CN215117292U - High-flux crystal screening instrument temperature control device - Google Patents
High-flux crystal screening instrument temperature control device Download PDFInfo
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- CN215117292U CN215117292U CN202121470572.8U CN202121470572U CN215117292U CN 215117292 U CN215117292 U CN 215117292U CN 202121470572 U CN202121470572 U CN 202121470572U CN 215117292 U CN215117292 U CN 215117292U
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Abstract
The utility model provides a high flux crystal screening appearance temperature control device, includes PID temperature control module, temperature sensor, heating element and refrigeration subassembly, and heating element includes electron heating plate and thermocouple, and refrigeration subassembly includes semiconductor refrigeration piece, water-cooling head, heat dissipation log raft, water pump and water cooling circulation pipeline. The high-throughput crystal screening instrument comprises a plurality of crystallizers, and each crystallizer is provided with a temperature control device capable of independently and accurately controlling the temperature increase and decrease rate and stability. The high-flux crystal screening instrument integrates the functions of temperature control, stirring, feeding, turbidity monitoring and the like. The temperature control device of the high-flux crystal screening instrument is suitable for temperature accurate control in an experimental process, the equipment does not need any refrigerant, is free of vibration and noise, long in service life, easy to install and realize control, high in cooling speed, accurate in temperature control and small in temperature buffering.
Description
Technical Field
The utility model relates to a crystallization screening technical field in the process control field particularly, relates to a high flux crystal screening appearance temperature control device.
Background
In the crystallization process, conditions and operations required for determining the crystallization process of a crystal are numerous, most of experiments at present mainly use manual operation experience, and monitoring results are compared and analyzed with historical operation results so as to improve a process control strategy, however, a unified process optimization control method is not available. The existing temperature control experimental equipment mainly comprises two temperature control equipment, namely a constant temperature water bath box and a metal bath (thermostat), wherein the crystallization experiment mainly adopts the constant temperature water bath box equipment to realize temperature control, the equipment mainly controls the temperature of a liquid medium and realizes temperature control of a reaction crystallizer through temperature transmission, and then crystallization screening experiments are completed with the help of the assistance of other equipment devices; the metal bath is mainly applied to the field of medical biology; the production equipment has certain limitation in the operation and use process. The existing high-flux parallel crystallization instrument basically adopts a water bath temperature control mode or a temperature control mode of electronic heating and compressor refrigerant refrigeration. The existing two temperature control devices of the constant-temperature water bath box and the metal bath can not realize independent temperature control of a plurality of reactors, only can carry out process temperature control of a single crystallizer or carry out synchronous temperature control on a plurality of crystallizers, and need to change environmental conditions for carrying out experiments for a plurality of times, and the temperature rising and falling speed is slow, so that the experiment efficiency can not be improved; the temperature control accuracy is low, the temperature fluctuation is large, the temperature buffer is too large, certain experiments with strict requirements on temperature are influenced, and the experiment results are directly influenced; and operations such as stirring, feeding, crystal form screening and the like in the crystallization experiment process are limited by the technical design of the equipment. The water bath temperature control mode has low temperature control speed, large and unstable fluctuation and certain hysteresis property of temperature, and certain temperature buffering is realized after the target temperature is reached. The temperature control mode of electronic heating and compressor refrigerant refrigeration is that each parallel channel shares a cooling equipment, and each parallel channel can also produce the influence when cooling simultaneously.
SUMMERY OF THE UTILITY MODEL
In order to compensate the above deficiency, the utility model provides a high flux crystal screening appearance temperature control device, every passageway can realize controlling the temperature alone, and temperature control is accurate, rapid, stable. All parameter measurements and controls can be set by computer software, and experimental data can be archived for data analysis and application.
The utility model discloses a realize like this:
the utility model provides a high flux crystal screening appearance temperature control device, includes PID temperature control module, temperature sensor, heating element and refrigeration subassembly, and heating element includes electron heating plate and thermocouple, and refrigeration subassembly includes semiconductor refrigeration piece, water-cooling head, heat dissipation log raft, water pump and water cooling circulation pipeline. The high-flux crystal screening instrument is composed of a plurality of crystallizers, and each crystallizer is provided with a temperature control device which can independently and accurately control the temperature rising and reducing speed and stability.
