CN108321127A - A kind of plastic package method and the packaging body using plastic package method preparation - Google Patents
A kind of plastic package method and the packaging body using plastic package method preparation Download PDFInfo
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- CN108321127A CN108321127A CN201711435262.0A CN201711435262A CN108321127A CN 108321127 A CN108321127 A CN 108321127A CN 201711435262 A CN201711435262 A CN 201711435262A CN 108321127 A CN108321127 A CN 108321127A
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- Prior art keywords
- plastic
- plastic packaging
- sheet metal
- packaging
- plastic package
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- 239000004033 plastic Substances 0.000 title claims abstract description 236
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 136
- 238000000034 method Methods 0.000 title claims abstract description 56
- 238000002360 preparation method Methods 0.000 title description 2
- 239000002184 metal Substances 0.000 claims abstract description 96
- 229910052751 metal Inorganic materials 0.000 claims abstract description 96
- 239000005022 packaging material Substances 0.000 claims abstract description 47
- 238000001816 cooling Methods 0.000 claims description 6
- 239000011888 foil Substances 0.000 claims description 4
- 238000007789 sealing Methods 0.000 claims description 4
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 abstract description 10
- 230000008901 benefit Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 description 8
- 238000007747 plating Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 6
- 238000010586 diagram Methods 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000004065 semiconductor Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 239000011469 building brick Substances 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000006870 function Effects 0.000 description 3
- 238000012536 packaging technology Methods 0.000 description 3
- 238000004544 sputter deposition Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 239000011230 binding agent Substances 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910052759 nickel Inorganic materials 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 241000416536 Euproctis pseudoconspersa Species 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Packages (AREA)
Abstract
The packaging body that the present invention is provided plastic package method and prepared using the plastic package method, plastic package method includes step：Product to be packaged is provided, product to be packaged includes carrier, and at least one chip is arranged on carrier, and chip is connect with carrier；Plastic package die is provided, plastic package die has plastic packaging slot, and the sheet metal of covering plastic packaging slot inner surface is placed in plastic packaging slot inner surface；Plastic packaging material is placed in plastic packaging slot or in product to be packaged there is the side of chip to place plastic packaging material；Product to be packaged and plastic packaging slot are fastened, wherein product to be packaged has the surface of chip towards in plastic packaging slot；Plastic packaging, plastic packaging material forms plastic-sealed body, and coats the chip, forms packaging body；Plastic package die is removed, sheet metal cover is on plastic-sealed body surface.Advantage is to save the process flow, and cost-effective, sheet metal not only acts as electromagnetic shielding action.It is also used as conductive layer use, while sheet metal has heat sink functionality, in addition, metallic pattern can be formed on sheet metal, is used as wiring layer.
Description
Technical field
The envelope prepared the present invention relates to field of semiconductor package more particularly to a kind of plastic package method and using the plastic package method
Fill body.
Background technology
With the development of electronic product, semiconductor technologies be widely used in manufacture memory, central processing unit (CPU),
Liquid crystal display device (LCD), light emitting diode (LED), laser diode and other devices or chipset etc..Due to semiconductor
The electronic building bricks such as component, electric component of microcomputer (MEMS) or photoelectric subassembly have small fine circuit and construction, therefore to avoid
Dust, acid-base material, moisture and oxygen etc. pollute or corrode electronic building brick, and then influence its reliability and service life, are needed in technique
The related electric energy transmission (PowerDistribution) of above-mentioned electronic building brick, signal transmission (Signal are provided by encapsulation technology
Distribution), heat loss (HeatDissipation), and protection and support (ProtectionandSupport)
Etc. functions.
Semiconductor chip it is packed form packaging body after, according to the difference of service condition, which also wants and it
He connects electric elements or assembling.For example, in certain situations it is desirable to form patterned conductive layer on packaging body surface, with
Convenient for the progress of the techniques such as subsequent plating.The mode that existing packaging body forms conductive layer is complicated, such as passes through ion sputtering
Technique forms conductive layer, can increase manufacture craft, extend the production time of product, and be unfavorable for cost-effective.
Therefore, the packaging body prepared there is an urgent need for a kind of novel plastic package method and using the plastic package method, overcomes above-mentioned encapsulation
The shortcomings that body.
