CN108254674A - For the integrated measurement system of smart mobile phone chips - Google Patents
For the integrated measurement system of smart mobile phone chips Download PDFInfo
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- CN108254674A CN108254674A CN201810154561.5A CN201810154561A CN108254674A CN 108254674 A CN108254674 A CN 108254674A CN 201810154561 A CN201810154561 A CN 201810154561A CN 108254674 A CN108254674 A CN 108254674A
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- 238000005259 measurement Methods 0.000 title claims abstract description 29
- 238000012360 testing method Methods 0.000 claims abstract description 77
- 239000000758 substrate Substances 0.000 claims abstract description 27
- 230000007246 mechanism Effects 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims description 10
- 230000000694 effects Effects 0.000 claims description 7
- 238000009434 installation Methods 0.000 claims description 6
- 239000000463 material Substances 0.000 abstract description 29
- 238000012545 processing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
Abstract
The present invention discloses a kind of integrated measurement system for smart mobile phone chips, including substrate, left movable plate, right movable plate, front mounting plate, installing plate afterwards, it is respectively arranged in front mounting plate, conveyer belt on the inside of installing plate afterwards, test carrier plate and the mechanism for testing right over test carrier plate, the mechanism for testing further comprises driving cylinder, fixed plate, the movable plate being set to immediately below fixed plate, lower adjustable plate and lower platen, it is fixedly connected between the fixed plate and substrate by least 2 guide posts, plate upper surface is evenly arranged at least ten pressure head cylinder in this, pressure head corresponding with pressure head cylinder is uniformly embedded on the lower platen, the piston rod of at least ten pressure head cylinder is each passed through middle plate and is fixedly connected with pressure head.The present invention can respectively be adjusted the distance between front and rear installing plate from the left and right sides of rear installing plate by the setting of screw and sliding rail, for various sizes of material strip, equipment be made to have good versatility.
Description
Technical field
The present invention relates to a kind of integrated measurement system for smart mobile phone chips is related to, belong to automation processing technology
Field.
Background technology
In fingerprint chip manufacture process, it is often necessary to conduction property test is carried out to assembled chip, due to
Fingerprint chip is more accurate, easily by external force or electrostatic damage, as can during feeding is tested, reduces artificial work as far as possible
Sequence link, it will help reduce wafer damage rate, be also beneficial to promote loading efficiency.
Invention content
The object of the present invention is to provide a kind of integrated measurement systems for smart mobile phone chips, this is used for smart mobile phone
The integrated measurement system of chip, can be respectively from the left and right sides of rear installing plate to front and rear peace by the setting of screw and sliding rail
The distance between loading board is adjusted, and for various sizes of material strip, equipment is made to have good versatility.
In order to achieve the above objectives, the technical solution adopted by the present invention is：A kind of integrated test for smart mobile phone chips
Test system including substrate, left movable plate, right movable plate, front mounting plate, rear installing plate, is respectively arranged in front mounting plate, rear installation
Conveyer belt, test carrier plate on the inside of plate and the mechanism for testing right over test carrier plate；
The left movable plate, right movable plate are arranged in parallel in upper surface of base plate both sides, and the front mounting plate, rear installing plate is parallel sets
It puts, front mounting plate, rear installing plate and left movable plate, right movable plate are vertically arranged, the front mounting plate, rear installing plate respective one
End respectively with left movable plate upper surface install connect, the front mounting plate, the respective other end of rear installing plate respectively with right activity
The installation connection of plate upper surface, the test carrier plate are installed on upper surface of base plate and positioned at left movable plate, right movable plate and preceding installations
Between plate, rear installing plate；
The base lower surface both sides are respectively arranged with a cylinder, this cylinder is located at left movable plate, right movable plate lower section respectively, this
The piston rod of cylinder is each passed through substrate and is fixedly connected with left movable plate, right movable plate, for driving left movable plate, right movable plate
It moves up and down；
The both ends of the front mounting plate are fixedly connected respectively with left movable plate, right movable plate, the both ends difference of the rear installing plate
It is flexibly connected by the left sliding rail, the right sliding rail that are arranged in parallel with left movable plate, right movable plate, the front mounting plate, rear installing plate
Between connected by the left screw that is arranged in parallel, right screw, the front end of the left screw passes through the through-hole of front mounting plate, the left side
The rear end of screw passes through the through-hole of rear installing plate and the nut by being set in left screw is fixedly connected with rear installing plate；
