CN108327104A - A kind of integrated disk manufacturing equipment of semiconductor - Google Patents
A kind of integrated disk manufacturing equipment of semiconductor Download PDFInfo
- Publication number
- CN108327104A CN108327104A CN201810130824.9A CN201810130824A CN108327104A CN 108327104 A CN108327104 A CN 108327104A CN 201810130824 A CN201810130824 A CN 201810130824A CN 108327104 A CN108327104 A CN 108327104A
- Authority
- CN
- China
- Prior art keywords
- semiconductor
- motor
- runner
- guide runner
- circular hole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/02—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills
- B28D5/022—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels
- B28D5/024—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor by rotary tools, e.g. drills by cutting with discs or wheels with the stock carried by a movable support for feeding stock into engagement with the cutting blade, e.g. stock carried by a pivoted arm or a carriage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B28—WORKING CEMENT, CLAY, OR STONE
- B28D—WORKING STONE OR STONE-LIKE MATERIALS
- B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
- B28D5/0058—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material
- B28D5/0082—Accessories specially adapted for use with machines for fine working of gems, jewels, crystals, e.g. of semiconductor material for supporting, holding, feeding, conveying or discharging work
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B15/00—Single-crystal growth by pulling from a melt, e.g. Czochralski method
-
- C—CHEMISTRY; METALLURGY
- C30—CRYSTAL GROWTH
- C30B—SINGLE-CRYSTAL GROWTH; UNIDIRECTIONAL SOLIDIFICATION OF EUTECTIC MATERIAL OR UNIDIRECTIONAL DEMIXING OF EUTECTOID MATERIAL; REFINING BY ZONE-MELTING OF MATERIAL; PRODUCTION OF A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; SINGLE CRYSTALS OR HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; AFTER-TREATMENT OF SINGLE CRYSTALS OR A HOMOGENEOUS POLYCRYSTALLINE MATERIAL WITH DEFINED STRUCTURE; APPARATUS THEREFOR
- C30B29/00—Single crystals or homogeneous polycrystalline material with defined structure characterised by the material or by their shape
- C30B29/02—Elements
- C30B29/06—Silicon
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Mechanical Engineering (AREA)
- Crystallography & Structural Chemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The invention discloses a kind of semiconductors to integrate disk manufacturing equipment, body is prepared including engine base and the semiconductor column being arranged at the top of the engine base and is arranged at the top of the engine base and is prepared positioned at the semiconductor disk cutting body of body right end, it is equipped in the engine base and is located at the semiconductor column and prepares between body and disk cutting body and the first guide runner of opening upwards, it is slidably connected with supporting plate in first guide runner, the supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts threaded rod, described first, which adjusts extending end at the top of threaded rod, runs through the supporting plate, first adjusting threaded rod bottom extending end be connected by power has the first motor, first motor outer surface is embedded in first guide runner and connection fixed thereto；The configuration of the present invention is simple, easy to operate, high degree of automation, meanwhile, improve integrated disk manufacture efficiency and effect.
Description
Technical field
The present invention relates to integrated chip preparing technical field, specifically a kind of semiconductor integrates disk manufacturing equipment.
Background technology
Integrated chip becomes the emphasis paid close attention to for producer as most popular electronic product now, processing and manufacturing,
Middle semiconductor integrates the substrate that disk is prepared as integrated chip, plays the role of key, current integrated disk manufacture and sets
It is standby be all from external import, it is not only expensive but also complicated for operation, it is necessary to which that professional person operates, and keeps early investment cost huge
Greatly, such device is individually to separate in the preparation of semiconductor monocrystal cylinder and cutting process, this is operation further complexity, and
It takes up a large area, preparation efficiency bottom, therefore, is badly in need of a kind of integrated disk manufacturing equipment of semiconductor at present.
Invention content
Technical problem to be solved by the invention is to provide a kind of semiconductors to integrate disk manufacturing equipment, can solve
State the problems in present technology.
