CN207114987U - A kind of backlight module and liquid crystal display die set - Google Patents
A kind of backlight module and liquid crystal display die set Download PDFInfo
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- CN207114987U CN207114987U CN201721193657.XU CN201721193657U CN207114987U CN 207114987 U CN207114987 U CN 207114987U CN 201721193657 U CN201721193657 U CN 201721193657U CN 207114987 U CN207114987 U CN 207114987U
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- underframe
- backlight module
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- heat
- fpc
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Abstract
The utility model provides a kind of backlight module and liquid crystal display die set, light guide plate and optical diaphragm group including underframe, on underframe, reflector plate, the luminescence component located at light guide plate side and the center being sheathed on underframe fitted between underframe and light guide plate, the underframe is aluminium frame, covered with heat dissipating layer on the underframe；The reflector plate is provided with heat-conducting layer towards underframe one side；The luminescence component includes FPC and the multiple LED being electrically connected on FPC；The FPC includes black PI base materials and the cover layer on black PI base materials, and the FPC is pasted by black heat-conducting glue and underframe to be connected；The center is black glue frame.Backlight module provided by the utility model and liquid crystal display die set can improve the radiating efficiency of backlight module, timely and effectively mediate heat caused by backlight module, the operating temperature of backlight module is reduced, solves the problem of causing backlight effect poor because heated, backlight module service life reduction.
Description
Technical field
Display technology field is the utility model is related to, more particularly to a kind of backlight module and liquid crystal display die set.
Background technology
Liquid crystal display die set has the advantages that frivolous, energy consumption is small, radiationless and be widely used in a variety of display devices, liquid
Display panel in brilliant display module belongs to passive display device, it is therefore desirable to backlight module is set, to provide light by showing
Panel reflects display picture.Emitted beam in backlight module using luminescence component, luminescence component generally comprises circuit board
And the LED on circuit board is electrically connected to, and wherein circuit board can be that PCB can also be FPC, because FPC structures are frivolous bent,
Therefore it is more widely applied.Luminescence component at work, can send amount of heat, because backlight module belongs to the knot of relative closure
Structure, therefore heat aggregation is easily produced, when backlight module temperature raises, LED luminance and service life can be reduced, can also be caused
Light guide plate or center inside backlight module etc. deform, and influence backlight effect, or even be damaged.Existing backlight module
Metal end frame typically is used, and luminescence component is connected to reach the purpose of radiating, but this by heat-conducting glue with metal end frame
The scheme radiating effect of sample is limited, in particular with the requirement more and more higher to backlight illumination, can not reach cooling requirements in time,
Protect the normal work of backlight module.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of backlight module and liquid crystal display die set, it can and
When effectively mediate heat caused by backlight module, reduce the operating temperature of backlight module, solve to cause backlight effect because being heated
Difference, the problem of backlight module service life reduction.
In order to solve the above technical problems, the utility model provides a kind of backlight module, including underframe, on underframe
Light guide plate and optical diaphragm group, the reflector plate fitted between underframe and light guide plate, the luminescence component located at light guide plate side and
The center being sheathed on underframe, the underframe are aluminium frame, covered with heat dissipating layer on the underframe；The reflector plate is towards underframe one
Face is provided with heat-conducting layer；The luminescence component includes FPC and the multiple LED being electrically connected on FPC；The FPC includes black PI
Base material and the cover layer on black PI base materials, the FPC is pasted by black heat-conducting glue and underframe to be connected；The center is
Black glue frame.
As a kind of preferred scheme of the present utility model, the heat dissipating layer is black oxidation aluminium lamination.
As a kind of preferred scheme of the present utility model, the heat dissipating layer thickness is 2-10um.
As a kind of preferred scheme of the present utility model, the heat-conducting layer uses black graphite particle, adhesive and solidification
Agent is made.
As a kind of preferred scheme of the present utility model, the underframe is provided with thermal trough.
Further, there is provided a kind of liquid crystal display die set, including backlight module described in any of the above item, located at backlight mould
Display panel in group, the anti-dazzling screen between backlight module and display panel and the front frame on display panel.
As a kind of preferred scheme of the present utility model, the front frame is for metal frame and covered with black light-absorption layer.
As a kind of preferred scheme of the present utility model, the anti-dazzling screen is black double faced adhesive tape.
As a kind of preferred scheme of the present utility model, the front frame fastens dress by an at least fastening structure and underframe
Match somebody with somebody, the center offers avoiding hollow groove in the position of corresponding buckle.