Invention content
The encapsulation prepared the technical problem to be solved by the invention is to provide a kind of plastic package method and using the plastic package method
Body can utilize packaging technology on packaging body surface, not increase additional step, saved work one sheet metal cover
Skill flow, it is cost-effective, and directly there is sheet metal to be formed in packaging body surface after plastic packaging, the sheet metal can play electricity
The effect of magnetic screen.
To solve the above-mentioned problems, the present invention provides a kind of plastic package method, include the following steps：One production to be packaged is provided
Product, the product to be packaged include a carrier, are provided at least one chip, the chip and the carrier on the carrier
Connection；A plastic package die is provided, the plastic package die has a plastic packaging slot, is placed described in a covering in the plastic packaging slot inner surface
The sheet metal of plastic packaging slot inner surface；Plastic packaging material is placed in the plastic packaging slot or has the one of chip in the product to be packaged
Place plastic packaging material in side；The product to be packaged and the plastic packaging slot are fastened, wherein the product to be packaged has the table of chip
Facing towards in the plastic packaging slot；Plastic packaging, the plastic packaging material forms plastic-sealed body, and coats the chip, forms packaging body；Remove institute
Plastic package die is stated, the sheet metal cover is on the plastic-sealed body surface.
In a specific embodiment, it is pre-formed sheet metal identical with the plastic packaging groove shape, in the metal
Plastic packaging material is placed in the groove of thin slice, will be placed with the sheet metal cover of plastic packaging material in the plastic packaging slot inner surface.
In a specific embodiment, the sheet metal includes smooth surface and hair side, the hair side and the encapsulation body surface
Face contacts.
In a specific embodiment, the hair side of the sheet metal has multiple pits, in plastic packaging step, the plastic packaging
Material is filled in the pit, so that after removing plastic package die, the sheet metal is combined and is covered in the packaging body
The packaging body surface.
In a specific embodiment, the sheet metal is one layer or multilayer.
In a specific embodiment, in plastic packaging step, the plastic package die heating, so that the plastic packaging material melts,
The cooling plastic package die, so that the plastic packaging material cures.
In a specific embodiment, in plastic packaging step, the product to be packaged has the surface of chip upward, described
The plastic packaging slot of plastic package die be buckled on the band encapsulating products or the plastic packaging slot of the plastic package die upward, it is described to be packaged
Product is buckled in the plastic packaging slot.
The present invention also provides a kind of packaging bodies prepared using above-mentioned plastic package method, including a carrier and at least one setting
Chip on the carrier, a plastic-sealed body coat the chip, sheet metal are covered on the surface of the plastic-sealed body.
In a specific embodiment, the hair side of the sheet metal has multiple pits, in plastic packaging step, the plastic packaging
Material is filled in the pit, so that after removing plastic package die, the sheet metal is combined and is covered in the plastic-sealed body
The plastic-sealed body surface.
In a specific embodiment, the sheet metal is one layer or multilayer.
An advantage of the present invention is that one sheet metal cover is not increased on packaging body surface using packaging technology
Add additional step, saves technological process, it is cost-effective, and directly there is sheet metal to be formed in encapsulation body surface after plastic packaging
Face, the sheet metal can play the role of electromagnetic shielding.In addition, be covered in packaging body surface sheet metal can be used as can
To be used as conductive layer in other techniques of packaging body, for example, in subsequent electroplating technology, the graphical metal foil
Piece, forms metal pattern, and the metal pattern can be used as conductive layer use.In addition, forming metal foil on the packaging body surface
After piece, in the subsequent process, the techniques such as plating, chemical plating, sputtering may be used and thicken the sheet metal, so that the metal
Thin slice has the function of cooling fin.At the same time it can also form other on sheet metal with techniques such as plating, chemical plating, sputterings
Metallic pattern.
It is a further advantage of the present invention that in the prior art, when carrying out plastic packaging using plastic package die, plastic packaging in order to prevent
Material sticks in the inner surface of the plastic packaging slot, it usually needs a release film (release is arranged in the inner surface of plastic packaging slot
Film), the release film can prevent plastic packaging material from sticking in the inner surface of plastic package die, and be easy to packaging body and plastic package die point
From.And the application places the sheet metal of a covering plastic packaging slot inner surface, the metal foil in the plastic packaging slot inner surface
Piece can play the role of preventing plastic packaging material from sticking in plastic packaging slot inner surface, and then can be not provided in the inner surface of the plastic package die
Release film, it is cost-effective, and shorten the process time.