The present invention is achieved through the following technical solutions：A kind of semiconductor of the present invention integrates disk manufacturing equipment,
Body is prepared including engine base and the semiconductor column being arranged at the top of the engine base and is arranged at the top of the engine base and is located at institute
The disk cutting body that semiconductor prepares body right end is stated, is equipped in the engine base and prepares body and institute positioned at the semiconductor column
It states between disk cutting body and the first guide runner of opening upwards, is slidably connected with supporting plate in first guide runner,
The supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts threaded rod, and described first adjusts threaded rod
Top extending end runs through the supporting plate, and first adjusting threaded rod bottom extending end be connected by power has the first motor,
First motor outer surface is embedded in first guide runner and connection fixed thereto, is set in the supporting plate top end surface
There is the heat preservation cylinder adjusted among threaded rod positioned at two first, prepared by the semiconductor column is equipped with opening upwards at the top of body
Second guide runner, the second guide runner right end prepare body right end end face through the semiconductor, in second guide runner
It is slidably connected with support plate, the support plate screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, described
Second adjusting threaded rod left end extending end be connected by power has the second motor, and the support plate top end surface, which is equipped with, is located at institute
State the movable block right over heat-preservation cylinder, the movable block bottom end face, which is fixedly connected with, to be extended downwardly and symmetrical slide guide bar,
The slide guide bar runs through the support plate, the third motor being embedded in the movable block among two slide guide bars, institute
It states support plate screw-internal thread fit and is connected with the screw rod for extending up and down and being located among two slide guide bars, the screw tip extends end
End through the support plate top end surface and with the third motor bottom end be connected by power, the screw rod bottom extends end
The support plate bottom end face is run through at end and end is fixedly connected with chuck, is equipped with up and down in the disk cutting machine body
Circular hole, the engine base is interior to be equipped with the splicing chamber for being located at and immediately below the circular hole and communicating, and the splicing chamber right end runs through the machine
Seat right end end face, the splicing chamber bottom interior wall are equipped with loss prevention plate, and the circular hole inner circumferential is communicated equipped with annular groove, described
It is equipped with the first logical positioned at the annular groove right end and therewith cavity in disk cutting machine body, is set in the disk cutting machine body
There is opening to the center of circular hole and symmetrical third guide runner, it is hollow to be slidably connected with external tooth in the annular groove
Runner, the interior pneumatic actuator symmetrical equipped with left and right of the hollow runner of external tooth, the pneumatic actuator is close to the circular hole
The push rod that the oriented center of circular hole of end face be connected by power at center extends, the push rod run through and put in hollow turn of the external tooth
Wheel is internal and is fixedly connected with curved splint in end, and the 4th motor is embedded in the first cavity bottom inner wall, described
4th motor top end be connected by power has the first rotation axis upwardly extended, the first rotation axis top extending end to stretch
It is equipped with to the tooth runner with the ratcheting connection of the hollow runner of the external tooth in into first cavity and in end, the third is led
Moving cutting device is equipped in sliding slot.
Preferably technical solution, top pressure connects between the loss prevention plate top end surface and the splicing chamber bottom interior wall
There is symmetrical top pressure spring.
Preferably technical solution, the moving cutting device include that sliding connection is arranged in the third slide guide
Slider guide in slot and the hydraulic drive actuator being arranged in the disk cutting machine body, the hydraulic drive actuator lean on
The end of the nearly center of circular hole and inner wall be connected by power of the slider guide far from the center of circular hole are set in the slider guide
There is groove of the opening to the center of circular hole, be equipped with cutting sheet in the groove, the cutting sheet is equipped with the extended up and down
Two rotation axis, second rotation axis bottom extending end are rotatably assorted with the bottom portion of groove inner wall and connect, described second turn
Extending end be connected by power has the 5th motor, third motor outer surface to be embedded in the groove top at the top of moving axis
In wall and connection fixed thereto.
Preferably technical solution, the semiconductor column prepares body left end end face and is equipped with Intelligent control cabinet, described
Intelligent control cabinet and all electrical equipment Electricity Federations.
