CN108258107A - Inner concealed ultra high-definitions LED - Google Patents
Inner concealed ultra high-definitions LED Download PDFInfo
- Publication number
- CN108258107A CN108258107A CN201810089251.XA CN201810089251A CN108258107A CN 108258107 A CN108258107 A CN 108258107A CN 201810089251 A CN201810089251 A CN 201810089251A CN 108258107 A CN108258107 A CN 108258107A
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- pad
- insulating body
- leg
- led
- reflector
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- 241000218202 Coptis Species 0.000 claims abstract description 27
- 235000002991 Coptis groenlandica Nutrition 0.000 claims abstract description 27
- 238000000465 moulding Methods 0.000 claims abstract description 21
- 239000004568 cement Substances 0.000 claims description 15
- 238000005452 bending Methods 0.000 claims description 13
- 239000000084 colloidal system Substances 0.000 claims description 3
- 238000009413 insulation Methods 0.000 claims description 3
- 208000002193 Pain Diseases 0.000 claims 1
- 239000003086 colorant Substances 0.000 abstract description 9
- 229910000679 solder Inorganic materials 0.000 abstract description 2
- 235000012431 wafers Nutrition 0.000 description 28
- 230000000694 effects Effects 0.000 description 10
- 238000005286 illumination Methods 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 238000002955 isolation Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 230000003760 hair shine Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 210000002189 macula lutea Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 238000009738 saturating Methods 0.000 description 1
- 230000035807 sensation Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
- H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
- H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
- H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
- H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
- H01L33/60—Reflective elements
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Computer Hardware Design (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Led Device Packages (AREA)
Abstract
The present invention discloses a kind of Inner concealeds ultra high-definition LED,Including an insulating body 10 and four conducting terminals 20,Four conducting terminals 20 and the integrated produced by insert molding of insulating body 10,The size of insulating body is 1.0mm*1.0mm,Tolerance is ± 0.08mm,So that the reflector in insulating body is smaller,There are 4 pads in the reflector of small size,Wherein the first pad and third pad are die bond pad,Two die bond pads above and below product center line (Y) in cross structure,Complete the die bond function of tri- kinds of primary colours chips of RGB,Structure staggeredly makes each chip close to center line as much as possible,Light efficiency is blocked to avoid left and right reflecting surface,Pass through gold thread and the 4th pad solder additionally, due to the chip of tri- kinds of primary colours of RGB,So as to set resigning recess portion in the first pad upper end,It is formed on the upside of corresponding 4th pad and widens protrusion,The 4th pad is allowd there are enough spaces to weld 3 articles of gold threads,Take full advantage of space,It is reasonably distributed,It is compact-sized.
Description
Technical field
The present invention relates to LED field technologies, refer in particular to a kind of Inner concealeds ultra high-definition LED.
Background technology
LED display is made of LED dot matrix, can show text by the light on and off of red, green or blue LED lamp
Word, picture, animation, video, each section component are all the display devices of modular construction, can be not only used for indoor environment, also
It can be used for outdoor environment, have the advantages that projecting apparatus, video wall, liquid crystal display are incomparable.LED display why by
It is rapidly developed to extensive pay attention to, is inseparable with advantage possessed by itself.These advantages sum up：It is bright
Low height, operating voltage, small power consumption, miniaturization, long lifespan, impact resistance and performance is spent to stablize.
As shown in Figure 1, the smaller spacing of LED display is 1.5mm × 1.5mm in industry, 1920* is substantially achieved
1080 full HD display.The structure of such LED includes insulating body and four conducting terminals, in the reflector of insulating body
There is linear type pad along center line, tri- kinds of primary colours chips of RGB are arranged in linear type, and are fully located at the center of pad
On line.The advantages of such LED, is that illumination effect is good, since each luminescent wafer is located on center line, from display screen just
Face viewing is watched from left side and right side, and the chip of a variety of colors shines unobstructed, can enrich the color of display screen.However
The LED of this 1.5mm × 1.5mm still cannot meet the requirement to the superelevation clear screen of extra small spacing at present.
As shown in Fig. 2, in order to reach smaller spacing, another way is employed in industry and makes LED.It is directly to adopt
With full wafer pcb board, multiple LED are arranged to spacing on pcb board, then at surface encapsulation fluorescent powder, bottom surface welds another
Pcb board carries out the LED that simple grain is isolated in cutting after the completion.The LED sizes that this mode produces are controlled to 1.0 mm × 1.0mm
Extra small spacing, however there are of high cost, the complicated difficulty low with efficiency of processing.And since such LED does not have reflector,
It shines between adjacent two LED and there is interference（Light interference region is represented with S）, influence the illumination effect of LED screen.
