CN108277480A - A kind of method of graphite nickel plating - Google Patents
A kind of method of graphite nickel plating Download PDFInfo
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- CN108277480A CN108277480A CN201711042881.3A CN201711042881A CN108277480A CN 108277480 A CN108277480 A CN 108277480A CN 201711042881 A CN201711042881 A CN 201711042881A CN 108277480 A CN108277480 A CN 108277480A
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/32—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron
- C23C18/34—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents
- C23C18/36—Coating with nickel, cobalt or mixtures thereof with phosphorus or boron using reducing agents using hypophosphites
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B22—CASTING; POWDER METALLURGY
- B22F—WORKING METALLIC POWDER; MANUFACTURE OF ARTICLES FROM METALLIC POWDER; MAKING METALLIC POWDER; APPARATUS OR DEVICES SPECIALLY ADAPTED FOR METALLIC POWDER
- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1651—Two or more layers only obtained by electroless plating
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
- C23C18/38—Coating with copper
- C23C18/40—Coating with copper using reducing agents
- C23C18/405—Formaldehyde
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- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
The present invention provides a kind of methods of graphite nickel plating, include the following steps：Graphite matrix is added in nickel plating solution, is reacted, obtains Ni-coated graphite；The nickel plating solution includes the component of following content：20~35g/L of nickel sulfate hexahydrate, 8~30g/L of lactic acid, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate, 10~35g/L of ammonium chloride, 30~45g/L of sodium hypophosphite, L 0.01~0.2mg/L of arginine, 0.1~10mg/L of potassium ferrocyanide, it is 8~9 that ammonium hydroxide, which adjusts pH,；The temperature of the nickel plating solution is 30~45 DEG C.The present invention reduces cumbersome surface degreasing, the techniques such as sensitization, Metal Palladium activation, dispergation substantially increase production efficiency, do not use precious metal catalyst, have saved cost.Further, the present invention is first by graphite composite powder copper facing, then carries out nickel plating, and graphite composite powder is made to have better electric conductivity and tensile strength.
Description
Technical field
The invention belongs to electrochemical technology field more particularly to a kind of methods of graphite nickel plating.
Background technology
Ni-coated graphite has a wide range of applications in national economy, in many application fields, it is desirable that is covered in graphite surface
One layer of metallic nickel, as graphite powder as conductive material in use, in order to improve the electric conductivity of graphite powder, often in graphite powder table
Face forms a kind of metallic nickel using chemical plating or vapour deposition process, and for another example graphite powder as electromagnetic shielding material when using
Also tend to, in one layer of nickel metal of its coating surface, graphite composite powder plating metal on surface material, there is good mechanics and electric property,
There is good heat conduction, electric conductivity and lubricity simultaneously, good conductive and filling capacity etc. is played in conductive plastics.
But traditional technique has more complicated pre-treating technology, as surface degreasing, roughening, sensitization, Metal Palladium activation,
The techniques such as dispergation, these pre-treating technologies not only waste time, and reduce the efficiency of nickel plating, also add graphite nickel plating at
This.
Invention content
The purpose of the present invention is to provide a kind of method of graphite nickel plating, the method in the present invention eliminates cumbersome preceding place
The method of reason and time, and the use of noble metal is not needed, time efficiency is substantially increased, cost has been saved.
The present invention provides a kind of method of graphite nickel plating, includes the following steps：
Graphite matrix is added in nickel plating solution, is reacted, obtains Ni-coated graphite；
The nickel plating solution includes the component of following content：
20~35g/L of nickel sulfate hexahydrate, 8~30g/L of lactic acid, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate,
10~35g/L of ammonium chloride, 30~45g/L of sodium hypophosphite, 0.01~0.2mg/L of L-arginine, 0.1~10mg/ of potassium ferrocyanide
L, it is 8~9 that ammonium hydroxide, which adjusts pH,；
The temperature of the nickel plating solution is 30~45 DEG C.
Preferably, the graphite matrix is graphite composite powder, copper-plated graphite powder or nickel-plated and copper-plated graphite composite powder.