The beneficial effects of the invention are as follows：The configuration of the present invention is simple, easy to operate, the first guide runner of setting in engine base, first
Supporting plate is slidably connected in guide runner, supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts screw thread
Bar, first, which adjusts extending end at the top of threaded rod, runs through supporting plate, and first adjusts threaded rod bottom extending end be connected by power first
Motor, the first motor outer surface is embedded in the first guide runner bottom interior wall and connection fixed thereto, fixed at the top of supporting plate
Equipped with heat-preservation cylinder, engine base top end surface left end prepares body equipped with semiconductor wafer, and prepared by semiconductor wafer is equipped at the top of body
Second guide runner of opening upwards, right end prepares body right end end face, the second slide guide through semiconductor wafer in the second guide runner
It is slidably connected with support plate in slot, support plate screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, and second
Adjusting threaded rod left end extending end be connected by power has the second motor, the second motor outer surface to be embedded at the second guide runner left side
It holds in inner wall and connection fixed thereto, support plate top end surface is equipped with the movable block being located at right over heat-preservation cylinder, movable block bottom
End surface is equipped with the slide guide bar extended downwardly, and slide guide bar penetrates through support plate, is embedded in two slide guide bars in movable block
Between third motor, support plate screw-internal thread fit is connected with the screw rod extended up and down, and screw tip extending end is through support
Plate top end surface and with third motor bottom end be connected by power, screw rod bottom extending end through support plate bottom end face simultaneously
It is fixedly connected with chuck in end, prepares semiconductor monocrystal column to realize to be controlled automatically under certain temperature and rotating speed, rotating speed
Stablize, avoid putting forward the problem uncoordinated with rotating speed, reduce unnecessary manual operation, improves semiconductor and prepare precision, carry
High follow-up manufacture semiconductor integrates the quality of disk, is equipped with positioned at the first guide runner right end further through engine base top end surface
It cuts disk and cuts body, the splicing chamber for being located at disk cutting organism bottom is equipped in engine base, splicing intracavitary is equipped with loss prevention plate, real
Existing semiconductor monocrystal column is coherent with semiconductor wafer cutting work, and cutting is stablized, and cutting speed is fast and high-quality, is solved existing
There is equipment prepared by the integrated disk of semiconductor complicated and the incoherent defect of work.
Description of the drawings
The present invention is described in detail by following specific embodiment and attached drawing for ease of explanation,.
Fig. 1 is that a kind of semiconductor of the present invention integrates disk manufacturing equipment overall structure diagram；
Fig. 2 is that the disk of the present invention cuts internal body structural schematic diagram；
Fig. 3 is the structural schematic diagram of A in Fig. 2；
Fig. 4 is the structural schematic diagram of B in Fig. 2.
Specific implementation mode
As Figure 1-Figure 4, a kind of semiconductor of the invention integrates disk manufacturing equipment, including engine base 100 and setting
Semiconductor column at 100 top of the engine base prepares body 102 and setting at 100 top of the engine base and is located at the semiconductor
The disk cutting body 113 of 102 right end of body is prepared, is equipped in the engine base 100 and prepares body 102 positioned at the semiconductor column
Between the disk cutting body 113 and the first guide runner 117 of opening upwards, the interior sliding of first guide runner 117 are matched
Conjunction is connected with supporting plate 118, and 118 screw-internal thread fit of the supporting plate is connected with extension up and down and symmetrical first adjusts threaded rod
120, described first, which adjusts 120 top extending end of threaded rod, runs through the supporting plate 118, and described first adjusts 120 bottom of threaded rod
Portion's extending end be connected by power has the first motor 119,119 outer surface of the first motor to be embedded at first guide runner
In 117 and connection fixed thereto, 118 top end surface of the supporting plate are equipped among two first adjusting threaded rods 120
Cylinder 110 is kept the temperature, the semiconductor column prepares the second guide runner that 102 top of body is equipped with opening upwards, second slide guide
