base and prepares body and institute positioned at the semiconductor column It states between disk cutting body and the first guide runner of opening upwards, is slidably connected with supporting plate in first guide runner, The supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts threaded rod, and described first adjusts threaded rod Top extending end runs through the supporting plate, and first adjusting threaded rod bottom extending end be connected by power has the first motor, First motor outer surface is embedded in first guide runner and connection fixed thereto, is set in the supporting plate top end surface There is the heat preservation cylinder adjusted among threaded rod positioned at two first, prepared by the semiconductor column is equipped with opening upwards at the top of body Second guide runner, the second guide runner right end prepare body right end end face through the semiconductor, in second guide runner It is slidably connected with support plate, the support plate screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, described Second adjusting threaded rod left end extending end be connected by power has the second motor, and the support plate top end surface, which is equipped with, is located at institute State the movable block right over heat-preservation cylinder, the movable block bottom end face, which is fixedly connected with, to be extended downwardly and symmetrical slide guide bar, The slide guide bar runs through the support plate, the third motor being embedded in the movable block among two slide guide bars, institute It states support plate screw-internal thread fit and is connected with the screw rod for extending up and down and being located among two slide guide bars, the screw tip extends end End through the support plate top end surface and with the third motor bottom end be connected by power, the screw rod bottom extends end The support plate bottom end face is run through at end and end is fixedly connected with chuck, is equipped with up and down in the disk cutting machine body Circular hole, the engine base is interior to be equipped with the splicing chamber for being located at and immediately below the circular hole and communicating, and the splicing chamber right end runs through the machine Seat right end end face, the splicing chamber bottom interior wall are equipped with loss prevention plate, and the circular hole inner circumferential is communicated equipped with annular groove, described It is equipped with the first logical positioned at the annular groove right end and therewith cavity in disk cutting machine body, is set in the disk cutting machine body There is opening to the center of circular hole and symmetrical third guide runner, it is hollow to be slidably connected with external tooth in the annular groove Runner, the interior pneumatic actuator symmetrical equipped with left and right of the hollow runner of external tooth, the pneumatic actuator is close to the circular hole The push rod that the oriented center of circular hole of end face be connected by power at center extends, the push rod run through and put in hollow turn of the external tooth Wheel is internal and is fixedly connected with curved splint in end, and the 4th motor is embedded in the first cavity bottom inner wall, described 4th motor top end be connected by power has the first rotation axis upwardly extended, the first rotation axis top extending end to stretch It is equipped with to the tooth runner with the ratcheting connection of the hollow runner of the external tooth in into first cavity and in end, the third is led Moving cutting device is equipped in sliding slot.
Preferably technical solution, top pressure connects between the loss prevention plate top end surface and the splicing chamber bottom interior wall There is symmetrical top pressure spring.
Preferably technical solution, the moving cutting device include that sliding connection is arranged in the third slide guide Slider guide in slot and the hydraulic drive actuator being arranged in the disk cutting machine body, the hydraulic drive actuator lean on The end of the nearly center of circular hole and inner wall be connected by power of the slider guide far from the center of circular hole are set in the slider guide There is groove of the opening to the center of circular hole, be equipped with cutting sheet in the groove, the cutting sheet is equipped with the extended up and down Two rotation axis, second rotation axis bottom extending end are rotatably assorted with the bottom portion of groove inner wall and connect, described second turn Extending end be connected by power has the 5th motor, third motor outer surface to be embedded in the groove top at the top of moving axis In wall and connection fixed thereto.
Preferably technical solution, the semiconductor column prepares body left end end face and is equipped with Intelligent control cabinet, described Intelligent control cabinet and all electrical equipment Electricity Federations.
