CN108282955A - A kind of modularized circuit component and preparation method thereof - Google Patents
A kind of modularized circuit component and preparation method thereof Download PDFInfo
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- CN108282955A CN108282955A CN201810117048.9A CN201810117048A CN108282955A CN 108282955 A CN108282955 A CN 108282955A CN 201810117048 A CN201810117048 A CN 201810117048A CN 108282955 A CN108282955 A CN 108282955A
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- flow path
- path groove
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- circuit module
- printing
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- 238000002360 preparation method Methods 0.000 title abstract description 5
- 238000000034 method Methods 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 24
- 239000002002 slurry Substances 0.000 claims abstract description 22
- 238000001035 drying Methods 0.000 claims abstract description 13
- 238000011049 filling Methods 0.000 claims abstract description 13
- 239000000463 material Substances 0.000 claims abstract description 13
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 10
- 239000003792 electrolyte Substances 0.000 claims abstract description 8
- 238000013461 design Methods 0.000 claims abstract description 7
- 239000007864 aqueous solution Substances 0.000 claims abstract 3
- 239000008151 electrolyte solution Substances 0.000 claims abstract 3
- 238000007639 printing Methods 0.000 claims description 21
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 18
- 239000003795 chemical substances by application Substances 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 7
- 239000000243 solution Substances 0.000 claims description 6
- UXVMQQNJUSDDNG-UHFFFAOYSA-L Calcium chloride Chemical compound [Cl-].[Cl-].[Ca+2] UXVMQQNJUSDDNG-UHFFFAOYSA-L 0.000 claims description 5
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 claims description 5
- 230000005611 electricity Effects 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000004626 polylactic acid Substances 0.000 claims description 5
- 229920005573 silicon-containing polymer Polymers 0.000 claims description 5
- 229920001131 Pulp (paper) Polymers 0.000 claims description 4
- VWDWKYIASSYTQR-UHFFFAOYSA-N sodium nitrate Chemical compound [Na+].[O-][N+]([O-])=O VWDWKYIASSYTQR-UHFFFAOYSA-N 0.000 claims description 4
- 229920002101 Chitin Polymers 0.000 claims description 3
- 229920002488 Hemicellulose Polymers 0.000 claims description 3
- 229920002472 Starch Polymers 0.000 claims description 3
- 229920000747 poly(lactic acid) Polymers 0.000 claims description 3
- 239000008107 starch Substances 0.000 claims description 3
- 235000019698 starch Nutrition 0.000 claims description 3
- 239000001110 calcium chloride Substances 0.000 claims description 2
- 229910001628 calcium chloride Inorganic materials 0.000 claims description 2
- -1 dimethyl siloxane Chemical class 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 235000010344 sodium nitrate Nutrition 0.000 claims description 2
- 239000004317 sodium nitrate Substances 0.000 claims description 2
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 claims description 2
- 229910052721 tungsten Inorganic materials 0.000 claims description 2
- 239000010937 tungsten Substances 0.000 claims description 2
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims 2
- 150000001336 alkenes Chemical class 0.000 claims 1
- WGWACCCAJWZIML-UHFFFAOYSA-N benzene;buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N.C1=CC=CC=C1 WGWACCCAJWZIML-UHFFFAOYSA-N 0.000 claims 1
- AEJIMXVJZFYIHN-UHFFFAOYSA-N copper;dihydrate Chemical compound O.O.[Cu] AEJIMXVJZFYIHN-UHFFFAOYSA-N 0.000 claims 1
- 229910052697 platinum Inorganic materials 0.000 claims 1
- 229920000642 polymer Polymers 0.000 claims 1
- 238000010146 3D printing Methods 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 11
- 239000004205 dimethyl polysiloxane Substances 0.000 description 11
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 11
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 11
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 11
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 description 11
- 239000010410 layer Substances 0.000 description 10
- 239000012530 fluid Substances 0.000 description 9
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 6
- 239000001913 cellulose Substances 0.000 description 5
- 229920002678 cellulose Polymers 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 5
- 239000007788 liquid Substances 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 4
- 239000004332 silver Substances 0.000 description 4
- 230000008901 benefit Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 238000011960 computer-aided design Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 238000007514 turning Methods 0.000 description 2
- 239000011800 void material Substances 0.000 description 2
- 235000017166 Bambusa arundinacea Nutrition 0.000 description 1
- 235000017491 Bambusa tulda Nutrition 0.000 description 1
