CN108387991A - Applied to optical accurate temperature controller method and apparatus - Google Patents
Applied to optical accurate temperature controller method and apparatus Download PDFInfo
- Publication number
- CN108387991A CN108387991A CN201710101805.9A CN201710101805A CN108387991A CN 108387991 A CN108387991 A CN 108387991A CN 201710101805 A CN201710101805 A CN 201710101805A CN 108387991 A CN108387991 A CN 108387991A
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- China
- Prior art keywords
- temperature
- control module
- heat
- plate
- temperature control
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/008—Mountings, adjusting means, or light-tight connections, for optical elements with means for compensating for changes in temperature or for controlling the temperature; thermal stabilisation
Abstract
It discloses one kind and being applied to optical accurate temperature controller device, including：Outer case, outer case are made of two pieces of outer panels being oppositely arranged, the two pieces of liquid cooling plates, outer top panel and the Outer Bottom Plating that are oppositely arranged；Internal box, internal box are made of two pieces of interior plates being oppositely arranged, the two pieces of heat-conducting plates, inner top panel and the inner bottom plating that are oppositely arranged, wherein are equipped with semiconductor chilling plate on every piece of heat-conducting plate；Temperature control module, temperature control module is mounted on the outer top panel of outer case, and is connected with semiconductor chilling plate, by temp probe with a heat-conducting plate by electric wire, wherein temp probe is fixed on one piece of heat-conducting plate, for acquiring target actual temperature；Wherein, liquid cooling plate liquid cooling plate carries out the first temperature adjusting by meeting the circulating cooling liquid of preset temperature to target temperature, and wherein, temperature control module controls semiconductor chilling plate and carries out accurate second temperature adjusting to target temperature.
Description
Technical field
The present invention relates to temperature control methods and device, more particularly to a kind of to be applied to optical accurate temperature controller method and apparatus.
Background technology
The temperature jitter of optical device or element in use can cause the performance of optical device or element unstable,
Even can not normal use, therefore, optical device or element need to control into trip temperature when in use.Currently, common electric wind
Fan, heat sink and semiconductor chilling plate can play the role of heat dissipation, and semiconductor refrigerating under the cooperation of temperature controller
Piece can also be heated in the case where providing reverse current, but the actual temperature control accuracy of these temprature control methods
It is relatively low, ± 0.5 DEG C or so is can only achieve, the temperature control requirement of high-accuracy optical device or element, Er Qieshou can not be met
To the interference of ambient temperature fluctuation, temperature control precision is lower under the faster working environment of temperature change.
The environment temperature of extensive use with optical device in fields such as ocean, military affairs, optical device or element manipulation
More severe, temperature is high, the temperature difference is big, therefore to need one kind that can be realized under extreme natural environment high-precision for optical device or element
The temperature control method and device of degree, high stability.
Invention content
In order to enable optical device steady operation under temperature height, the big environment of the temperature difference, the present invention provides one kind to answer
For optical accurate temperature controller method and apparatus, the optical device working environment of high-precision, high stability can be provided.
According to one embodiment of present invention, it provides one kind and being applied to optical accurate temperature controller device, including：Outer container
Body, the outer case are made of two pieces of outer panels being oppositely arranged, the two pieces of liquid cooling plates, outer top panel and the Outer Bottom Plating that are oppositely arranged；
Internal box, the internal box is by two pieces of interior plates being oppositely arranged, the two pieces of heat-conducting plates, inner top panel and the inner bottom plating group that are oppositely arranged
At, and the outer case is mounted on the outside of the internal box, and optical element is placed on positioned at the inside of the internal box
In optical element rest area, wherein semiconductor chilling plate is installed on every piece of heat-conducting plate of the internal box；Temperature control module, institute
Temperature control module is stated on the outer top panel of the outer case, and is visited with the semiconductor chilling plate, by temperature by electric wire
Head is connected with a heat-conducting plate, wherein the temp probe is fixed on one piece of heat-conducting plate, for acquiring the light
Learn the target actual temperature of component placing region；Wherein, the liquid cooling plate carries inlet and liquid outlet, the inlet and goes out liquid
Mouth is respectively turned on the initiating terminal and tail end of the cooling liquid flowing channel of the liquid cooling plate, and the liquid cooling plate is by meeting preset temperature
Coolant liquid the first temperature adjusting is carried out to target temperature, and wherein, the temperature control module controls the semiconductor chilling plate
Accurate second temperature adjusting is further carried out to target temperature.
