CN108317233B - Integrated assembling-free multilayer micro-gear structure applied to MEMS micro-nano processing - Google Patents
Integrated assembling-free multilayer micro-gear structure applied to MEMS micro-nano processing Download PDFInfo
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- CN108317233B CN108317233B CN201810312357.1A CN201810312357A CN108317233B CN 108317233 B CN108317233 B CN 108317233B CN 201810312357 A CN201810312357 A CN 201810312357A CN 108317233 B CN108317233 B CN 108317233B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
- F16H55/02—Toothed members; Worms
- F16H55/17—Toothed wheels
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F16—ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
- F16H—GEARING
- F16H55/00—Elements with teeth or friction surfaces for conveying motion; Worms, pulleys or sheaves for gearing mechanisms
- F16H55/02—Toothed members; Worms
- F16H55/12—Toothed members; Worms with body or rim assembled out of detachable parts
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Abstract
The invention discloses an integrated assembling-free multilayer micro-gear structure applied to MEMS micro-nano processing, which comprises a rooting bearing, a first step-shaped gear positioning structure, a second step-shaped gear positioning structure and a multilayer gear layer, wherein the lower end surface of the rooting bearing is fixedly connected to a gear substrate, the second step-shaped gear positioning structure is arranged at the lower end of the rooting bearing, the second step-shaped gear positioning structure is fixedly connected to the gear substrate, the first step-shaped gear positioning structure is arranged at the upper end of the rooting bearing, and the multilayer gear layer is sleeved at the middle part of the rooting bearing. The multilayer micro-gear structure is an integrated structure, the assembly precision consistency of the multilayer micro-gear structure is better, the multilayer micro-gear structure is more suitable for mass production, and the connection strength of the gear structure is higher.
Description
Technical Field
The invention relates to the technical field of micro-gears, in particular to an integrated assembly-free multilayer micro-gear structure applied to MEMS micro-nano processing.
Background
Microelectromechanical Systems (MEMS) have become a hotspot for industrial and academic research, which is of great importance for the development of industry. Gears refer to mechanical elements with teeth on the rim that continuously engage to transfer motion and power. The gear has the function of transmitting the rotation of one shaft to the other shaft, thereby realizing the purposes of speed reduction, speed increase, direction change, reversing and the like, being an important mechanical base piece and being very widely applied.
With the development of MEMS technology and the urgent need for integrated microsystems, the trend of mechanical structures towards miniaturization is becoming more and more evident. The gear, transmission and driving components are in need of miniaturization at present, and the device has wide application space in the fields of micro robots, micro-nano control platforms and the like. The MEMS micro-nano processing technology is utilized for gear processing, and the advantages of batch, integration, compatibility with integrated circuit technology and the like are achieved. And the metal micro-machining mode (including UV-LIGA and metal sacrificial layer machining mode) in MEMS technology can obtain a complex metal structure with high strength, and is an effective method for machining the micro-gears.
However, at present, a gear structure processed by adopting a traditional processing mode of a machine tool and a cutter is directly applied to the field of micro-nano processing of micro-gears of MEMS, the micro-gears are assembled by adopting an axle hole assembly mode, and cannot be processed into integrated micro-gears without assembly, so that the problems that the batch quantity and the consistency of the assembly precision cannot be ensured exist. The metal micro-machining mode in the MEMS micro-nano machining process is generally prepared by an additive manufacturing mode, the metal additive manufacturing mode is generally electroplating, sputtering and the like, the metal materials manufactured by the methods are far away from the bulk metal materials in terms of metal quality such as material density, material strength and the like, and the gear structure is easy to fail.
Disclosure of Invention
The invention aims to provide an integrated assembly-free multilayer micro-gear structure applied to MEMS micro-nano processing, so as to solve the problems in the prior art, and the multilayer micro-gear structure is an integrated structure which does not need assembly, has better assembly precision consistency, is more suitable for mass production, and has higher connection strength of a gear structure.
