CN108287601A - A kind of airborne computer thermal balance adjuster - Google Patents
A kind of airborne computer thermal balance adjuster Download PDFInfo
- Publication number
- CN108287601A CN108287601A CN201810100261.9A CN201810100261A CN108287601A CN 108287601 A CN108287601 A CN 108287601A CN 201810100261 A CN201810100261 A CN 201810100261A CN 108287601 A CN108287601 A CN 108287601A
- Authority
- CN
- China
- Prior art keywords
- metp
- mainboard
- heating film
- thermal balance
- metal partion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
Abstract
A kind of airborne computer thermal balance adjuster, including shell and at least one heat sink, shell surrounds open-topped cavity, heat regulating device is installed in the cavity, the heat regulating device includes the metal partion (metp) at both ends, at least one heating film is provided between metal partion (metp), the heating film is fixed in metal frame, and metal frame both ends are fixed on by locking member on metal partion (metp);Mainboard both ends are fixed on metal partion (metp), and mainboard is not contacted with heating film.Airborne computer provided by the invention thermal balance adjuster, the temperature of mainboard is adjusted by heat regulating device, it is internal that there is heating, heat insulation function, outside to have heat sinking function, the dynamic equilibrium that can realize heat controls the temperature of mainboard in suitable working range.
Description
Technical field
The present invention relates to airborne computer technology fields, more particularly, to a kind of thermal balance adjuster.
Background technology
With the intelligentized continuous improvement of aircraft, airborne computer to the intelligentized influence degree of aircraft increasingly
Greatly.
Under normal conditions, computer motherboard is susceptible to the excessively high phenomenon of temperature at work, therefore existing mainboard temperature
Control is excessively high for mainboard temperature mostly and designs, such as disclosed in the utility model patent of notification number CN206402627U
A kind of installation mainboard that thermal diffusivity is good.
And the working environment of aircraft is severe, such as aircarrier aircraft flying height in stratosphere, climatic environment is usual
It is sub-zero temperature, the parts in mainboard, slave board and the interface board in airborne computer may be caused to solidify under this environment
To which operation troubles occur.Therefore it needs to heat up to mainboard in high-altitude, while being also required to prevent mainboard from work occurring
Mainboard temperature, is maintained suitable range by the excessively high phenomenon of temperature.
Invention content
The technical problem to be solved by the present invention is to:Mainboard can be added by overcoming the deficiencies of the prior art and provide one kind
Heat, heat preservation and heat dissipation, realize heat balance, maintain the airborne computer thermal balance adjuster of mainboard temperature.
The technical solution adopted by the present invention to solve the technical problems is:A kind of airborne computer is provided to be adjusted with thermal balance
Device, including shell, shell surround open-topped cavity, and heat regulating device, the heat regulating device are equipped in the cavity
Metal partion (metp) including both ends is provided at least one heating film between metal partion (metp), and the heating film is fixed in metal frame,
Metal frame both ends are fixed on by locking member on metal partion (metp);Mainboard both ends are fixed on metal partion (metp), and mainboard and heating film
It does not contact.
Further, the quantity of the heating film is two or more, heating film parallel arrangement, and mainboard and heating film interval cloth
It sets.
There are threading space, the data line of mainboard and the power cords of heating film between the metal partion (metp) and cavity bottom
It is pierced by from threading space.
The shell side offers power cord jack and serial line interface, the data line of mainboard and the power cord of heating film
It is respectively connected to serial line interface and power cord jack.
Further, the back of the metal partion (metp) at the heat regulating device both ends is wavy or metal partion (metp) phase
The back side opens up fluted.
Further, the outer surface of the shell opens up fluted for wavy or shell outer surface.
Beneficial effects of the present invention:
Airborne computer provided by the invention thermal balance adjuster is adjusted the temperature of mainboard by heat regulating device,
It is internal with heating, heat insulation function, and outside has heat sinking function, the dynamic equilibrium of heat can be realized, by the temperature of mainboard
Control is in suitable working range.