Preferably, the cooling liquid flowing channel of the liquid cooling plate includes straight channel and is in helicoid bending runner, to increase
The contact area of coolant liquid and the liquid cooling plate.
Preferably, the target actual temperature is compared by the temperature control module with preset temperature, and in the target
In the case that actual temperature has differences with the set temperature, controls the semiconductor chilling plate and execute the second temperature tune
Section.
Preferably, the temperature control module includes power input interface, temp probe interface and output interface, and wherein
The power input interface is connected with external power supply, and the temp probe is connected to the temperature via the temp probe interface
Module is controlled, the semiconductor chilling plate is connected to the temperature control module via the output interface.
Preferably, the internal layer chamber outer surface of the internal box covers one layer of thermal insulation layer, and the semiconductor chilling plate
It is placed between the internal box outer wall and the inner wall of the liquid cooling plate of the outer case, it is logical to provide controlled heat transmission
Road.
Preferably, the semiconductor chilling plate is fitted in one heat-conducting plate of the internal box with heat-conducting silicone grease
In groove.
Preferably, the stuffed heat insulated cotton between the outer case and the internal box, the heat insulation foam closely surround in addition to
Internal box outer wall surface except the semiconductor chilling plate.
Preferably, the temp probe is fixed on heat-conducting silicone grease in the aperture of the side plate of the internal box, conducting wire
Heat insulation foam is penetrated to draw and the outer panel of the outer case is passed through with the temperature control module to be connected.
According to still another embodiment of the invention, it provides one kind and being applied to optical accurate temperature controller method, including：According to
Preset temperature carries out the first temperature adjusting by meeting the coolant liquid of preset temperature by liquid cooling plate to target temperature；By temperature control mould
Block is obtained through the collected target actual temperature of temp probe institute；By the temperature control module by the target actual temperature and in advance
If temperature is compared, judge that the target actual temperature whether there is difference with the preset temperature；If there is difference, then
The temperature control module control semiconductor chilling plate carries out second temperature adjusting to target temperature.
Preferably, the method further includes：If it is determined that the target actual temperature is more than the preset temperature, then
The temperature control module controls the semiconductor chilling plate and freezes；If it is determined that the target actual temperature is less than described preset
Temperature, then the temperature control module control the semiconductor chilling plate and heated.
According to the detailed description below the disclosure and attached drawing, mesh other to those skilled in the art
, feature and advantage will be apparent.
Description of the drawings
Attached drawing illustrates the embodiment of the present invention, and is used to explain the principle of the present invention together with specification.In the accompanying drawings：
Fig. 1 shows the schematic isometric according to the ... of the embodiment of the present invention applied to optical accurate temperature controller device 100；
Fig. 2 shows the structural schematic diagrams of liquid cooling plate 6 according to the ... of the embodiment of the present invention；
Fig. 3 shows the integrally-built cross according to the ... of the embodiment of the present invention applied to optical accurate temperature controller device 100
Sectional structural map；
Fig. 4 shows according to the ... of the embodiment of the present invention applied to the integrally-built vertical of optical accurate temperature controller device 100
Sectional structural map；
Fig. 5 shows the circuit connection diagram of temperature control module 101 according to the ... of the embodiment of the present invention；And
Fig. 6 shows the flow chart according to the ... of the embodiment of the present invention applied to optical accurate temperature controller method 600.
Specific implementation mode
It discloses according to an embodiment of the invention a kind of applied to optical accurate temperature controller device.In the following description, it is
The purpose of explanation, elaborates multiple details to provide the comprehensive understanding to the embodiment of the present invention.However, for ability
Domain personnel are it is readily apparent that the embodiment of the present invention can be realized without these specific details.