The beneficial effects of the invention are as follows:The configuration of the present invention is simple, easy to operate, the first guide runner of setting in engine base, first Supporting plate is slidably connected in guide runner, supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts screw thread Bar, first, which adjusts extending end at the top of threaded rod, runs through supporting plate, and first adjusts threaded rod bottom extending end be connected by power first Motor, the first motor outer surface is embedded in the first guide runner bottom interior wall and connection fixed thereto, fixed at the top of supporting plate Equipped with heat-preservation cylinder, engine base top end surface left end prepares body equipped with semiconductor wafer, and prepared by semiconductor wafer is equipped at the top of body Second guide runner of opening upwards, right end prepares body right end end face, the second slide guide through semiconductor wafer in the second guide runner It is slidably connected with support plate in slot, support plate screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, and second Adjusting threaded rod left end extending end be connected by power has the second motor, the second motor outer surface to be embedded at the second guide runner left side It holds in inner wall and connection fixed thereto, support plate top end surface is equipped with the movable block being located at right over heat-preservation cylinder, movable block bottom End surface is equipped with the slide guide bar extended downwardly, and slide guide bar penetrates through support plate, is embedded in two slide guide bars in movable block Between third motor, support plate screw-internal thread fit is connected with the screw rod extended up and down, and screw tip extending end is through support Plate top end surface and with third motor bottom end be connected by power, screw rod bottom extending end through support plate bottom end face simultaneously It is fixedly connected with chuck in end, prepares semiconductor monocrystal column to realize to be controlled automatically under certain temperature and rotating speed, rotating speed Stablize, avoid putting forward the problem uncoordinated with rotating speed, reduce unnecessary manual operation, improves semiconductor and prepare precision, carry High follow-up manufacture semiconductor integrates the quality of disk, is equipped with positioned at the first guide runner right end further through engine base top end surface It cuts disk and cuts body, the splicing chamber for being located at disk cutting organism bottom is equipped in engine base, splicing intracavitary is equipped with loss prevention plate, real Existing semiconductor monocrystal column is coherent with semiconductor wafer cutting work, and cutting is stablized, and cutting speed is fast and high-quality, is solved existing There is equipment prepared by the integrated disk of semiconductor complicated and the incoherent defect of work.
Description of the drawings
The present invention is described in detail by following specific embodiment and attached drawing for ease of explanation,.
Fig. 1 is that a kind of semiconductor of the present invention integrates disk manufacturing equipment overall structure diagram;
Fig. 2 is that the disk of the present invention cuts internal body structural schematic diagram;
Fig. 3 is the structural schematic diagram of A in Fig. 2;
Fig. 4 is the structural schematic diagram of B in Fig. 2.
Specific implementation mode
As Figure 1-Figure 4, a kind of semiconductor of the invention integrates disk manufacturing equipment, including engine base 100 and setting Semiconductor column at 100 top of the engine base prepares body 102 and setting at 100 top of the engine base and is located at the semiconductor The disk cutting body 113 of 102 right end of body is prepared, is equipped in the engine base 100 and prepares body 102 positioned at the semiconductor column Between the disk cutting body 113 and the first guide runner 117 of opening upwards, the interior sliding of first guide runner 117 are matched Conjunction is connected with supporting plate 118, and 118 screw-internal thread fit of the supporting plate is connected with extension up and down and symmetrical first adjusts threaded rod 120, described first, which adjusts 120 top extending end of threaded rod, runs through the supporting plate 118, and described first adjusts 120 bottom of threaded rod Portion's extending end be connected by power has the first motor 119,119 outer surface of the first motor to be embedded at first guide runner In 117 and connection fixed thereto, 118 top end surface of the supporting plate are equipped among two first adjusting threaded rods 120 Cylinder 110 is kept the temperature, the semiconductor column prepares the second guide runner that 102 top of body is equipped with opening upwards, second slide guide Slot right end prepares 102 right end end face of body through the semiconductor, and support plate is slidably connected in second guide runner 104,104 screw-internal thread fit of the support plate is connected with left and right extends second and adjusts threaded rod 105, and described second adjusts screw thread 105 left end extending end be connected by power of bar has the second motor 103,104 top end surface of the support plate to be equipped with positioned at described Movable block 106 right over heat-preservation cylinder 110,106 bottom end face of the movable block, which is fixedly connected with, to be extended downwardly and symmetrical Slide guide bar 108, the slide guide bar 108 run through the support plate 104, are embedded with positioned at two slide guide bars in the movable block 106 Third motor 107 among 108,104 screw-internal thread fit of the support plate is