Preferably, the graphite copper facing powder is made according to the following steps：
Graphite composite powder is added in copper plating solution, is reacted, obtains copper-plated graphite powder；
The copper plating solution includes the component of following content：
2~15g/L of cupric sulfate pentahydrate, 12~45g/L of tetrasodium ethylenediamine tetraacetate, 4~20g/L of sodium hydroxide, formaldehyde 5~
16mL/L, 5~20mg/L of bipyridyl, 10~100mg/L of polyethylene glycol.
Preferably, the temperature of the copper plating solution is 30~55 DEG C.
Preferably, the nickel-plated and copper-plated graphite composite powder is made according to the following steps：
Graphite composite powder is added in nickel plating solution, is reacted, obtains Ni-coated graphite intermediate；
The Ni-coated graphite intermediate is added in copper plating solution, is reacted, obtains plating copper and nickel graphite composite powder；
The nickel plating solution includes the component of following content：
20~35g/L of nickel sulfate hexahydrate, 8~30g/L of lactic acid, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate,
10~35g/L of ammonium chloride, 30~45g/L of sodium hypophosphite, 0.01~0.2mg/L of L-arginine, 0.1~10mg/ of potassium ferrocyanide
L, it is 8~9 that ammonium hydroxide, which adjusts pH,；
The copper plating solution includes the component of following content：
2~15g/L of cupric sulfate pentahydrate, 12~45g/L of tetrasodium ethylenediamine tetraacetate, 4~20g/L of sodium hydroxide, formaldehyde 5~
16mL/L, 5~20mg/L of bipyridyl, 10~100mg/L of polyethylene glycol.
Preferably, the temperature of the nickel plating solution is 30~45 DEG C；
The temperature of the copper plating solution is 30~55 DEG C.
Preferably, the graphite matrix in nickel plating solution after completion of the reaction, reaction product is dried, nickel plating is obtained
Graphite.
Preferably, the temperature of the drying is 130~180 DEG C；
The time of the drying is 10~15min.
The present invention provides a kind of methods of graphite nickel plating, include the following steps：Graphite matrix is added in nickel plating solution,
It is reacted, obtains Ni-coated graphite；The nickel plating solution includes the component of following content：20~35g/L of nickel sulfate hexahydrate, lactic acid
8~30g/L, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate, 10~35g/L of ammonium chloride, 30~45g/ of sodium hypophosphite
L, 0.01~0.2mg/L of L-arginine, 0.1~10mg/L of potassium ferrocyanide, it is 8~9 that ammonium hydroxide, which adjusts pH,；The nickel plating solution
Temperature is 30~45 DEG C.The beneficial effects of the invention are as follows：Reduce cumbersome surface degreasing, sensitization, Metal Palladium activation, dispergation etc.
Technique substantially increases production efficiency, does not use precious metal catalyst, has saved cost.
Further, the present invention is existing by graphite composite powder copper facing, is carrying out nickel plating, the graphite composite powder enabled to has more
Good electric conductivity and tensile strength.
Description of the drawings
In order to more clearly explain the embodiment of the invention or the technical proposal in the existing technology, to embodiment or will show below
There is attached drawing needed in technology description to be briefly described, it should be apparent that, the accompanying drawings in the following description is only this
The embodiment of invention for those of ordinary skill in the art without creative efforts, can also basis
The attached drawing of offer obtains other attached drawings.
Fig. 1 is the process flow chart of nickel plating in the embodiment of the present invention 1；
Fig. 2 be the embodiment of the present invention 2 in copper facing, nickel process flow chart；
Fig. 3 be the embodiment of the present invention 3 in nickel plating, copper, nickel process flow chart.
Specific implementation mode
The present invention provides a kind of methods of graphite nickel plating, include the following steps：
Graphite matrix is added in nickel plating solution, is reacted, obtains Ni-coated graphite；
The nickel plating solution includes the component of following content：
20~35g/L of nickel sulfate hexahydrate, 8~30g/L of lactic acid, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate,
10~35g/L of ammonium chloride, 30~45g/L of sodium hypophosphite, 0.01~0.2mg/L of L-arginine, 0.1~10mg/ of potassium ferrocyanide
L, it is 8~9 that ammonium hydroxide, which adjusts pH,；
The temperature of the nickel plating solution is 30~45 DEG C.