- 244000025254 Cannabis sativa Species 0.000 description 1
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 1
- 239000005751 Copper oxide Substances 0.000 description 1
- 240000000491 Corchorus aestuans Species 0.000 description 1
- 235000011777 Corchorus aestuans Nutrition 0.000 description 1
- 235000010862 Corchorus capsularis Nutrition 0.000 description 1
- 108091092195 Intron Proteins 0.000 description 1
- 235000014676 Phragmites communis Nutrition 0.000 description 1
- 244000082204 Phyllostachys viridis Species 0.000 description 1
- 235000015334 Phyllostachys viridis Nutrition 0.000 description 1
- 240000000111 Saccharum officinarum Species 0.000 description 1
- 235000007201 Saccharum officinarum Nutrition 0.000 description 1
- 238000003854 Surface Print Methods 0.000 description 1
- 239000011425 bamboo Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910000431 copper oxide Inorganic materials 0.000 description 1
- 238000004043 dyeing Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000011031 large-scale manufacturing process Methods 0.000 description 1
- 230000013011 mating Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000013055 pulp slurry Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
- H05K2201/0275—Fibers and reinforcement materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09036—Recesses or grooves in insulating substrate
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
Abstract
The invention discloses a kind of modularized circuit components and preparation method thereof, modularized circuit component can be split by the basic unit of circuit, individual circuit module can independent design, independent manufacture, each circuit module can be connected with each other there are general interface, be assembled into a complicated integrated circuit.Individually the production method of circuit module is：The circuit module substrate with flow path groove is made using 3D printing technique, in one layer of driving layer of flow path groove inner surface laying, the driving layer direct conduction, or cooperation aqueous solution or electrolyte solution carry out conductive.Driving layer laying method include：（1）Electrocondution slurry is directly loaded in flow path groove, different electrocondution slurries can make the circuit of different role；（2）Material of the filling with capillarity in flow path groove, is added electrolyte solution；（3）In the slurry that flow path groove filling is mixed by electrolyte powder, capillarity material with water, water is added in drying when to be used.
Description
Technical field
The present invention relates to circuit manufacturing technology field more particularly to a kind of modular circuit component based on 3D printing technique and
Its production method.
Background technology
Modularized circuit refers to that circuit is divided into module by basic unit, and whole complicated electricity is formed by the assembling in later stage
A kind of circuit on road builds mode, and compared to circuit made in one piece, modularized circuit is simple to manufacture, and support independently builds electricity
Road, change circuit is convenient, it is at low cost the features such as.
PCB technologies rapidly develop and continuous technological innovation, are developed to from simple single, double surface printing plate high-precision
Multi-layer board, high density interconnection（HDI）Plate, flex plate and rigid-flexible combination multi-layer board.Compared with pcb board, modularized circuit can letter
The three dimensional stress for easily realizing circuit structure, is adapted to more complicated stereochemical structure.
Existing mainstream three-dimensional circuit manufacturing method, such as ink-jet molding, water transfer etc. are required for complicated manufacture
Journey, belongs to global formation mode, and of high cost and yields is low.Once circuit is molded, errors excepted or circuit changes, it is difficult to real
Existing circuit change.
The manufacturing method of existing modularized circuit mainly makes bottom plate by making the methods of mold injection, then exists
Install plain conductor on plastic bottom board additional.The circuit module manufactured in this way does not support custom shape, and die cost is high, needs specific
Making apparatus, customization is low.
Invention content
Above of the existing technology in order to solve the problems, such as, the purpose of the present invention is to provide one kind being based on 3D printing technique
Modularized circuit component and preparation method thereof, which, which is mainly characterized in that, to be torn open by the basic unit of circuit
Point, individual circuit basic module can with independent design, it is independent manufacture, each circuit module, can be with there are general interface
As long as being connected with each other, being assembled into the circuit module that a complicated integrated circuit makes according to general-purpose interface in the present invention, all
Can directly it be connected with other modular circuits.