connected with to be extended and is located at two slide guide bars up and down Screw rod 109 among 108,109 top extending end of the screw rod through 104 top end surface of the support plate and with the third 107 bottom end be connected by power of motor, 109 bottom extending end of the screw rod through 104 bottom end face of the support plate and End is fixedly connected with chuck 111, and circular hole 129 up and down, the engine base 100 are equipped in the disk cutting body 113 Interior to be equipped with the splicing chamber 114 for being located at and immediately below the circular hole 129 and communicating, 114 right end of splicing chamber runs through the engine base 100 Right end end face, 114 bottom interior wall of splicing chamber are equipped with loss prevention plate 115, and 129 inner circumferential of the circular hole communicates recessed equipped with annular Slot 121, the disk cutting body 113 is interior to be equipped with the first logical positioned at 121 right end of the annular groove and therewith cavity 128, It is equipped with the third guide runner 130 to 129 center of the circular hole and symmetrical that is open, the ring in the disk cutting body 113 The hollow runner 122 of external tooth is slidably connected in connected in star 121, the hollow runner 122 of external tooth is interior symmetrical equipped with left and right Pneumatic actuator 123, the oriented circle of end face be connected by power of the pneumatic actuator 123 close to 129 center of the circular hole The push rod that 129 center of hole extends, the push rod run through and put in hollow 122 inside of runner of the external tooth and be fixedly connected in end There is curved splint 124, the 4th motor 125, the 4th motor 125 are embedded in 128 bottom interior wall of the first cavity Top end be connected by power has the first rotation axis 126 upwardly extended, first rotation axis, 126 top extending end to put in institute It states in the first cavity 128 and is equipped with to the tooth runner 127 with the hollow 122 ratcheting connection of runner of the external tooth in end, it is described Moving cutting device is equipped in third guide runner 130.
Valuably, top pressure is connected with relatively between 115 top end surface of loss prevention plate and 114 bottom interior wall of splicing chamber The top pressure spring 116 of title prevents the semiconductor after cutting from integrating disk and breaks..
Valuably, the moving cutting device includes that leading in the third guide runner 130 is arranged in sliding connection Sliding block 133 and the hydraulic drive actuator 134 being arranged in disk cutting body 113, the hydraulic drive actuator 134 end and inner wall be connected by power of the slider guide 133 far from 129 center of the circular hole close to 129 center of the circular hole, It is equipped with groove 132 of the opening to 129 center of the circular hole in the slider guide 133, cutting sheet 135 is equipped in the groove 132, The cutting sheet 135 is equipped with the second rotation axis 136 extended up and down, second rotation axis, 136 bottom extending end and institute It states 132 bottom interior wall of groove to be rotatably assorted connection, second rotation axis, 136 top extending end be connected by power has the 5th electronic Machine 131,131 outer surface of third motor is embedded in 132 top inner wall of the groove and connection fixed thereto, convenient for certainly Dynamic control cutting sheet 135 is moved to center of circular hole, increases depth of cut, improves cutting efficiency.
Valuably, the semiconductor column prepares 102 left end end face of body and is equipped with Intelligent control cabinet 101, the intelligence control Cabinet 101 processed and all electrical equipment Electricity Federations, are convenient for intelligent controlling device automatic operating, improve semiconductor and integrate disk manufacture effect Rate and effect.
When original state, supporting plate 118 is located at 117 bottommost of the first guide runner, at this point, heat-preservation cylinder 110 is fully located at first In guide runner 117, support plate 104 is located at the second guide runner left end, 106 bottom end face of movable block and 104 top end of support plate Face abuts against, and utmostly open configuration, slider guide 133 are fully located in third guide runner 130 curved splint 124, make cutting Piece 135 is fully located in third guide runner 130.
When needing manufacture semiconductor to integrate disk work, device is integrally powered, liquid is added in heat-preservation cylinder 110 High-purity polycrystalline silicon fixes monocrystalline silicon kind on chuck 111, at this point, the first motor 119 of control drives first to adjust threaded rod 120 rotations, the first adjusting threaded rod 120 drive supporting plate 118 to move up, and supporting plate 118 drives heat-preservation cylinder 110 to move up, when monocrystalline silicon kind When touching liquid level surface layer, the first motor 119 of control shuts down, meanwhile, control third motor 107 drives screw rod 109 Rotation, screw rod 109 move up and movable block 106 are driven to move up, and screw rod 109 drives monocrystalline silicon kind to rotate and move up simultaneously, when Final solidified monocrystalline silicon column is just formed, at this point, control third motor 107 shuts