The heating assembly is positioned at the bottom of the crystallizer, the heating assembly comprises an electronic heating sheet and a thermocouple, the heating is realized by a bottom heating mode, the refrigerating assembly is arranged at two sides of the crystallizer, the refrigerating assembly comprises a semiconductor refrigerating sheet, a water cooling head, a water pump and a water cooling circulation pipeline, the water cooling head is respectively communicated with a heat dissipation water discharge and the water pump through the water cooling circulation pipeline, the heat dissipation water discharge is communicated with a water tank through the water cooling circulation pipeline, the water pump is communicated with the water tank through the water cooling circulation pipeline, the temperature sensor is used for acquiring the actual temperature in the crystallizer and comparing the actual temperature with the target temperature, and the PID temperature control module is used for carrying out PID control on the refrigerating assembly and the heating assembly to realize temperature control;
the utility model discloses an in the embodiment, high flux crystal screening appearance comprises a plurality of crystallizer, can place different specification crystallization beakers through the aluminium cover of expanding in the crystallizer, crystallization beaker top is provided with the sealed lid of beaker, temperature sensor with the sealed lid of beaker pegs graft and sets up inside the crystallization beaker.
The utility model discloses an in the embodiment, heating element is the electron heating plate, refrigeration subassembly for semiconductor refrigeration piece and set up in the both sides of crystallizer, the water-cooling head the heat dissipation log raft the water pump with the water tank all is linked together through the water cooling circulation pipeline, and is used for the cooling the hot junction of semiconductor refrigeration piece.
The utility model has the advantages that:
the temperature control of the equipment is realized by controlling the working time of the heating plate and the semiconductor refrigerating plate by an upper computer and a PID temperature controller in two stages. Obtaining a temperature value through a temperature sensor in the crystallization reactor and comparing the temperature value with a set target temperature value, and if the temperature difference is overlarge, controlling a heating sheet and a refrigerating sheet to heat or cool through PID regulation until the temperature difference is reduced to a certain value; the controller controls the working time of the heating plate and the refrigerating plate in a PID control mode so as to realize temperature control, and the temperature difference between the temperature acquired by the temperature sensor in the crystallization reactor and the set target temperature is transmitted to the controller to be used as the feedback of the PID control method, so that the temperature in the crystallization reactor can quickly and accurately reach the target temperature set by the upper computer.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention, and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
Fig. 1 is a schematic view of the overall cross-sectional structure of the present invention;
fig. 2 is a schematic view of the three-dimensional structure of the crystallizer of the present invention.
In the figure: 1. a crystallization beaker; 2. a semiconductor refrigeration sheet; 3. a water cooling head; 4. a water cooling circulation pipeline; 5. discharging the heat-dissipating water; 6. a crystallizer; 7. an electronic heating sheet; 8. a water tank; 9. and (4) a water pump.
Detailed Description
To make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the drawings of the embodiments of the present invention are combined to clearly and completely describe the technical solutions of the embodiments of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Thus, the following detailed description of the embodiments of the present invention, presented in the accompanying drawings, is not intended to limit the scope of the invention, as claimed, but is merely representative of selected embodiments of the invention. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically limited otherwise.
Example of the implementation
Referring to fig. 1-2, the utility model relates to a high flux crystal screening appearance temperature control device, including PID temperature control module, temperature sensor, heating element and refrigeration subassembly, heating element includes electron heating plate 7 and thermocouple, and the refrigeration subassembly includes semiconductor refrigeration piece 2, water-cooling head 3, heat dissipation log raft 5, water pump 9 and water cooling circulation pipeline 4.