The production method of the present invention provides a kind of repeatable circuit module utilized based on 3D printing technique, can facilitate
Quickly manufacture foregoing circuit module, includes the following steps：
Step（1）：Circuit module substrate threedimensional model of the design with flow path groove；During designing three bit models, mould
There are the flow path grooves of 0.2mm-1mm in type, and model has general interface structure, specially：
The locating slot of four square arrangement of the top surface equipped with 7.5mm × 7.5mm × 5mm, locating slot centre distance is 50mm；Bottom surface
The positioning pin of four square arrangements equipped with the 7.5mm × 7.5mm opposite with top surface locating slot × 5mm, positioning pin centre distance
For 50mm, the positioning pin on locating slot and bottom surface on the top surface is mutually clamped；
There are through hole, a diameter of 16mm of through hole, depth at the square center that top surface is constituted with four locating slot central points
For 2mm；The other end of the flow path groove opposite with the through hole is equipped with non-through hole；
There are round boss, a diameter of 16mm of round boss at the square center that four positioning pin central points are constituted highly is
2mm, it is 4mm, depth 2mm to have cross recess, cross recess width through round boss center；
Step（2）：Threedimensional model is generated into STL formats, imports three-dimensional printer（FDM、DLP）Print software sets printing
Parameter utilizes polylactic acid（PLA）, the file printings such as photosensitive resin provide the fluid circuit module substrate of flow path groove；
Step（3）：There is the one side of flow path groove to smear a strata dimethyl siloxane material printed substrate（PDMS）, then
The substrate for smearing PDMS is put into 50-70 degrees Celsius of drying box to dry 40-120 minutes；
Step（4）：One layer is laid with for conductive driving layer in the flow path groove inner surface of fluid circuit module substrate, obtains base
In the no benzene fluid circuit module of 3 D-printing.
Step（4）There are three types of the laying methods of middle driving layer：
The first is direct completion method：Electrocondution slurry is directly inserted into flow path groove, is then placed in 50-70 degrees Celsius of drying box
40-120 minutes.The electrocondution slurry can be conductive silver paste, tungsten slurry, gold paste etc., or possess conductive silver paste for various purposes,
Such as thermistor silver paste, low temperature silver paste, inductance silver paste, piezoelectric ceramics silver paste etc..
Second is paving slurry processes：Cellulose powder, electrolyte powder and water are carried out being mixed in certain proportion to be slurried
Material, then pours into cellulose powder slurry in the flow path groove of substrate, is then placed in 50-70 degrees Celsius of 40-120 points of drying box
Clock.It is either one or more in starch, chitin, hemicellulose or replace with that the cellulose powder also can be replaced paper pulp
Cellulose and mixture one or more in starch, chitin, hemicellulose；Common wood pulp, grass may be selected in the paper pulp
Slurry, jute pulp, reed pulp, sugarcane slurry, bamboo pulp, rag stock etc.；Common calcium chloride, sodium nitrate, hydrogen may be selected in the electrolyte powder
Copper oxide etc..
The third is completion method：The place mat flexibility paper in flow path groove is added the solution containing electrolyte and can be obtained
No benzene fluid circuit module based on 3 D-printing.
Step（1）In, according to design requirement, existing mature technology can be used in structure micro-fluidic chip substrate model, can lead to
It crosses computer aided design cad (Computer Aided Design) software and obtains three-dimensional model diagram, can be used business CAD soft
Part, such as CorelDraw, the designs such as Solidworks.
In print procedure, it can be realized using a variety of printing types, such as FDM, DLP.To improve printing precision, can fit
When the filling rate for improving FDM printings, preferably, filling rate is 50-80% in print procedure；Further preferred filling rate is
60%, since chip base size is that Centimeter Level is other, the time-write interval is also relatively short.DLP printing parameter selection be：Slice
Thickness is 0.05mm, light application time 8s.The depth of flow path groove can be arranged to 0.2mm-1mm according to demand.
Step（3）In, PDMS is the mixture of dimethyl silicone polymer and curing agent.The curing agent be and existing skill
The mass ratio of the curing agent mating with dimethyl silicone polymer in art, dimethyl silicone polymer and curing agent is generally（8-15）:
1.Can protective filmy layer effectively be formed in water passage surface by uniformly applying one layer of PDMS in flow path groove one side, prevent examination
Agent penetrates into PLA chip bases.The present invention changes runner groove surfaces using the PDMS configured in specific proportions simultaneously
Property, enable flow path groove that there is preferable hydrophobicity and surface quality, to be utilized to achieve the purpose that repeat.
Step（4）In, cellulose powder and deionized water are with mass ratio 1:（3-8）Proportioning mixed, cellulose powder
Diameter is 74-125 μm, and cellulose slurry or conductive slurry should utilize the principle of surface tension of liquid to make stream when pouring into runner
Slurry in road groove reaches saturation state.Smooth runner effect after capable of just being dried in this state.Work as cellulose
When powder replaces with other powders, the mass ratio of powder and water can be adjusted as needed, to meet actual needs.Add in driving layer
The electrolyte powder entered can be adjusted according to physical circuit demand.
