JP2006035602A - Method for producing minute structure - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method which can accurately produce a minute structure having a minute, complex three-dimensional structure moldable by a photo-fabrication method and optional physical properties. <P>SOLUTION: A photo-polymer (1) is photo-fabricated as a minute, three-dimensional transfer mold (10). The three-dimensional structure of the photo-polymer is transferred to an optional metal (13) by the transfer mold. The metal is packed in the cavity (11) of the transfer mold, and the metal in the cavity, after being passed through an electrolytic grinding process and a resin elimination process, is demolded from the transfer mold. A mask for etching can be manufactured by the transfer mold. The profile of a transfer mold (30) is transferred to a special silicone resin (40). The silicone resin is adhered to a substrate (41) as the mask for etching, and the substrate (41) is etched. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a method for manufacturing a microstructure, and more particularly to a method for manufacturing a microstructure that forms a micro / nano order microstructure having any physical property.

  Lithography is known as a technique for processing a surface of a semiconductor or the like to obtain a three-dimensional structure. A lithography apparatus or a lithography process is used in the manufacture of optical / electronic devices as an apparatus or process for printing a circuit pattern on a semiconductor wafer or the like. Since the lithography technique can also be used in the manufacturing process of the microstructure, a manufacturing method of the microstructure that applies the lithography technique to manufacture a three-dimensional micromachine has been proposed. For example, in JP-A-11-28768 and JP-A-11-61436, a thin film having a two-dimensional pattern is formed on a substrate by a lithography process, the substrate and the thin film are etched, and the substrate and the thin film after etching are processed. Describes a method of manufacturing a micro structure in which three-dimensional micro gears are manufactured by laminating a plurality of layers.

On the other hand, there is known an optical modeling method for modeling a photopolymer having a three-dimensional structure by irradiating a photopolymerizable resin raw material with a laser beam, and a manufacturing method of a microstructure using this is proposed. For example, as described in JP-A-2003-25295, JP-A-2001-158050, and JP-A-11-17037, the optical modeling method irradiates a liquid photopolymerizable resin raw material with laser light. It is known as a processing method for forming a three-dimensional structure made of a photopolymer having a desired shape. According to such an optical modeling method, a micro-structure such as a micro gear having a relatively complicated three-dimensional structure can be obtained by accurately controlling the condensing point of laser light and two-photon absorption. It can be manufactured from raw materials. This photopolymer is usually called a photocurable resin.
JP-A-11-28768 Japanese Patent Laid-Open No. 11-61436 JP 2003-25295 A JP 2001-158050 A JP-A-11-17037

  However, in a method for manufacturing a microstructure using a lithography technique, there is a limit to the three-dimensional structure that can be processed in one lithography process, and a three-dimensional structure having a relatively high aspect ratio or a three-dimensional structure having relatively large irregularities. When a structure is manufactured, or when a three-dimensional structure having a minute and complicated outline or shape is manufactured, it is necessary to repeatedly perform multi-step patterning and etching in accordance with the three-dimensional structure. For this reason, when a micro structure such as a micro gear is manufactured by applying the lithography technique, the manufacturing process becomes complicated or the manufacturing apparatus becomes expensive. Therefore, an effective manufacturing method has not yet been realized for mass-producing micro / nano-order microstructures with an arbitrary material (for example, metal) at low cost.

  On the other hand, according to the manufacturing method of the microstructure using the stereolithography method, by improving the controllability of the laser beam, the three-dimensional structure of the photopolymer having a fine and complicated contour can be obtained with high accuracy. Can be molded. Therefore, a three-dimensional structure having a relatively high aspect ratio or large unevenness, or a three-dimensional structure having a minute and complicated contour can be manufactured by a photopolymerization method by an optical modeling method. However, since the physical properties of the microstructure are governed by the physical properties of the photopolymer, any physical properties such as high mechanical strength, heat resistance, chemical resistance, corrosion resistance, etc., such as metal microstructures, can be obtained. It is very difficult to manufacture a microstructure having a photopolymer with a current technology.

  The present invention has been made in view of such a problem, and the object of the present invention is to have a minute and complicated three-dimensional structure that can be formed by an optical modeling method, and to have a minute physical property. An object of the present invention is to provide a manufacturing method of a microstructure that can form a structure with high accuracy without depending on a lithography technique.