down, meanwhile, control the first motor 119, which drive first to adjust threaded rod 120, inverts, and so that supporting plate 118 is moved down, is led when supporting plate 118 drives heat-preservation cylinder 110 to be moved to first When 117 bottommost of sliding slot, heat-preservation cylinder 110 is fully stowed into the first guide runner 117, at this point, the first motor 119 of control stops Operating, meanwhile, the second motor 103 of control drives the second adjusting rotation of threaded rod 105 that support plate 104 is made to move to right, and works as monocrystalline silicon When column is located at 129 surface of circular hole, control third motor 107, which drives screw rod 109 to rotate backward, makes monocrystalline silicon column move down, and works as list Crystal silicon column is located in curved splint 124, and the control operating of pneumatic actuator 123 makes curved splint 124 move towards to clamp list Crystal silicon column, at this point, the 4th motor 125 of control is rotated with moving teeth runner 127, tooth runner 127 drives hollow 122 turns of the runner of external tooth It is dynamic, to drive the rotation of monocrystalline silicon column that it is made to be detached with stud 109, at this point, continuing to control 107 drive stud of third motor 109 rotations make it move down and push the monocrystalline silicon column of clamping, when monocrystalline silicon column is moved to 135 place plane of cutting sheet, control Third motor 107 shuts down, meanwhile, it controls the 5th motor 131 and hydraulic drive actuator 134 operates, the 5th is electronic Machine 131 drives the rotation of the second rotation axis 136, the second rotation axis 136 that cutting sheet 135 is driven to rotate, and hydraulic drive actuator 134 pushes away Dynamic slider guide 133 is moved to monocrystalline silicon column direction, to complete to stablize the cutting monocrystalline silicon column gradually stretched into, is cut into the list of sheet Crystal silicon disk is then fallen on loss prevention plate 115, then following process processing to be removed.
The beneficial effects of the invention are as follows:The configuration of the present invention is simple, easy to operate, the first guide runner of setting in engine base, first Supporting plate is slidably connected in guide runner, supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts screw thread Bar, first, which adjusts extending end at the top of threaded rod, runs through supporting plate, and first adjusts threaded rod bottom extending end be connected by power first Motor, the first motor outer surface is embedded in the first guide runner bottom interior wall and connection fixed thereto, fixed at the top of supporting plate Equipped with heat-preservation cylinder, engine base top end surface left end prepares body equipped with semiconductor wafer, and prepared by semiconductor wafer is equipped at the top of body Second guide runner of opening upwards, right end prepares body right end end face, the second slide guide through semiconductor wafer in the second guide runner It is slidably connected with support plate in slot, support plate screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, and second Adjusting threaded rod left end extending end be connected by power has the second motor, the second motor outer surface to be embedded at the second guide runner left side It holds in inner wall and connection fixed thereto, support plate top end surface is equipped with the movable block being located at right over heat-preservation cylinder, movable block bottom End surface is equipped with the slide guide bar extended downwardly, and slide guide bar penetrates through support plate, is embedded in two slide guide bars in movable block Between third motor, support plate screw-internal thread fit is connected with the screw rod extended up and down, and screw tip extending end is through support Plate top end surface and with third motor bottom end be connected by power, screw rod bottom extending end through support plate bottom end face simultaneously It is fixedly connected with chuck in end, prepares semiconductor monocrystal column to realize to be controlled automatically under certain temperature and rotating speed, rotating speed Stablize, avoid putting forward the problem uncoordinated with rotating speed, reduce unnecessary manual operation, improves semiconductor and prepare precision, carry High follow-up manufacture semiconductor integrates the quality of disk, is equipped with positioned at the first guide runner right end further through engine base top end surface It cuts disk and cuts body, the splicing chamber for being located at disk cutting organism bottom is equipped in engine base, splicing intracavitary is equipped with loss prevention plate, real Existing semiconductor monocrystal column is coherent with semiconductor wafer cutting work, and cutting is stablized, and cutting speed is fast and high-quality, is solved existing There is equipment prepared by the integrated disk of semiconductor complicated and the incoherent defect of work.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any The change or replacement expected without creative work, should be covered by the protection scope of the present invention.Therefore, of the invention Protection domain should be determined by the scope of protection defined in the claims.