The front end of the right screw passes through the through-hole of front mounting plate, and the rear end of the right screw passes through the through-hole of rear installing plate and leads to
It crosses and is set in the nut of left screw and is fixedly connected with rear installing plate, the front end of the left screw is installed with left gear, described
The front end of right screw is installed with right gear, passes through a transmission band connection between this left gear, right gear；
A baffle cylinder is vertically arranged between the test carrier plate and right movable plate, the piston rod upper surface of this baffle cylinder connects
A baffle is connected to, this baffle can move up and down under the driving of baffle cylinder, and the baffle front end is located above test carrier plate；
The mechanism for testing further comprises driving cylinder, fixed plate, the movable plate being set to immediately below fixed plate, lower adjustable plate
And lower platen, it is fixedly connected between the fixed plate and substrate by least 2 guide posts, at least 2 guide posts are each passed through work for this
In the guide post through-hole at movable plate both ends, the driving cylinder is installed on fixed plate upper surface and the piston rod of cylinder is driven to pass through and fixes
Plate is simultaneously fixedly connected with movable plate upper surface, and the lower adjustable plate is connect with movable plate lower surface, and the lower adjustable plate is with pushing
Plate in being provided with one between plate, plate upper surface is evenly arranged at least ten pressure head cylinder in this, uniformly embedding on the lower platen
There is pressure head corresponding with pressure head cylinder, the piston rod of at least ten pressure head cylinder, which is each passed through middle plate and is fixed with pressure head, to be connected
It connects.
Further improved scheme is as follows in above-mentioned technical proposal：
1. in said program, the left movable plate is equipped with a left backgauge cylinder close to the side of test carrier plate, this left backgauge gas
Cylinder is fixedly connected by a switching piece with left movable plate.
2. in said program, the side of the right movable plate far from test carrier plate is equipped with a right backgauge cylinder, this right gear
Material cylinder is fixedly connected by a switching piece with right movable plate.
3. in said program, the rear installing plate is flexibly connected by left slider with left sliding rail.
4. in said program, the rear installing plate is flexibly connected by right sliding block with right sliding rail.
5. in said program, several spring columns are evenly arranged on the lower platen.
6. in said program, each pressure head cylinder side surface is mounted on an air pressure test instrument, this air pressure test instrument point
It is not connect with being installed on the air gauge of upper surface of base plate.
7. in said program, the number of at least 2 guide posts is 4, respectively positioned at four corners of fixed plate.
8. in said program, bearing is provided between the guide post through-hole of the guide post and movable plate.
Due to the utilization of above-mentioned technical proposal, the present invention has following advantages compared with prior art：
1st, the present invention is used for the integrated measurement system of smart mobile phone chips, and wherein plate upper surface is evenly arranged at least ten pressure
Head cylinder, uniformly embedded with pressure head corresponding with pressure head cylinder, the piston rod of at least ten pressure head cylinder on the lower platen
It is each passed through middle plate and is fixedly connected with pressure head, the setting of at least ten pressure head cylinder, it is ensured that each pressure head corresponds to one
A cylinder, instead of former full page push mechanism for testing, coordinate air gauge, can the independent pressure to each pressure head adjust
Section, to ensure each pressure head to the accurate of chip pressure, so as to enhance the precision to chip testing；Secondly, lower platen
On be evenly arranged with several spring columns, the setting of spring column can then play the work of buffering during cylinder is pushed with dynamic head
With guarantee pressure head is uniform to the pressure stability for being tested chip, and the needs used time for meeting test protects chip not because pressure is excessive
And it is damaged.
2nd, the present invention is used for the integrated measurement system of smart mobile phone chips, and base lower surface both sides are respectively arranged with one
Cylinder, this cylinder are located at left movable plate, right movable plate lower section respectively, and the piston rod of this cylinder is each passed through substrate and left activity
Plate, right movable plate are fixedly connected, and for left movable plate, right movable plate to be driven to move up and down, by the setting of cylinder, pass through driving
Movable plate moves up and down and front mounting plate, the conveyer belt on the inside of rear installing plate is driven to move up and down, and will be transmitted when transmit material strip
Band rises, and after material strip is sent to above test microscope carrier, conveyer belt is put down, material strip is dropped down onto in test microscope carrier naturally, will be in transport
Material strip and test microscope carrier between certain height difference is set, material strip lower surface is avoided to contact generation with test microscope carrier during transport
Contact friction etc. influences the precision of test or generates abrasion to material strip.