Fig. 1 shows the schematic isometric according to the ... of the embodiment of the present invention applied to optical accurate temperature controller device 100.Such as
Shown in Fig. 1, temperature control device 100 according to the present invention includes temperature control module 101, outer case 103 and internal box 105, wherein outer container
Body 103 is mounted on outside internal box 105.Specifically, outer case 103 by be oppositely arranged two pieces of outer panels 13, be oppositely arranged
Two pieces of liquid cooling plates 6, outer top panel 1 and Outer Bottom Plating 9 form；Internal box 105 by be oppositely arranged two pieces of interior plates 10, be oppositely arranged
Two pieces of heat-conducting plates 4, inner top panel 2 and inner bottom plating 8 form；And temperature control module 101 is mounted on the outer top panel 1 of outer case 103 simultaneously
It is fixed, such as be screwed.Moreover, each plate engaging portion can be interconnected with screw, however those skilled in the art manage
Other connection types may be used in solution, such as can also use blind rivet connection, take out hole riveting, grab connection, hinge connection, weldering
The modes such as connect.
Fig. 2 shows the structural schematic diagrams of liquid cooling plate 6 according to the ... of the embodiment of the present invention.Liquid cooling plate 6 passes through circulating cooling liquid
Flowing take away heat, to achieve the purpose that fast cooling.As shown in Fig. 2, the liquid cooling plate 6 carries inlet 201 and liquid outlet
203, and the inlet 201 and liquid outlet 203 are respectively turned on the initiating terminal and tail end of the cooling liquid flowing channel of liquid cooling plate 6.Liquid
The cooling liquid flowing channel of cold plate 6 includes straight channel and is in helicoid bending runner, so as to increase coolant liquid and liquid cooling plate
Contact area improves the working efficiency of liquid cooling plate.Preferably, according to an embodiment of the invention, two pieces of liquid cooling plates of outer case 103
6 provide coolant liquid to adjust temperature from two opposites by extraneous liquid cooling machine respectively, can form symmetrical heat stream in this way
Dynamic channel, to ensure the temperature consistency in target unit.Specifically, by liquid cooling plate 6 by meeting the cooling of preset temperature
Liquid carries out the first temperature adjusting to target temperature, to complete the coarse adjustment to target temperature.It will be understood by those skilled in the art that
The quantity of liquid cooling plate is optional according to situation, as long as it can ensure to realize the function that temperature is adjusted.
Fig. 3 shows the integrally-built cross according to the ... of the embodiment of the present invention applied to optical accurate temperature controller device 100
Sectional structural map.As shown in figure 3, installing semiconductor chilling plate 5, semiconductor chilling plate 5 on every piece of heat-conducting plate 4 of internal box 105
It is in the same face between internal box 103 and outer case 105 and with liquid cooling plate 6, consequently facilitating liquid cooling plate 6 is to target temperature
Degree can also radiate to semiconductor chilling plate 5 while coarse adjustment.Optical device or element are positioned in internal box 105
The optical element rest area 7 in portion.According to one embodiment of present invention, semiconductor chilling plate 5 is fitted in heat-conducting silicone grease interior
In the groove of the heat-conducting plate 4 of babinet 105.
According to one embodiment of present invention, the heat-conducting plate 4 of internal box 105 is made of the good material of heat conduction, and interior
The internal layer chamber outer surface of babinet 105 covers one layer of thermal insulation layer, prevents internal box 105 and extraneous heat exchange.Moreover, semiconductor
Cooling piece 5 is placed between 105 outer wall of internal box and the inner wall of the liquid cooling plate 6 of outer case 103, to provide controlled heat transmission
Channel.
According to still another embodiment of the invention, the stuffed heat insulated cotton 3 between outer case 103 and internal box 105, such as Fig. 3
Shown, heat insulation foam 3 closely surrounds the internal box outer wall surface other than semiconductor chilling plate 5, to avoid optics as far as possible
Heat exchange between component placing region 7 and the external world so that the temperature of entire internal box 105 is not influenced by 103 temperature of outer case,
And it is only controlled by semiconductor chilling plate 5.
