CN215578488U - Chip mounting device - Google Patents
Chip mounting device Download PDFInfo
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- CN215578488U CN215578488U CN202121368967.7U CN202121368967U CN215578488U CN 215578488 U CN215578488 U CN 215578488U CN 202121368967 U CN202121368967 U CN 202121368967U CN 215578488 U CN215578488 U CN 215578488U
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- chip mounting
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Abstract
The utility model discloses a chip mounting device, which comprises a substrate and two clamping units arranged on the substrate, wherein each clamping unit comprises a clamping plate and a driving unit, the driving unit comprises a plate seat fixed on the substrate and a guide rod in clearance fit with the plate seat, the clamping plate is fixed at the end part of the guide rod, a spring is also arranged between the upper clamping plate of each clamping unit and the plate seat, a chip clamping space is enclosed between the two clamping plates, the chip mounting device also comprises an antifriction plate fixed on the upper surface of the substrate, and the top surface of the antifriction plate is used as a chip supporting surface of the chip clamping space: the chip clamping space is positioned right above the antifriction plate. The device can effectively improve the mounting and positioning speed and precision of the semiconductor chip by reducing the friction force between the chip and the substrate.
Description
Technical Field
The utility model relates to the technical field of chip processing equipment, in particular to a chip mounting device.
Background
In the manufacturing process of electronic parts, the following operations are involved: the semiconductor chip is sealed with resin to obtain a sealed solid, and then the wiring layer is bonded to the sealed solid. When a wiring layer is provided on a semiconductor chip, the accuracy of the position of the wiring layer on a sealing body needs to be considered.
In the structural design of the existing chip mounter, the structure is generally set as follows: the packaging device comprises a substrate, a clamp arranged on the substrate and a movable mounting head, wherein after clamping of a packaging body is completed through the clamp, mounting is completed through the mounting head.
When the semiconductor chips are pasted in batches, the sealing solid clamped on the clamp is accurately positioned in space, and the efficiency and the precision of the batch pasting can be effectively improved.
SUMMERY OF THE UTILITY MODEL
The utility model provides a chip mounting device, aiming at the technical problems that when a batch of semiconductor chips are mounted, a sealing solid body clamped on a clamp is accurately positioned in space, and the batch mounting efficiency and precision can be effectively improved. The device can effectively improve the mounting and positioning speed and precision of the semiconductor chip by reducing the friction force between the chip and the substrate.
Aiming at the problems, the chip mounting device provided by the utility model solves the problems through the following technical key points: the utility model provides a chip pastes dress device, includes the base plate and installs two clamping unit on the base plate, and each clamping unit all includes splint and drive unit, drive unit including be fixed in the base plate on the board seat, with board seat clearance fit's guide arm, splint are fixed in the tip of guide arm, still are provided with the spring between each clamping unit punch holder and the board seat, enclose into chip centre gripping space between two splint, still including being fixed in the wear plate on the base plate upper surface, the top surface of wear plate is as the chip holding surface in chip centre gripping space: the chip clamping space is positioned right above the antifriction plate.
In the prior art, the structural design of the clamping unit on the substrate includes the following chip clamping schemes: each driving unit comprises a plate seat, a guide rod and a spring, the guide rod is in clearance fit with the plate seat, the clamping plates are fixed at the end parts of the guide rods, a chip clamping space is enclosed between the two clamping plates, when no sealing solid is arranged in the chip clamping space, the width of the clamping space is smaller than that of the sealing solid under the action of the spring (the spring is in a free state), and after the sealing solid is arranged in the chip clamping space, the position of the sealing solid in the space is restrained by the elasticity of the spring. In the mounting process of the semiconductor chip, the mounting head moves in the space, so that the wiring layer is positioned and attached on the sealing body.
When the scheme is specifically designed, only the elastic deformation capacity of the spring is considered and utilized in the prior art, so that the chips within a certain size range can be reliably clamped in the chip clamping space, and then the movable mounting head is utilized to adapt to the position of the specific chip to complete the mounting. The prior art does not consider the effect of the friction between the chip and the substrate on the final resting position of the chip.