Invention content
In view of this, in view of the deficiencies of the prior art, the present invention aims to provide a kind of Inner concealeds superelevation
Clear LED, size can control the extra small spacing in 1.0mm*1.0 mm, make tri- kinds of RGB as far as possible in so small reflector
Primary colours distribution is close on centerline, to improve illumination effect, so as to overcome the deficiencies in the prior art.
To achieve the above object, the present invention is using following technical solution：
A kind of Inner concealeds ultra high-definition LED, including
One insulating body, the insulating body are square structure, and length and width dimensions are 1 ± 0.08mm*1 ± 0.08mm, in exhausted
The top of edge ontology is recessed a reflector；
Four conducting terminals, four conducting terminals and insulating body one produced by insert molding, the conducting terminal are respectively the
One conducting terminal, the second conducting terminal, third conducting terminal, the 4th conducting terminal, first conducting terminal have the first pad
With the first leg, second conducting terminal have the second pad and the second leg, the third conducting terminal have third pad and
Third leg, the 4th conducting terminal have the 4th pad and the 4th leg, and each pad flushes in the bottom of a cup of reflector, each leg
The bottom of insulating body is concealed in after reflexed；
Wherein, the first pad is distributed in the upper left of reflector, and the second pad is distributed in the lower left of reflector, third weldering
Disk is distributed in the lower right of reflector, and the 4th pad is distributed in the upper right of reflector；And first pad is to the right
The right side of upper and lower central axis is extended beyond, the third pad extends beyond the left side of upper and lower central axis, makes first to the left
Pad and third pad have alternating share about upper and lower central axis；
First pad, the second pad, third pad, the 4th pad have isolation strip each other, wherein the first pad
Upside is bent to form resigning recess portion in the form of camber line to the left；The upside of 4th pad bent in the form of camber line to the left
Into widening protrusion.
As a preferred embodiment, first pad and third pad are die bond pads, second pad and the 4th
Pad is gold thread pad, the face of the second pads of area ＞ of the 4th pads of area ＞ of the area ＞ third pads of the first pad
Product.
As a preferred embodiment, the reflector be oval cup, the width of the width W1 ＞ left and right directions of upper and lower directions
Spend W2.
As a preferred embodiment, first pad is equipped with the first LED wafer and the second LED wafer, the third
Pad is equipped with third LED wafer, wherein, the first LED wafer has the first gold thread and the second gold thread be respectively welded in the first pad,
4th pad；Second LED wafer has third gold thread and the 4th gold thread to be respectively welded in the second pad and the 4th pad；3rd LED
Chip has hardware wire bonding to be connected to the 4th pad.
As a preferred embodiment, first LED wafer, the second LED wafer, third LED wafer it is respectively red, it is green,
Blue three-color light-emitting chip.
As a preferred embodiment, the both sides of the junction of each pad and corresponding leg of four conducting terminals are all provided with
The hook hopper of arc concave shape is equipped with, after four conducting terminals and insulating body one produced by insert molding, the hook hopper is stung tight exhausted
The plastic cement of edge ontology, and four corner indents in reflector that four pads correspondences hook hopper cause colloid to expose body hook
Face.
As a preferred embodiment, offset is equipped at the end angle of second pad, third pad, the 4th pad, with
And the equal scutching flower point in the back side of first pad, the second pad, third pad, the 4th pad, when each pad and insulating body one
After produced by insert molding, each offset and fried dough twist point sting the plastic cement of tight insulating body.
As a preferred embodiment, the left and right sides lower end of the insulating body is equipped with recessing groove, each conducting terminal
There is adjutage, each adjutage is accommodated in recessing groove, and adjutage is vertically connected at pad and weldering between pad and leg
Between foot, thinned between adjutage and pad, leg and form the pre- broken line of bending.
As a preferred embodiment, the bottom surface of the insulating body is set there are four boss, is isolated between adjacent two leg.
As a preferred embodiment, the outer surface of the insulating body is cloudy surface structure.