In order to achieve the above object, the present invention provides a microstructure manufacturing method using a photopolymer modeled by an optical modeling method.
A transfer mold manufacturing process in which a three-dimensional structure of a photopolymer is formed into an arbitrary shape by an optical modeling method to form a transfer mold having a microscopic and three-dimensional structure,
A transfer step of transferring the outline of the transfer mold to an arbitrary material,
Provided is a method for manufacturing a microstructure, characterized in that a microstructure having a substantially same structure as a three-dimensional structure that can be formed by an optical modeling method is manufactured.

  According to the above-described configuration of the present invention, a photopolymer transfer mold having a three-dimensional structure is formed with high accuracy by an optical modeling method without passing through a multi-stage patterning and etching process by a lithography technique. The transfer mold can be formed into a fine and complicated three-dimensional structure that can be formed by stereolithography. The three-dimensional structure of the photopolymer is transferred to a material such as a metal or a semiconductor, and a micro structure having substantially the same structure as the three-dimensional structure formed by the optical modeling method is manufactured. The physical properties of the microstructure are not directly related to the physical properties of the photopolymer, but are determined by the physical properties of the material to which the three-dimensional structure is transferred. Therefore, a microstructure having resistance (mechanical strength, heat resistance, chemical resistance, corrosion resistance, etc.) corresponding to the purpose of use, for example, a metal microstructure can be manufactured. In addition, the microstructure formed in this way reflects the accuracy and formability of the optical modeling method, and has a fine and complex three-dimensional structure that can be modeled by the optical modeling method. In addition, since the microstructure can be molded from any material other than the photopolymer, the physical properties of the microstructure after molding can be modified by heat treatment or chemical treatment.

  Preferably, in the transfer step, an arbitrary metal is filled in the cavity of the transfer mold, and the three-dimensional contour of the transfer mold is transferred to the metal in the cavity. More preferably, the metal is filled into the transfer mold cavity using an electroless plating process. Here, the photopolymer has a relatively low heat resistance and pressure resistance, and is difficult to adapt to a high temperature or high pressure molding process. However, the electroless plating method that can be carried out under relatively low temperature (60 ° C. or lower, preferably in the range of 40 to 50 ° C.) and low pressure is preferably applied to the transfer step using a photopolymer transfer mold. obtain.

  Preferably, the plating layer formed on the surface of the transfer mold is removed by electrolytic grinding. Using the characteristics of electrolytic grinding (the property that the grinding tool reaches the electrochemically passive film and the film is peeled off so that only the peeled portion is processed), only the plating layer on the transfer mold surface is accurately measured. Can be removed. As a result of removing all or part of the plating layer on the surface, the photopolymer transfer mold and the microstructure embedded in the transfer mold remain, but the photopolymer is dissolved by the organic solvent, Alternatively, it generally has the property of melting or burning away by heat. Therefore, the metal in the cavity can be demolded by dissolving the transfer mold with an organic solvent or by melting or burning (or gasifying) it with heat. If desired, the mechanical strength of the microstructure after demolding can be improved by heat treatment or the like, or the metal molded body can be subjected to surface treatment. The microstructure formed in this way has both the accuracy, formability, and molding freedom of the optical modeling method, and the freedom of material selection. For this reason, it is possible to inexpensively manufacture a fine structure having a fine and complicated three-dimensional structure, which requires a complicated manufacturing process and expensive or large-scale equipment in the conventional technology, with a simple manufacturing process and equipment.

  In accordance with the present invention, an etching mask may be fabricated with the above transfer mold. The transfer type three-dimensional structure is transferred to an etching mask, and an arbitrary substrate is etched using the etching mask. As a result, a three-dimensional structure substantially the same as the three-dimensional structure modeled by the optical modeling method is formed on the substrate. Preferably, the etching mask is made of a resin that can transfer the three-dimensional contour of the transfer mold, for example, a special silicone resin, and a first surface that is detachably attached to the transfer mold and a first surface that can be attached to the surface of the substrate. Two sides.

  The etching mask having the transfer pattern transferred to the first surface is etched with an etching solution with the second surface in close contact with the surface of the substrate, or is subjected to a dry etching process. According to such a manufacturing method, a large-scale facility represented by a LIGA (lithographie galvanoformung Abformung) process using a lithographic technique, a multi-step repetitive process, or radiant light is used. In addition, a fine structure having a complicated and three-dimensional structure can be manufactured inexpensively with a simple manufacturing process and equipment.