3rd, the present invention is used for the integrated measurement system of smart mobile phone chips, and the both ends of installing plate are respectively by parallel thereafter
Left sliding rail, the right sliding rail of setting are flexibly connected with left movable plate, right movable plate, are passed through between the front mounting plate, rear installing plate
Left screw, the right screw being arranged in parallel connect, can be respectively from the left and right sides of rear installing plate by the setting of screw and sliding rail
The distance between front and rear installing plate is adjusted, for various sizes of material strip, makes equipment that there is good versatility；Its
Secondary, the front end of left screw is installed with left gear, and the front end of the right screw is installed with right gear, this left gear,
Pass through a transmission band connection, the setting of left and right gear and transmission belt so that the rotation of left and right screw remains between right gear
Unanimously, screw rotates simultaneously when installing plate spacing before and after adjusting or so, with the distance of installing plate both sides movement after guarantee always
It is consistent, so that remaining parallel between front and rear installing plate, without further calibrating and adjusting, the saving time carries
High working efficiency, while also avoid individually adjusting left screw or right screw and occurring stuck or cause the feelings such as rear installing plate deformation
Condition extends service life of equipment.
4th, the present invention is used for the integrated measurement system of smart mobile phone chips, vertical between test carrier plate and right movable plate
A baffle cylinder is provided with, the piston rod upper surface of this baffle cylinder is connected with a baffle, this baffle can drive in baffle cylinder
Dynamic lower to move up and down, the baffle front end is located at test carrier plate top, the setting of baffle cylinder and baffle, can will be on conveyer belt
Material strip block so that material strip is placed exactly in above test carrier plate, so as to ensure that each material strip is accurately transported to test carrier plate
Test position, so as to ensure test precision；In addition, the setting of baffle cylinder, then when needed rise baffle, material is blocked
Band when not used by baffle retracted downward, does not influence being normally carried out for other processes.
5th, the present invention is used for the integrated measurement system of smart mobile phone chips, and left movable plate is close to the side of test carrier plate
One left backgauge cylinder is installed, this left backgauge cylinder is fixedly connected by a switching piece with left movable plate, and right movable plate is far from survey
The side of examination support plate is equipped with a right backgauge cylinder, this right backgauge cylinder is fixedly connected by a switching piece with right movable plate, gear
Expect the setting of cylinder, when the next step has material strip processing, material strip to be processed is jacked up, prevents previous block band
It is processing, the situation of latter block band feeding again, to ensure the precision of processing.
Description of the drawings
Attached drawing 1 is used for the integrated measurement system structure diagram of smart mobile phone chips for the present invention；
Attached drawing 2 is mechanism for testing structure diagram in integrated measurement system of the present invention；
Attached drawing 3 is used for the integrated measurement system partial structural diagram of smart mobile phone chips for the present invention；
Attached drawing 4 is the present invention for structural representation of air cylinder in the integrated measurement system of smart mobile phone chips；
Attached drawing 5 is baffle structural representation of air cylinder in integrated measurement system of the present invention；
Attached drawing 6 is used for the integrated measurement system partial structural diagram of smart mobile phone chips for the present invention.
In the figures above：1st, substrate；201st, left movable plate；202nd, right movable plate；301st, front mounting plate；302nd, rear installation
Plate；4th, conveyer belt；5th, test carrier plate；6th, cylinder；8th, mechanism for testing；1a, driving cylinder；2a, fixed plate；3a, movable plate；4a、
Upper adjustable plate；5a, lower adjustable plate；6a, lower platen；7a, guide post；13a, middle plate；14a, pressure head cylinder；15a, pressure head；16a, gas
Pressure tester；17a, air gauge；18a, spring column；81st, left sliding rail；82nd, right sliding rail；91st, left screw；92nd, right screw；101st, it is left
Gear；102nd, right gear；11st, transmission belt；121st, left slider；122nd, right sliding block；35th, baffle cylinder；36th, baffle；131st, left gear
Expect cylinder；132nd, right backgauge cylinder.