Description of the drawings
Fig. 1 is the step schematic diagram of plastic package method of the present invention；
Fig. 2A~Fig. 2 F are the process flow charts of the first specific implementation mode of plastic package method of the present invention；
Fig. 3 A~Fig. 3 F are the process flow charts of the second specific implementation mode of plastic package method of the present invention；
Fig. 4 is the structural schematic diagram of packaging body of the present invention；
Fig. 5 is flip-chip schematic diagram.
Specific implementation mode
The packaging body prepared below in conjunction with the accompanying drawings to a kind of plastic package method provided by the invention and using the plastic package method
Specific implementation mode elaborates.
The present invention provides a kind of plastic package method.Fig. 1 is the step schematic diagram of plastic package method of the present invention, shown in Figure 1,
Plastic package method of the present invention includes the following steps：Step S10, one product to be packaged is provided, the product to be packaged includes a carrier,
It is provided at least one chip on the carrier, the chip is electrically connected with the carrier；Step S11, one plastic sealed mould is provided
Tool, the plastic package die have a plastic packaging slot, and the gold of a covering plastic packaging slot inner surface is placed in the plastic packaging slot inner surface
Belong to thin slice；Step S12, plastic packaging material is placed in the plastic packaging slot or in the product to be packaged there is the side of chip to place modeling
Envelope material；Step S13, the product to be packaged and the plastic packaging slot are fastened, wherein the product to be packaged has the table of chip
Facing towards in the plastic packaging slot；Step S14, plastic packaging, the plastic packaging material forms plastic-sealed body, and coats the chip, forms encapsulation
Body；Step S15, the plastic package die is removed, the sheet metal cover is on the plastic-sealed body surface.
Fig. 2A~Fig. 2 F are the process flow charts of the first specific implementation mode of plastic package method of the present invention.
It refers to shown in step S10 and Fig. 2A, a product 20 to be packaged is provided, the product 20 to be packaged includes a carrier
21, at least one chip 22 is provided on the carrier 21, the chip 22 is connect with the carrier 21.Wherein, the load
Body 21 can be the structures well known in the art such as lead frame, in this embodiment, in order to clearly illustrate skill of the present invention
Art scheme, there are two chips, the present invention to be not limited to the number of chips on carrier 21 for setting on the carrier 21.It is described
Chip 21 can be pasted on the carrier by binder, and the chip 22 can pass through conducting resinl or metal lead wire and the load
Body 21 connects.The chip 22 is arranged by the way of formal dress or upside-down mounting on the carrier 21.In present embodiment
In, 22 formal dress of the chip is arranged on the carrier 21.In another specific implementation mode of the present invention, 22 upside-down mounting of the chip
It is arranged on the carrier 21, please refers to Fig. 5.Wherein, chip formal dress mode and upside-down mounting mode are this field conventional structure, chip
22 mounting means on carrier 21 has no effect on technical scheme of the present invention.
Step S11 and Fig. 2 B is referred to, a plastic package die 30 is provided, the plastic package die 30 has a plastic packaging slot 31,
31 inner surface of plastic packaging slot places the sheet metal 40 of covering 31 inner surface of plastic packaging slot.The plastic package die 30 is half
Traditional dies in conductor encapsulation.The plastic packaging slot 31 provides encapsulated space for follow-up for chip package.The sheet metal
Material can be this fields common metal such as copper, nickel or stainless steel.The sheet metal can be one layer or multilayer.
In present embodiment, it is schematically painted one layer of sheet metal, the sheet metal is copper foil, is adsorbed on the plastic packaging
The inner surface of slot.Preferably, the sheet metal includes smooth surface and hair side, and the roughness of the smooth surface is less than the thick of the hair side
Rugosity, the smooth surface are contacted with 31 inner surface of plastic packaging slot.Due to placing a covering plastic packaging in 31 inner surface of plastic packaging slot
The sheet metal 40 of 31 inner surface of slot, the sheet metal 40 can prevent subsequent plastic packaging material from sticking in the interior of the plastic packaging slot 3
Surface, and be also easy to packaging body and detached with plastic package die, therefore, it can be not provided with release film in the inner surface of the plastic packaging slot, into
And it is cost-effective, and shorten the process time.
Step S12 and Fig. 2 C is referred to, plastic packaging material 50 is placed in the plastic packaging slot 31 or in the product 20 to be packaged
Place plastic packaging material 50 in side with chip 22.Shown in his Fig. 2 C, in this embodiment, in the production to be packaged
There is product 20 side of chip 22 to place plastic packaging material 50, and the plastic packaging material is solid states.The plastic packaging material 50 is that this field is normal
The material of rule, such as epoxy resin.