Fig. 4 shows according to the ... of the embodiment of the present invention applied to the integrally-built vertical of optical accurate temperature controller device 100
Sectional structural map.As shown in figure 4, temp probe 12 is fixed on one piece of heat-conducting plate 4 of internal box 105, for acquiring optics member
The temperature information of part rest area 7.Moreover, temp probe 12 to be fixed on to the aperture of the side plate 10 of internal box 105 with heat-conducting silicone grease
It is interior, and by the conducting wire of temp probe 12 penetrate heat insulation foam 3 draw and across outer case 103 outer panel 13, so as to temperature control mould
Block 101 is connected.In this way, temperature control module 101 can be obtained through the 12 collected target actual temperature of institute of temp probe.In order to
Accurate second temperature adjusting further is carried out to target temperature, electric wire 11 is connected to semiconductor chilling plate 5, so as to by semiconductor
Cooling piece 5 is connected with temperature control module 101.In this way, judging that target actual temperature has differences with preset temperature in temperature control module 101
When, semiconductor chilling plate 5 can be controlled, further accurate heating or refrigeration are carried out to target.
Fig. 5 shows the circuit connection diagram of temperature control module 101 according to the ... of the embodiment of the present invention.Temperature control module 101 can
Further accurate adjusting is carried out to target temperature to control semiconductor chilling plate 5.As shown in figure 5, temperature control module 101 mainly wraps
Include three interfaces：Power input interface 15, output interface 16 and temp probe interface 17.
Specifically, the power input interface 15 of temperature control module 101 is connected with external power supply, to be temperature control module 101
Power supply.As it is known to the person skilled in the art, the powering mode of temperature control module 101 can be direct current supply, it is not limited to
This.Temp probe 12 is connected to the temp probe interface 17 of temperature control module 101 via its conducting wire.In this way, temperature control module 101 can be with
It is obtained via temp probe interface 17 and passes through the 12 collected target actual temperatures of institute of temp probe, and the target obtained is real
Border temperature is compared with preset temperature, judges that the target actual temperature whether there is difference with the set temperature.In addition,
Semiconductor chilling plate 5 is connected to the output interface 16 of temperature control module 101 by electric wire 11.Therefore, via the defeated of temperature control module 101
Outgoing interface 16, temperature control module 101 can according to the output control semiconductor chilling plate 5 of above-mentioned judgement to target temperature into advancing one
Accurate second temperature is walked to adjust.For example, if it is determined that the target actual temperature is more than the preset temperature, then temperature control module
101 control semiconductor chilling plates 5 freeze to target temperature；If it is determined that the target actual temperature is less than the default temperature
Degree, then control semiconductor chilling plate 5 and heated to target temperature.
As will be understood by the skilled person in the art, although one embodiment of the present of invention uses six semiconductor refrigeratings
Piece can select to use one or more as shown in figure 5, still according to indexs such as the calorific value of optical device or element and sizes
A semiconductor chilling plate.
Fig. 6 shows the flow chart according to the ... of the embodiment of the present invention applied to optical accurate temperature controller method 600.Such as Fig. 6
It is shown, in step 601, according to preset temperature, by liquid cooling plate 6 by meet the circulating cooling liquid of preset temperature to target temperature into
The first temperature of row is adjusted.In step 603, temperature control module 101 is obtained through the 12 collected target actual temperature of institute of temp probe.
In step 605, the target actual temperature is compared by temperature control module 101 with preset temperature, judges the practical temperature of the target
Degree whether there is difference with the preset temperature.If there is difference, then in step 607, temperature control module 101 controls semiconductor system
Cold 5 pairs of target temperature carries out second temperature adjusting.For example, if it is determined that the target actual temperature is more than the default temperature
It spends, then temperature control module 101 controls semiconductor chilling plate 5 and freezes；If it is determined that the target actual temperature is less than described pre-
If temperature, then controls semiconductor chilling plate 5 and heated.If there is no difference, then the process flow terminates.
