CN108321110A - 一种缓存升降装置 - Google Patents
一种缓存升降装置 Download PDFInfo
- Publication number
- CN108321110A CN108321110A CN201810206241.XA CN201810206241A CN108321110A CN 108321110 A CN108321110 A CN 108321110A CN 201810206241 A CN201810206241 A CN 201810206241A CN 108321110 A CN108321110 A CN 108321110A
- Authority
- CN
- China
- Prior art keywords
- lifting
- transmission
- rack
- board
- external support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000005540 biological transmission Effects 0.000 claims abstract description 115
- 239000000463 material Substances 0.000 claims abstract description 21
- 230000033001 locomotion Effects 0.000 claims description 14
- 230000005484 gravity Effects 0.000 claims description 7
- 238000000465 moulding Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 239000011232 storage material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 description 5
- 230000032683 aging Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000630 rising effect Effects 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000001427 coherent effect Effects 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810206241.XA CN108321110B (zh) | 2018-03-13 | 一种缓存升降装置 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810206241.XA CN108321110B (zh) | 2018-03-13 | 一种缓存升降装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108321110A true CN108321110A (zh) | 2018-07-24 |
CN108321110B CN108321110B (zh) | 2024-04-26 |
Family
ID=
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114348622A (zh) * | 2022-02-18 | 2022-04-15 | 苏州杰锐思智能科技股份有限公司 | 缓存装置 |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216166A (ja) * | 1993-01-20 | 1994-08-05 | Hitachi Ltd | 半導体装置用一貫組立装置 |
CN102394226A (zh) * | 2011-10-19 | 2012-03-28 | 东莞宏威数码机械有限公司 | 太阳能电池板传送缓存设备 |
CN103930984A (zh) * | 2011-11-23 | 2014-07-16 | 日本电产三协株式会社 | 工件搬运系统 |
CN104444438A (zh) * | 2014-11-25 | 2015-03-25 | 重庆耀勇减震器有限公司 | 一种拉杆自动上料装置 |
CN208111414U (zh) * | 2018-03-13 | 2018-11-16 | 东莞阿李自动化股份有限公司 | 一种缓存升降装置 |
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06216166A (ja) * | 1993-01-20 | 1994-08-05 | Hitachi Ltd | 半導体装置用一貫組立装置 |
CN102394226A (zh) * | 2011-10-19 | 2012-03-28 | 东莞宏威数码机械有限公司 | 太阳能电池板传送缓存设备 |
CN103930984A (zh) * | 2011-11-23 | 2014-07-16 | 日本电产三协株式会社 | 工件搬运系统 |
CN104444438A (zh) * | 2014-11-25 | 2015-03-25 | 重庆耀勇减震器有限公司 | 一种拉杆自动上料装置 |
CN208111414U (zh) * | 2018-03-13 | 2018-11-16 | 东莞阿李自动化股份有限公司 | 一种缓存升降装置 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114348622A (zh) * | 2022-02-18 | 2022-04-15 | 苏州杰锐思智能科技股份有限公司 | 缓存装置 |
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Legal Events
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PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20231107 Address after: 361000 room 4101, No. 131, xinjingdongli, Haicang District, Xiamen City, Fujian Province Applicant after: Xiamen Jiupin sesame Information Technology Co.,Ltd. Address before: 523000 Lingxing Street, Lingxia Development Zone, Liaobu Town, Dongguan City, Guangdong Province Applicant before: DONGGUAN ALI SYSTEM Co.,Ltd. |
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TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20240401 Address after: No. 16, Hegao Road, Hefeng Town, Lishui District, Nanjing, Jiangsu 210000 Applicant after: Nanjing Jinzai New Energy Dynamics Research Institute Co.,Ltd. Country or region after: China Address before: 361000 room 4101, No. 131, xinjingdongli, Haicang District, Xiamen City, Fujian Province Applicant before: Xiamen Jiupin sesame Information Technology Co.,Ltd. Country or region before: China |
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GR01 | Patent grant |