In the present invention, the graphite matrix is preferably graphite composite powder, copper-plated graphite powder or nickel-plated and copper-plated graphite composite powder.
When the graphite matrix is graphite composite powder：
Method in the present invention includes the following steps：
Graphite composite powder is added in nickel plating solution, is reacted, obtains Ni-coated graphite；
The graphite composite powder is preferably micron-sized graphite composite powder, and grain size is preferably 1~200 μm；
The nickel plating solution includes the component of following content：
20~35g/L of nickel sulfate hexahydrate, preferably 25~30g/L；8~30g/L of lactic acid, preferably 15~30g/L；Three second
2~18g/L of hydramine, preferably 10~18g/L；20~45g/L of sodium citrate, preferably 20~35g/L；10~35g/ of ammonium chloride
L, preferably 20~35g/L；30~45g/L of sodium hypophosphite, preferably 35~45g/L；L-arginine 0.01~0.2mg/L, it is excellent
It is selected as 0.05~0.15mg/L, more preferably 0.1mg/L；0.1~10mg/L of potassium ferrocyanide, preferably 1~8mg/L, it is more excellent
It is selected as 2~5mg/L, it is 8~9, preferably 8.8 that ammonium hydroxide, which adjusts pH,.
The L-arginine and potassium ferrocyanide collective effect play the role of stabilizer in nickel plating solution.
The temperature of the nickel plating solution is preferably 30~45 DEG C, more preferably 35~40 DEG C；It is anti-in the nickel plating solution
The time answered is preferably 10~20min.
The present invention preferably detaches the reaction product in nickel plating solution, carries out high temperature drying after clear water washing, obtains
Ni-coated graphite；The temperature of the drying is preferably 130~180 DEG C, more preferably 150~160 DEG C；The time of the drying is preferred
For 10~15min.
When the graphite matrix is copper-plated graphite powder：
Method in the present invention includes the following steps：
Graphite composite powder is added in copper plating solution, is reacted, obtains copper-plated graphite powder；
Copper-plated graphite powder is added in nickel plating solution, is reacted, obtains plating copper and nickel graphite composite powder.
In the present invention, the grain size of the graphite composite powder is consistent with graphite composite powder grain size above, and details are not described herein.
The copper plating solution includes the component of following content：
2~15g/L of cupric sulfate pentahydrate, preferably 5~10g/L, more preferably 7~8g/L；Tetrasodium ethylenediamine tetraacetate 12
~45g/L, preferably 15~40g/L, more preferably 20~35g/L；4~20g/L of sodium hydroxide, preferably 10~15g/L, more
Preferably 12~13g/L；5~16mL/L of formaldehyde, preferably 8~15g/L, more preferably 10~13g/L；Bipyridyl 5~
20mg/L, preferably 5~15mg/L；10~100mg/L of polyethylene glycol, preferably 30~80mg/L, more preferably 50~60mg/
L。
The temperature of the copper plating solution is preferably 30~55 DEG C, more preferably 35~50 DEG C, most preferably 40~45 DEG C；
The time reacted in the copper plating solution is preferably 5~10min.
The present invention preferably detaches the reaction product in the copper plating solution, after clear water washes clean, in 5% sulphur
Pickling 1min in acid solution, then washes with clean water, and is added directly into nickel plating solution, is reacted, and plating copper and nickel is obtained
Graphite.
In the present invention, the nickel plating solution and the method for nickel plating and the nickel plating of graphite composite powder nickel plating used above are molten
Liquid is consistent with nickel plating process, and details are not described herein.
When the graphite matrix is nickel-plated and copper-plated graphite composite powder；
Method in the present invention includes the following steps：
Graphite composite powder is added in nickel plating solution, is reacted, obtains Ni-coated graphite intermediate；
The Ni-coated graphite intermediate is added in copper plating solution, is reacted, obtains plating copper and nickel graphite composite powder；
Above-mentioned plating copper and nickel graphite composite powder is added in nickel plating solution, is reacted, obtains nickel plating, copper, nickel graphite composite powder.
In the present invention, nickel plating solution and the method for nickel plating used in the first step nickel plating and graphite used above
The nickel plating solution of powder nickel plating is consistent with nickel plating process, and details are not described herein.