It refers to shown in step S13 and Fig. 2 D, the product 20 to be packaged is fastened with the plastic packaging slot 31, wherein institute
Surface of the product 20 to be packaged with chip 22 is stated towards in the plastic packaging slot 31.In this embodiment, the plastic packaging
Mold 30 is located at the top of the product 20 to be packaged, and the plastic packaging slot 31 is directed at the product to be packaged 20 downward.It needs to mould
Feng Shi moves down the plastic package die 30 or moves up the product to be packaged 20, so that the product 20 to be packaged has
The surface of chip 22 is located inside the plastic packaging slot 31, and then the product to be packaged 20 is made to be fastened with the plastic packaging slot 31.
It refers to shown in step S14 and Fig. 2 E, plastic packaging, the plastic packaging material 50 forms plastic-sealed body 51, and coats the chip
22, form packaging body, wherein and the plastic-sealed body 51 can also coat the carrier 21, in this embodiment, the modeling
Seal the only coating chip 22 of body 51.Further, in the plastic packaging step, the plastic package die 30 heats, so that the plastic packaging material 50
Fusing, the cooling plastic package die 30, so that the plastic packaging material 50 is formed by curing plastic-sealed body 51.In this step, the plastic packaging
The pressure of mold 30 makes the sheet metal 40 be combined with the plastic-sealed body 51, in step S15, after removing plastic package die,
The sheet metal 40 is combined with the packaging body and is covered in the packaging body surface.Preferably due to the sheet metal
40 hair side has multiple pits (not indicated in attached drawing), then can be filled in the pit after the plastic packaging material fusing, into one
Step improves the sheet metal and 51 binding force of the plastic-sealed body.
It refers to shown in step S15 and Fig. 2 F, removes the plastic package die 30, the sheet metal 40 is covered in the modeling
Seal 51 surface of body.Since in plastic packaging step, the pressure of the plastic package die makes the sheet metal 40 and the plastic-sealed body
51 combine, and therefore, in this step, after removing the plastic package die 30, the sheet metal 40 is not in company with plastic package die 30
It removes together, but is covered in the surface of the plastic-sealed body 51.
After 50 surface of the plastic-sealed body forms sheet metal 40, when there is demand, the methods of plating may be used and thicken
The sheet metal 40, so that the sheet metal 40 has the function of cooling fin.At the same time it can also with plating, chemical plating, splash
It the techniques such as penetrates and forms other metallic patterns on sheet metal.
Plastic package method of the present invention also provides one second specific implementation mode.Fig. 3 A~Fig. 3 F are plastic package methods second of the present invention
The process flow chart of specific implementation mode.
The second specific implementation mode of plastic package method of the present invention and the first specific implementation mode difference lies in sheet metal 40,
The relative position of the setting of plastic packaging material 50 and plastic package die and product to be packaged, is described as follows.
It refers to shown in Fig. 3 A, provides a product 20 to be packaged, the product 20 to be packaged includes a carrier 21, described
At least one chip 22 is provided on carrier 21, the chip 22 is electrically connected with the carrier 21.Wherein, the carrier 21 can be with
For the structure well known in the art such as lead frame, in this embodiment, in order to clearly illustrate technical solution of the present invention,
There are two chips, the present invention to be not limited to the number of chips on carrier 21 for setting on the carrier 21.The chip 21 can
It is pasted on the carrier by binder, the chip 22 can be electrically connected by conducting resinl or metal lead wire with the carrier 21
It connects.
It refers to shown in Fig. 3 B, a plastic package die 30 is provided, the plastic package die 30 has a plastic packaging slot 31.It is pre-formed
Sheet metal 40 identical with 31 shape of plastic packaging slot places plastic packaging material 50 in the groove of the sheet metal 40.It is described
Plastic package die 30 is the traditional dies in semiconductor packages.The plastic packaging slot 31 provides encapsulation sky for follow-up for chip package
Between.The material of the sheet metal 40 can be this fields common metals such as copper, nickel or stainless steel.The sheet metal 40 can
Think one layer or multilayer.In this embodiment, one layer of sheet metal 40, the sheet metal 40 are schematically painted
For copper foil, it is adsorbed on the inner surface of the plastic packaging slot 31.Preferably, the sheet metal 40 includes smooth surface and hair side, described
The roughness of smooth surface is less than the roughness of the hair side, and in subsequent step, the smooth surface connects with 31 inner surface of plastic packaging slot
It touches.The plastic packaging material 50 is solid states or liquid form.The plastic packaging material 50 is the material of this field routine, such as epoxy
Resin.