The present invention has clear advantage and advantageous effect compared with prior art, specifically, by above-mentioned technical proposal
It is found that this product be RGB types LED support, size 1.0mm*1.0mm, tolerance be ± 0.08mm, the reflector of this product
Inside there are 4 pads, wherein the first pad and third pad are die bond pad, two die bond pads center line (Y) above and below product
In cross structure, chip is allowed in die bond, close to center line, light efficiency is blocked to avoid left and right reflecting surface, in addition, due to RGB tri-
The chip of kind of primary colours by gold connect with the 4th pad solder, resigning recess portion, corresponding 4th weldering are set in the first pad upper end
It is formed on the upside of disk and widens protrusion, widened protrusion and the 4th pad is allowd to have enough spaces to weld 3 articles of gold threads, ensure enough
Space can be welded for three gold threads, and this product is fully sharp based on LED support so small 1.0*1.0mm in a word
With space, it is reasonably distributed, it is compact-sized.
More clearly to illustrate the structure feature and effect of the present invention, come below in conjunction with the accompanying drawings with specific embodiment to this hair
It is bright to be described in detail.
Description of the drawings
Fig. 1 is the LED front views that conventional size is 1.5mm*1.5mm.
Fig. 2 is the LED stereograms for the no-reflection cup that conventional size is 1.0 mm *, 1.0 mm.
Fig. 3 is the LED illumination effect figures of Fig. 2.
Fig. 4 is the LED product front schematic view of embodiments of the present invention.
Fig. 5 is the LED product schematic rear view of embodiments of the present invention.
Fig. 6 is the LED product front view of embodiments of the present invention.
Fig. 7 is the front view after the LED product die bond of embodiments of the present invention.
Fig. 8 is the exploded view of the LED of embodiments of the present invention.
Fig. 9 is the schematic rear view after each conducting terminal bending of embodiments of the present invention.
Figure 10 is the perspective view after each conducting terminal bending of embodiments of the present invention.
Figure 11 is the front elevation before each conducting terminal bending of embodiments of the present invention.
Figure 12 is the back view before each conducting terminal bending of embodiments of the present invention.
Figure 13 is the copper coin support schematic diagram of embodiments of the present invention.
Figure 14 is the copper coin stent of embodiments of the present invention and the molding product figures of plastic cement Molding.
Attached drawing identifier declaration：
10th, insulating body 11, reflector
12nd, cloudy surface structure 13, isolation strip
14th, hook face 15, recessing groove
16th, 20, four conducting terminals of boss
21st, the first conducting terminal 211, the first pad
212nd, the first leg 22, the second conducting terminal
221st, the second pad 222, the second leg
223rd, resigning recess portion 23, third conducting terminal
231st, third pad 232, third leg
24th, the 4th conducting terminal 241, the 4th pad
242nd, the 4th leg 243, widen protrusion
25th, hopper 26, offset are hooked
27th, fried dough twist point 28, adjutage
29th, the pre- broken line 31 of bending, the first LED wafer
311st, the first gold thread 312, the second gold thread
32nd, the second LED wafer 321, third gold thread
322nd, the 4th gold thread 33, third LED wafer
331st, the 5th gold thread.
Specific embodiment
It please refers to shown in Fig. 4 to Figure 14, that show the concrete structures of the preferred embodiments of the invention, are that a kind of Inner hides
Formula ultra high-definition LED includes an insulating body 10 and four conducting terminals 20, four conducting terminals 20 per LED finished product
With the integrated produced by insert molding of insulating body 10.
Wherein, as shown in fig. 6, the insulating body 10 be square structure, length and width dimensions for 1 ± 0.08mm*1 ±
0.08mm has breached the limit of 1.5 mm * 1.5mm of traditional structure, this design can make this product make small spacing LED
During display screen, can reach high definition and show, high refreshing frequency, seamless spliced, good heat dissipation, it is convenient for disassembly and assembly the features such as, even if
Relatively far away from distance viewing display screen, display picture is super clear, and flicker free is also without granular sensation.
As shown in fig. 6, there is a reflector 11 in the top of insulating body 10 is recessed；The reflector 11 is oval cup.Its
The width W2 of the width W1 ＞ left and right directions of upper and lower directions, enables the luminescent wafer of tri- kinds of primary colours of RGB in upper and lower as far as possible
To lining up close to straight line, to ensure illumination effect.