In order to achieve the above object, the present invention provides the following solutions: the invention provides an integrated assembling-free multilayer micro-gear structure applied to MEMS micro-nano processing, which comprises a rooting bearing, a first step-shaped gear positioning structure, a second step-shaped gear positioning structure and a multilayer gear layer, wherein the lower end surface of the rooting bearing is fixedly connected to a gear substrate, the second step-shaped gear positioning structure is arranged at the lower end of the rooting bearing, the second step-shaped gear positioning structure is fixedly connected to the gear substrate, the first step-shaped gear positioning structure is arranged at the upper end of the rooting bearing, and the multilayer gear layer is sleeved at the middle part of the rooting bearing.
Preferably, the multi-layer gear layer comprises a plurality of gears, and the gears are connected together through isolation layer electroplating.
Preferably, the upper surface of the second step-type gear positioning structure is fixedly connected with a second anti-adhesion cylinder, and the lower surface of the first step-type gear positioning structure is fixedly connected with a first anti-adhesion cylinder.
Preferably, the lower surface of the multi-layer gear layer is fixedly connected with a third anti-adhesion cylinder.
Preferably, the first anti-adhesion cylinder, the second anti-adhesion cylinder and the third anti-adhesion cylinder are all uniformly distributed on the corresponding surfaces.
Preferably, the fixed connection is an electroplated connection.
Preferably, an annular groove is formed in the upper surface of the uppermost gear in the multi-layer gear layer, the first step-type gear positioning structure is arranged in the annular groove, and the upper surface of the first step-type gear positioning structure and the upper surface of the uppermost gear are located on the same plane.
Preferably, the distance between the first anti-adhesion cylinder and the upper surface of the multi-layer gear layer is 10-20 μm, the distance between the second anti-adhesion cylinder and the lower surface of the multi-layer gear layer is 10-20 μm, and the distance between the third anti-adhesion cylinder and the upper surface of the gear substrate is 10-20 μm.
Preferably, gear face holes are uniformly distributed on the gear face of the multi-layer gear layer.
Compared with the prior art, the invention has the following technical effects:
the invention provides an integrated assembling-free multilayer micro-gear structure applied to MEMS micro-nano processing, and the two ends of a rooting bearing are provided with a first step-shaped gear positioning structure and a second step-shaped gear positioning structure, so that a multilayer gear layer positioned on the rooting bearing can be effectively restrained. The rooting bearing, the first step-shaped gear positioning structure and the second step-shaped gear positioning structure are connected together, so that on one hand, the multi-layer micro-gear and gear substrate integrated rooting structure is a chip-level mechanical structure which can be transferred independently and used for integrated process operation, and secondary processing is eliminated, thereby avoiding the problems of incapability of batch, incapability of ensuring consistency, difficult part transfer and assembly operation and the like caused by gear shaft hole alignment assembly; on the other hand, the positions of the multi-layer micro gears are limited, and the situation that the multi-layer micro gears are greatly deviated due to external environmental factors such as vibration and the like is avoided. The multilayer micro-gear structure is an integrated structure, the assembly precision consistency of the multilayer micro-gear structure is better, the multilayer micro-gear structure is more suitable for mass production, and the connection strength of the gear structure is higher.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions of the prior art, the drawings that are needed in the embodiments will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present invention, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is an axial cross-sectional view of an integrated fabricated multilayer free micro-gear structure of the present invention for MEMS micro-nano machining;
FIG. 2 is a top view of an integrated fabricated multilayer free micro-gear structure of the present invention for MEMS micro-nano machining;
wherein, 1 is a root bearing, 2 is a first ladder type gear positioning structure, 3 is a second ladder type gear positioning structure, 4 is a first anti-adhesion cylinder, 5 is a second anti-adhesion cylinder, 6 is a third anti-adhesion cylinder, 7 is an annular groove, 8 is a multi-layer gear layer, 9 is an isolation layer, 10 is a gear substrate, and 11 is a gear face.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
The invention aims to provide an integrated assembly-free multilayer micro-gear structure applied to MEMS micro-nano processing, so as to solve the problems in the prior art, and enable the multilayer micro-gear structure to be an integrated structure which does not need assembly, the assembly precision of the multilayer micro-gear structure is better in consistency, the multilayer micro-gear structure is more suitable for batch production, and the connection strength of the gear structure is higher.