As will be understood by the skilled person in the art, the first temperature is adjusted and second temperature is adjusted and be can perform repeatedly, and
And may be performed simultaneously, it can also successively execute, be not exposed to the limitation of execution sequence.The adjusting includes that heating and refrigeration are adjusted
Section.In general, the range that the first temperature is adjusted is more than the range that second temperature is adjusted.Preferably, temperature control module 101 is acquired periodically logical
The 12 collected target actual temperature of institute of excess temperature probe, to realize temperature cycles control so that target temperature maintains always
The normal working temperature of optical device or element.
Application according to the present invention is in the temperature-controlled precision of the method and apparatus of optical accurate temperature controller<0.05 DEG C, and not
The interference of additional vibration noise can be introduced, can improving optical system to greatest extent stability, therefore can be optical device or
Element provides low noise, pinpoint accuracy, the operating temperature of high stability, meets the temperature control of high-accuracy optical device or element
It is required that and can ensure (for example, in the working environment of ocean) in the faster working environment of temperature change temperature controlled
High-precision and high stability.
Above-described embodiment is only the preferred embodiment of the present invention, is not intended to restrict the invention.To those skilled in the art
It is readily apparent that without departing from the spirit and scope of the present invention, various repair can be carried out to the embodiment of the present invention
Change and changes.Therefore, the invention is intended to cover fall within the scope of the present invention as defined by the appended claims all to repair
Change or modification.
Claims (10)
1. one kind being applied to optical accurate temperature controller device, including：
Outer case, the outer case is by two pieces of outer panels being oppositely arranged, the two pieces of liquid cooling plates, outer top panel and the outer bottom that are oppositely arranged
Board group at；
Internal box, the internal box is by two pieces of interior plates being oppositely arranged, the two pieces of heat-conducting plates, inner top panel and the interior bottom that are oppositely arranged
Board group is at and the outer case is mounted on the outside of the internal box, and optical element is placed in the internal box
In the optical element rest area in portion, wherein semiconductor chilling plate is installed on every piece of heat-conducting plate of the internal box；
Temperature control module, the temperature control module is mounted on the outer top panel of the outer case, and passes through electric wire and the semiconductor system
Cold, be connected with a heat-conducting plate by temp probe, wherein the temp probe is fixed on one piece of heat-conducting plate
On, for acquiring the target actual temperature of the optical element rest area；
Wherein, the liquid cooling plate carries inlet and liquid outlet, and the inlet and liquid outlet are respectively turned on the liquid cooling plate
The initiating terminal and tail end of cooling liquid flowing channel, and the liquid cooling plate carries out target temperature by meeting the coolant liquid of preset temperature
First temperature is adjusted, and
Wherein, the temperature control module controls the semiconductor chilling plate and further carries out accurate second temperature tune to target temperature
Section.
2. the apparatus according to claim 1, wherein the cooling liquid flowing channel of the liquid cooling plate includes straight channel and is in swinging
Bending runner, to increase the contact area of coolant liquid and the liquid cooling plate.
3. the apparatus according to claim 1, wherein the temperature control module by the target actual temperature and preset temperature into
Row compares, and in the case where the target actual temperature and the set temperature have differences, controls the semiconductor refrigerating
Piece executes the second temperature and adjusts.
4. the apparatus according to claim 1, wherein the temperature control module include power input interface, temp probe interface,
And output interface, and the wherein described power input interface is connected with external power supply, and the temp probe is via the temperature
Probe interface is connected to the temperature control module, and the semiconductor chilling plate is connected to the temperature control mould via the output interface
Block.
5. the apparatus according to claim 1, wherein the internal layer chamber outer surface of the internal box covers one layer of thermal insulation layer,
And the semiconductor chilling plate is placed between the internal box outer wall and the inner wall of the liquid cooling plate of the outer case, with
Controlled heat transmission channel is provided.
6. device according to claim 1 or 5, wherein be fitted in the semiconductor chilling plate with heat-conducting silicone grease described
In the groove of one heat-conducting plate of internal box.