Description of the drawings
The schematic diagram for the airborne computer thermal balance adjuster that Fig. 1-embodiment 1 provides;
The schematic diagram of heat regulating device in Fig. 2-embodiment 1;
Enlarged diagram in Fig. 3-Fig. 2 at B;
The schematic diagram of heating film in Fig. 4-embodiment 1;
The schematic diagram of Section A-A in Fig. 5-Fig. 1.
Reference sign
1 shell, 1.1 grooves, 2 metal frames, 3 heat regulating devices, 4 metal partion (metp)s, 4.1 card slots, 5 heating films, 5.1 power cords, 6 masters
Plate, 6.1 data lines, 7 power cord jacks, 8 serial line interfaces.
Specific implementation mode
The invention will be further described with reference to the accompanying drawings and embodiments.
Embodiment 1
Referring to Fig.1 ~ 5, a kind of airborne computer thermal balance adjuster that embodiment 1 provides, including shell 1, shell 1 surround top
The cavity of portion's opening, is equipped with heat regulating device 3 in the cavity, and the heat regulating device 3 includes the metal partion (metp) 4 at both ends,
There are three heating film 5,6 both ends of mainboard are fixed on by locking member on metal partion (metp) 4 for setting between metal partion (metp) 4, and mainboard 6 with
Heating film 5 does not contact.
The heating film 5 is fixed in metal frame 2, and 2 both ends of metal frame are fixed on metal partion (metp) 4.
The locking member is card slot 4.1, and card slot 4.1 is opened in the opposite face of the metal partion (metp) 4 at 3 both ends of heat regulating device,
And be an integral structure with metal partion (metp) 4,6 both ends of mainboard are embedded in card slot 4.1.
5 parallel arrangement of the heating film, and mainboard 6 and 5 arranged for interval of heating film.
There are threading space between the metal partion (metp) 4 and cavity bottom, the data line 6.1 of mainboard 6 and heating film 5
Power cord 5.1 is pierced by from threading space.
1 side of the shell offers power cord jack 7 and serial line interface 8, the data line 6.1 and heating film 5 of mainboard 6
Power cord 5.1 be respectively connected to serial line interface 8 and power cord jack 7.
The back of the metal partion (metp) 4 at 3 both ends of the heat regulating device is wavy.
The outer surface of the shell 1 opens up fluted 1.1.
The operation principle and using method of the present embodiment:
The temperature of mainboard 6 is adjusted by heat regulating device 3, and heating film 5 is used for the heating of mainboard 6, the metal at both ends every
Plate 4 is used for the heat dissipation of mainboard 6, when heating reaches balance with heat dissipation, you can controlling the temperature of mainboard 6 in certain range
(Such as -60 DEG C or more).
Mainboard 6 is not contacted with heating film 5, and when 6 temperature of mainboard is relatively low, heat radiation is carried out to mainboard 6 using heating film 5,
Air themperature between heating film 5 and mainboard 6 increases simultaneously, has heat insulation effect, prevents temperature aloft is low from causing mainboard 6 to attached
Close air heat dissipation is too fast.It is heated using heat radiation, heating effect is uniform, and mainboard 6 is avoided to generate temperature gradient.
After 6 temperature of mainboard increases, it will continue to obtain heat, while the locking member for passing through both ends from heating film 5(This implementation
Locking member in example is card slot 4.1, and heat is transferred to metal partion (metp) 4 by card slot 4.1 and is finally shed by shell 1)It carries out
Heat transfer and radiate, realize the dynamic equilibrium of heat, the temperature of mainboard 6 controlled in suitable working range.
5 parallel arrangement of the heating film, maximally utilizes the space between metal partion (metp) 4;Mainboard 6 is spaced with heating film 5
Arrangement, every piece of mainboard 6 are heated by individual heating film 5, avoid the distance between heating film 5 that heating is caused to be imitated too far
Fruit declines.
For the ease of the arrangement of data line 6.1 and power cord 5.1, there are threading between metal partion (metp) 4 and cavity bottom
Space avoids data line 6.1 and power cord 5.1 excessively crowded and mutually entwine.Power cord jack 7 and serial line interface 8 are distinguished
Interface as power cord 5.1 and data line 6.1.
