CN108299898A - The cured circuit board electronic Protection glues of UV - Google Patents

The cured circuit board electronic Protection glues of UV Download PDF

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Publication number
CN108299898A
CN108299898A CN201610791424.3A CN201610791424A CN108299898A CN 108299898 A CN108299898 A CN 108299898A CN 201610791424 A CN201610791424 A CN 201610791424A CN 108299898 A CN108299898 A CN 108299898A
Authority
CN
China
Prior art keywords
circuit board
electronic protection
board electronic
protection glues
glues
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610791424.3A
Other languages
Chinese (zh)
Inventor
陈平
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHANGHAI CHANGYUE COATING CO Ltd
Original Assignee
SHANGHAI CHANGYUE COATING CO Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHANGHAI CHANGYUE COATING CO Ltd filed Critical SHANGHAI CHANGYUE COATING CO Ltd
Priority to CN201610791424.3A priority Critical patent/CN108299898A/en
Publication of CN108299898A publication Critical patent/CN108299898A/en
Pending legal-status Critical Current

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Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D4/00Coating compositions, e.g. paints, varnishes or lacquers, based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; Coating compositions, based on monomers of macromolecular compounds of groups C09D183/00 - C09D183/16
    • C09D4/06Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09D159/00 - C09D187/00
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09DCOATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/20Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes for coatings strippable as coherent films, e.g. temporary coatings strippable as coherent films

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  • Chemical & Material Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Paints Or Removers (AREA)

Abstract

The present invention relates to the Protection glues of circuit board more particularly to circuit board.A kind of cured circuit board electronic Protection glues of UV, it include the Y804 6 10% of following weight percents, DY2600 6 10%, PM 24 6%, polyurethane 19 22%, hydroxy-ethyl acrylate 45 50%, 1,173 5 6%, benzophenone 0.6 1.1%, diethylamine be modified that TM 3 4%, BYK358N 0.1 0.3%, moral be modest 2,700 0.1 0.5%, Changxing 4,601 0.1 0.30.Smell of the present invention is small, and curing rate is high, and glossiness is good.

Description

The cured circuit board electronic Protection glues of UV
Technical field
The present invention relates to the Protection glues of circuit board more particularly to circuit board.
Background technology
Currently, circuit board is required for coating Electronic protection glue will not be because of small metal for protection circuit boards solder, pin Part falls and leads to short circuit, and the cured Electronic protection glues of wherein UV are gradually promoted come in recent years.But current UV solidifications Electronic protection glue smell it is larger, damage and discomfort in smell are brought to user;Also, existing product glossiness is inadequate, apply Circuit board appearance after covering is bad;In addition, curing rate is also the bottleneck for limiting UV solidification Electronic protection glues and promoting slowly.
Invention content
Present invention seek to address that the drawbacks described above of the prior art, provides a kind of cured circuit board electronic Protection glues of UV.This Invention smell is small, and curing rate is high, and glossiness is good.
In order to solve the above-mentioned technical problem, the cured circuit board electronic Protection glues of a kind of UV, it includes following weight percent Ratio:
The cured circuit board electronic Protection glues of the UV, its condition of cure are 500mJ, 3-5s.
The cured circuit board electronic Protection glues of the UV, it is I grades that the cross-hatching after solidification, which measures paint film intensity,.
Raw material smell of the present invention is small, and peculiar smell is substantially not present after solidification, does not interfere with the smell of user.This Outside, higher solidification hastens that production efficiency can be effectively improved, and glossiness is high after solidification, good visual effect.
Specific implementation mode
A kind of cured circuit board electronic Protection glues of UV, it includes following weight percents
Embodiment 1 Embodiment 2 Embodiment 3 Embodiment 4
Y804 9.5 7.4 9 8.6
DY2600 9.5 7.4 9 8.6
Acrylated phosphate 4 4.5 5.5 6
Polyurethane 22 20 21 19
Hydroxy-ethyl acrylate 45 50 45 47.1
- 2 methyl-1 phenyl -1- acetone of 2- hydroxyls 6 5.3 5.9 5
Benzophenone 0.6 0.9 0.8 1.1
Diethylamine is modified TM 3.1 4 3 3.5
BYK358N 0.1 0.15 0.26 0.3
Moral modest 2700 0.1 0.2 0.34 0.5
Changxing 4601 0.1 0.15 0.2 0.3
It amounts to 100 100 100 100
Solidification, is the ultraviolet light 3-5s of 500mJ with power.
Paint film intensity, it is I grades that each embodiment measures paint film intensity with cross-hatching.

Claims (3)

1. a kind of cured circuit board electronic Protection glues of UV, it includes following weight percents
2. the cured circuit board electronic Protection glues of UV according to claim 1, which is characterized in that its condition of cure is 500mJ ultraviolet lights, 3-5s.
3. the cured circuit board electronic Protection glues of UV according to claim 1, which is characterized in that the cross-hatching after solidification is surveyed It is I grades to determine paint film intensity.
CN201610791424.3A 2016-08-31 2016-08-31 The cured circuit board electronic Protection glues of UV Pending CN108299898A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201610791424.3A CN108299898A (en) 2016-08-31 2016-08-31 The cured circuit board electronic Protection glues of UV

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201610791424.3A CN108299898A (en) 2016-08-31 2016-08-31 The cured circuit board electronic Protection glues of UV

Publications (1)

Publication Number Publication Date
CN108299898A true CN108299898A (en) 2018-07-20

Family

ID=62871629

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201610791424.3A Pending CN108299898A (en) 2016-08-31 2016-08-31 The cured circuit board electronic Protection glues of UV

Country Status (1)

Country Link
CN (1) CN108299898A (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102643600A (en) * 2012-04-18 2012-08-22 上海维凯化学品有限公司 Ultraviolet light curing coating composition
CN102732159A (en) * 2012-06-25 2012-10-17 烟台开发区泰盛精化新材料有限公司 Peelable solder mask UV curing adhesive, and its preparation and application methods
CN103555187A (en) * 2013-09-30 2014-02-05 上海维凯化学品有限公司 High impact resistance ultraviolet curing coating combination and use method thereof
CN104152032A (en) * 2014-08-01 2014-11-19 苏州袭麟光电科技产业有限公司 Scratch-resistant stiffed film and preparation method thereof

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102643600A (en) * 2012-04-18 2012-08-22 上海维凯化学品有限公司 Ultraviolet light curing coating composition
CN102732159A (en) * 2012-06-25 2012-10-17 烟台开发区泰盛精化新材料有限公司 Peelable solder mask UV curing adhesive, and its preparation and application methods
CN103555187A (en) * 2013-09-30 2014-02-05 上海维凯化学品有限公司 High impact resistance ultraviolet curing coating combination and use method thereof
CN104152032A (en) * 2014-08-01 2014-11-19 苏州袭麟光电科技产业有限公司 Scratch-resistant stiffed film and preparation method thereof

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SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
WD01 Invention patent application deemed withdrawn after publication

Application publication date: 20180720

WD01 Invention patent application deemed withdrawn after publication