The second step copper facing and third step nickel plating used in copper plating solution, nickel plating solution and copper coating and
The method of nickel plating is consistent in above graphite composite powder plating copper and nickel, and details are not described herein.
The present invention provides a kind of methods of graphite nickel plating, include the following steps：Graphite matrix is added in nickel plating solution,
It is reacted, obtains Ni-coated graphite；The nickel plating solution includes the component of following content：20~35g/L of nickel sulfate hexahydrate, lactic acid
8~30g/L, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate, 10~35g/L of ammonium chloride, 30~45g/ of sodium hypophosphite
L, 0.01~0.2mg/L of L-arginine, 0.1~10mg/L of potassium ferrocyanide, it is 8~9 that ammonium hydroxide, which adjusts pH,；The nickel plating solution
Temperature is 30~45 DEG C.The beneficial effects of the invention are as follows：Reduce cumbersome surface degreasing, sensitization, Metal Palladium activation, dispergation etc.
Technique substantially increases production efficiency, does not use precious metal catalyst, has saved cost.
In order to further illustrate the present invention, with reference to embodiments to a kind of method of graphite nickel plating provided by the invention into
Row detailed description, but limiting the scope of the present invention cannot be understood as.
1 Ni-coated graphite powder of embodiment
(1) chemical nickel-plating solution has been configured：Nickel sulfate hexahydrate 25g/L, lactic acid 30g/L, triethanolamine 18g/L, citric acid
Sodium 20g/L, ammonium chloride 35g/L, sodium hypophosphite 45g/L, L-arginine 0.1mg/L, potassium ferrocyanide 5mg/L are adjusted with ammonium hydroxide
To pH8.8.
(2) graphite powder is added directly into and is heated in 30 DEG C of chemical nickel-plating solution, side mechanical agitation 10 minutes, warp
Chemical reaction is crossed, graphite powder surface can form one layer of chemical plating nickel-phosphorus alloy metal layer.After wash clean being washed down with circulating water, warp
150 DEG C of high temperature drying are after ten minutes, you can obtain the graphite of good plating nickel-phosphorus alloy.
Fig. 1 is the process flow chart of nickel plating in the embodiment of the present invention 1.
Embodiment 2
First step electroless copper
(1) chemical copper plating solution has been configured：Cupric sulfate pentahydrate 8g/L, tetrasodium ethylenediamine tetraacetate 35g/L, sodium hydroxide
12g/L, formaldehyde 10mL/L, bipyridyl 5mg/L, polyethylene glycol 50mg/L.
(2) graphite powder is added directly into the chemical copper plating solution of 30 DEG C or so of temperature, side mechanical agitation 10 minutes, is passed through
Chemical reaction is crossed, graphite powder surface can form a stratification copper metal layer.
Second step chemical nickel plating
(1) chemical nickel-plating solution has been configured：Nickel sulfate hexahydrate 25g/L, lactic acid 30g/L, triethanolamine 18g/L, citric acid
Sodium 20g/L, ammonium chloride 35g/L, sodium hypophosphite 45g/L, L-arginine 0.2mg/L, potassium ferrocyanide 10mg/L, ammonium hydroxide are adjusted to
PH8.8 etc..
(2) sour in 5% sulfuric acid solution after the graphite powder for having plated good chemical layers of copper being washed down wash clean with circulating water
It washes 1 minute, then washes down wash clean with circulating water, be added directly into and be heated in 40 DEG C of chemical nickel-plating solution, side machinery
Stirring 5 minutes, after chemical reaction, graphite powder surface can form one layer of chemical plating nickel-phosphorus alloy metal layer.It is washed with flowing
After cleaning up, after ten minutes through 150 DEG C of high temperature drying, you can obtain good copper facing, nickel graphite.
Fig. 2 be the embodiment of the present invention 2 in copper facing, nickel process flow chart.
Embodiment 3
First step chemical nickel plating
(1) graphite powder is added directly into the chemical nickel-plating solution of temperature 45 C or so, side mechanical agitation 10 minutes, is passed through
Chemical reaction is crossed, graphite powder surface can form a stratification nickel-phosphorus alloy metal layer.