Specific embodiment
Embodiment 1：A kind of integrated measurement system for smart mobile phone chips, including substrate 1, left movable plate 201, the right side
Movable plate 202, front mounting plate 301, rear installing plate 302, the transmission for being respectively arranged in front mounting plate 301,302 inside of rear installing plate
Mechanism for testing 8 with 4, test carrier plate 5 and right over test carrier plate 5；
The left movable plate 201, right movable plate 202 are arranged in parallel in 1 upper surface both sides of substrate, the front mounting plate 301, rear peace
Loading board 302 is arranged in parallel, and front mounting plate 301, rear installing plate 302 and left movable plate 201, right movable plate 202 are vertically arranged, described
Front mounting plate 301,302 respective one end of rear installing plate install with left 201 upper surface of movable plate connect respectively, the front mounting plate
301st, the rear 302 respective other end of installing plate is installed with right 202 upper surface of movable plate connect respectively, and the test carrier plate 5 is installed
In 1 upper surface of substrate and between left movable plate 201, right movable plate 202 and front mounting plate 301, rear installing plate 302；
The 1 lower surface both sides of substrate are respectively arranged with a cylinder 6, this cylinder 6 is located at left movable plate 201, right movable plate respectively
202 lower sections, the piston rod of this cylinder 6 is each passed through substrate 1 and is fixedly connected with left movable plate 201, right movable plate 202, for driving
Move left movable plate 201, right movable plate 202 moves up and down；
The both ends of the front mounting plate 301 are fixedly connected respectively with left movable plate 201, right movable plate 202, the rear installing plate
302 both ends are connected respectively by the left sliding rail 81, the right sliding rail 82 that are arranged in parallel with left movable plate 201,202 activity of right movable plate
It connects, is connected between the front mounting plate 301, rear installing plate 302 by the left screw 91, the right screw 92 that are arranged in parallel, the left side
The front end of screw 91 passes through the through-hole of front mounting plate 301, and the rear end of the left screw 91 passes through the through-hole of rear installing plate 302 and leads to
It crosses and is set in the nut of left screw 91 and is fixedly connected with rear installing plate 302；
The front end of the right screw 92 passes through the through-hole of front mounting plate 301, and the rear end of the right screw 92 passes through rear installing plate 302
Through-hole and the nut by being set in left screw 91 be fixedly connected with rear installing plate 302, the front end of the left screw 91 is fixed
Left gear 101 is installed, the front end of the right screw 92 is installed with right gear 102, this left gear 101, right gear 102 it
Between connected by a transmission belt 11；
A baffle cylinder 35, the piston rod of this baffle cylinder 35 are vertically arranged between the test carrier plate 5 and right movable plate 202
Upper surface is connected with a baffle 36, this baffle 36 can move up and down under the driving of baffle cylinder 35,36 front end of the baffle position
Above test carrier plate 5；
The mechanism for testing 8 further comprises driving cylinder 1a, fixed plate 2a, the movable plate being set to immediately below fixed plate 2a
3a, lower adjustable plate 5a and lower platen 6a, are fixedly connected, this is extremely between the fixed plate 2a and substrate 1 by least 2 guide post 7a
Few 2 guide post 7a are each passed through in the guide post through-hole at movable plate 3a both ends, and the driving cylinder 1a is installed on fixed plate 2a upper tables
The piston rod of face and driving cylinder 1a pass through fixed plate 2a and are fixedly connected with movable plate 3a upper surfaces, the lower adjustable plate 5a with
Movable plate 3a lower surfaces connect, plate 13a in being provided with one between the lower adjustable plate 5a and lower platen 6a, plate 13a upper tables in this
Face is evenly arranged at least ten pressure head cylinder 14a, the lower platen 6a uniformly embedded with pressure head corresponding with pressure head cylinder 14a
15a, the piston rod of at least ten pressure head cylinder 14a are each passed through middle plate 13a and are fixedly connected with pressure head 15a.
Above-mentioned left movable plate 201 is equipped with a left backgauge cylinder 131, this left backgauge cylinder close to the side of test carrier plate 5
131 are fixedly connected by a switching piece with left movable plate 201；Above-mentioned side of the right movable plate 202 far from test carrier plate 5 is equipped with
One right backgauge cylinder 132, this right backgauge cylinder 132 are fixedly connected by a switching piece with right movable plate 202；Installing plate after above-mentioned
302 are flexibly connected by left slider 121 with left sliding rail 81；Installing plate 302 passes through right sliding block 122 and right 82 activity of sliding rail after above-mentioned
Connection.