The utility model has following technique effect：Backlight module provided by the utility model and liquid crystal display die set pass through
Set and be covered in the aluminum underframe and black glue frame of heat dissipating layer, frame and heat-conducting layer is set on reflector plate and with black heat conduction sticker
The FPC for including black PI base materials closed, the radiating efficiency of backlight module can be improved, timely and effectively mediate backlight module generation
Heat, reduce the operating temperature of backlight module, solve to cause backlight effect poor because being heated, backlight module service life reduction is asked
Topic.In addition, by thermal trough and setting, radiating effect is further improved, effectively reduces the temperature at luminescence component；Pass through setting
Front frame with black light-absorption layer and black double faced adhesive tape is set as anti-dazzling screen, the radiating efficiency of backlight module is improved, by
Frame position sets avoiding hollow groove, be underframe and front frame directly by snap-fitted, improve fitting tight degree, and contribute to dissipating for underframe
Heat, it helps the electrostatic protection of backlight module.
Brief description of the drawings
Fig. 1 is a kind of structural representation of backlight module provided by the utility model；
Fig. 2 is a kind of structural representation of underframe heat dissipating layer provided by the utility model；
Fig. 3 is a kind of result schematic diagram of reflector plate heat-conducting layer provided by the utility model；
Fig. 4 is a kind of FPC structural representation provided by the utility model；
Fig. 5 is a kind of structural representation of thermal trough provided by the utility model；
Fig. 6 is a kind of structural representation of liquid crystal display die set provided by the utility model；
Fig. 7 is a kind of structural representation of front frame provided by the utility model；
Fig. 8 is a kind of structural representation of avoiding hollow groove provided by the utility model.
Embodiment
To make the purpose of this utility model, technical scheme and advantage are clearer, below in conjunction with the accompanying drawings to the utility model
Embodiment is described in further detail.
As shown in figure 1, which show a kind of structural representation of backlight module provided by the utility model.The backlight module
BL includes underframe 1, the light guide plate 2 on underframe 1 and optical diaphragm group 3, the reflection fitted between underframe 1 and light guide plate 2
Piece 4, the luminescence component 5 located at the side of light guide plate 2 and the center 6 being sheathed on underframe 1, the luminescence component 5 include FPC51 and
The multiple LED52 being electrically connected on FPC51.Specifically, as in Figure 2-4, the underframe 1 is aluminium frame, is covered on the underframe 1
There is heat dissipating layer 11；The reflector plate 4 is simultaneously provided with heat-conducting layer 41 towards underframe 1；The FPC51 includes black PI base materials 511
With the cover layer 512 on black PI base materials 511, the FPC51 is pasted by black heat-conducting glue 7 and underframe 1 to be connected；It is described
Center 6 is glue frame, is made of black material.So, at work, the heat that LED52 is sent can be via FPC51 for backlight module
Underframe 1 is passed to by black heat-conducting glue 7, in the present embodiment, because FPC51 includes black PI base materials 511 and located at black
Cover layer on PI base materials 511, black object heat loss through radiation is fast, and FPC51 is pasted on underframe 1 by black heat-conducting glue 7, because
This can be faster by LED52 heat transfer to underframe 1；Meanwhile the heat that LED52 is sent can also be delivered to light guide plate 2
On, in the present embodiment, reflector plate 4 is provided between light guide plate 2 and underframe 1, and reflector plate 4 is simultaneously provided with towards underframe 1 and led
Thermosphere 41, specifically, the heat-conducting layer 41 are made of black graphite particle, adhesive and curing agent.So, it is delivered to light guide plate
2 heat quickly can be delivered on underframe 1 via reflector plate 4.
In the present embodiment, because underframe 1 is aluminium frame, aluminium frame has the good result of rapid heat dissipation as metal frame, meanwhile,
Heat dissipating layer 11 is also covered with the underframe 1, specifically the heat dissipating layer 11 can be black alumina layer, be existed by aluminum underframe 1
In electrolyte solution, its surface is formed oxide-film by applying anode current outside, then pass through black processing generation, the black
Alumina layer thickness is 2-10um.The aluminium frame covered using black oxidation aluminium lamination, the efficiency of the heat loss through radiation of underframe 1 can be increased,
Quickly the heat for being delivered to underframe 1 is discharged, heat caused by backlight module is mediated so as to effectively realize, reduces the back of the body
The effect of the operating temperature of optical mode group, specifically, using the aluminum underframe covered with heat dissipating layer 11, it can effectively reduce backlight module
Operating temperature 3-5 degree.
Further, as shown in figure 5, the underframe 1 is provided with thermal trough 12, after setting thermal trough 12, because LED52 is
The thermal source of backlight module, near LED52 can be run through thermal trough 12 by thermogenetic hot-air spreads, then by heat
The middle part of underframe 1 is delivered to, therefore rapidly can just be radiated using the backboard of whole underframe 1, can effectively reduce luminescence component
The temperature of position, improve radiating effect.