Claims (4)

1. a kind of semiconductor integrates disk manufacturing equipment, including prepared by engine base and the semiconductor column that is arranged at the top of the engine base Body and the disk cutting body for being arranged at the top of the engine base and being prepared positioned at the semiconductor body right end, feature exist In:Be equipped in the engine base be located at the semiconductor column prepare between body and disk cutting body and opening upwards the One guide runner, supporting plate is slidably connected in first guide runner, and the supporting plate screw-internal thread fit is connected with extension up and down And symmetrical first adjusts threaded rod, and described first, which adjusts extending end at the top of threaded rod, runs through the supporting plate, and described the One adjusting threaded rod bottom extending end be connected by power has the first motor, and first motor outer surface is embedded at described the In one guide runner and connection fixed thereto, the supporting plate top end surface are equipped with the guarantors being located among two first adjusting threaded rods Warm cylinder, the semiconductor column prepare the second guide runner that opening upwards are equipped at the top of body, and the second guide runner right end passes through It wears the semiconductor and prepares body right end end face, support plate, the support plate are slidably connected in second guide runner Screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, and described second, which adjusts threaded rod left end extending end power, connects It is connected to the second motor, the support plate top end surface is equipped with the movable block being located at right over the heat-preservation cylinder, the activity Block bottom end face, which is fixedly connected with, to be extended downwardly and symmetrical slide guide bar, and the slide guide bar runs through the support plate, the work The third motor being embedded in motion block among two slide guide bars, the support plate screw-internal thread fit are connected with extension up and down And the screw rod among two slide guide bars, the screw tip extending end through the support plate top end surface and with it is described Third motor bottom end be connected by power, it is solid that screw rod bottom extending end runs through the support plate bottom end face and end Surely it is connected with chuck, circular hole up and down is equipped in the disk cutting machine body, is equipped in the engine base and is located at the circular hole Underface and the splicing chamber communicated, the splicing chamber right end is on engine base right end end face, the splicing chamber bottom interior wall Equipped with loss prevention plate, the circular hole inner circumferential is communicated equipped with annular groove, is equipped in the disk cutting machine body and is located at the annular Groove right end and the first logical therewith cavity are equipped with opening in the disk cutting machine body to the center of circular hole and symmetrical Third guide runner is slidably connected with the hollow runner of external tooth in the annular groove, a left side is equipped in the hollow runner of external tooth Right symmetrical pneumatic actuator, the end face be connected by power oriented circular hole of the pneumatic actuator close to the center of circular hole The push rod that center extends, the push rod run through and put in inside the hollow runner of the external tooth and be fixedly connected with arc folder in end Plate is embedded with the 4th motor in the first cavity bottom inner wall, and the 4th motor top end be connected by power is oriented First rotation axis of upper extension, the first rotation axis top extending end, which puts in first cavity and is equipped in end, to be used With the tooth runner with the ratcheting connection of the hollow runner of the external tooth, moving cutting device is equipped in the third guide runner.
2. a kind of semiconductor according to claim 1 integrates disk manufacturing equipment, it is characterised in that:At the top of the loss prevention plate Top pressure is connected with symmetrical top pressure spring between end face and the splicing chamber bottom interior wall.
3. a kind of semiconductor according to claim 1 integrates disk manufacturing equipment, it is characterised in that:The mobile cutting dress It sets and the slider guide in the third guide runner is set including sliding connection and is arranged in the disk cutting machine body Hydraulic drive actuator, the hydraulic drive actuator is close to the end of the center of circular hole and the slider guide far from described The inner wall be connected by power of center of circular hole, the slider guide is interior to be equipped with groove of the opening to the center of circular hole, is set in the groove There are cutting sheet, the cutting sheet to be equipped with the second rotation axis extended up and down, second rotation axis bottom extending end and institute It states bottom portion of groove inner wall to be rotatably assorted connection, extending end be connected by power has the 5th motor, institute at the top of second rotation axis Third motor outer surface is stated to be embedded in the groove top inner wall and connection fixed thereto.
4. a kind of semiconductor according to claim 1 integrates disk manufacturing equipment, it is characterised in that:The semiconductor column system Standby host body left end end face is equipped with Intelligent control cabinet, the Intelligent control cabinet and all electrical equipment Electricity Federations.
CN201810130824.9A 2018-02-08 2018-02-08 A kind of integrated disk manufacturing equipment of semiconductor Withdrawn CN108327104A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810130824.9A CN108327104A (en) 2018-02-08 2018-02-08 A kind of integrated disk manufacturing equipment of semiconductor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201810130824.9A CN108327104A (en) 2018-02-08 2018-02-08 A kind of integrated disk manufacturing equipment of semiconductor