Slot right end prepares 102 right end end face of body through the semiconductor, and support plate is slidably connected in second guide runner
104,104 screw-internal thread fit of the support plate is connected with left and right extends second and adjusts threaded rod 105, and described second adjusts screw thread
105 left end extending end be connected by power of bar has the second motor 103,104 top end surface of the support plate to be equipped with positioned at described
Movable block 106 right over heat-preservation cylinder 110,106 bottom end face of the movable block, which is fixedly connected with, to be extended downwardly and symmetrical
Slide guide bar 108, the slide guide bar 108 run through the support plate 104, are embedded with positioned at two slide guide bars in the movable block 106
Third motor 107 among 108,104 screw-internal thread fit of the support plate is connected with to be extended and is located at two slide guide bars up and down
Screw rod 109 among 108,109 top extending end of the screw rod through 104 top end surface of the support plate and with the third
107 bottom end be connected by power of motor, 109 bottom extending end of the screw rod through 104 bottom end face of the support plate and
End is fixedly connected with chuck 111, and circular hole 129 up and down, the engine base 100 are equipped in the disk cutting body 113
Interior to be equipped with the splicing chamber 114 for being located at and immediately below the circular hole 129 and communicating, 114 right end of splicing chamber runs through the engine base 100
Right end end face, 114 bottom interior wall of splicing chamber are equipped with loss prevention plate 115, and 129 inner circumferential of the circular hole communicates recessed equipped with annular
Slot 121, the disk cutting body 113 is interior to be equipped with the first logical positioned at 121 right end of the annular groove and therewith cavity 128,
It is equipped with the third guide runner 130 to 129 center of the circular hole and symmetrical that is open, the ring in the disk cutting body 113
The hollow runner 122 of external tooth is slidably connected in connected in star 121, the hollow runner 122 of external tooth is interior symmetrical equipped with left and right
Pneumatic actuator 123, the oriented circle of end face be connected by power of the pneumatic actuator 123 close to 129 center of the circular hole
The push rod that 129 center of hole extends, the push rod run through and put in hollow 122 inside of runner of the external tooth and be fixedly connected in end
There is curved splint 124, the 4th motor 125, the 4th motor 125 are embedded in 128 bottom interior wall of the first cavity
Top end be connected by power has the first rotation axis 126 upwardly extended, first rotation axis, 126 top extending end to put in institute
It states in the first cavity 128 and is equipped with to the tooth runner 127 with the hollow 122 ratcheting connection of runner of the external tooth in end, it is described
Moving cutting device is equipped in third guide runner 130.
Valuably, top pressure is connected with relatively between 115 top end surface of loss prevention plate and 114 bottom interior wall of splicing chamber
The top pressure spring 116 of title prevents the semiconductor after cutting from integrating disk and breaks..
Valuably, the moving cutting device includes that leading in the third guide runner 130 is arranged in sliding connection
Sliding block 133 and the hydraulic drive actuator 134 being arranged in disk cutting body 113, the hydraulic drive actuator
134 end and inner wall be connected by power of the slider guide 133 far from 129 center of the circular hole close to 129 center of the circular hole,
It is equipped with groove 132 of the opening to 129 center of the circular hole in the slider guide 133, cutting sheet 135 is equipped in the groove 132,
The cutting sheet 135 is equipped with the second rotation axis 136 extended up and down, second rotation axis, 136 bottom extending end and institute
It states 132 bottom interior wall of groove to be rotatably assorted connection, second rotation axis, 136 top extending end be connected by power has the 5th electronic
Machine 131,131 outer surface of third motor is embedded in 132 top inner wall of the groove and connection fixed thereto, convenient for certainly
Dynamic control cutting sheet 135 is moved to center of circular hole, increases depth of cut, improves cutting efficiency.
Valuably, the semiconductor column prepares 102 left end end face of body and is equipped with Intelligent control cabinet 101, the intelligence control
Cabinet 101 processed and all electrical equipment Electricity Federations, are convenient for intelligent controlling device automatic operating, improve semiconductor and integrate disk manufacture effect
Rate and effect.