As shown in fig. 7, the outer surface of the insulating body 10 is cloudy surface structure 12, this design is more when can prevent product from shining
Remaining light forms shade or macula lutea by light-transmitting plate bounce back to impinge upon product surface.
The conducting terminal 20 is respectively the first conducting terminal 21, the second conducting terminal 22, third conducting terminal the 23, the 4th
Conducting terminal 24.First conducting terminal has the first pad 211 and the first leg 212, which has second
221 and second leg 222 of pad, the third conducting terminal have third pad 231 and third leg 232, the 4th conducting end
Son has the 4th pad 241 and the 4th leg 242, and each pad flushes in the bottom of a cup of reflector, is concealed in after each leg reflexed absolutely
Built-in LED is formed on the bottom of edge ontology.Built-in leg, which is advantageous in that, will not occupy additional welding space, it is only necessary to
It is welded in the magnitude range of LED 1.0*1.0mm itself, ensures to form display screen with minimum spacing.
Wherein, the first pad 211 is distributed in the upper left of reflector, and the second pad 221 is distributed in a left side for reflector 11
Lower direction, third pad 231 are distributed in the lower right of reflector, and the 4th pad 241 is distributed in the upper right of reflector；With
And first pad 211 extends beyond to the right the right side of upper and lower central axis Y, the third pad 231 extends beyond to the left
The left side of upper and lower central axis Y, makes the first pad 211 and third pad 231 have alternating share about upper and lower central axis Y, makes
It obtains and as far as possible does the first pad and the second pad greatly in so small reflector, meeting die bond requirement while making as far as possible
The chip of tri- kinds of primary colours of RGB is close to upper and lower central axis Y.
First pad 211, the second pad 221, third pad 231, the 4th pad 241 have isolation strip each other
13, wherein the upside of the first pad 211 is bent to form resigning recess portion 223 in the form of camber line to the left；4th pad 241
Upside is bent to form in the form of camber line to the left widens protrusion 243, so as to which the 4th pad has enough spaces to be used to weld gold thread.
Wherein, first pad 211 and third pad 231 are die bond pads, 221 and the 4th pad of the second pad
241 be gold thread pad, and the area ＞ second of the 4th pads 241 of area ＞ of the area ＞ thirds pad 231 of the first pad 211 is welded
The area of disk 221.First pad 211 is equipped with the first LED wafer 31 and the second LED wafer 32, the third pad 231
Third LED wafer 33 is equipped with, wherein, the first LED wafer 31 has the first gold thread 311 and the second gold thread 312 is respectively welded in the
One pad 211, the 4th pad 241；Second LED wafer 32 has 321 and the 4th gold thread 322 of third gold thread to be respectively welded in the second weldering
221 and the 4th pad 241 of disk；Third LED wafer 33 has the 5th gold thread 331 to be welded in the 4th pad 241.In this way, area is maximum
The first pad 211 be mounted with two luminescent wafers, and the larger third pad 231 of area is mounted with single luminescent wafer, separately
The smaller pad of outer two areas is only used for bonding wire, takes full advantage of space, is reasonably distributed, compact-sized.
As shown in fig. 7, first LED wafer 31, the second LED wafer 32, third LED wafer 33 are respectively red, green, blue
Three-color light-emitting chip.For example, putting in order to be：First LED wafer 31 be green emitting chip, the second LED wafer 32
For blue emitting dies, third LED wafer 33 is emitting red light chip, realizes full-color light-emitting effect.
As shown in figure 8, the both sides of the junction of each pad and corresponding leg of four conducting terminals 20 are both provided with
The hook hopper 25 of arc concave shape, after four conducting terminals and insulating body one produced by insert molding, the hook hopper stings tight insulation
The plastic cement of ontology, and four corner indents in reflector 11 that four pads correspondences hook hopper 25 cause colloid to expose body card
Hook surface 14（See Fig. 6 and Fig. 7）.The plastic cement of each conducting terminal and insulating body 10 can be prevented by hooking the design of hopper herein
After Molding moldings, occur loosening and obscission.And the exposing in hook face 14 is imitated with confirming that pad catches on the functional of plastic cement
Fruit, while leg bending situation can be observed, it is ensured that bottom of a cup is uneven during each leg bending of product or deformation occurs, and increases simultaneously
The impermeable ability of product.