(1) chemical nickel-plating solution has been configured：Chemical nickel-plating solution has nickel sulfate hexahydrate, lactic acid, triethanolamine, citric acid
Sodium, ammonium chloride, sodium hypophosphite, the compositions such as stabilizer.Dosage：Nickel sulfate hexahydrate 25g/L, lactic acid 30g/L, triethanolamine 18g/L,
Sodium citrate 20g/L, ammonium chloride 35g/L, sodium hypophosphite 45g/L, L-arginine 0.01mg/L, potassium ferrocyanide 0.1mg/L, ammonia
Water adjusts pH8.8.
Second step configures electroless copper
(2) chemical copper plating solution has been configured：Cupric sulfate pentahydrate 8g/L, tetrasodium ethylenediamine tetraacetate 35g/l, sodium hydroxide
12g/l, formaldehyde 10mL/L, bipyridyl 5mg/L, polyethylene glycol 50mg/L.
(2) graphite powder of Ni plated phosphor alloy coating is added directly into the chemical copper plating solution of 40 DEG C or so of temperature,
Side mechanical agitation 10 minutes, after chemical reaction, graphite powder surface can form a stratification copper metal layer.
(3) sour in 5% sulfuric acid solution after the graphite powder for having plated good chemical layers of copper being washed down wash clean with circulating water
It washes, 1 minute, then washes down wash clean with circulating water, be added directly into and be heated in 40 DEG C of chemical nickel-plating solution, side machinery
Stirring 2 minutes, after chemical reaction, graphite powder surface can form one layer of chemical plating nickel-phosphorus alloy metal layer.It is washed with flowing
After cleaning up, after ten minutes through 150 DEG C of high temperature drying, you can obtain good nickel plating, copper, nickel graphite.
Fig. 3 be the embodiment of the present invention 3 in nickel plating, copper, nickel process flow chart.
The present invention is tested for the property the product in Examples 1 to 3, and the results are shown in Table 1.
The performance of Ni-coated graphite in 1 embodiment of the present invention 1~3 of table
By table 1 as it can be seen that Ni-coated graphite made from the method in the present invention is not only simple for process, nickel plating is efficient, simultaneously
The Ni-coated graphite arrived, which also has in good electric property, especially embodiment 2 and embodiment 3, is added to copper coating step, due to
Electric conductivity and ductility the ratio nickel of copper are much better, and therefore, the Ni-coated graphite in embodiment 2 and 3 has preferably conductive
Property and tensile strength.
The above is only a preferred embodiment of the present invention, it is noted that for the ordinary skill people of the art
For member, various improvements and modifications may be made without departing from the principle of the present invention, these improvements and modifications are also answered
It is considered as protection scope of the present invention.
Claims (8)
1. a kind of method of graphite nickel plating, includes the following steps：
Graphite matrix is added in nickel plating solution, is reacted, obtains Ni-coated graphite；
The nickel plating solution includes the component of following content：
20~35g/L of nickel sulfate hexahydrate, 8~30g/L of lactic acid, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate, chlorination
10~35g/L of ammonium, 30~45g/L of sodium hypophosphite, 0.01~0.2mg/L of L-arginine, 0.1~10mg/L of potassium ferrocyanide, ammonia
It is 8~9 that water, which adjusts pH,；
The temperature of the nickel plating solution is 30~45 DEG C.
2. according to the method described in claim 1, it is characterized in that, the graphite matrix is graphite composite powder, copper-plated graphite powder
Or nickel-plated and copper-plated graphite composite powder.
3. according to the method described in claim 2, it is characterized in that, the graphite copper facing powder is made according to the following steps：
Graphite composite powder is added in copper plating solution, is reacted, obtains copper-plated graphite powder；
The copper plating solution includes the component of following content：
2~15g/L of cupric sulfate pentahydrate, 12~45g/L of tetrasodium ethylenediamine tetraacetate, 4~20g/L of sodium hydroxide, formaldehyde 5~
16mL/L, 5~20mg/L of bipyridyl, 10~100mg/L of polyethylene glycol.
4. according to the method described in claim 3, it is characterized in that, the temperature of the copper plating solution is 30~55 DEG C.