The heating assembly is positioned at the bottom of the crystallizer 6 and comprises an electronic heating sheet 7 and a thermocouple, the temperature rise is realized by heating the crystallizer 6 at the bottom, the refrigerating assembly is arranged at two sides of the crystallizer 6 and comprises a semiconductor refrigerating sheet 2, a water cooling head 3, a water pump 9 and a cooling circulation pipeline, the water cooling head 3 is respectively communicated with a heat dissipation water discharge 5 and the water pump 9 through the cooling circulation pipeline, the heat dissipation water discharge 5 is communicated with a water tank 8 through the cooling circulation pipeline, the water pump 9 is communicated with the water tank 8 through the cooling circulation pipeline, a temperature sensor is used for acquiring the actual temperature in the crystallizer 6 and comparing the actual temperature with the target temperature, and a PID temperature control module is used for carrying out PID control on the refrigerating assembly and the heating assembly to realize temperature control;
the high-flux crystal screening instrument is composed of a plurality of crystallizers 6, each crystallizer 6 is provided with a temperature control device which can independently and accurately control the speed and the stability of temperature rise and fall, crystallization beakers 1 with different specifications can be placed in the crystallizer 6 through an expanding aluminum sleeve, a beaker sealing cover is arranged at the top of each crystallization beaker 1, and a temperature sensor is inserted into the beaker sealing cover and is arranged inside each crystallization beaker 1.
The heating component is mainly an electronic heating plate 7, the refrigerating component is mainly a semiconductor refrigerating plate 2 and is arranged at two sides of a crystallizer 6, a water cooling head 3, a radiating water discharge 5, a water pump 9 and a water tank 8 are communicated through a water cooling circulation pipeline 4 and are used for cooling the hot end of the semiconductor refrigerating plate 2, the heating component is the electronic heating plate 7, the electric heating is induction heating equipment which has the highest heating efficiency and the fastest heating speed to metal materials at present, the electric heating can obtain higher temperature, the automatic control and the remote control of the temperature can be easily realized, a heated object can be kept at certain temperature distribution according to needs, the electric heating can directly generate heat inside the heated object, the heat efficiency is high, the heating speed is fast, the integral uniform heating or the local heating can be realized according to the heating process requirements, the electronic heating plate 7 in the device mainly realizes the temperature control by controlling the on-off of the electronic heating plate 7 through an upper computer and a controller, therefore, the temperature rise control of the crystallizer 6 is realized, the cooling component adopts a semiconductor refrigerating sheet 2 called TEC, and the principle is the Peltier effect: when a N-type semiconductor and a P-type semiconductor are connected into a galvanic couple, as long as a direct current power supply is connected into a loop of the galvanic couple, current flows through the galvanic couple to generate energy transfer, heat is released at one joint, heat is absorbed on the other joint in an opposite way, if the galvanic couple works at a temperature lower than room temperature, the direction of the current is adjusted to ensure that the side of the crystallizer 6 absorbs heat, the purpose of using the water tank 8 is to ensure that a sufficient cooling water source is provided for the semiconductor hot end to carry out heat transfer, the water pump 9 pumps cooling water in the water tank 8 and then injects the cooling water into the water cooling head 3 to form a complete water cooling circulation loop, and the cooling circulation loops of other crystallizers 6 are the same, the semiconductor refrigerating plate 2 has very small thermal inertia, high refrigerating speed, and can reach the maximum temperature difference when being electrified for less than one minute under the condition of no load of a cold end with good heat dissipation at a hot end, the parameters of the semiconductor refrigerator are not influenced by the space direction, namely the gravity field, the acting speed is high, the work is reliable, the service life is long, the semiconductor refrigerating plate is easy to control and convenient to adjust, the refrigerating capacity can be adjusted by adjusting the refrigerating power of the semiconductor by adjusting the working current or voltage, or the refrigerating capacity can be adjusted by adjusting the working time of the semiconductor refrigerating plate 2, the semiconductor refrigerating is a refrigerating technology generating negative thermal resistance, and the semiconductor refrigerating plate 2 is a current transduction type plate and can realize high-precision temperature control by controlling the voltage, the current or the working time, and a temperature detection and control means is added, program control and computer control are easily realized, an automatic control system is convenient to form, so that the use of the semiconductor refrigerating sheet 2 has great convenience for a temperature control system of the device, and the heat dissipation of the semiconductor refrigerating sheet 2 in the device adopts a water cooling mode, so that the refrigerating effect is greatly improved.
