CN108321140A - A kind of chip package ultrasonic welding process - Google Patents
A kind of chip package ultrasonic welding process Download PDFInfo
- Publication number
- CN108321140A CN108321140A CN201810045541.4A CN201810045541A CN108321140A CN 108321140 A CN108321140 A CN 108321140A CN 201810045541 A CN201810045541 A CN 201810045541A CN 108321140 A CN108321140 A CN 108321140A
- Authority
- CN
- China
- Prior art keywords
- arcing
- chip
- ultrasonic welding
- bank
- welding process
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K20/00—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating
- B23K20/10—Non-electric welding by applying impact or other pressure, with or without the application of heat, e.g. cladding or plating making use of vibrations, e.g. ultrasonic welding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48095—Kinked
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
- Wire Bonding (AREA)
Abstract
The invention discloses a kind of chip package ultrasonic welding processes, include the following steps：Step 1 plants soldered ball；Step 2 folds ball；Step 3, looping are got ready；Wherein, in upward looping arcing, arcing certain altitude vertical first, subsequent horizontal arcing is to the edge beyond chip, and finally arcing forms platform bank to frame pin obliquely；Step 3 chip is put into reflow machine, carries out Reflow Soldering by step 4.In present invention process, in upward looping arcing, arcing certain altitude vertical first, subsequent horizontal arcing is to the edge for exceeding chip, finally arcing forms platform bank to frame pin obliquely, thus the case where can not only avoiding generating triangle arc, being also prevented from bank deformation touches chip simultaneously, efficiently solves the problems, such as that short circuit occurs for chip.Present invention process reasonable design is suitble to promote the use of.
Description
Technical field
The present invention relates to chip package manufacturing technology field, specifically a kind of chip package ultrasonic welding process.
Background technology
In chip package manufacturing process, usually it is required for carrying out ultrasonic welding operation.Currently, existing chip package
Ultrasonic bonding is typically all to be got ready using arcing to carry out looping, but during arcing, often will appear triangle arc
The case where, the reliability of product can be thus reduced, defective products is generated；Moreover, these camber lines can occur because of gravity
Deformation results in camber line and is in contact with chip edge, be easy to cause chip short circuit, reduces the reliability of product.
Invention content
In order to overcome the above-mentioned deficiencies of the prior art, the object of the present invention is to provide a kind of higher chip packages of reliability
Ultrasonic welding process.
The present invention by using following technical scheme by realizing above-mentioned purpose：
A kind of chip package ultrasonic welding process, includes the following steps：
Step 1 plants soldered ball：Tin silk is heated using pellet bonding machine, each needs the pressure area of bonding wire in chip, it is pre- to plant
One tin ball；
Step 2 folds ball：Welding wire is heated using pellet bonding machine, bond ball is stacked on tin ball；
Step 3, looping are got ready：After stacking bond ball, upward looping arcing to frame pin forms bank；
Wherein, in upward looping arcing, arcing certain altitude vertical first, subsequent horizontal arcing to the side beyond chip
Edge, finally arcing forms platform bank to frame pin obliquely；
Step 3 chip is put into reflow machine, carries out Reflow Soldering by step 4.
Preferably, in step 3, the angle between the bank of the bank of horizontal arcing and obliquely arcing is 100-145
Degree, can thus realize that the bank of arcing obliquely is supported the bank of horizontal arcing.
Preferably, in step 3, the loop height of vertical arcing is in 10 ± 0.5mm.
Preferably, in step 3, the diameter of bank is between 22-25um.
Preferably, in step 1, pellet bonding machine temperature be 200 ± 2 DEG C, the tin ball apart from welding zone central point offset not
More than 0.3mm.
Preferably, in step 1, the loop height of pellet bonding machine is 5mm, and reversion height is 11mm, and reversal distance is
79mm, reverse angle are -20 degree.
Preferably, the chip is mounted on frame Ji Dao, and glue is equipped between the chip and frame base island.
The beneficial effects of the invention are as follows：Compared with the existing technology, in the ultrasonic Welding of the present invention, in upward looping arcing
When, arcing certain altitude vertical first, subsequent horizontal arcing to the edge for exceeding chip, finally obliquely arcing to frame tube
Foot forms platform bank.The case where to avoid generating triangle arc, while being also prevented from bank deformation and touching
Chip efficiently solves the problems, such as that short circuit occurs for chip.
Description of the drawings
The present invention will further illustrate by specific embodiment and with reference to the appended drawing, wherein：
Fig. 1 is conventional ultrasonic welding process schematic diagram；
Fig. 2 is abnormal ultrasonic welding process schematic diagram；
Fig. 3 is ultrasonic welding process schematic diagram of the present invention.
In figure：1. chip, 2. tin balls, 3. bond balls, 4. frame pins, 5. frame Ji Dao, 6. glue.
Specific implementation mode
In conjunction with the accompanying drawings, the present invention is further explained in detail.These attached drawings are simplified schematic diagram, only with
Illustration illustrates the basic structure of the present invention, therefore it only shows the composition relevant to the invention.