When original state, supporting plate 118 is located at 117 bottommost of the first guide runner, at this point, heat-preservation cylinder 110 is fully located at first
In guide runner 117, support plate 104 is located at the second guide runner left end, 106 bottom end face of movable block and 104 top end of support plate
Face abuts against, and utmostly open configuration, slider guide 133 are fully located in third guide runner 130 curved splint 124, make cutting
Piece 135 is fully located in third guide runner 130.
When needing manufacture semiconductor to integrate disk work, device is integrally powered, liquid is added in heat-preservation cylinder 110
High-purity polycrystalline silicon fixes monocrystalline silicon kind on chuck 111, at this point, the first motor 119 of control drives first to adjust threaded rod
120 rotations, the first adjusting threaded rod 120 drive supporting plate 118 to move up, and supporting plate 118 drives heat-preservation cylinder 110 to move up, when monocrystalline silicon kind
When touching liquid level surface layer, the first motor 119 of control shuts down, meanwhile, control third motor 107 drives screw rod 109
Rotation, screw rod 109 move up and movable block 106 are driven to move up, and screw rod 109 drives monocrystalline silicon kind to rotate and move up simultaneously, when
Final solidified monocrystalline silicon column is just formed, at this point, control third motor 107 shuts down, meanwhile, control the first motor
119, which drive first to adjust threaded rod 120, inverts, and so that supporting plate 118 is moved down, is led when supporting plate 118 drives heat-preservation cylinder 110 to be moved to first
When 117 bottommost of sliding slot, heat-preservation cylinder 110 is fully stowed into the first guide runner 117, at this point, the first motor 119 of control stops
Operating, meanwhile, the second motor 103 of control drives the second adjusting rotation of threaded rod 105 that support plate 104 is made to move to right, and works as monocrystalline silicon
When column is located at 129 surface of circular hole, control third motor 107, which drives screw rod 109 to rotate backward, makes monocrystalline silicon column move down, and works as list
Crystal silicon column is located in curved splint 124, and the control operating of pneumatic actuator 123 makes curved splint 124 move towards to clamp list
Crystal silicon column, at this point, the 4th motor 125 of control is rotated with moving teeth runner 127, tooth runner 127 drives hollow 122 turns of the runner of external tooth
It is dynamic, to drive the rotation of monocrystalline silicon column that it is made to be detached with stud 109, at this point, continuing to control 107 drive stud of third motor
109 rotations make it move down and push the monocrystalline silicon column of clamping, when monocrystalline silicon column is moved to 135 place plane of cutting sheet, control
Third motor 107 shuts down, meanwhile, it controls the 5th motor 131 and hydraulic drive actuator 134 operates, the 5th is electronic
Machine 131 drives the rotation of the second rotation axis 136, the second rotation axis 136 that cutting sheet 135 is driven to rotate, and hydraulic drive actuator 134 pushes away
Dynamic slider guide 133 is moved to monocrystalline silicon column direction, to complete to stablize the cutting monocrystalline silicon column gradually stretched into, is cut into the list of sheet
Crystal silicon disk is then fallen on loss prevention plate 115, then following process processing to be removed.