5. according to the method described in claim 2, it is characterized in that, the nickel-plated and copper-plated graphite composite powder is made according to the following steps
：
Graphite composite powder is added in nickel plating solution, is reacted, obtains Ni-coated graphite intermediate；
The Ni-coated graphite intermediate is added in copper plating solution, is reacted, obtains plating copper and nickel graphite composite powder；
The nickel plating solution includes the component of following content：
20~35g/L of nickel sulfate hexahydrate, 8~30g/L of lactic acid, 2~18g/L of triethanolamine, 20~45g/L of sodium citrate, chlorination
10~35g/L of ammonium, 30~45g/L of sodium hypophosphite, 0.01~0.2mg/L of L-arginine, 0.1~10mg/L of potassium ferrocyanide, ammonia
It is 8~9 that water, which adjusts pH,；
The copper plating solution includes the component of following content：
2~15g/L of cupric sulfate pentahydrate, 12~45g/L of tetrasodium ethylenediamine tetraacetate, 4~20g/L of sodium hydroxide, formaldehyde 5~
16mL/L, 5~20mg/L of bipyridyl, 10~100mg/L of polyethylene glycol.
6. according to the method described in claim 5, it is characterized in that, the temperature of the nickel plating solution is 30~45 DEG C；
The temperature of the copper plating solution is 30~55 DEG C.
7. according to the method described in claim 1~6 any one, which is characterized in that the graphite matrix is in nickel plating solution
After completion of the reaction, reaction product is dried, obtains Ni-coated graphite.
8. the method according to the description of claim 7 is characterized in that the temperature of the drying is 130~180 DEG C；
The time of the drying is 10~15min.
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| CN109021533A (en) * | 2018-07-18 | 2018-12-18 | 浙江三元电子科技有限公司 | A kind of compound conductive plastic and preparation method thereof |
| CN110899692A (en) * | 2019-11-29 | 2020-03-24 | 安徽工业大学 | Preparation method of iron-based alloy powder |
| CN111360244A (en) * | 2018-12-25 | 2020-07-03 | 上海核威实业有限公司 | Bearing alloy blank, bearing alloy, bearing material, and preparation method and application thereof |
| CN112045182A (en) * | 2020-08-03 | 2020-12-08 | 西安工程大学 | Preparation method of Ni/C composite conductive powder |
| RU2739924C1 (en) * | 2020-02-18 | 2020-12-29 | Общество с ограниченной ответственностью "Гранит" | Method of producing composite material based on nickel and graphite |
| CN115233137A (en) * | 2022-08-03 | 2022-10-25 | 四川苏克流体控制设备有限公司 | Low-friction supersonic flame spraying wear-resistant coating material, preparation method and application |
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| CN109021533B (en) * | 2018-07-18 | 2020-09-15 | 浙江三元电子科技有限公司 | Composite conductive plastic and preparation method thereof |
| CN111360244A (en) * | 2018-12-25 | 2020-07-03 | 上海核威实业有限公司 | Bearing alloy blank, bearing alloy, bearing material, and preparation method and application thereof |
| CN111360244B (en) * | 2018-12-25 | 2022-06-07 | 上海核威实业有限公司 | Bearing alloy blank, bearing alloy, bearing material, and preparation method and application thereof |
| CN110899692A (en) * | 2019-11-29 | 2020-03-24 | 安徽工业大学 | Preparation method of iron-based alloy powder |
| RU2739924C1 (en) * | 2020-02-18 | 2020-12-29 | Общество с ограниченной ответственностью "Гранит" | Method of producing composite material based on nickel and graphite |
| CN112045182A (en) * | 2020-08-03 | 2020-12-08 | 西安工程大学 | Preparation method of Ni/C composite conductive powder |
| CN115233137A (en) * | 2022-08-03 | 2022-10-25 | 四川苏克流体控制设备有限公司 | Low-friction supersonic flame spraying wear-resistant coating material, preparation method and application |
| CN115233137B (en) * | 2022-08-03 | 2023-07-18 | 四川苏克流体控制设备股份有限公司 | Low-friction supersonic flame spraying wear-resistant coating material, preparation method and application |
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