As shown in Figure 1 to Figure 3, a kind of chip package ultrasonic welding process, includes the following steps：
Step 1 plants soldered ball：Tin silk is heated using pellet bonding machine, each needs the pressure area of bonding wire in chip 1, it is pre- to plant
One tin ball 2；
Step 2 folds ball：Welding wire is heated using pellet bonding machine, bond ball 3 is stacked on tin ball 2；
Step 3, looping are got ready：After stacking bond ball 3, upward looping arcing to frame pin 4 forms bank；
Wherein, in upward looping arcing, arcing certain altitude vertical first, subsequent horizontal arcing is to exceeding chip 1
Edge, finally arcing forms platform bank to frame pin 4 obliquely；
Step 3 chip 1 is put into reflow machine, carries out Reflow Soldering by step 4.
In step 3, the angle between the bank of the bank of horizontal arcing and obliquely arcing is 100-145 degree；In step
In rapid three, the loop height of vertical arcing is in 10 ± 0.5mm；In step 3, the diameter of bank is between 22-25um；In step
In rapid one, pellet bonding machine temperature is 200 ± 2 DEG C, and the tin ball 2 is no more than 0.3mm apart from welding zone central point offset；In step 1
In, the loop height of pellet bonding machine is 5mm, and reversion height is 11mm, and reversal distance 79mm, reverse angle is -20 degree；The core
Piece 1 is mounted on frame base island 5, and glue 6 is equipped between the chip 1 and frame base island 5.
Above-described embodiment is only limitted to illustrate design and the technical characteristic of the present invention, and its object is to allow those skilled in the art
Member understands the technical solution and embodiment of invention, can not limit the scope of the invention accordingly.It is every according to the present invention
Equivalent replacement or equivalence changes made by technical solution, should be covered by the protection scope of the present invention.
Claims (7)
1. a kind of chip package ultrasonic welding process, it is characterised in that：Include the following steps：
Step 1 plants soldered ball：Tin silk is heated using pellet bonding machine, each needs the pressure area of bonding wire in chip, it is pre- to plant one
Tin ball；
Step 2 folds ball：Welding wire is heated using pellet bonding machine, bond ball is stacked on tin ball；
Step 3, looping are got ready：After stacking bond ball, upward looping arcing to frame pin forms bank；
Wherein, in upward looping arcing, arcing certain altitude vertical first, subsequent horizontal arcing to the edge beyond chip,
Finally arcing forms platform bank to frame pin obliquely；
Chip obtained by step 3 is put into reflow machine, carries out Reflow Soldering by step 4.
2. chip package ultrasonic welding process according to claim 1, it is characterised in that：In step 3, level is drawn
Angle between the bank of the bank of arc and obliquely arcing is 100-145 degree.
3. chip package ultrasonic welding process according to claim 1, it is characterised in that：It is vertical to draw in step 3
The loop height of arc is in 10 ± 0.5mm.
4. chip package ultrasonic welding process according to claim 1, it is characterised in that：In step 3, bank
Diameter is between 22-25um.
5. chip package ultrasonic welding process according to any one of claims 1 to 4, it is characterised in that：In step 1
In, pellet bonding machine temperature is 200 ± 2 DEG C, and the tin ball is no more than 0.3mm apart from welding zone central point offset.
6. chip package ultrasonic welding process according to claim 5, it is characterised in that：In step 1, pellet bonding machine
Loop height be 5mm, reversion height be 11mm, reversal distance 79mm, reverse angle be -20 degree.
7. chip package ultrasonic welding process according to claim 1, it is characterised in that：The chip is mounted on frame
On Ji Dao, glue is equipped between the chip and frame base island.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810045541.4A CN108321140B (en) | 2018-01-17 | 2018-01-17 | A kind of chip package ultrasonic welding process |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810045541.4A CN108321140B (en) | 2018-01-17 | 2018-01-17 | A kind of chip package ultrasonic welding process |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108321140A true CN108321140A (en) | 2018-07-24 |
| CN108321140B CN108321140B (en) | 2019-11-05 |
Family
ID=62894591
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810045541.4A Active CN108321140B (en) | 2018-01-17 | 2018-01-17 | A kind of chip package ultrasonic welding process |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108321140B (en) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202111073U (en) * | 2011-07-08 | 2012-01-11 | 深圳电通纬创微电子股份有限公司 | High-low bonding wire structure of integrated circuit |
| CN104241152A (en) * | 2014-08-21 | 2014-12-24 | 深圳电通纬创微电子股份有限公司 | Chip packaging method based on copper ball plane prepressing |
| CN106252246A (en) * | 2016-08-30 | 2016-12-21 | 长电科技（滁州）有限公司 | Welding wire bonding technology that a kind of stannum bag is wrapped up in and chip packaging method |
-
2018
- 2018-01-17 CN CN201810045541.4A patent/CN108321140B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202111073U (en) * | 2011-07-08 | 2012-01-11 | 深圳电通纬创微电子股份有限公司 | High-low bonding wire structure of integrated circuit |
| CN104241152A (en) * | 2014-08-21 | 2014-12-24 | 深圳电通纬创微电子股份有限公司 | Chip packaging method based on copper ball plane prepressing |
| CN106252246A (en) * | 2016-08-30 | 2016-12-21 | 长电科技（滁州）有限公司 | Welding wire bonding technology that a kind of stannum bag is wrapped up in and chip packaging method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108321140B (en) | 2019-11-05 |
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