Embodiment 2：A kind of integrated measurement system for smart mobile phone chips, including substrate 1, left movable plate 201, the right side
Movable plate 202, front mounting plate 301, rear installing plate 302, the transmission for being respectively arranged in front mounting plate 301,302 inside of rear installing plate
Mechanism for testing 8 with 4, test carrier plate 5 and right over test carrier plate 5；
The left movable plate 201, right movable plate 202 are arranged in parallel in 1 upper surface both sides of substrate, the front mounting plate 301, rear peace
Loading board 302 is arranged in parallel, and front mounting plate 301, rear installing plate 302 and left movable plate 201, right movable plate 202 are vertically arranged, described
Front mounting plate 301,302 respective one end of rear installing plate install with left 201 upper surface of movable plate connect respectively, the front mounting plate
301st, the rear 302 respective other end of installing plate is installed with right 202 upper surface of movable plate connect respectively, and the test carrier plate 5 is installed
In 1 upper surface of substrate and between left movable plate 201, right movable plate 202 and front mounting plate 301, rear installing plate 302；
The 1 lower surface both sides of substrate are respectively arranged with a cylinder 6, this cylinder 6 is located at left movable plate 201, right movable plate respectively
202 lower sections, the piston rod of this cylinder 6 is each passed through substrate 1 and is fixedly connected with left movable plate 201, right movable plate 202, for driving
Move left movable plate 201, right movable plate 202 moves up and down；
The both ends of the front mounting plate 301 are fixedly connected respectively with left movable plate 201, right movable plate 202, the rear installing plate
302 both ends are connected respectively by the left sliding rail 81, the right sliding rail 82 that are arranged in parallel with left movable plate 201,202 activity of right movable plate
It connects, is connected between the front mounting plate 301, rear installing plate 302 by the left screw 91, the right screw 92 that are arranged in parallel, the left side
The front end of screw 91 passes through the through-hole of front mounting plate 301, and the rear end of the left screw 91 passes through the through-hole of rear installing plate 302 and leads to
It crosses and is set in the nut of left screw 91 and is fixedly connected with rear installing plate 302；
The front end of the right screw 92 passes through the through-hole of front mounting plate 301, and the rear end of the right screw 92 passes through rear installing plate 302
Through-hole and the nut by being set in left screw 91 be fixedly connected with rear installing plate 302, the front end of the left screw 91 is fixed
Left gear 101 is installed, the front end of the right screw 92 is installed with right gear 102, this left gear 101, right gear 102 it
Between connected by a transmission belt 11；
A baffle cylinder 35, the piston rod of this baffle cylinder 35 are vertically arranged between the test carrier plate 5 and right movable plate 202
Upper surface is connected with a baffle 36, this baffle 36 can move up and down under the driving of baffle cylinder 35,36 front end of the baffle position
Above test carrier plate 5；
The mechanism for testing 8 further comprises driving cylinder 1a, fixed plate 2a, the movable plate being set to immediately below fixed plate 2a
3a, lower adjustable plate 5a and lower platen 6a, are fixedly connected, this is extremely between the fixed plate 2a and substrate 1 by least 2 guide post 7a
Few 2 guide post 7a are each passed through in the guide post through-hole at movable plate 3a both ends, and the driving cylinder 1a is installed on fixed plate 2a upper tables
The piston rod of face and driving cylinder 1a pass through fixed plate 2a and are fixedly connected with movable plate 3a upper surfaces, the lower adjustable plate 5a with
Movable plate 3a lower surfaces connect, plate 13a in being provided with one between the lower adjustable plate 5a and lower platen 6a, plate 13a upper tables in this
Face is evenly arranged at least ten pressure head cylinder 14a, the lower platen 6a uniformly embedded with pressure head corresponding with pressure head cylinder 14a
15a, the piston rod of at least ten pressure head cylinder 14a are each passed through middle plate 13a and are fixedly connected with pressure head 15a.