The back of the metal partion (metp) 4 at 3 both ends of the heat regulating device is that wavy and shell 1 outer surface opens up
Fluted 1.1, increase metal partion (metp) 4, the outer surface of shell 1 and the contact area of extraneous air, when 6 temperature of mainboard is excessively high(Example
Such as 80 DEG C or more), promote external heat dissipation effect.
In the present embodiment, the heating film 5 can be used with metal frame 2,2 both ends of metal frame and the fixation of metal partion (metp) 4
The routine fixed form such as clamping, adhesion.In addition, the mainboard in the present invention is also replaced by slave board or interface board etc..The above skill
The change of art feature, those skilled in the art is appreciated that and is implemented by verbal description, therefore is no longer separately said as attached drawing
It is bright.
Claims (8)
1. a kind of airborne computer thermal balance adjuster, including shell and at least one heat sink, shell surround open top
Cavity, heat regulating device is installed in the cavity, which is characterized in that the heat regulating device include both ends metal every
Plate is provided at least one heating film between metal partion (metp), and the heating film is fixed in metal frame, and metal frame both ends pass through lock
Tight part is fixed on metal partion (metp);Mainboard both ends are fixed on metal partion (metp), and mainboard is not contacted with heating film.
2. airborne computer as described in claim 1 thermal balance adjuster, it is characterised in that:The quantity of the heating film is two
More than a, heating film parallel arrangement, and mainboard and heating film arranged for interval.
3. airborne computer as claimed in claim 1 or 2 thermal balance adjuster, it is characterised in that:The locking member is card slot,
Card slot is opened in the opposite face of the metal partion (metp) at heat regulating device both ends, and is an integral structure with metal partion (metp), mainboard both ends
In embedded card slot.
4. airborne computer as claimed in claim 3 thermal balance adjuster, it is characterised in that:The metal partion (metp) and cavity bottom
There are threading space, the data line of mainboard and the power cords of heating film between portion is pierced by from threading space.
5. airborne computer as claimed in claim 4 thermal balance adjuster, it is characterised in that:The shell side offers electricity
Source line jack and serial line interface, the data line of mainboard and the power cord of heating film are respectively connected to serial line interface and power cord is inserted
Mouthful.
6. airborne computer as claimed in claim 1 or 2 thermal balance adjuster, it is characterised in that:The heat regulating device two
The back of the metal partion (metp) at end opens up fluted for wavy or metal partion (metp) back.
7. airborne computer as claimed in claim 1 or 2 thermal balance adjuster, it is characterised in that:The outer surface of the shell
It is opened up for wavy or shell outer surface fluted.
8. airborne computer as claimed in claim 3 thermal balance adjuster, it is characterised in that:The heating film clamping or viscous
It is connected in metal frame;Metal frame both ends are clamped or stick on metal partion (metp).