It refers to shown in Fig. 3 C, the sheet metal 40 for being placed with plastic packaging material 50 is covered in 31 inner surface of plastic packaging slot.
It refers to shown in Fig. 3 D, the product 20 to be packaged is fastened with the plastic packaging slot 31, wherein the production to be packaged
Product 20 have the surface of chip 22 towards in the plastic packaging slot 31.In this embodiment, the plastic package die 30 is located at
There is the surface of chip 22 to be directed at the plastic packaging slot downward for the lower section of the product to be packaged 20, the product 20 to be packaged.It needs
It when wanting plastic packaging, moves up the plastic package die 30 or moves down the product to be packaged 20, so that the product 20 to be packaged
Surface with chip 22 is located inside the plastic packaging slot 31, and then the product to be packaged 20 is made to be buckled with the plastic packaging slot 31
It closes.
It refers to shown in Fig. 3 E, plastic packaging, the plastic packaging material 50 forms plastic-sealed body 51, and coats the chip 22, forms envelope
Fill body.Further, in the plastic packaging step, the plastic package die 30 heats, so that the plastic packaging material 50 melts, the cooling modeling
Mold 30 is sealed, so that the plastic packaging material 50 is formed by curing plastic-sealed body 51.In this step, the pressure of the plastic package die 30 makes
The sheet metal 40 is combined with the plastic-sealed body 51, then subsequently remove plastic package die after, the sheet metal 40 with it is described
Packaging body in conjunction with and be covered in the packaging body surface.Preferably due to which the hair side of the sheet metal 40 has multiple pits
(not indicated in attached drawing) can then be filled in the pit after the plastic packaging material fusing, further improve the sheet metal
With 51 binding force of the plastic-sealed body.
It refers to shown in Fig. 3 F, removes the plastic package die 30, the sheet metal 40 is covered in 51 table of the plastic-sealed body
Face.Since in plastic packaging step, the pressure of the plastic package die makes the sheet metal 40 be combined with the plastic-sealed body 51, because
This, in this step, after removing the plastic package die 30, the sheet metal 40 is not removed in company with plastic package die 30 together,
But it is covered in the surface of the plastic-sealed body 51.
Plastic package method of the present invention utilizes packaging technology on packaging body surface, not to increase a sheet metal cover additional
Step has saved technological process, cost-effective, and directly has sheet metal to be formed in packaging body surface, the gold after plastic packaging
Electromagnetic shielding can be played the role of by belonging to thin slice.In addition, the sheet metal for being covered in packaging body surface can be used as and can encapsulate
It is used as conductive layer in other techniques of body, for example, in subsequent electroplating technology, the graphical sheet metal is formed
Metal pattern, the metal pattern can be used as conductive layer use.
In the prior art, when carrying out plastic packaging using plastic package die, plastic packaging material sticks in the plastic packaging slot in order to prevent
Inner surface, it usually needs one release film (release film) is set in the inner surface of plastic packaging slot, the release film can prevent from moulding
Envelope material sticks in the inner surface of plastic package die, and is easy to packaging body and is detached with plastic package die.And the application is in the plastic packaging slot
The sheet metal of a covering plastic packaging slot inner surface is placed on surface, and the sheet metal, which can play, prevents plastic packaging material from sticking in modeling
The effect of sealing groove inner surface, and then it can be not provided with release film in the inner surface of the plastic package die, it is cost-effective, and shorten technique
Time.
The present invention also provides a kind of packaging bodies.Fig. 4 is the structural schematic diagram of packaging body of the present invention, shown in Figure 4, institute
It includes a carrier 21 and at least one chip 22 that is arranged on the carrier 21 to state packaging body.One plastic-sealed body 51 coats the chip
22, it is covered with sheet metal 40 on the surface of the plastic-sealed body 51.Further, the hair side of the sheet metal 40 has multiple recessed
Hole, in plastic packaging step, the plastic packaging material is filled in the pit, so that after removing plastic package die, the sheet metal
40 are combined with the plastic-sealed body and are covered in the plastic-sealed body surface.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
Member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications also should be regarded as
Protection scope of the present invention.