Publications (1)

Publication Number Publication Date
CN108327104A true CN108327104A (en) 2018-07-27

Family

ID=62928673

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201810130824.9A Withdrawn CN108327104A (en) 2018-02-08 2018-02-08 A kind of integrated disk manufacturing equipment of semiconductor

Country Status (1)

Country Link
CN (1) CN108327104A (en)

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102581975A (en) * 2011-01-12 2012-07-18 硅电子股份公司 Method for cooling a workpiece made of semiconductor material during wire sawing
CN103252845A (en) * 2012-02-19 2013-08-21 上海日进机床有限公司 Two-way diamond wire silicon rod cutting machine
CN203391130U (en) * 2013-06-28 2014-01-15 邢台晶龙电子材料有限公司 Silicon chip cutting device
CN103707426A (en) * 2013-12-30 2014-04-09 镇江市港南电子有限公司 Silicon wafer cutting machine
JP2015046512A (en) * 2013-08-28 2015-03-12 三菱マテリアル株式会社 Silicon ingot cutting device
KR20150060125A (en) * 2013-11-26 2015-06-03 김청균 Hollow roller integrated with composite laminate for wire saw machine
CN105442037A (en) * 2015-12-08 2016-03-30 西安交通大学 High-speed single crystal growth device
CN106319618A (en) * 2016-09-22 2017-01-11 上海交通大学 Equipment and method for manufacturing czochralski silicon rod from silane
CN106346622A (en) * 2016-11-16 2017-01-25 盛江 Single crystal silicon rod slicing equipment for battery production technology
CN107604431A (en) * 2016-07-11 2018-01-19 上海超硅半导体有限公司 N-type monocrystalline silicon manufacturing method and apparatus

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102581975A (en) * 2011-01-12 2012-07-18 硅电子股份公司 Method for cooling a workpiece made of semiconductor material during wire sawing
CN103252845A (en) * 2012-02-19 2013-08-21 上海日进机床有限公司 Two-way diamond wire silicon rod cutting machine
CN203391130U (en) * 2013-06-28 2014-01-15 邢台晶龙电子材料有限公司 Silicon chip cutting device
JP2015046512A (en) * 2013-08-28 2015-03-12 三菱マテリアル株式会社 Silicon ingot cutting device
KR20150060125A (en) * 2013-11-26 2015-06-03 김청균 Hollow roller integrated with composite laminate for wire saw machine
CN103707426A (en) * 2013-12-30 2014-04-09 镇江市港南电子有限公司 Silicon wafer cutting machine
CN105442037A (en) * 2015-12-08 2016-03-30 西安交通大学 High-speed single crystal growth device
CN107604431A (en) * 2016-07-11 2018-01-19 上海超硅半导体有限公司 N-type monocrystalline silicon manufacturing method and apparatus
CN106319618A (en) * 2016-09-22 2017-01-11 上海交通大学 Equipment and method for manufacturing czochralski silicon rod from silane
CN106346622A (en) * 2016-11-16 2017-01-25 盛江 Single crystal silicon rod slicing equipment for battery production technology

Similar Documents

Publication Publication Date Title
CN110508846A (en) A kind of annular blade process units based on numerical control
CN108723417A (en) A kind of multi-function robot servo drive
CN203845942U (en) Bottle cutter
CN108327104A (en) A kind of integrated disk manufacturing equipment of semiconductor
CN219521384U (en) Tool changing mechanism of numerical control lathe
CN108327103A (en) A kind of integrated disk manufacturing equipment of novel semiconductor
CN206623188U (en) A kind of cutter device of artistic bamboo-wood product
CN108391825A (en) It is a kind of that skin equipment is dialled based on robot
CN219152126U (en) Multi-station processing table
CN209022243U (en) A kind of boiling hot turning device of Wheel-type sponge
CN206936085U (en) A kind of pot blank hemming device
CN215039520U (en) Full-automatic daily plastic products unhairing limit device
CN108922859A (en) A kind of wafer flow cutter device
CN203418157U (en) Horizontal numerical-control camshaft milling machine
CN206296947U (en) A kind of PVC protection film productions Sino-U.S. line paper self-adhesive tape parent roll pipe cutting machine
CN212948041U (en) Convenient-to-use glasses rubber plate cutting machine
CN211413914U (en) Cutting table for metal section processing machine
CN108747481A (en) Milling tool with multifunctional blade compensation
CN2216881Y (en) Frame for supporting tools
CN214040624U (en) Intelligent detection device for tap gas testing machine
CN108326735A (en) A kind of equipment for grinding
CN210851394U (en) Automatic cutting type middle frame automatic film sticking machine
CN212713259U (en) Lens cutting device is used in optical lens production
CN107187256A (en) A kind of novel water glass device
CN204431335U (en) A kind of PE inner bag tank mouth finishing machine

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WW01 Invention patent application withdrawn after publication
WW01 Invention patent application withdrawn after publication

Application publication date: 20180727