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810100261.9A CN108287601A (en) | 2018-02-01 | 2018-02-01 | A kind of airborne computer thermal balance adjuster |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810100261.9A CN108287601A (en) | 2018-02-01 | 2018-02-01 | A kind of airborne computer thermal balance adjuster |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108287601A true CN108287601A (en) | 2018-07-17 |
Family
ID=62836163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810100261.9A Pending CN108287601A (en) | 2018-02-01 | 2018-02-01 | A kind of airborne computer thermal balance adjuster |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108287601A (en) |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6743201B1 (en) * | 1998-04-01 | 2004-06-01 | Fresenius Medical Care Deutschland Gmbh | Cassette for delivering fluids, especially dialysis fluids |
CN1633230A (en) * | 2003-12-24 | 2005-06-29 | 华为技术有限公司 | A heating system |
CN1921094A (en) * | 2005-08-24 | 2007-02-28 | 讯凯国际股份有限公司 | Radiating fin, radiator built-up by same and its manufacturing method |
CN101217857A (en) * | 2007-12-26 | 2008-07-09 | 中兴通讯股份有限公司 | A heating device and method for outdoor base station |
CN202857210U (en) * | 2012-09-17 | 2013-04-03 | 西安天伟电子系统工程有限公司 | Low temperature starting device of electronic unit |
CN103140030A (en) * | 2011-11-21 | 2013-06-05 | 艾默生网络能源-嵌入式计算有限公司 | Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature |
CN103455102A (en) * | 2013-06-03 | 2013-12-18 | 孔繁忠 | Equipment cabinet server |
CN105895843A (en) * | 2016-06-23 | 2016-08-24 | 广州益维电动汽车有限公司 | Intelligent lithium ion battery module |
CN106058112A (en) * | 2016-08-12 | 2016-10-26 | 东莞力朗电池科技有限公司 | Cylindrical battery module |
-
2018
- 2018-02-01 CN CN201810100261.9A patent/CN108287601A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6743201B1 (en) * | 1998-04-01 | 2004-06-01 | Fresenius Medical Care Deutschland Gmbh | Cassette for delivering fluids, especially dialysis fluids |
CN1633230A (en) * | 2003-12-24 | 2005-06-29 | 华为技术有限公司 | A heating system |
CN1921094A (en) * | 2005-08-24 | 2007-02-28 | 讯凯国际股份有限公司 | Radiating fin, radiator built-up by same and its manufacturing method |
CN101217857A (en) * | 2007-12-26 | 2008-07-09 | 中兴通讯股份有限公司 | A heating device and method for outdoor base station |
CN103140030A (en) * | 2011-11-21 | 2013-06-05 | 艾默生网络能源-嵌入式计算有限公司 | Circuit board heatsink and heatframe structures with heater element for circuit board operation at below zero temperature |
CN202857210U (en) * | 2012-09-17 | 2013-04-03 | 西安天伟电子系统工程有限公司 | Low temperature starting device of electronic unit |
CN103455102A (en) * | 2013-06-03 | 2013-12-18 | 孔繁忠 | Equipment cabinet server |
CN105895843A (en) * | 2016-06-23 | 2016-08-24 | 广州益维电动汽车有限公司 | Intelligent lithium ion battery module |
CN106058112A (en) * | 2016-08-12 | 2016-10-26 | 东莞力朗电池科技有限公司 | Cylindrical battery module |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN107102479A (en) | Backlight module and display device | |
CN108287601A (en) | A kind of airborne computer thermal balance adjuster | |
CN107704066A (en) | A kind of integrated form cooling stand | |
CN207449380U (en) | A kind of heating unit for die-cutting gold-stamping machine | |
CN105101760B (en) | Temperature-controlled appliance electric cabinet with external radiating device | |
CN210042377U (en) | Circuit board with location buckle structure | |
CN208969125U (en) | Acceleration measurement device based on quartz flexible accelerometer | |
CN207541242U (en) | A kind of lamps and lanterns test box with reference | |
CN208737158U (en) | Liquid crystal display | |
CN206253157U (en) | A kind of visual constant temp test tube rack device | |
CN108533906A (en) | A kind of laptop radiator support | |
CN208919592U (en) | A kind of laptop radiator support | |
CN205593037U (en) | Multi -functional heating plate | |
CN208334843U (en) | LED backlight, large-size screen monitors touch control display device and infrared touch control display device | |
CN205351850U (en) | Dual -purpose case of changes in temperature based on single chip microcomputer control | |
CN209165079U (en) | A kind of ultra-high brightness LED glass fluorescent lamp | |
CN213282694U (en) | Towel rack with heating function | |
CN208026994U (en) | A kind of heatable microscope carrier | |
CN108387991A (en) | Applied to optical accurate temperature controller method and apparatus | |
CN207162077U (en) | A kind of display rack with intelligent fan | |
CN208489879U (en) | Terminal device | |
CN207114987U (en) | A kind of backlight module and liquid crystal display die set | |
CN205179382U (en) | Microscope stage heating device | |
CN206757260U (en) | A kind of backlight and liquid crystal display die set | |
CN109770518A (en) | A kind of accurate temperature control fever comb teeth and the comb that generates heat |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180717 |