In order that the above-recited objects, features and advantages of the present invention will become more readily apparent, a more particular description of the invention will be rendered by reference to the appended drawings and appended detailed description.
As shown in fig. 1-2, the invention provides an integrated assembling-free multilayer micro-gear structure applied to micro-nano MEMS processing, which comprises a rooting bearing 1, a first step-shaped gear positioning structure 2, a second step-shaped gear positioning structure 3 and a multilayer gear layer 8, wherein the lower end surface of the rooting bearing 1 is fixedly connected to a gear substrate 10, the second step-shaped gear positioning structure 3 is arranged at the lower end of the rooting bearing 1, the second step-shaped gear positioning structure 3 is fixedly connected to the gear substrate 10, the first step-shaped gear positioning structure 2 is arranged at the upper end of the rooting bearing 1, and the multilayer gear layer 8 is sleeved at the middle part of the rooting bearing 1. The multi-layer micro-gear structure is integrally obtained through electroplating, assembly is not needed, and the bearing is directly grown on the gear substrate 10, so that the bearing is named as a rooting bearing 1, and the first step-shaped gear positioning structure 2 and the second step-shaped gear positioning structure 3 are arranged at two ends of the rooting bearing 1, so that the multi-layer gear layer 8 positioned on the rooting bearing 1 can be effectively restrained.
The rooting bearing 1, the first step-type gear positioning structure 2 and the second step-type gear positioning structure 3 are connected together, so that on one hand, the integrated rooting structure of the multi-layer micro gear and the gear substrate 10 is a chip-level mechanical structure which can be transferred independently and used for integrated process operation, and secondary processing is eliminated, thereby solving the problems that the gear shaft hole is aligned and assembled and cannot be batched, the consistency cannot be ensured, the part transfer and assembly operation are difficult, and the like. On the other hand, the positions of the multi-layer micro gears are limited, and the situation that the multi-layer micro gears are greatly deviated due to external environmental factors such as vibration and the like is avoided. The multilayer micro-gear structure is an integrated structure, the assembly precision consistency of the multilayer micro-gear structure is better, the multilayer micro-gear structure is more suitable for mass production, and the connection strength of the gear structure is higher.
Wherein, multilayer gear layer 8 includes a plurality of gears, in order to guarantee that the positional relationship of a plurality of gears is stable, electroplate through isolation layer 9 between a plurality of gears and link together.
The upper surface fixedly connected with second anti-adhesion cylinder 5 of second ladder-type gear location structure 3, the lower surface fixedly connected with first anti-adhesion cylinder 4 of first ladder-type gear location structure 2. The lower surface of the multi-layer gear layer 8 is fixedly connected with a third anti-adhesion cylinder 6. Through setting up first anti-adhesion cylinder 4, second anti-adhesion cylinder 5 and third anti-adhesion cylinder 6 for effectively prevented the adhesion between the adjacent surface, effectively solved the adhesion problem that MEMS micro-nano technology brought. In the MEMS process, the sticking problem is caused by uneven stress, and in general, the larger the planar size and thickness, the more likely the sticking is caused. The anti-adhesion cylinder structure of this application sets up, can make plane size or thickness suitably increase to better the slim of realization multilayer micro-gear.
The first anti-adhesion cylinder 4, the second anti-adhesion cylinder 5 and the third anti-adhesion cylinder 6 are all uniformly distributed on the corresponding surfaces, so that uneven distribution of supporting force between adjacent planes is avoided.
In this embodiment, the fixed connection is an electroplating connection. The electroplated connection enables a high aspect ratio die to achieve a robust and consistent metal deposition.
The upper surface of the uppermost gear in the multi-layer gear layer 8 is provided with an annular groove 7, the first step-type gear positioning structure 2 is arranged in the annular groove 7, and the upper surface of the first step-type gear positioning structure 2 and the upper surface of the uppermost gear are located on the same plane. The first step-shaped gear positioning structure 2 is combined with the upper surface of the uppermost gear, so that the upper surface of the multi-layer micro-gear structure is a plane, and the integration of functions of the system is further improved due to the integration of the first step-shaped gear positioning structure with other structures or devices in a micro-system.