Several spring column 18a are evenly arranged on above-mentioned lower platen 6a；Above-mentioned each pressure head cylinder 14a sides are mounted on one
Air pressure test instrument 16, this air pressure test instrument 16a are connect respectively with being installed on the air gauge 17a of 1 upper surface of substrate；Above-mentioned at least 2
The number of root guide post 7a is 4, respectively positioned at four corners of fixed plate 2a；The guide post of above-mentioned guide post 7a and movable plate 3a leads to
Bearing is provided between hole.
During using above-mentioned integrated measurement system for smart mobile phone chips, pass through setting at least ten pressure head cylinder
It puts, it is ensured that each pressure head corresponds to a cylinder, pushed mechanism for testing instead of former full page, coordinates air gauge, can be only
The vertical pressure to each pressure head is adjusted, to ensure each pressure head to the accurate of chip pressure, so as to enhance pair
The precision of chip testing；Secondly, the setting of spring column can then play the work of buffering during cylinder is pushed with dynamic head
With guarantee pressure head is uniform to the pressure stability for being tested chip, and the needs used time for meeting test protects chip not because pressure is excessive
And it is damaged；Again, by the setting of cylinder, front mounting plate is driven, in rear installing plate by the way that movable plate is driven to move up and down
The conveyer belt of side moves up and down, and rises conveyer belt when transmitting material strip, after material strip is sent to above test microscope carrier, by conveyer belt
It puts down, material strip is dropped down onto in test microscope carrier naturally, will be set certain height difference between material strip in transit and test microscope carrier, is avoided material strip
Lower surface contacts generation contact friction etc. with test microscope carrier during transport, influences the precision of test or generates mill to material strip
Damage；Again, by the setting of screw and sliding rail, can respectively from the left and right sides of rear installing plate between front and rear installing plate away from
From being adjusted, for various sizes of material strip, make equipment that there is good versatility；Again, left and right gear and transmission belt
Setting so that the rotation of left and right screw is always consistent, before and after adjusting install plate spacing when or so screw rotate simultaneously,
It is always consistent with the distance that installing plate both sides after guarantee are moved, so that remain parallel between front and rear installing plate,
It without further calibration and adjusts, saves the time and improve working efficiency, while also avoid individually adjusting left screw or right screw
And there is stuck or so that situations such as rear installing plate deforms, extension service life of equipment；Again, baffle cylinder and baffle are set
It puts, the material strip on conveyer belt can be blocked so that material strip is placed exactly in above test carrier plate, so as to ensure that each material strip is accurate
The test position of test carrier plate is really transported to, so as to ensure the precision of test；In addition, the setting of baffle cylinder, then when needed
Baffle is risen, blocks material strip, when not used by baffle retracted downward, does not influence being normally carried out for other processes；Again, backgauge gas
When the next step has material strip processing, material strip to be processed is jacked up for the setting of cylinder, is preventing previous block band
Processing, the situation of latter block band feeding again, to ensure the precision of processing.
The above embodiments merely illustrate the technical concept and features of the present invention, and its object is to allow person skilled in the art
Scholar can understand present disclosure and implement according to this, and it is not intended to limit the scope of the present invention.It is all according to the present invention
The equivalent change or modification that Spirit Essence is made, should be covered by the protection scope of the present invention.