Aiming at the problem of the final stop position of the chip, the scheme provides a concrete surface mounting device technical scheme which is based on a spring clamping scheme and solves the problem that the friction force influences the final stop position of the chip. In the concrete structural design, through setting up to set up the antifriction plate on the base plate, and chip centre gripping space is located the antifriction plate directly over, like this, in the centre gripping process of completion to the chip, utilize the antifriction plate to support the chip and reduce the resistance that the chip moved on the base plate through above antifriction plate, can make the final stop position of chip only receive the influence of spring lectotype as far as possible, through weakening chip location interference factor promptly, reach the effect that effectively promotes semiconductor chip subsides dress positioning speed and precision.
In particular, it is preferable to set: the clamping units on the two sides of the chip clamping space are generally designed with the same parameters, namely the movement resistance of the clamping plates is the same, and the elastic performance of the springs is the same, so that the chip can stay at the middle positions of the two clamping units as far as possible.
The further scheme is as follows:
as a convenient material of drawing, and can provide the technical scheme of low coefficient of friction holding surface, the design is: the antifriction plate is a copper plate or a polytetrafluoroethylene plate.
As a method for forming a pneumatic support for the bottom of a chip by introducing stirring gas in the chip positioning process, the influence of friction on the chip positioning is partially or completely eliminated, and the method is designed as follows: the upper surface of the antifriction plate is also provided with a plurality of strip-shaped grooves which extend along the width direction of the chip clamping space. In this scheme, relate to and span many bar grooves for the chip, through injecting into gas in to the bar groove of going to the market, utilize the gravity of gaseous part or whole balanced chip, reach the purpose of part or whole elimination frictional force to chip location influence.
As a technical scheme that parts on the device have long-term matching precision to ensure the accuracy of the position of a chip through antifriction, the device adopts: the plate seat is also provided with a sliding bearing, and a bearing hole of the sliding bearing is used as a matching hole of the guide rod on the plate seat.
As a convenient technical scheme of changing the sliding bearing, adopt: the sliding bearing is detachably connected to the plate seat through an elastic retainer ring or connecting threads for the shaft.
For the atress of optimizing the guide arm and reduce the influence of frictional force to splint motion, further promote the position of splint motion and stop the precision, adopt: all the clamping plates are supported on the antifriction plate through antifriction sliding blocks fixed on the clamping plates respectively.
For avoiding the spring freely kick-back to cause the chip impaired, adopt: the drive unit further comprises a damping device for achieving spring damped rebound. In particular use, the damping device can be activated to achieve the damping movement of the splint throughout the entire movement or at the end of the movement.
As a technical scheme that the structure is simple and the damping size is convenient to adjust, the following steps are adopted: the damping device comprises an electromagnet, and the electromagnet realizes spring damping rebound through an adsorption guide rod. When the clamp is used specifically, the clamp can be adsorbed to the side surface of the guide rod, and the damping motion of the clamp plate is realized by utilizing the friction force between the side surface of the guide rod and the damping device.
In order to further protect the chip, the following steps are adopted: splint include the foundatin plate and paste the paster on the foundatin plate, the paster is rubber gasket and paster setting on the adjacent side of two splint.
The utility model has the following beneficial effects:
aiming at the problem of the final stop position of the chip, the scheme provides a concrete surface mounting device technical scheme which is based on a spring clamping scheme and solves the problem that the friction force influences the final stop position of the chip. In the concrete structural design, through setting up to set up the antifriction plate on the base plate, and chip centre gripping space is located the antifriction plate directly over, like this, in the centre gripping process of completion to the chip, utilize the antifriction plate to support the chip and reduce the resistance that the chip moved on the base plate through above antifriction plate, can make the final stop position of chip only receive the influence of spring lectotype as far as possible, through weakening chip location interference factor promptly, reach the effect that effectively promotes semiconductor chip subsides dress positioning speed and precision.
Drawings
Fig. 1 is a front view of an embodiment of a chip mounting apparatus according to the present disclosure.
The reference numbers in the drawings are respectively: 1. the anti-friction device comprises a base plate, 2, a damping device, 3, a sliding bearing, 4, a plate seat, 5, a spring, 6, a clamping plate, 61, a paster, 62, a base plate, 63, an anti-friction sliding block, 7, a pasting head, 8, a guide rod, 9 and an anti-friction plate.