The beneficial effects of the invention are as follows：The configuration of the present invention is simple, easy to operate, the first guide runner of setting in engine base, first
Supporting plate is slidably connected in guide runner, supporting plate screw-internal thread fit is connected with extension up and down and symmetrical first adjusts screw thread
Bar, first, which adjusts extending end at the top of threaded rod, runs through supporting plate, and first adjusts threaded rod bottom extending end be connected by power first
Motor, the first motor outer surface is embedded in the first guide runner bottom interior wall and connection fixed thereto, fixed at the top of supporting plate
Equipped with heat-preservation cylinder, engine base top end surface left end prepares body equipped with semiconductor wafer, and prepared by semiconductor wafer is equipped at the top of body
Second guide runner of opening upwards, right end prepares body right end end face, the second slide guide through semiconductor wafer in the second guide runner
It is slidably connected with support plate in slot, support plate screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, and second
Adjusting threaded rod left end extending end be connected by power has the second motor, the second motor outer surface to be embedded at the second guide runner left side
It holds in inner wall and connection fixed thereto, support plate top end surface is equipped with the movable block being located at right over heat-preservation cylinder, movable block bottom
End surface is equipped with the slide guide bar extended downwardly, and slide guide bar penetrates through support plate, is embedded in two slide guide bars in movable block
Between third motor, support plate screw-internal thread fit is connected with the screw rod extended up and down, and screw tip extending end is through support
Plate top end surface and with third motor bottom end be connected by power, screw rod bottom extending end through support plate bottom end face simultaneously
It is fixedly connected with chuck in end, prepares semiconductor monocrystal column to realize to be controlled automatically under certain temperature and rotating speed, rotating speed
Stablize, avoid putting forward the problem uncoordinated with rotating speed, reduce unnecessary manual operation, improves semiconductor and prepare precision, carry
High follow-up manufacture semiconductor integrates the quality of disk, is equipped with positioned at the first guide runner right end further through engine base top end surface
It cuts disk and cuts body, the splicing chamber for being located at disk cutting organism bottom is equipped in engine base, splicing intracavitary is equipped with loss prevention plate, real
Existing semiconductor monocrystal column is coherent with semiconductor wafer cutting work, and cutting is stablized, and cutting speed is fast and high-quality, is solved existing
There is equipment prepared by the integrated disk of semiconductor complicated and the incoherent defect of work.
The above description is merely a specific embodiment, but scope of protection of the present invention is not limited thereto, any
The change or replacement expected without creative work, should be covered by the protection scope of the present invention.Therefore, of the invention
Protection domain should be determined by the scope of protection defined in the claims.
Claims (4)
1. a kind of semiconductor integrates disk manufacturing equipment, including prepared by engine base and the semiconductor column that is arranged at the top of the engine base
Body and the disk cutting body for being arranged at the top of the engine base and being prepared positioned at the semiconductor body right end, feature exist
In：Be equipped in the engine base be located at the semiconductor column prepare between body and disk cutting body and opening upwards the
One guide runner, supporting plate is slidably connected in first guide runner, and the supporting plate screw-internal thread fit is connected with extension up and down
And symmetrical first adjusts threaded rod, and described first, which adjusts extending end at the top of threaded rod, runs through the supporting plate, and described the
One adjusting threaded rod bottom extending end be connected by power has the first motor, and first motor outer surface is embedded at described the
In one guide runner and connection fixed thereto, the supporting plate top end surface are equipped with the guarantors being located among two first adjusting threaded rods
Warm cylinder, the semiconductor column prepare the second guide runner that opening upwards are equipped at the top of body, and the second guide runner right end passes through
It wears the semiconductor and prepares body right end end face, support plate, the support plate are slidably connected in second guide runner
Screw-internal thread fit is connected with left and right extends second and adjusts threaded rod, and described second, which adjusts threaded rod left end extending end power, connects
It is connected to the second motor, the support plate top end surface is equipped with the movable block being located at right over the heat-preservation cylinder, the activity
Block bottom end face, which is fixedly connected with, to be extended downwardly and symmetrical slide guide bar, and the slide guide bar runs through the support plate, the work
The third motor being embedded in motion block among two slide guide bars, the support plate screw-internal thread fit are connected with extension up and down
And the screw rod among two slide guide bars, the screw tip extending end through the support plate top end surface and with it is described
Third motor bottom end be connected by power, it is solid that screw rod bottom extending end runs through the support plate bottom end face and end
Surely it is connected with chuck, circular hole up and down is equipped in the disk cutting machine body, is equipped in the engine base and is located at the circular hole
Underface and the splicing chamber communicated, the splicing chamber right end is on engine base right end end face, the splicing chamber bottom interior wall
Equipped with loss prevention plate, the circular hole inner circumferential is communicated equipped with annular groove, is equipped in the disk cutting machine body and is located at the annular
Groove right end and the first logical therewith cavity are equipped with opening in the disk cutting machine body to the center of circular hole and symmetrical
Third guide runner is slidably connected with the hollow runner of external tooth in the annular groove, a left side is equipped in the hollow runner of external tooth
Right symmetrical pneumatic actuator, the end face be connected by power oriented circular hole of the pneumatic actuator close to the center of circular hole
The push rod that center extends, the push rod run through and put in inside the hollow runner of the external tooth and be fixedly connected with arc folder in end
Plate is embedded with the 4th motor in the first cavity bottom inner wall, and the 4th motor top end be connected by power is oriented
First rotation axis of upper extension, the first rotation axis top extending end, which puts in first cavity and is equipped in end, to be used
With the tooth runner with the ratcheting connection of the hollow runner of the external tooth, moving cutting device is equipped in the third guide runner.