Claims (9)
1. a kind of integrated measurement system for smart mobile phone chips, it is characterised in that：Including substrate（1）, left movable plate
（201）, right movable plate（202）, front mounting plate（301）, rear installing plate（302）, be respectively arranged in front mounting plate（301）, rear peace
Loading board（302）The conveyer belt of inside（4）, test carrier plate（5）With positioned at test carrier plate（5）The mechanism for testing of surface（8）；
The left movable plate（201）, right movable plate（202）It is arranged in parallel in substrate（1）Upper surface both sides, the front mounting plate
（301）, rear installing plate（302）It is arranged in parallel, front mounting plate（301）, rear installing plate（302）With left movable plate（201）, right activity
Plate（202）It is vertically arranged, the front mounting plate（301）, rear installing plate（302）Respective one end respectively with left movable plate（201）
Upper surface installation connection, the front mounting plate（301）, rear installing plate（302）The respective other end respectively with right movable plate（202）
Upper surface installation connection, the test carrier plate（5）It is installed on substrate（1）Upper surface is simultaneously located at left movable plate（201）, right movable plate
（202）And front mounting plate（301）, rear installing plate（302）Between；
The substrate（1）Lower surface both sides are respectively arranged with a cylinder（6）, this cylinder（6）It is located at left movable plate respectively（201）、
Right movable plate（202）Lower section, this cylinder（6）Piston rod be each passed through substrate（1）With left movable plate（201）, right movable plate
（202）It is fixedly connected, for driving left movable plate（201）, right movable plate（202）It moves up and down；
The front mounting plate（301）Both ends respectively with left movable plate（201）, right movable plate（202）It is fixedly connected, pacifies after described
Loading board（302）The both ends left sliding rail by being arranged in parallel respectively（81）, right sliding rail（82）With left movable plate（201）, right activity
Plate（202）Flexible connection, the front mounting plate（301）, rear installing plate（302）Between pass through the left screw that is arranged in parallel（91）、
Right screw（92）Connection, the left screw（91）Front end pass through front mounting plate（301）Through-hole, the left screw（91）After
It holds across rear installing plate（302）Through-hole and by being set in left screw（91）Nut and rear installing plate（302）It is fixedly connected；
The right screw（92）Front end pass through front mounting plate（301）Through-hole, the right screw（92）Rear end pass through after pacify
Loading board（302）Through-hole and by being set in left screw（91）Nut and rear installing plate（302）It is fixedly connected, the left screw
（91）Front end be installed with left gear（101）, the right screw（92）Front end be installed with right gear（102）, this
Left gear（101）, right gear（102）Between pass through a transmission belt（11）Connection；
The test carrier plate（5）With right movable plate（202）Between be vertically arranged with a baffle cylinder（35）, this baffle cylinder（35）
Piston rod upper surface be connected with a baffle（36）, this baffle（36）It can be in baffle cylinder（35）Driving is lower to move up and down, institute
State baffle（36）Front end is located at test carrier plate（5）Top；
The mechanism for testing（8）Further comprise driving cylinder（1a）, fixed plate（2a）, be set to fixed plate（2a）Underface
Movable plate（3a）, lower adjustable plate（5a）And lower platen（6a）, the fixed plate（2a）With substrate（1）Between led by least 2
Column（7a）It is fixedly connected, this at least 2 guide post（7a）It is each passed through movable plate（3a）In the guide post through-hole at both ends, the driving gas
Cylinder（1a）It is installed on fixed plate（2a）Upper surface and driving cylinder（1a）Piston rod pass through fixed plate（2a）And and movable plate
（3a）Upper surface is fixedly connected, the lower adjustable plate（5a）With movable plate（3a）Lower surface connects, the lower adjustable plate（5a）With
Lower platen（6a）Between be provided with one in plate（13a）, plate in this（13a）Upper surface is evenly arranged at least ten pressure head cylinder
（14a）, the lower platen（6a）It is upper to be uniformly embedded with and pressure head cylinder（14a）Corresponding pressure head（15a）, at least ten pressure head
Cylinder（14a）Piston rod be each passed through middle plate（13a）And and pressure head（15a）It is fixedly connected.
2. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：The left work
Movable plate（201）Close to test carrier plate（5）Side one left backgauge cylinder is installed（131）, this left backgauge cylinder（131）Pass through one
Switching piece and left movable plate（201）It is fixedly connected.
3. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：The right work
Movable plate（202）Far from test carrier plate（5）Side one right backgauge cylinder is installed（132）, this right backgauge cylinder（132）Pass through one
Switching piece and right movable plate（202）It is fixedly connected.
4. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：Pacify after described
Loading board（302）Pass through left slider（121）With left sliding rail（81）Flexible connection.
5. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：Pacify after described
Loading board（302）Pass through right sliding block（122）With right sliding rail（82）Flexible connection.
6. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：The pushing
Plate（6a）On be evenly arranged with several spring columns（18a）.
7. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：It is described each
Pressure head cylinder（14a）Side is mounted on an air pressure test instrument（16）, this air pressure test instrument（16a）Respectively with being installed on substrate
（1）The air gauge of upper surface（17a）Connection.
8. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：It is described at least
2 guide posts（7a）Number for 4, respectively positioned at fixed plate（2a）Four corners.
9. the integrated measurement system according to claim 1 for smart mobile phone chips, it is characterised in that：The guide post
（7a）With movable plate（3a）Guide post through-hole between be provided with bearing.
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| CN108254674B (en) | 2024-03-29 |
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