As shown in figure 11, it is equipped with offset at the end angle of second pad 221, third pad 231, the 4th pad 241
26.The design of break difference structure can prevent pad to be molded the phenomenon that hair generation bottom of a cup is uneven with insulating body Molding, enhance simultaneously
The impermeable ability of product solves the problems, such as that client occurs chip in die bond bonding wire and places injustice.And showing such as Figure 12, the
Point 27 is spent in the equal scutching in the back side of one pad, the second pad, third pad, the 4th pad, when each pad and insulating body are integrally inlayed
After embedding molding, each offset and fried dough twist point 27 sting the plastic cement of tight insulating body.It can enhance in the back side scutching flower point 27 of each pad
The bond strength of pad and the plastic cement of insulating body prevents pad from loosening problem occur with plastic cement, increases the antiseepage of this product
Saturating ability, and it is susceptible to the problem of bottom of a cup is uneven after also improving pad and plastic cement Molding.
The left and right sides lower end of the insulating body 10 is equipped with recessing groove 15, between the pad and leg of each conducting terminal
With adjutage 28, each adjutage 28 is accommodated in recessing groove, and adjutage 28 is vertically connected between pad and leg, this
Sample, the four sides of product will conceal without prominent adjutage 28 in each adjutage 28, accomplish LED display
It is seamless spliced.And thinned between adjutage 28 and pad, leg and form the pre- broken line 29 of bending, this design, which solves, prolongs
Plastic cement is pulled when semi-girder 28 and leg bending and plastic cement is caused to loosen problem with pad, while exceed week after improving leg bending
Side influences the problems such as product illumination effect.
As shown in figure 5, the bottom surface of the insulating body 10 is set, there are four boss 16, are isolated between adjacent two leg.It will
The scolding tin of each leg separates, and prevents short circuit phenomenon.It is welded simultaneously using built-in leg, this structure is punched by copper coin
It after molding, then is molded and is combined together with plastic cement Molding, such processing method is at low cost, efficient, and molding and welding are held
Easily.
As shown in Figure 13 and Figure 14, be the present invention LED forming process.First punch forming goes out conductive branch on copper coin
Frame is placed with 28 row's stents on every copper coin, up and down each 14 row, this structure is different from the structure of traditional 20 rows, and the design can
The cost of product is reduced, improves the production capacity of product.Whole LED support is placed in injection mold again, with the molding sides of Molding
Formula makes stent be inlayed together with insulating body, subsequently also to carry out severing, bending process to the stent of every LED, be formed single
The LED finished products of grain.
In conclusion the design focal point of the present invention is, and LED support of this product for RGB types, size 1.0mm*
1.0mm, tolerance are ± 0.08mm, have 4 pads in the reflector of this product, wherein the first pad 211 and third pad 231
For die bond pad, two die bond pads center line Y above and below product is in cross structure, allows chip in die bond, close center line, with
Left and right reflecting surface is avoided to block light efficiency, in addition, welded since the chip of tri- kinds of primary colours of RGB is connect by gold with the 4th pad 241,
In 211 upper end of the first pad setting resigning recess portion 223, corresponding 4th pad, 241 upside, which is formed, widens protrusion 243, such curved
Folded structure causes chip closer to center line, to ensure product illumination effect.
The above described is only a preferred embodiment of the present invention, be not intended to limit the scope of the present invention,
Therefore any subtle modifications, equivalent variations and modifications that every technical spirit according to the present invention makees above example, still
Belong in the range of technical solution of the present invention.
Claims (10)
1. a kind of Inner concealeds ultra high-definition LED, it is characterised in that：Including
One insulating body（10）, the insulating body is square structure, and length and width dimensions are 1 ± 0.08mm*1 ± 0.08mm,
There is a reflector in the top of insulating body is recessed（11）；
Four conducting terminals（20）, four conducting terminals and insulating body one produced by insert molding, the conducting terminal are distinguished
For the first conducting terminal (21), the second conducting terminal (22), third conducting terminal (23), the 4th conducting terminal (24), this first
Conducting terminal has the first pad (211) and the first leg (212), and second conducting terminal is with the second pad (221) and the
Two legs (222), the third conducting terminal have third pad (231) and third leg (232）, the 4th conducting terminal has
4th pad（241）With the 4th leg（242）, each pad flushes in the bottom of a cup of reflector, insulation is concealed in after each leg reflexed
The bottom of ontology；
Wherein, the first pad（211）It is distributed in the upper left of reflector, the second pad（221）It is distributed in the lower-left of reflector
Direction, third pad（231）It is distributed in the lower right of reflector, the 4th pad（241）It is distributed in the upper right of reflector；
And first pad（211）Central axis up and down is extended beyond to the right（Y）Right side, the third pad（231）To the left
Extend beyond central axis up and down（Y）Left side, make the first pad（211）With third pad（231）About upper and lower central axis
（Y）There is alternating share；
First pad（211）, the second pad（221）, third pad（231）, the 4th pad（241）Each other have every
From band（13）, wherein the first pad（211）Upside resigning recess portion is bent to form in the form of camber line to the left（223）；Described
Four pads（241）Upside be bent to form in the form of camber line widen protrusion to the left（243）.