2. a kind of semiconductor according to claim 1 integrates disk manufacturing equipment, it is characterised in that：At the top of the loss prevention plate
Top pressure is connected with symmetrical top pressure spring between end face and the splicing chamber bottom interior wall.
3. a kind of semiconductor according to claim 1 integrates disk manufacturing equipment, it is characterised in that：The mobile cutting dress
It sets and the slider guide in the third guide runner is set including sliding connection and is arranged in the disk cutting machine body
Hydraulic drive actuator, the hydraulic drive actuator is close to the end of the center of circular hole and the slider guide far from described
The inner wall be connected by power of center of circular hole, the slider guide is interior to be equipped with groove of the opening to the center of circular hole, is set in the groove
There are cutting sheet, the cutting sheet to be equipped with the second rotation axis extended up and down, second rotation axis bottom extending end and institute
It states bottom portion of groove inner wall to be rotatably assorted connection, extending end be connected by power has the 5th motor, institute at the top of second rotation axis
Third motor outer surface is stated to be embedded in the groove top inner wall and connection fixed thereto.
4. a kind of semiconductor according to claim 1 integrates disk manufacturing equipment, it is characterised in that：The semiconductor column system
Standby host body left end end face is equipped with Intelligent control cabinet, the Intelligent control cabinet and all electrical equipment Electricity Federations.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810130824.9A CN108327104A (en) | 2018-02-08 | 2018-02-08 | A kind of integrated disk manufacturing equipment of semiconductor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810130824.9A CN108327104A (en) | 2018-02-08 | 2018-02-08 | A kind of integrated disk manufacturing equipment of semiconductor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108327104A true CN108327104A (en) | 2018-07-27 |
Family
ID=62928673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810130824.9A Withdrawn CN108327104A (en) | 2018-02-08 | 2018-02-08 | A kind of integrated disk manufacturing equipment of semiconductor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108327104A (en) |
Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581975A (en) * | 2011-01-12 | 2012-07-18 | 硅电子股份公司 | Method for cooling a workpiece made of semiconductor material during wire sawing |
| CN103252845A (en) * | 2012-02-19 | 2013-08-21 | 上海日进机床有限公司 | Two-way diamond wire silicon rod cutting machine |
| CN203391130U (en) * | 2013-06-28 | 2014-01-15 | 邢台晶龙电子材料有限公司 | Silicon chip cutting device |
| CN103707426A (en) * | 2013-12-30 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer cutting machine |
| JP2015046512A (en) * | 2013-08-28 | 2015-03-12 | 三菱マテリアル株式会社 | Silicon ingot cutting device |
| KR20150060125A (en) * | 2013-11-26 | 2015-06-03 | 김청균 | Hollow roller integrated with composite laminate for wire saw machine |
| CN105442037A (en) * | 2015-12-08 | 2016-03-30 | 西安交通大学 | High-speed single crystal growth device |
| CN106319618A (en) * | 2016-09-22 | 2017-01-11 | 上海交通大学 | Equipment and method for manufacturing czochralski silicon rod from silane |
| CN106346622A (en) * | 2016-11-16 | 2017-01-25 | 盛江 | Single crystal silicon rod slicing equipment for battery production technology |