The distance between the first anti-adhesion cylinder 4 and the upper surface of the multi-layer gear layer 8 is 10-20 μm, the distance between the second anti-adhesion cylinder 5 and the lower surface of the multi-layer gear layer 8 is 10-20 μm, and the distance between the third anti-adhesion cylinder 6 and the upper surface of the gear substrate 10 is 10-20 μm. Through the arrangement of the above intervals, the rotation of the multi-layer gear layer 8 is ensured. A certain gap is reserved between the rooting bearing 1 and the shaft hole of the multi-layer gear layer 8, so that the gear is prevented from being blocked while rotating.
The material of whole gear microstructure is nickel, and multilayer structure forms through electroplating growth's form, from bottom to top growth structure in proper order, electroplate first layer structure second ladder type gear location structure 3 on gear substrate 10 at first, then electroplate growth structure second anti-adhesion cylinder 5 above that, electroplate growth structure third anti-adhesion cylinder 6 at the lower surface of multilayer gear layer 8, and the first layer gear of whole gear structure, first layer isolation layer, second time gear, second layer isolation layer, third layer gear, first anti-adhesion cylinder 4 and first ladder type gear location structure 2 are grown in electroplating by analogy.
The principles and embodiments of the present invention have been described in detail with reference to specific examples, which are provided to facilitate understanding of the method and core ideas of the present invention; also, it is within the scope of the present invention to be modified by those of ordinary skill in the art in light of the present teachings. In view of the foregoing, this description should not be construed as limiting the invention.
Claims (7)
1. Be applied to MEMS and receive processing's integration does not have assembled multilayer micro-gear structure a little, its characterized in that: including rooting bearing, first ladder type gear location structure, second ladder type gear location structure and multilayer gear layer, the terminal surface fixed connection is on a gear basement under the rooting bearing, second ladder type gear location structure set up in rooting bearing's lower extreme, second ladder type gear location structure fixed connection is in on the gear basement, first ladder type gear location structure set up in rooting bearing's upper end, multilayer gear layer cover is established rooting bearing's middle part, multilayer gear layer includes a plurality of gears, a plurality of pass through the isolation layer electroplating link together between the gears, second ladder type gear location structure's upper surface fixedly connected with second anti-adhesion cylinder, first ladder type gear location structure's lower surface fixedly connected with first anti-adhesion cylinder.
2. The integrated, non-assembled, multi-layered micro-gear structure for MEMS micro-nano machining of claim 1, wherein: the lower surface of the multi-layer gear layer is fixedly connected with a third anti-adhesion cylinder.
3. The integrated, non-assembled, multi-layered micro-gear structure for MEMS micro-nano machining of claim 2, wherein: the first anti-adhesion cylinder, the second anti-adhesion cylinder and the third anti-adhesion cylinder are all uniformly distributed on the corresponding surfaces.
4. The integrated, non-assembled, multi-layered micro-gear structure for use in MEMS micro-nano machining of claim 3, wherein: the fixed connection is electroplating connection.
5. The integrated, non-assembled, multi-layered micro-gear structure for MEMS micro-nano machining of claim 1, wherein: the upper surface of the uppermost gear in the multi-layer gear layer is provided with an annular groove, the first step-type gear positioning structure is arranged in the annular groove, and the upper surface of the first step-type gear positioning structure and the upper surface of the uppermost gear are located on the same plane.
6. The integrated, non-assembled, multi-layered micro-gear structure for MEMS micro-nano machining of claim 2, wherein: the distance between the first anti-adhesion cylinder and the upper surface of the multi-layer gear layer is 10-20 mu m, the distance between the second anti-adhesion cylinder and the lower surface of the multi-layer gear layer is 10-20 mu m, and the distance between the third anti-adhesion cylinder and the upper surface of the gear substrate is 10-20 mu m.
7. The integrated, non-assembled, multi-layered micro-gear structure for use in MEMS micro-nano processing according to any one of claims 1-6, wherein: gear face holes are uniformly distributed on the gear face of the multi-layer gear layer.
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