Compared with the prior art, the utility model discloses a high flux crystal screening appearance temperature control device is realized, through by host computer and PID temperature controller two-stage control electron heating plate 7, the operating duration of semiconductor refrigeration piece 2 realizes the temperature control of crystallizer 6, compare with the target temperature that the host computer end sent through the actual temperature that temperature sensor obtained in crystallizer 6, if the difference in temperature is too big, adjust control electron heating plate 7 and semiconductor refrigeration piece 2 through PID control module and heat up or cool down, reduce to certain value until the difference in temperature; the temperature difference between the temperature acquired by the temperature sensor in the crystallizer 6 and the set target temperature is transmitted to the PID control module as a control method, so that the temperature in the crystallizer 6 can quickly and accurately reach the target temperature set by an upper computer.
It should be noted that the control program and the specific operation flow of the upper computer software are the prior art and will be clear to those skilled in the art, and will not be described in detail herein.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (3)
1. The utility model provides a high flux crystal screening appearance temperature control device, includes PID temperature control module, temperature sensor, heating element and refrigeration subassembly, and heating element includes electron heating plate (7) and thermocouple, and refrigeration subassembly includes semiconductor refrigeration piece (2), water-cooling head (3), heat dissipation log raft (5), water pump (9) and water cooling circulation pipeline (4), its characterized in that:
the heating assembly is located at the bottom of the crystallizer (6), temperature rise is achieved through a bottom heating mode, the refrigerating assembly is arranged on two sides of the crystallizer (6), the water cooling head (3) is communicated with the heat dissipation water discharge device (5) and the water pump (9) through the water cooling circulation pipeline (4), the heat dissipation water discharge device (5) is communicated with the water tank (8) through the water cooling circulation pipeline (4), the water pump (9) is communicated with the water tank (8) through the water cooling circulation pipeline (4), the temperature sensor is used for acquiring actual temperature in the crystallizer (6) and comparing the actual temperature with target temperature, and the PID temperature control module is used for controlling the refrigerating assembly and the heating assembly to achieve PID temperature control.
2. The temperature control device of the high-throughput crystal screening instrument of claim 1, wherein: the high-flux crystal screening instrument is composed of a plurality of crystallizers (6), each crystallizer (6) is provided with a temperature control device capable of independently and accurately controlling the temperature rise and fall rate and stability, crystallization beakers (1) with different specifications can be placed in the crystallizer (6) through an expanded diameter aluminum sleeve, a beaker sealing cover is arranged at the top of each crystallization beaker (1), and a temperature sensor is spliced with the beaker sealing cover and is arranged inside each crystallization beaker (1).
3. The temperature control device of the high-throughput crystal screening instrument of claim 1, wherein: the heating assembly is an electronic heating sheet (7) and is arranged at the bottom of the crystallizer (6), the refrigerating assembly is a semiconductor refrigerating sheet (2) and is arranged at two sides of the crystallizer (6), and the water cooling head (3), the heat dissipation water discharge (5), the water pump (9) and the water tank (8) are communicated through a water cooling circulation pipeline (4) and are used for cooling the hot end of the semiconductor refrigerating sheet (2).
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| CN202121470572.8U CN215117292U (en) | 2021-06-30 | 2021-06-30 | High-flux crystal screening instrument temperature control device |
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| CN202121470572.8U CN215117292U (en) | 2021-06-30 | 2021-06-30 | High-flux crystal screening instrument temperature control device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114602566A (en) * | 2022-03-23 | 2022-06-10 | 电子科技大学 | Experimental equipment and experimental method for studying Mumba effect |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114602566A (en) * | 2022-03-23 | 2022-06-10 | 电子科技大学 | Experimental equipment and experimental method for studying Mumba effect |
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