Embodiment two
As shown in fig. 6, which show a kind of structural representation of liquid crystal display die set provided by the utility model.The liquid crystal
Display module include embodiment one provide backlight module BL, the display panel 8 on backlight module BL, located at backlight module
Anti-dazzling screen 9 between BL and display panel 8 and the front frame on display panel 8 10.Specifically, the anti-dazzling screen 9 is black
Double faced adhesive tape, as shown in fig. 7, the front frame 10 is for metal frame and covered with black light-absorption layer 101, it is in the present embodiment, described black
Color light-absorption layer 101 can be black ink, so by setting front frame 10 and the screening of black double faced adhesive tape with black light-absorption layer 101
Mating plate 9, because black object heat loss through radiation is fast, therefore also contribute to the radiating of backlight module.Further, as shown in figure 8, institute
State front frame 10 and assembling is fastened by an at least fastening structure 11 and underframe 1, the center 6 is opened in the position of corresponding fastening structure 11
Provided with avoiding hollow groove 62.So, front frame 10 can directly fasten assembling with underframe 1, rather than could be realized by center 6 completely and
The assembling of underframe 1 is fixed, the tight ness rating for contributing to increase to assemble, while only needs to control the cooperation between front frame 10 and underframe 1
Tolerance can realizes the firm of assembling, so as to reduce the difficulty of technology controlling and process, improves production efficiency；And aluminum underframe 1
It can be directly connected to and turned on by fastening structure 11 with metal front frame 10, both contributed to the radiating of underframe 1, it helps liquid
The electrostatic protection of brilliant display module.
Embodiment described above only expresses embodiment of the present utility model, and its description is more specific and detailed, but simultaneously
Therefore the limitation to the utility model patent scope can not be interpreted as, as long as using equivalent substitution or the form of equivalent transformation institute
The technical scheme of acquisition, it all should fall within the scope of protection of the utility model.
Claims (9)
1. a kind of backlight module, including underframe, the light guide plate on underframe and optical diaphragm group, fit in underframe and light guide plate
Between reflector plate, the luminescence component located at light guide plate side and the center being sheathed on underframe, it is characterised in that the underframe
For aluminium frame, covered with heat dissipating layer on the underframe；The reflector plate is provided with heat-conducting layer towards underframe one side；The luminescence component
Including FPC and the multiple LED being electrically connected on FPC；The FPC includes black PI base materials and the covering on black PI base materials
Film, the FPC is pasted by black heat-conducting glue and underframe to be connected；The center is black glue frame.
2. backlight module according to claim 1, it is characterised in that the heat dissipating layer is black oxidation aluminium lamination.
3. backlight module according to claim 1, it is characterised in that the heat dissipating layer thickness is 2-10um.
4. backlight module according to claim 1, it is characterised in that the heat-conducting layer is using black graphite particle, gluing
Agent and curing agent are made.
5. backlight module according to claim 1, it is characterised in that the underframe is provided with thermal trough.
6. a kind of liquid crystal display die set, it is characterised in that including the backlight module described in claim any one of 1-5, located at the back of the body
Display panel in optical mode group, the anti-dazzling screen between backlight module and display panel and the front frame on display panel.
7. liquid crystal display die set according to claim 6, it is characterised in that the front frame is for metal frame and covered with black
Light-absorption layer.
8. liquid crystal display die set according to claim 6, it is characterised in that the anti-dazzling screen is black double faced adhesive tape.
9. liquid crystal display die set according to claim 6, it is characterised in that the front frame by an at least fastening structure and
Underframe fastens assembling, and the center offers avoiding hollow groove in the position of corresponding buckle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721193657.XU CN207114987U (en) | 2017-09-18 | 2017-09-18 | A kind of backlight module and liquid crystal display die set |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721193657.XU CN207114987U (en) | 2017-09-18 | 2017-09-18 | A kind of backlight module and liquid crystal display die set |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207114987U true CN207114987U (en) | 2018-03-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721193657.XU Active CN207114987U (en) | 2017-09-18 | 2017-09-18 | A kind of backlight module and liquid crystal display die set |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN207114987U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109212807A (en) * | 2018-10-11 | 2019-01-15 | 深圳市晶联讯电子有限公司 | A kind of outdoor liquid crystal display screen |
-
2017
- 2017-09-18 CN CN201721193657.XU patent/CN207114987U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109212807A (en) * | 2018-10-11 | 2019-01-15 | 深圳市晶联讯电子有限公司 | A kind of outdoor liquid crystal display screen |
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