Detailed Description
The present invention will be described in further detail with reference to the following examples, but the present invention is not limited to the following examples:
example 1:
as shown in fig. 1, a chip mounting device, including base plate 1 and two clamping units installed on base plate 1, each clamping unit all includes splint 6 and drive unit, drive unit including be fixed in base plate 1 on board seat 4, with board seat 4 clearance fit's guide arm 8, splint 6 are fixed in the tip of guide arm 8, still are provided with spring 5 between each clamping unit punch holder 6 and the board seat 4, enclose into chip centre gripping space between two splint 6, still including being fixed in the antifriction plate 9 on base plate 1 upper surface, the top surface of antifriction plate 9 is as the chip holding surface in chip centre gripping space: the chip holding space is located directly above the wear plate 9.
In the prior art, the structural design of the clamping unit on the substrate 1 includes the following chip clamping schemes: each driving unit comprises a plate seat 4, a guide rod 8 and a spring 5, the guide rod 8 is in clearance fit with the plate seat 4, the clamping plates 6 are fixed at the ends of the guide rod 8, a chip clamping space is enclosed between the two clamping plates 6, when a sealing solid is not arranged in the chip clamping space, the width of the clamping space is smaller than that of the sealing solid under the action of the spring 5 (the spring 5 is in a free state), and after the sealing solid is arranged in the chip clamping space, the position of the sealing solid in the space is restrained by the elasticity of the spring 5. In the mounting process of the semiconductor chip, the mounting head 7 moves in the space, so that the wiring layer is positioned and attached to the sealing body.
In the specific design of the scheme, only the elastic deformation capacity of the spring 5 is considered in the prior art, so that the chips within a certain size range can be reliably clamped in the chip clamping space, and then the movable mounting head 7 is used for adapting to the specific chip position to complete the mounting 61. The prior art does not consider the effect of the friction between the chip and the substrate 1 on the final resting position of the chip.
Aiming at the problem of the final stop position of the chip, the scheme provides a concrete surface mounting device technical scheme which is based on a spring 5 clamping scheme and solves the problem that the friction force influences the final stop position of the chip. In the concrete structural design, through setting up to set up antifriction plate 9 on base plate 1, and chip centre gripping space is located antifriction plate 9 directly over, like this, in the centre gripping process of completion to the chip, utilize antifriction plate 9 to support the chip and reduce the resistance of chip motion on base plate 1 through above antifriction plate 9, can make the final stop position of chip only receive the influence of spring 5 lectotype as far as possible, through weakening chip location interference factor promptly, reach the effect that effectively promotes semiconductor chip subsides dress positioning speed and precision.
In particular, it is preferable to set: the clamping units on the two sides of the chip clamping space are generally designed with the same parameters, namely the movement resistance of the clamping plate 6 is the same, and the elastic performance of the spring 5 is the same, so that the chip can stay at the middle position of the two clamping units as far as possible.
The further scheme is as follows:
as a convenient material of drawing, and can provide the technical scheme of low coefficient of friction holding surface, the design is: the antifriction plate 9 is a copper plate or a polytetrafluoroethylene plate.
As a method for forming a pneumatic support for the bottom of a chip by introducing stirring gas in the chip positioning process, the influence of friction on the chip positioning is partially or completely eliminated, and the method is designed as follows: the upper surface of the antifriction plate 9 is also provided with a plurality of strip-shaped grooves which extend along the width direction of the chip clamping space. In this scheme, relate to and span many bar grooves for the chip, through injecting into gas in to the bar groove of going to the market, utilize the gravity of gaseous part or whole balanced chip, reach the purpose of part or whole elimination frictional force to chip location influence.
As a technical scheme that parts on the device have long-term matching precision to ensure the accuracy of the position of a chip through antifriction, the device adopts: the plate seat 4 is also provided with a sliding bearing 3, and a bearing hole of the sliding bearing 3 is used as a matching hole of the guide rod 8 on the plate seat 4.
As a convenient technical solution for replacing the sliding bearing 3, the following are adopted: the sliding bearing 3 is detachably connected to the plate base 4 through a circlip for a shaft or a connecting thread.
For the atress of optimizing guide arm 8 and reducing the influence of frictional force to splint 6 motion, further promote the position that splint 6 moved and stop the precision, adopt: each clamping plate 6 is supported on the wear plate 9 by means of a respective fixed wear-reducing slide 63.
For avoiding 5 free rebounds of spring to cause the chip impaired, adopt: the drive unit further comprises a damping device 2, the damping device 2 being adapted to achieve a damped rebound of the spring 5. In particular use, the damping device 2 may be activated to effect a damped movement of the splint 6 throughout the entire movement or at the end of the movement of the splint 6.