  According to the manufacturing method of the present invention, a microstructure having a fine and complicated three-dimensional structure that can be shaped by an optical shaping method and having any physical property is formed with high accuracy without depending on lithography technology. can do.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings.
1 and 2 are a perspective view and a longitudinal sectional view for explaining the principle of the optical modeling method. FIG. 1 shows a layered stereolithography, and FIG. 2 shows a two-photon absorption stereolithography.

  In the layered stereolithography shown in FIG. 1, an elevating stage 4 that can be raised and lowered in stages is used, and a solidified layer 5 of a photopolymerizable resin is laminated in stages. Hereinafter, the lamination type stereolithography will be described.

  A bath 1 of a photopolymerizable resin material is accommodated in a container (not shown). As shown in FIG. 1A, the platform (table) of the elevating stage 4 is immersed in the bath 1. A relatively thin liquid layer of the photopolymerizable resin material is formed between the upper surface of the platform and the liquid surface of the bath 1. A laser system (not shown) having a light source of ultraviolet laser light irradiates the photopolymerizable resin raw material of the bath 1 with the laser light 2. The laser system focuses the ultraviolet laser beam 2 on the surface layer portion of the bath 1 and scans the laser beam 2 in accordance with preset molding cross-section data. The liquid resin raw material between the liquid surface and the elevating stage 4 is sequentially solidified according to the shift of the focal point 3 to form a polymer layer having a predetermined thickness. The position of the focal point 3 moves under the control of the laser system in the vicinity of the surface layer of the bath 1, and a photopolymer having the desired three-dimensional structure is shaped on the platform.

  Next, the driving device for the lifting stage 4 lowers the platform of the lifting stage 4 by one layer, and the laser system scans the laser beam 2 in the same manner as the first layer, and the second photopolymer layer becomes the laser beam. Modeled on the first layer under the control of the system.

  Thereafter, as shown in FIGS. 1B and 1C, such an operation is repeatedly executed, and the photopolymer 5 is formed. After the curing of all layers is completed as desired, the platform is pulled up to the uppermost stage, and the cured body 5 after shaping is removed from the bath 1. The cured body 5 is washed with a solvent such as ethanol in order to remove the unpolymerized resin raw material. Thus, a desired photopolymer is formed as a matrix or master mold made of a photopolymer described later. The processing resolution by such an optical shaping method is generally about 20 to 200 μm. In addition, if necessary, the master die or the master die may be divided into a plurality of parts, and each component part may be optically modeled according to the above process. In this case, the optically shaped components are joined together to form an integral master or master mold.

  FIG. 2 shows a two-photon absorption method in which a condensing spot 7 is formed inside the photopolymerizable resin raw material bath 1 and a three-dimensional polymer is formed inside the liquid resin raw material by controlling the position of the condensing spot. Stereolithography is shown.

  In the stereolithography shown in FIG. 2, the laser system (not shown) has a light source of a near infrared (or red) femtosecond pulse laser, and the near infrared (or red) laser light 2 of the light source is short. The bath 1 of the photopolymerizable resin material is irradiated through the focus lens 6. The photopolymerizable resin material is transmissive to the laser beam 2, and the laser beam 2 is condensed inside the bath 1 to form a condensed spot 7. A two-photon absorption phenomenon that changes near infrared rays into ultraviolet rays is induced in the condensed spot 7, and only the photopolymerizable resin raw material in the vicinity of the focal position (the focal spot 7) is polymerized.

  The laser system scans the focused spot 7 in the bath 1 and forms a photopolymer 8 having a desired contour. The molded photopolymer 8 is removed from the bath 1 and washed with a solvent such as ethanol. Thus, the photopolymer 8 having a desired contour is formed as a matrix or master mold made of a photopolymer described later. Processing resolution by such an optical shaping method is generally about 0.1 to 10 μm. If necessary, the master mold or master mold components may be optically modeled, and the molded components may be joined together to produce an integral master mold or master mold.

  FIG. 3 is a process explanatory view showing the first embodiment of the microstructure manufacturing method according to the present invention.

  A mother die 10 shaped by the optical shaping method shown in FIG. 1 or FIG. 2 is shown in FIG. 3 (A) and FIG. 3 (B). The mother die 10 is made of a photopolymer having cavities 11 formed by stereolithography. The contour of the cavity 11 matches the contour of the microstructure 20 shown in FIG.

  As shown in FIG. 3C, a metal film 13 is formed on the surface of the mother die 10 and in the cavity 11 by electroless plating.