Claims (10)
1. a kind of plastic package method, which is characterized in that include the following steps：
One product to be packaged is provided, the product to be packaged includes a carrier, is provided at least one chip on the carrier,
The chip is connect with the carrier；
A plastic package die is provided, the plastic package die has a plastic packaging slot, is placed described in a covering in the plastic packaging slot inner surface
The sheet metal of plastic packaging slot inner surface；
Plastic packaging material is placed in the plastic packaging slot or in the product to be packaged there is the side of chip to place plastic packaging material；
The product to be packaged and the plastic packaging slot are fastened, wherein the product to be packaged has the surface of chip towards institute
It states in plastic packaging slot；
Plastic packaging, the plastic packaging material forms plastic-sealed body, and coats the chip, forms packaging body；
The plastic package die is removed, the sheet metal cover is on the plastic-sealed body surface.
2. plastic package method according to claim 1, which is characterized in that be pre-formed gold identical with the plastic packaging groove shape
Belong to thin slice, places plastic packaging material in the groove of the sheet metal, the sheet metal cover of plastic packaging material will be placed in the modeling
Sealing groove inner surface.
3. plastic package method according to claim 1, which is characterized in that the sheet metal includes smooth surface and hair side, described
Hair side is contacted with the packaging body surface.
4. plastic package method according to claim 3, which is characterized in that the hair side of the sheet metal has multiple pits,
In plastic packaging step, the plastic packaging material is filled in the pit so that after removing plastic package die, the sheet metal with it is described
Packaging body in conjunction with and be covered in the packaging body surface.
5. plastic package method according to claim 1, which is characterized in that the sheet metal is one layer or multilayer.
6. plastic package method according to claim 1, which is characterized in that in plastic packaging step, the plastic package die heating, with
The plastic packaging material is set to melt, the cooling plastic package die, so that the plastic packaging material cures.
7. plastic package method according to claim 1, which is characterized in that in plastic packaging step, the product to be packaged has
Upward, the plastic packaging slot of the plastic package die is buckled on the band encapsulating products or the modeling of the plastic package die on the surface of chip
Upward, the product to be packaged is buckled in the plastic packaging slot sealing groove.
8. a kind of packaging body prepared using plastic package method described in claim 1, which is characterized in that including a carrier and at least
The chip of one setting on the carrier, a plastic-sealed body coat the chip, metal foil are covered on the surface of the plastic-sealed body
Piece.
9. packaging body according to claim 8, which is characterized in that the hair side of the sheet metal has multiple pits, modeling
It sealing in step, the plastic packaging material is filled in the pit, so that after removing plastic package die, the sheet metal and the modeling
Envelope body in conjunction with and be covered in the plastic-sealed body surface.
10. packaging body according to claim 8, which is characterized in that the sheet metal is one layer or multilayer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2017112685662 | 2017-12-05 | ||
| CN201711268566 | 2017-12-05 |
Publications (1)
| Publication Number | Publication Date |
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| CN110634819A (en) * | 2019-09-27 | 2019-12-31 | 华天科技（西安）有限公司 | Storage product packaging structure with radiating fins and manufacturing method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104272446A (en) * | 2012-08-30 | 2015-01-07 | 松下知识产权经营株式会社 | Electronic component package and method of manufacturing same |
| CN106935522A (en) * | 2015-12-29 | 2017-07-07 | 意法半导体有限公司 | For manufacturing the integrated circuit with conductive shielding layer（IC）The method of packaging body |
| CN107026107A (en) * | 2016-02-02 | 2017-08-08 | 东和株式会社 | The manufacture device and manufacture method and electronic unit of electronic unit |
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|---|---|---|---|---|
| CN104272446A (en) * | 2012-08-30 | 2015-01-07 | 松下知识产权经营株式会社 | Electronic component package and method of manufacturing same |
| CN106935522A (en) * | 2015-12-29 | 2017-07-07 | 意法半导体有限公司 | For manufacturing the integrated circuit with conductive shielding layer（IC）The method of packaging body |
| CN107026107A (en) * | 2016-02-02 | 2017-08-08 | 东和株式会社 | The manufacture device and manufacture method and electronic unit of electronic unit |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110634819A (en) * | 2019-09-27 | 2019-12-31 | 华天科技（西安）有限公司 | Storage product packaging structure with radiating fins and manufacturing method |
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| CN208093541U (en) | 2018-11-13 |
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