The making that above four steps just complete entire circuit module later is completed, circuit module exists made from this method
After using, the cellulose powder in runner can be washed with water（Or other powders）, repeat step（4）It can realize
The recycling of module.
Compared with prior art, the invention has the advantages that：
Using the preparation method of the present invention, the circuit module of various structures can be made.The present invention is based on the circuit moulds of 3D printing
The production method of block, process is simple and efficient, and production efficiency is high, is easy to industrialization large-scale production, is molded with traditional injection moulding
Mode is compared, and the method customization that 3D printing method makes circuit substrate is high, and monolithic cost of manufacture is far below the cost of injection mould.
Unlimited circulating repetition utilization theoretically may be implemented in circuit module substrate obtained by the method for the invention, greatly reduces into
This.
The circuit module of the present invention can be overlapped and assembly operation, can only print several basic circuit modules and carry out
Assembling, so that it may to obtain a complicated circuit system.Assembling between each module is simple, and degree of freedom is high, may be implemented a variety of
There is the circuit of customized demand to build.The driving layer for conduction filled in flow path groove by changing circuit module substrate,
The making of a variety of different function circuits can be fast implemented,（1）Electrocondution slurry that filling is relatively stablized, more than specific function is directly real
Conducting function is applied,（2）The material with capillarity is filled, cooperation conducting solution can work；（3）Filling carries electrolyte
Capillary materials, entire circuit can start to work after water is added, and the requirement for experiment condition is relatively low.
Description of the drawings
Assembling schematic diagram between the basic circuit module of Fig. 1 present invention.
Assembling schematic diagram between the basic circuit module of Fig. 2 present invention.
Fig. 3 is the schematic diagram of circuit module substrate in the present invention.
Fig. 4 is the signal placed mold in circuit module substrate flow path groove in the present invention and be filled with cellulose powder slurry
Figure.
Fig. 5 is final circuit module schematic diagram obtained in the present invention.
Fig. 6 is the traffic light circuit schematic diagram built using the method for the present invention.
Fig. 7 is the circuit module substrate pictorial diagram of the method for the present invention 3D printing.
Fig. 8 is the method for the present invention finally circuit module pictorial diagram obtained, has been added to cellulose and conduction liquid.
The circuit that the polylith circuit module that Fig. 9 is made by the method for the present invention is built.
Figure 10 is the traffic light circuit system that the method for the present invention makes.
Figure 11 is the order circuit for lamp module that the method for the present invention makes.
Wherein：1, locating slot；2, positioning pin；3, flow path groove；4, through hole；5, non-through hole；6, round boss；7, ten
Word groove.
Specific implementation mode
The invention will now be further described with reference to specific embodiments, but examples are merely exemplary, not to this hair
Bright range constitutes any restrictions.It will be understood by those skilled in the art that without departing from the spirit and scope of the invention
Can the details and form of technical solution of the present invention be modified or be replaced, but these modifications and replacement each fall within the present invention's
In protection domain.
Embodiment 1：By taking traffic light circuit is built as an example, the circuit mentioned by the present invention is built and its manufacture craft is into one
Walk explanation.
Fig. 1 and Fig. 2 shows the assembly between the basic circuit module of the present invention completely and assembling process schematic diagram, pass through
Positioning pin and round boss, two pieces of basic circuit modules can be attached on four direction, the various circuits designed and produced
Module has identical general-purpose interface.
The concrete structure of the general-purpose interface is：The top surface of the circuit module is set there are four the locating slot 1 of square arrangement,
Position corresponding with top surface locating slot is set there are four the positioning pin 2 of square arrangement on bottom surface, the locating slot 1 on the top surface with
Positioning pin 2 on bottom surface is mutually clamped；It is equipped at the square center that top surface is constituted with four locating slot central points recessed with runner
The other end of the through hole 4 that slot 3 is connected, the flow path groove 3 opposite with the through hole 4 is equipped with non-through hole 5；Bottom surface
Round boss 6 is equipped at the square center constituted with four positioning pin central points, 6 center of the round boss, which is run through, cross
Groove 7.