| CN107604431A (en) * | 2016-07-11 | 2018-01-19 | 上海超硅半导体有限公司 | N-type monocrystalline silicon manufacturing method and apparatus |
-
2018
- 2018-02-08 CN CN201810130824.9A patent/CN108327104A/en not_active Withdrawn
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102581975A (en) * | 2011-01-12 | 2012-07-18 | 硅电子股份公司 | Method for cooling a workpiece made of semiconductor material during wire sawing |
| CN103252845A (en) * | 2012-02-19 | 2013-08-21 | 上海日进机床有限公司 | Two-way diamond wire silicon rod cutting machine |
| CN203391130U (en) * | 2013-06-28 | 2014-01-15 | 邢台晶龙电子材料有限公司 | Silicon chip cutting device |
| JP2015046512A (en) * | 2013-08-28 | 2015-03-12 | 三菱マテリアル株式会社 | Silicon ingot cutting device |
| KR20150060125A (en) * | 2013-11-26 | 2015-06-03 | 김청균 | Hollow roller integrated with composite laminate for wire saw machine |
| CN103707426A (en) * | 2013-12-30 | 2014-04-09 | 镇江市港南电子有限公司 | Silicon wafer cutting machine |
| CN105442037A (en) * | 2015-12-08 | 2016-03-30 | 西安交通大学 | High-speed single crystal growth device |
| CN107604431A (en) * | 2016-07-11 | 2018-01-19 | 上海超硅半导体有限公司 | N-type monocrystalline silicon manufacturing method and apparatus |
| CN106319618A (en) * | 2016-09-22 | 2017-01-11 | 上海交通大学 | Equipment and method for manufacturing czochralski silicon rod from silane |
| CN106346622A (en) * | 2016-11-16 | 2017-01-25 | 盛江 | Single crystal silicon rod slicing equipment for battery production technology |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US4191501A (en) | Plastic lens cutter and edger | |
| CN203845942U (en) | Bottle cutter | |
| CN108327104A (en) | A kind of integrated disk manufacturing equipment of semiconductor | |
| CN216633722U (en) | Workpiece chamfering and polishing equipment | |
| CN209022243U (en) | A kind of boiling hot turning device of Wheel-type sponge | |
| CN219521384U (en) | Tool changing mechanism of numerical control lathe | |
| CN108327103A (en) | A kind of integrated disk manufacturing equipment of novel semiconductor | |
| CN112059863B (en) | Coarse-fine grinding and polishing integrated grinding tool | |
| CN206623188U (en) | A kind of cutter device of artistic bamboo-wood product | |
| CN108391825A (en) | It is a kind of that skin equipment is dialled based on robot | |
| CN219152126U (en) | Multi-station processing table | |
| CN215469537U (en) | Automatic rotating device for numerical control precision machining | |
| CN108922859A (en) | A kind of wafer flow cutter device | |
| CN203418157U (en) | Horizontal numerical-control camshaft milling machine | |
| CN206296947U (en) | A kind of PVC protection film productions Sino-U.S. line paper self-adhesive tape parent roll pipe cutting machine | |
| CN212948041U (en) | Convenient-to-use glasses rubber plate cutting machine | |
| CN211413914U (en) | Cutting table for metal section processing machine | |
| CN108747481A (en) | Milling tool with multifunctional blade compensation | |
| CN2216881Y (en) | Frame for supporting tools | |
| CN108405907B (en) | A kind of manufacturing device | |
| CN221203952U (en) | Automatic back opening machine for yellow croaker processing | |
| CN220935788U (en) | Adjustable apple planting trimming means | |
| CN212713259U (en) | Lens cutting device is used in optical lens production | |
| CN107187256A (en) | A kind of novel water glass device | |
| CN108747641A (en) | A kind of multifunctional accurate bearing |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20180727 |