  In the electroless plating process, metal salts (such as nickel sulfate), reducing agents (such as sodium hypophosphite), pH adjusters, buffers, complexing agents (such as sodium citrate), stabilizers, improvers (lead ions) ) And the like are prepared, and an electroless plating solution (not shown) is prepared, and the matrix 10 is immersed in a plating bath (solution). The temperature of the plating bath (solution) is set to 60 ° C. or lower, preferably 40 to 50 ° C. Metal ions in the solution are reduced by ions released during oxidation of the reducing agent, and are deposited as a plating film to form a plating film on the mother die 10. According to such an electroless plating method, the metal film 13 having an arbitrary thickness can be uniformly formed on the matrix 10 made of photopolymer, and the cavity 11 can be filled with metal.

  Examples of the electroless plating process are illustrated as follows.

  Degreasing step: After immersing the mother die 10 in an ethanol bath (500 ml) at room temperature (about 20 ° C.) for 3 minutes, the mother die 10 is washed with pure water.

  Sensitization process: 2 g of stannous chloride is mixed with 500 ml of hydrochloric acid to prepare a liquid bath at room temperature (about 20 ° C.), and the mother mold 10 is immersed in the liquid bath for 3 minutes. Wash.

  Activation step: A liquid bath of 30 ml of hydrochloric acid mixed with 0.3 g of palladium chloride and 270 ml of ion-exchanged water was prepared, and the mother mold 10 was immersed in a liquid bath at room temperature (about 20 ° C.) for 3 minutes. Wash with pure water.

  Electroless plating process: Prepare a liquid bath by dissolving 21 g of nickel sulfate, 22 g of glycine, 4 mg of lead chloride and 20 g of sodium hypophosphite in 1 liter of pure water, and in a liquid bath whose liquid temperature is controlled at 40 to 50 ° C. The mother die 10 is immersed for 1 to 10 minutes, and the mother die 10 is covered with a plating layer.

  The metal film 13 formed on the mother die 10 by such an electroless plating process generally has a hardness of about 500 to 600 Hv. The mother die 10 is dissolved by an organic solvent in a mother die removing process (FIGS. 3E and 3F) after an electrolytic grinding process (FIG. 3D) for removing an unnecessary metal film portion, Alternatively, it is melted or burned away by heat.

  Electrolytic grinding is a grinding method in which the workpiece is set to the anode and the grinding tool is set to the cathode to cause an electrolytic action in the narrow gap between the two and to grind the workpiece by elution of the workpiece. Are known. Employment of the electrolytic grinding method in the present invention focuses on the characteristics of the electrolytic grinding method in which the grinding action is automatically stopped when the grinding tool reaches the non-conductive portion. As shown in FIG. The portion of the metal film 13 covering the surface (upper surface) is ground by an electrolytic grinding process.

  FIG. 4A shows a state in which a metal bond rotating electrode magnet is used as the grinding tool 50 and the matrix 10 after electroless plating is disposed on the fixed base 51. The exhaust path 52 is connected to a suction device (not shown), and the mother die 10 is vacuum-fixed on the fixed base 51 by a suction pressure acting through the exhaust path 52.

The grinding tool 50 is connected to the cathode of the power supply 53, and the metal film 13 is connected to the anode of the power supply. When an electrolytic solution (for example, NaNO ₃ or the like) is sprayed from the spray nozzle 54 and a voltage is applied to the mother die 10 and the grinding tool 50 by the power supply device 63, a passive film is formed on the upper surface of the mother die 10. When the cutting tool 50 is horizontally displaced as shown in FIG. 4B and the upper surface of the mother die 10 is lightly rubbed, the passive film is peeled off, and electrolytic cutting proceeds as shown in FIG. 4C. When electrolytic cutting is advanced while supplying the electrolytic solution from the spray nozzle 54 and the thickness of the metal film 13 is reduced, the metal film portion on the upper surface of the mother die is completely removed as shown in FIG. As a result, the photopolymer constituting the mother die 10 is exposed on the upper surface of the mother die. The electrolytic action automatically stops due to the exposure of the photopolymer which is an electrical nonconductor, and the metal portion 20 ′ having the shape and contour of the microstructure 20 remains in the cavity 11.

  The mother die 10 that has finished the electrolytic grinding process is shown in FIG. The mother die 10 is immersed in an organic solvent or heated to a temperature higher than the melting point of the photopolymer so as to remove the metal portion 20 ′ in the cavity 10, whereby the metal portion 20 ′ is separated from the photopolymer. To do. The metal part 20 ′ thus demolded is subjected to heat treatment for curing or surface treatment as desired, and thus the microstructure 20 shown in FIGS. 3F and 3G is manufactured. Is done.