The flow path groove is arranged in intermediate, the length of 0.2mm-1mm along circuit module length direction；Described four
The size of locating slot is 7.5mm × 7.5mm × 5mm, and the centre distance between adjacent two locating slot is 50mm；Described four fixed
The size of position pin is 7.5mm × 7.5mm × 5mm, and the centre distance between adjacent two positioning pin is 50mm；A diameter of 16mm,
Depth is 2mm；A diameter of 16mm of the through hole, depth 2mm；A diameter of 16mm of the round boss is highly
2mm；The width of the cross recess is 4mm, depth 2mm.
Fig. 3 shows the threedimensional model of designed circuit module substrate 1, by the threedimensional model file generated STL formats
Obtained STL formatted files are imported into 3 D-printing software by file, and setting print parameters filling rate is 60%.3D in this example
Printing technique selects FDM Method of printings.It is connected to computer, and starts FDM three-dimensional printers, is controlled by computer and moves FDM
Three-dimensional printer works, the print procedure of start circuit module substrate.The printed material selected in the present embodiment is polylactic acid
（PLA）.PLA circuit module substrates are removed after the completion of printing from printer.
With dimethyl silicone polymer and curing agent 10:1 mass ratio prepares PDMS, is waited in PDMS after standing 20min
After bubble completely disappears, it is evenly coated in the one side that circuit module substrate carries flow path groove, forms a thin layer of guarantor
Sheath.The circuit module substrate for coating PDMS is put into 60 degrees Celsius of drying box, curing process is dried, taken out after 1 hour
Circuit module substrate with PDMS protective layers.
With cellulose powder and deionized water with 1:5 mass ratio configures cellulose powder slurry, after stirring evenly.In through hole
Install mold, cellulose powder slurry is so uniform that pour into the flow path groove of the circuit module substrate with PDMS protective layers, Fig. 4 additional
It shows that circuit module substrate pours into the state diagram of cellulose powder slurry, using the effect of surface tension of liquid, enables flow path groove
Interior cellulose powder slurry reaches expanded state.By the circuit module substrate with cellulose powder slurry, smoothly it is put into 60 and takes the photograph
Family name's degree drying box carries out drying and processing, is taken out after 1 hour and takes out mold.Fig. 5 is that showing for circuit module is finally made after drying
It is intended to.
Fig. 6 shows that the traffic light circuit schematic diagram that this example is built, main operating circuit are modularized circuit, passes through
Sequentially lighting for light emitting diode is realized in the control of Arduino UNO.
Fig. 7 show the circuit module unit of actual processing, and this element is basic turning circuit unit, can be with other moulds
Block connects；After runner filling by the method for the present invention, the calcium chloride solution of dyeing is added in runner, as shown in Figure 8.
Four pieces of basic circuit modules are sequentially fixed at together by positioning pin shown in Fig. 9, by each circuit module
Through hole connecting passage groove constitutes the circuit there are one intersection point and four branches.Divide in wherein three module flow path grooves
Not Zhu Ru red, yellow, blue calcium chloride solution, Article 4 runner outflow solution colour and three kinds of colors in test tube
Direct blend color is consistent, demonstrates the interconnection between four branches.
Circuit shown in Figure 10 is to be added to the hair of red, yellow, green on the basis of fluid circuit shown in Fig. 6
Optical diode, and be connected respectively to No. 4 of Arduino UNO, No. 7, on No. 10 pins；Another does not connect lampet
Branch is connected to the grounding pin of Arduino UNO as public domain end, completes building for traffic light circuit.
Next the burning following procedure in Arduino UNO：
int led_green = 4;
int led_yellow = 7;
int led_red = 10;
void setup() {
pinMode(led_green,OUTPUT);
pinMode(led_yellow,OUTPUT);
pinMode(led_red,OUTPUT);
}
void loop() {
digitalWrite(led_green,HIGH);
delay(1000);
digitalWrite(led_green,LOW);
digitalWrite(led_yellow,HIGH);
delay(1000);
digitalWrite(led_yellow,LOW);
digitalWrite(led_red,HIGH);
delay(1000);
digitalWrite(led_red,LOW);
}
Procedure above can using 1s as interval respectively give No. 4, No. 7, No. 10 pins be set as high level, to make green, yellow,
Red light emitting diodes are lighted by intervening sequences of 1s.
In practical applications, three lumination of light emitting diode sequence is in order expection, and since fluid circuit has one
Fixed impedance can play the role of light emitting diode to divide current-limiting protection element.