2. Inner concealeds ultra high-definition LED according to claim 1, it is characterised in that：First pad（211）It is welded with third
Disk（231）It is die bond pad, second pad（221）With the 4th pad（241）It is gold thread pad, the first pad（211）'s
Area ＞ third pads（231）The 4th pads of area ＞（241）The second pads of area ＞（221）Area.
3. Inner concealeds ultra high-definition LED according to claim 1 or 2, it is characterised in that：The reflector（11）For ellipse
Cup, the width W2 of the width W1 ＞ left and right directions of upper and lower directions.
4. Inner concealeds ultra high-definition LED according to claim 2, it is characterised in that：First pad（211）It is equipped with the
One LED wafer（31）With the second LED wafer（32）, the third pad（231）It is equipped with third LED wafer（33）, wherein, the
One LED wafer（31）There is the first gold thread（311）With the second gold thread（312）It is respectively welded in the first pad（211）, the 4th pad
（241）；Second LED wafer（32）There is third gold thread（321）With the 4th gold thread（322）It is respectively welded in the second pad（221）With
4th pad（241）；Third LED wafer（33）There is the 5th gold thread（331）It is welded in the 4th pad（241）.
5. Inner concealeds ultra high-definition LED according to claim 4, it is characterised in that：First LED wafer（31）, second
LED wafer（32）, third LED wafer（33）Respectively red, green, blue three-color light-emitting chip.
6. Inner concealeds ultra high-definition LED according to claim 1, it is characterised in that：Each pad of four conducting terminals and
The both sides of the junction of corresponding leg are both provided with the hook hopper of arc concave shape（25）, when four conducting terminals and insulating body
After integrated produced by insert molding, the plastic cement for hooking hopper and stinging tight insulating body, and four pads correspond to and hook hopper（25）Reflective
Four corner indents of cup (11) cause colloid to expose body hook face（14）.
7. Inner concealeds ultra high-definition LED according to claim 1, it is characterised in that：Second pad, third pad,
Offset is equipped at the end angle of four pads（26）And first pad, the second pad, third pad, the back side of the 4th pad are equal
Point is spent in scutching（27）, after each pad and insulating body one produced by insert molding, each offset and fried dough twist point（27）Sting tight insulation originally
The plastic cement of body.
8. Inner concealeds ultra high-definition LED according to claim 1, it is characterised in that：The insulating body（10）Left and right two
Side lower end is equipped with recessing groove（15）, there is adjutage between the pad and leg of each conducting terminal（28）, each adjutage（28）
It is accommodated in recessing groove（15）It is interior, and adjutage（28）It is vertically connected between pad and leg, in adjutage（28）With pad,
It is thinned between leg and forms the pre- broken line of bending（29）.
9. Inner concealeds ultra high-definition LED according to claim 1, it is characterised in that：The insulating body（10）Bottom surface set
There are four boss（16）, it is isolated between adjacent two leg.
10. Inner concealeds ultra high-definition LED according to claim 1, it is characterised in that：The insulating body（10）Outer surface
For cloudy surface structure.
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| CN201810089251.XA CN108258107B (en) | 2018-01-30 | 2018-01-30 | Built-in ultra-high definition LED |
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| CN201810089251.XA CN108258107B (en) | 2018-01-30 | 2018-01-30 | Built-in ultra-high definition LED |
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| CN108258107B CN108258107B (en) | 2024-03-01 |
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| CN109411588A (en) * | 2018-12-11 | 2019-03-01 | 深圳市晶族科技有限公司 | It is a kind of to mount LED element, transparent display screen mould group and its production method in parallel |
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| CN108258107B (en) | 2024-03-01 |
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