  As the microstructure 20 manufactured in this manner, for example, a micro turbine as shown in FIG. 5, a micro gear having a plurality of tooth profile portions, a micro manipulator constituting a micro assembly jig, or a magnetic system is used. A medical micromachine or the like can be exemplified.

  In order to simplify the description, the mother die 10 having a single cavity 11 is shown and described. However, as shown in FIG. 6, a plurality of cavities 11 are formed in the mother die 10 and a plurality of microstructures 20 are formed. You may make it manufacture simultaneously.

  FIG. 7 is a process explanatory view showing a second embodiment of the microstructure manufacturing method according to the present invention.

  A master mold 30 made of a photopolymer manufactured by the above-described lamination method or two-photon method of optical modeling is shown in FIG. A surface contour 31 having minute and complicated irregularities is formed on the surface of the master mold 30 by an optical modeling method, and the surface contour 31 is a contour of the microstructure 40 as a final product (FIG. 7E). It corresponds to. Here, in order to form a complicated surface contour 31 having relatively large undulations in the micro / nano order, conventionally, a resist mask using a lithography technique, a multi-step repetitive process, and a synchrotron radiation are used. Large equipment such as LIGA (lithographie galvanoformung Abformung) process using LIGA was required. However, according to stereolithography, the desired surface contour 31 can be formed into a master type without requiring such steps or equipment. 30 can be formed.

  As shown in FIG. 7B, a special silicone resin sheet 40 is pressed against the master mold 30. The special silicone resin of the sheet 40 has a deformability capable of being deformed by being pressed against the surface contour 31 and a shape retaining property for retaining a contour shaped in the same shape as the surface contour 31.

  As a photopolymerizable resin material constituting the master mold 30, an epoxy-based photocurable resin can be exemplified. In general, the thermal deformation temperature of an epoxy photocurable resin is about 56 ° C., and its tensile strength is about 80 MPa. On the other hand, a polydimethylsiloxane-based silicone elastomer can be suitably used as the special silicone resin constituting the sheet 40. The polydimethylsiloxane-based silicone elastomer has moderate gas permeability, and this gas permeability is larger than the gas permeability of the photopolymer. Further, the polydimethylsiloxane-based silicone elastomer has moderate elasticity and tensile strength (about 7 MPa).

The surface contour 31 of the master mold 30 is transferred to the first surface of the sheet 40 released from the master mold 30 (the lower surface in FIGS. 7B and 7C), and the second surface of the sheet 40 (FIG. B) and (C) are disposed on the substrate 41 as an etching mask in an inverted state, as shown in FIG. 7D. The second surface of the sheet 40 is in close contact with the upper surface of the substrate 41. An etching gas (for example, XeF ₂ (xenon fluoride (II)) is applied to the sheet 40 as indicated by an arrow in FIG. 7D by utilizing the gas permeability and adhesion of the special silicone resin constituting the master mold 30. The isotropic etching of the substrate 41 is performed under room temperature conditions, and the etching gas acts on the substrate 41 through the sheet 40, and the substrate 41 is etched. The three-dimensional structure of the master mold 30 transferred to 40 is further transferred to the substrate 41. Therefore, it is substantially the same as the fine and complicated three-dimensional structure (three-dimensional structure) formed with the accuracy or resolution of the optical modeling method. The structure is formed on the substrate 41. Moreover, according to such a manufacturing method, a substrate made of any material that can be etched can be adopted as the substrate 41. Note that this embodiment Master mold 30 are not subjected to chemical treatment or heat treatment in the microstructure manufacturing process, therefore, can be repeatedly reused.

  The preferred embodiments of the present invention have been described in detail above. However, the present invention is not limited to the above-described embodiments, and various modifications or changes can be made within the scope of the present invention described in the claims. Is possible.

  For example, the etching process for the substrate 41 is not limited to the dry etching method, and a wet etching method in which an etching solution is sprayed onto the sheet 40 may be employed.

  Further, other metals such as titanium may be adopted as the metal filled in the cavity 11.

  The production method of the present invention can be applied to the production of micro / nano-order micromachines or semiconductor elements. According to the present invention, it is possible to manufacture a micromachine, a semiconductor element, or the like at low cost, simply, and with high accuracy.