Embodiment 2：Order circuit for lamp is realized
On the basis of the above, this example has probed into a example design of separate modular circuit, to illustrate 3D printing technique for circuit
The advantage of making adjusts basic fluid circuit module, it is made to be bent into a custom circuit element, verifies the realization of order lamp,
Other circuits connect example as above.
Circuit shown in Figure 11 is the specialized fluids circuit module made by oneself, after being completed using CAD software modeling, is led
Enter FDM printers to be printed, obtained fluid circuit module substrate use method identical with upper example carries out at PDMS overlay films
The filling of reason and cellulose.
Three light emitting diodes are added at three turnings, cathode is inserted into runner, and anode is connected to 5V power supplys, runner one
Grounding pin is inserted at end.Calcium chloride solution is added in the runner port for having grounding pin, is full of entire circuit along runner in solution
During, understand three light emitting diodes of unicom successively, it is observed that with the flowing of liquid, three light emitting diodes are in due order
Sequence lights.
Claims (10)
1. a kind of modularized circuit component, which is characterized in that the modularized circuit component is by multiple independent 3 D-printing electricity
Road module assembled forms, and the top surface of each circuit module is equipped with flow path groove, be equipped in the flow path groove one layer by conductive or
The driving layer of the driving material composition of additional conductive, circuit module are equipped with general-purpose interface, are connect by general between circuit module
Mouth is attached；The top surface of the circuit module is set there are four the locating slot of square arrangement, opposite with top surface locating slot on bottom surface
The position answered is set there are four the positioning pin of square arrangement, and the positioning pin on locating slot and bottom surface on the top surface is mutually clamped；
It is equipped with the through hole being connected with flow path groove at the square center that top surface is constituted with four locating slot central points, is passed through with described
The other end for the opposite flow path groove of perforating is equipped with non-through hole；The square that bottom surface is constituted with four positioning pin central points
Round boss is equipped at center, the round boss center, which is run through, cross recess.
2. a kind of modularized circuit component according to claim 1, which is characterized in that the flow path groove is arranged along electricity
Intermediate, the length of 0.2mm-1mm in road block length direction；The size of four locating slots be 7.5mm × 7.5mm ×
5mm, the centre distance between adjacent two locating slot are 50mm；The size of four positioning pins be 7.5mm × 7.5mm ×
5mm, the centre distance between adjacent two positioning pin are 50mm；A diameter of 16mm of the through hole, depth 2mm；The circle
A diameter of 16mm of shape boss is highly 2mm；The width of the cross recess is 4mm, depth 2mm.
3. a kind of production method of claims 1 or 2 any one of them modularized circuit component, which is characterized in that including with
Lower step：
（1）The making of 3 D-printing circuit module
The production method of the 3 D-printing circuit module is：
A. the threedimensional model of circuit module substrate of the design with flow path groove and general-purpose interface；
B. threedimensional model is imported in three-dimensional printer, using three-dimensional printer print software, is printed with flow path groove
Circuit module substrate；
C. there is the one side of flow path groove to smear a strata dimethyl siloxane and curing agent printed circuit module substrate
Mixture, drying；
D. it is laid with one layer of driving layer in the flow path groove inner surface of circuit module substrate, obtains the circuit mould based on 3 D-printing
Block, the driving layer direct conduction, or cooperation aqueous solution or electrolyte solution carry out conductive；
（2）Multiple 3 D-printing circuit modules are assembled into modularized circuit component.
4. a kind of production method of modularized circuit component according to claim 3, which is characterized in that the driving layer
Laying method is：Place mat has flexible paper or the sponge of capillary force in flow path groove, coordinates conducting solution, obtains base
In the circuit module of 3 D-printing.
5. a kind of production method of modularized circuit component according to claim 3, which is characterized in that the driving layer
Laying method is：In the electrocondution slurry filling flow path groove that capillarity material, electrolyte powder and water are mixed into, after drying
Coordinate aqueous solution, obtains the circuit module based on 3 D-printing；The capillarity material be cellulose powder, paper pulp, starch,
One or more combinations in chitin, hemicellulose, the electrolyte powder are calcium chloride, sodium nitrate or Kocide SD
One kind of multiple combinations.
6. a kind of production method of modularized circuit component according to claim 3, which is characterized in that the driving layer
Laying method is：By in conductive silver paste, gold paste, tungsten slurry or platinum slurry filling flow path groove, drying obtains the electricity based on 3 D-printing
Road module.