7. the apparatus according to claim 1, wherein the stuffed heat insulated cotton between the outer case and the internal box, institute
State heat insulation foam closely internal box outer wall surface of the encirclement other than the semiconductor chilling plate.
8. the apparatus according to claim 1, wherein the temp probe is fixed on the internal box with heat-conducting silicone grease
In the aperture of side plate, conducting wire penetrates heat insulation foam and draws and the outer panel of the outer case is passed through to be connected with the temperature control module
It connects.
9. one kind being applied to optical accurate temperature controller method, including：
According to preset temperature, the first temperature adjusting is carried out to target temperature by meeting the coolant liquid of preset temperature by liquid cooling plate；
It is obtained through the collected target actual temperature of temp probe institute by temperature control module；
The target actual temperature is compared with preset temperature by the temperature control module, judge the target actual temperature with
The preset temperature whether there is difference；
If there is difference, then the temperature control module control semiconductor chilling plate is to target temperature progress second temperature adjusting.
10. according to the method described in claim 9, further comprising：
If it is determined that the target actual temperature is more than the preset temperature, then the temperature control module controls the semiconductor refrigerating
Piece freezes；
If it is determined that the target actual temperature is less than the preset temperature, then the temperature control module controls the semiconductor refrigerating
Piece is heated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710101805.9A CN108387991A (en) | 2017-02-24 | 2017-02-24 | Applied to optical accurate temperature controller method and apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710101805.9A CN108387991A (en) | 2017-02-24 | 2017-02-24 | Applied to optical accurate temperature controller method and apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108387991A true CN108387991A (en) | 2018-08-10 |
Family
ID=63076044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710101805.9A Pending CN108387991A (en) | 2017-02-24 | 2017-02-24 | Applied to optical accurate temperature controller method and apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108387991A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343605A (en) * | 2018-11-07 | 2019-02-15 | 南京牧镭激光科技有限公司 | A kind of temperature control equipment and control method |
| CN112631052A (en) * | 2021-01-20 | 2021-04-09 | 范聪洁 | Optical equipment heating protection system |
| CN115000470A (en) * | 2022-08-02 | 2022-09-02 | 中汽研新能源汽车检验中心(天津)有限公司 | Fuel cell temperature control system and temperature control method thereof |
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| US20080142198A1 (en) * | 2005-01-11 | 2008-06-19 | Tuchelt Maurice J | Heat Transfer Pipe With Control |
| CN202995238U (en) * | 2012-09-11 | 2013-06-12 | 广东威创视讯科技股份有限公司 | Projector heat dissipation device |
| CN203606992U (en) * | 2013-11-23 | 2014-05-21 | 南昌航空大学 | Instrument for demonstrating phenomenon that dripping water freezes |
| CN207067497U (en) * | 2017-02-24 | 2018-03-02 | 武汉普惠海洋光电技术有限公司 | Applied to optical accurate temperature controller device |
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2017
- 2017-02-24 CN CN201710101805.9A patent/CN108387991A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20080142198A1 (en) * | 2005-01-11 | 2008-06-19 | Tuchelt Maurice J | Heat Transfer Pipe With Control |
| CN202995238U (en) * | 2012-09-11 | 2013-06-12 | 广东威创视讯科技股份有限公司 | Projector heat dissipation device |
| CN203606992U (en) * | 2013-11-23 | 2014-05-21 | 南昌航空大学 | Instrument for demonstrating phenomenon that dripping water freezes |
| CN207067497U (en) * | 2017-02-24 | 2018-03-02 | 武汉普惠海洋光电技术有限公司 | Applied to optical accurate temperature controller device |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109343605A (en) * | 2018-11-07 | 2019-02-15 | 南京牧镭激光科技有限公司 | A kind of temperature control equipment and control method |
| CN112631052A (en) * | 2021-01-20 | 2021-04-09 | 范聪洁 | Optical equipment heating protection system |
| CN115000470A (en) * | 2022-08-02 | 2022-09-02 | 中汽研新能源汽车检验中心(天津)有限公司 | Fuel cell temperature control system and temperature control method thereof |
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