  In particular, while many micromachines are made of silicon at present, when the present invention is applied to the manufacture of micromachines, metal micromachines such as microcantilever arrays and nano-vibrators can be easily and simply used. It can be manufactured at a low price. This enables mass production of metal micromachines that are expected to be promising especially in the medical device field.

  Further, the present invention can be applied to the manufacture of a semiconductor optical device. For example, when the present invention is applied to lens processing of a semiconductor surface, it becomes possible to give a specific function to the top light emitting element, thereby improving the light emitting efficiency of a light emitting diode (LED) or an electroluminescence (EL) element. Alternatively, it is possible to improve the coupling efficiency between a surface emitting semiconductor laser (VCSEL) element or a single photon light source and an optical fiber cable, and to manufacture a high-precision lens with a short focal length.

  Furthermore, the present invention may be applied to the formation of an optical waveguide. Even when it is necessary to form extreme irregularities on the surface in the formation of a circuit using an optical waveguide, according to the present invention, a complicated three-dimensional structure can be relatively formed without depending on multi-step lithography. It can be molded in a short time and easily.

It is a perspective view which shows the process of the lamination | stacking type optical shaping method which laminates | stacks the solidified layer of a photopolymerizable resin raw material using the raising / lowering stage which can be raised / lowered in steps. It is a longitudinal cross-sectional view which shows the two-photon absorption-type optical modeling method which forms a condensing spot inside a liquid photopolymerizable resin raw material, and forms a photopolymer inside a liquid resin raw material. It is process explanatory drawing which shows 1st Embodiment of the microstructure manufacturing method by this invention with a longitudinal cross-sectional view and a perspective view. It is process explanatory drawing which shows the detail of an electrolytic grinding process (FIG.3 (C)-(E)) with a longitudinal cross-sectional view. FIG. 5 is a perspective view illustrating a microstructure (microturbine) manufactured by the manufacturing process illustrated in FIGS. 3 and 4. It is a perspective view which illustrates the mother die in which a plurality of cavities were formed. It is process explanatory drawing which shows 2nd Embodiment of the microstructure manufacturing method by this invention with a longitudinal cross-sectional view.

Explanation of symbols

1 Bath (raw material for photopolymerizable resin)
2 Laser light 3 Focus 4 Lifting stage (platform)
5 Photopolymer 6 Short focus lens 7 Condensing spot 8 Photopolymer 10 Master mold 11 Cavity 13 Metal coating 20 Microstructure 20 ′ Metal part 30 Master mold 31 Surface contour 40 Sheet 41 Substrate 42 Surface contour 50 Grinding tool 51 Fixed Stand 52 Exhaust path 53 Power supply 54 Spray nozzle

Claims (8)

In the manufacturing method of the microstructure using the photopolymer modeled by the optical modeling method,
A transfer mold manufacturing process in which a three-dimensional structure of a photopolymer is formed into an arbitrary shape by an optical modeling method to form a transfer mold having a microscopic and three-dimensional structure,
A transfer step of transferring the outline of the transfer mold to an arbitrary material,
A method for manufacturing a microstructure, comprising manufacturing a microstructure having a substantially same structure as a three-dimensional structure that can be formed by stereolithography and having an arbitrary physical property.   2. The microstructure according to claim 1, wherein in the transfer step, an arbitrary metal is filled in the cavity of the transfer mold, and the three-dimensional contour of the transfer mold is transferred to the metal in the cavity. Production method.   3. The method for manufacturing a microstructure according to claim 2, wherein an arbitrary metal is filled in the cavity of the transfer mold by electroless plating.   4. The method for manufacturing a microstructure according to claim 3, wherein a plating layer formed on the surface of the transfer mold by electroless plating is removed by electrolytic grinding.   5. The method for manufacturing a microstructure according to claim 2, wherein the metal in the cavity is removed from the transfer mold by melting, burning, or dissolving the transfer mold. 6.   The transfer type three-dimensional structure is transferred to an etching mask, an arbitrary substrate is etched using the etching mask, and a substantially same structure as the three-dimensional structure formed by stereolithography is formed on the substrate. The method for manufacturing a microstructure according to claim 1.   The etching mask is made of a resin capable of transferring the three-dimensional contour of the transfer mold, and has a first surface that can be detachably attached to the transfer mold and a second surface that can be closely attached to the surface of the substrate. The method for manufacturing a microstructure according to claim 6. The method for producing a microstructure according to any one of claims 1 to 7, wherein physical properties of the microstructure are modified by heat treatment or chemical treatment.

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