7. a kind of production method of modularized circuit component according to claim 3, which is characterized in that in the step b,
Filling rate during 3 D-printing is 50-80%；The material that 3 D-printing uses is polylactic acid or acrylonitrile-butadiene-benzene second
Alkene polymer.
8. a kind of production method of modularized circuit component according to claim 3, which is characterized in that in the step c
The mass ratio of dimethyl silicone polymer and curing agent is（8-15）:1.
9. a kind of production method of modularized circuit component according to claim 5, which is characterized in that the capillarity
Material is cellulose powder, and the mass ratio of cellulose powder and water is 1:（3-8）, the diameter of cellulose powder is 74-125 μm, is led
Plasma-based material fills entire flow path groove.
10. according to claim 5 or a kind of production method of modularized circuit component of 6 any one of them, which is characterized in that institute
The temperature for stating drying course is 50-70 degrees Celsius, and drying time is 40-120 minutes.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901138A (en) * | 2018-08-30 | 2018-11-27 | 西安瑞特三维科技有限公司 | Integral preparation method based on 3D printing ceramics and metallic circuit |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130069014A1 (en) * | 2011-09-21 | 2013-03-21 | Samsung Electro-Mechanics Co., Ltd. | Conductive paste composition for low temperature firing |
| CN103055973A (en) * | 2012-12-31 | 2013-04-24 | 苏州汶颢芯片科技有限公司 | Novel micro-fluidic separating chip and preparation method thereof |
| CN103895226A (en) * | 2014-03-24 | 2014-07-02 | 浙江大学 | 3D-printing-based machining method of three-dimensional micro-fluidic chip and printing device |
| CN103894248A (en) * | 2014-04-09 | 2014-07-02 | 国家纳米科学中心 | Micro-fluidic chip and micro-fluidic chip system for single cell analysis and single cell analyzing method |
| CN103967740A (en) * | 2014-04-12 | 2014-08-06 | 北京工业大学 | Steam-bubble-driven micro pump conducting heating through induction |
| CN105642377A (en) * | 2016-01-28 | 2016-06-08 | 浙江大学 | Pump-driving-free micro-fluidic chip manufacturing method based on three-dimensional printing and product |
| CN105665045A (en) * | 2016-02-05 | 2016-06-15 | 中国科学技术大学 | Micro-fluidic chip and preparation method thereof |
| CN208158971U (en) * | 2018-02-06 | 2018-11-27 | 苏州智能制造研究院有限公司 | A kind of modularized circuit component |
-
2018
- 2018-02-06 CN CN201810117048.9A patent/CN108282955A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20130069014A1 (en) * | 2011-09-21 | 2013-03-21 | Samsung Electro-Mechanics Co., Ltd. | Conductive paste composition for low temperature firing |
| CN103055973A (en) * | 2012-12-31 | 2013-04-24 | 苏州汶颢芯片科技有限公司 | Novel micro-fluidic separating chip and preparation method thereof |
| CN103895226A (en) * | 2014-03-24 | 2014-07-02 | 浙江大学 | 3D-printing-based machining method of three-dimensional micro-fluidic chip and printing device |
| CN103894248A (en) * | 2014-04-09 | 2014-07-02 | 国家纳米科学中心 | Micro-fluidic chip and micro-fluidic chip system for single cell analysis and single cell analyzing method |
| CN103967740A (en) * | 2014-04-12 | 2014-08-06 | 北京工业大学 | Steam-bubble-driven micro pump conducting heating through induction |
| CN105642377A (en) * | 2016-01-28 | 2016-06-08 | 浙江大学 | Pump-driving-free micro-fluidic chip manufacturing method based on three-dimensional printing and product |
| CN105665045A (en) * | 2016-02-05 | 2016-06-15 | 中国科学技术大学 | Micro-fluidic chip and preparation method thereof |
| CN208158971U (en) * | 2018-02-06 | 2018-11-27 | 苏州智能制造研究院有限公司 | A kind of modularized circuit component |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108901138A (en) * | 2018-08-30 | 2018-11-27 | 西安瑞特三维科技有限公司 | Integral preparation method based on 3D printing ceramics and metallic circuit |
| CN108901138B (en) * | 2018-08-30 | 2021-03-26 | 西安瑞特三维科技有限公司 | Integrated preparation method based on 3D printing ceramic and metal circuit |
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