As a technical scheme that the structure is simple and the damping size is convenient to adjust, the following steps are adopted: the damping device 2 comprises an electromagnet, and the electromagnet realizes damping rebound of the spring 5 through an adsorption guide rod 8. When the damping device is used specifically, the side surface of the guide rod 8 can be adsorbed, and the damping motion of the clamping plate 6 can be realized by utilizing the friction force between the side surface of the guide rod 8 and the damping device 2.
In order to further protect the chip, the following steps are adopted: splint 6 includes foundatin plate 62 and pastes the paster 61 on foundatin plate 62, paster 61 is rubber gasket and paster 61 and sets up on the adjacent side of two splint 6.
The foregoing is a more detailed description of the present invention in connection with specific preferred embodiments thereof, and it is not intended that the specific embodiments of the present invention be limited to these descriptions. For those skilled in the art to which the utility model pertains, other embodiments that do not depart from the gist of the utility model are intended to be within the scope of the utility model.
Claims (9)
1. The utility model provides a chip pastes dress device, includes base plate (1) and installs two clamping unit on base plate (1), and each clamping unit all includes splint (6) and drive unit, drive unit including be fixed in base plate (1) on board seat (4), with board seat (4) clearance fit's guide arm (8), splint (6) are fixed in the tip of guide arm (8), still are provided with spring (5) between each clamping unit punch holder (6) and board seat (4), enclose into chip centre gripping space between two splint (6), its characterized in that, still including being fixed in antifriction board (9) on base plate (1) upper surface, the top surface of antifriction board (9) is as the chip holding surface in chip centre gripping space: the chip clamping space is positioned right above the antifriction plate (9).
2. A chip mounting apparatus according to claim 1, wherein said wear plate (9) is a copper plate or a teflon plate.
3. A chip mounting apparatus according to claim 1, wherein the upper surface of the wear plate (9) is further provided with a plurality of strip grooves each extending along the width direction of the chip holding space.
4. A chip mounting apparatus according to claim 1, wherein the plate holder (4) is further provided with a sliding bearing (3), and a bearing hole of the sliding bearing (3) is used as a matching hole of the guide rod (8) on the plate holder (4).
5. A chip mounting device according to claim 4, wherein the slide bearing (3) is detachably connected to the plate base (4) by means of a circlip for a shaft or a connecting thread.
6. A chip mounting apparatus according to claim 1, wherein each clamping plate (6) is supported on the wear plate (9) by a respective fixed wear-reducing slide (63).
7. A chip mounting device according to claim 1, wherein said drive unit further comprises a damping device (2), said damping device (2) being adapted to achieve a spring (5) damped springback.
8. A chip mounting device according to claim 7, characterized in that the damping device (2) comprises an electromagnet, and the electromagnet realizes damping rebound of the spring (5) through an adsorption guide rod (8).
9. A chip mounting device according to claim 1, wherein said clamping plates (6) comprise a base plate (62) and a patch (61) adhered to the base plate (62), said patch (61) being rubber gasket and said patch (61) being arranged on adjacent sides of the two clamping plates (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121368967.7U CN215578488U (en) | 2021-06-19 | 2021-06-19 | Chip mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121368967.7U CN215578488U (en) | 2021-06-19 | 2021-06-19 | Chip mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN215578488U true CN215578488U (en) | 2022-01-18 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121368967.7U Active CN215578488U (en) | 2021-06-19 | 2021-06-19 | Chip mounting device |
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| Country | Link |
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| CN (1) | CN215578488U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939451A (en) * | 2022-06-29 | 2022-08-26 | 苏州百源基因技术有限公司 | Urine advances a kind microcurrent control chip clamping device |
| CN115410962A (en) * | 2022-11-01 | 2022-11-29 | 四川九华光子通信技术有限公司 | Blue membrane of crystal plate pastes dress device |
-
2021
- 2021-06-19 CN CN202121368967.7U patent/CN215578488U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114939451A (en) * | 2022-06-29 | 2022-08-26 | 苏州百源基因技术有限公司 | Urine advances a kind microcurrent control chip clamping device |
| CN115410962A (en) * | 2022-11-01 | 2022-11-29 | 四川九华光子通信技术有限公司 | Blue membrane of crystal plate pastes dress device |
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