CN108230933A - A kind of LED display Integral mask based on encapsulating technology - Google Patents
A kind of LED display Integral mask based on encapsulating technology Download PDFInfo
- Publication number
- CN108230933A CN108230933A CN201810175659.9A CN201810175659A CN108230933A CN 108230933 A CN108230933 A CN 108230933A CN 201810175659 A CN201810175659 A CN 201810175659A CN 108230933 A CN108230933 A CN 108230933A
- Authority
- CN
- China
- Prior art keywords
- integral mask
- encapsulating
- colloid
- led lamp
- lamp bead
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
Abstract
The present invention relates to LED display fields, more particularly to a kind of LED display Integral mask based on encapsulating technology.Including several LED lamp beads for carrying the PCB module group substrates of IC and being attached to by SMT modes on PCB module group substrates, wherein, gap and LED light bead surface between PCB module group substrates front, LED lamp bead carry out encapsulating, and Integral mask is formed after the colloid poured into is cured.The present invention solves the problems, such as the SMD encapsulation aberration of display screen and piece aberration, improves the contrast of display screen, while also improve the anticollision ability of display screen instead of Conventional masks technology.
Description
Technical field
The present invention relates to LED display fields, more particularly to a kind of LED display integration based on encapsulating technology
Mask.
Background technology
With the gradual development in display market, until since 2016, indoor small spacing market becomes the master of display area
Miscarriage product, it is contemplated that in following 5 years, the explosive growth stage can be in.At present, based on small spacing market is mainly encapsulated with SMD,
Mainly there is the mainstreams package dimension such as 1515,1010,0808.For existing SMD encapsulation technologies realize display screen be primarily present with
Lower problem:
1st, aberration problem.Between different modules, there are aberration and splicing seams can also influence display screen entirety aberration.It is in addition, existing
Have in the LED lamp bead colloid that technology realizes and be added to black dose or dumb light powder, after upper screen, there are aberration for lamp bead color.
2nd, since small spacing lamp bead is small, the anticollision ability of lamp bead is poor, display screen carry or using when be easy to cause it is blind
Point.
In addition, at this stage COB forms due to production technology, technical maturity it is not high, can not still replace SMD lamp beads encapsulate,
Therefore within 3 years futures, the indoor small clearance display screen of SMD packing forms remains as the mainstream finished product in market.
Invention content
The present invention provides a kind of LED display integration based on encapsulating technology to solve above-mentioned technological deficiency
Mask instead of Conventional masks technology, solves the problems, such as the SMD encapsulation aberration of display screen and piece aberration, improves display screen
Contrast, while also improve the anticollision ability of display screen.
The technical scheme is that;A kind of LED display Integral mask based on encapsulating technology, including carrying IC's
PCB module group substrates and several LED lamp beads being attached to by SMT modes on PCB module group substrates, wherein, to PCB module group substrates
Gap and LED light bead surface between front, LED lamp bead carry out encapsulating, and one is formed after the colloid poured into is cured
Change mask.
On the basis of existing technology, to the processing of display screen module encapsulating, Integral mask, Integral mask pair are formed
LED lamp bead gap be filled up completely forming lamp bead gap glue-line, and covering is carried out to LED light bead surface and forms lamp bead surface glue
Layer carries out totally-enclosed protection to LED lamp bead, improves the anticollision ability of display screen;It is carried out simultaneously by the compounding ingredients to encapsulating
Processing improves display screen contrast, can eliminate the display screen flower screen that lamp bead aberration is brought.
Preferably, when display screen matrix spacing is 0.5mm-2.0mm, LED lamp bead size is 0.5mm-1.5mm.It keeps
The problem of gap between LED lamp bead is small, reduction piece aberration, improves contrast.
Preferably, LED lamp bead includes the transparent colloid encapsulating structure based on QFN structures or the transparent adhesive tape based on TOP structures
Body encapsulating structure.It realizes that LED lamp bead encapsulation carries out water white transparency encapsulation, reduces the aberration of display screen.
Preferably, LED lamp bead colloid transmissivity is 70%-95%.
Preferably, it is formed by curing the colloid of Integral mask to be allocated by water white transparency glue+black dose, the ratio of allotment
Ranging from 1:0.01—1:0.1, the water white transparency glue includes epoxy resin, silicones, the mixing of silica gel one or more of which
It forms, hardness is 50D-80D after hardening.Black dose of raising display screen contrast is called in mask encapsulating, lamp bead aberration can be eliminated
The display screen flower screen brought.
Preferably, be formed by curing Integral mask colloid can be low-temperature setting adhesive or high temperature setting glue, by mold into
After type completes semi-solid preparation, then cured.
Preferably, in one layer of glue-line of PCB module group substrates front embedding, gap is filled up completely between LED lamp bead, with
And LED light bead surface carries out covering a thin layer of colloid, LED lamp bead surface covering rubber body thickness is 0.02mm-0.2mm.
Preferably, the colloid surface of LED lamp bead includes plane or roughening matte surface or patterned surface processing.
The forming process step of Integral mask is;
1st, LED lamp bead is attached to by SMT modes on the PCB module group substrates with IC;
2nd, mask casting glue is allocated;
3rd, the display screen module after patch is put into mold and carries out encapsulating;
4th, colloid cures.
The beneficial effects of the invention are as follows;The present invention realizes the integration of indoor small clearance display screen module using encapsulating technology
Mask solves the problems, such as the aberration between small clearance display screen module, and it is the extra small spacing of below 1.5mm that can realize display spacing
The mask covering of display screen, solves Conventional masks technology and covers problem to extra small clearance display screen;Meanwhile to LED lamp bead into
Row all standing is protected, and improves the waterproof ability of display screen and anticollision ability.
Description of the drawings
Fig. 1 is the display screen module side structure schematic diagram that the prior art is realized.
Fig. 2 is the side structure schematic diagram of the display screen module of the present invention.
In figure;Integral mask 1, LED lamp bead surface size 1-1, LED lamp bead gap glue-line 1-2,
LED lamp bead 2, PCB module group substrates 3.
Specific embodiment
The attached figures are only used for illustrative purposes and cannot be understood as limitating the patent;It is attached in order to more preferably illustrate the present embodiment
Scheme certain components to have omission, zoom in or out, do not represent the size of actual product;To those skilled in the art,
The omitting of some known structures and their instructions in the attached drawings are understandable.Being given for example only property of position relationship described in attached drawing
Explanation, it is impossible to be interpreted as the limitation to this patent.
Embodiment 1:
Such as figure one is the display screen module that the prior art is realized.The display screen that this structure is realized can exist apparent in the process of splicing
Piece problem, piece can cause display aberration, in addition, LED lamp bead 2, which encapsulates, can also form aberration.Also, not to LED
Lamp bead 2 is protected, and in handling process, is be easy to cause LED lamp bead 2 and is damaged, and is formed and is shown blind spot.
To advanced optimize said program, as described in Figure 2, in the technology of the prior art, positive to PCB module group substrates 3,
Gap and 2 surface of LED lamp bead between LED lamp bead 2 carry out encapsulating, and display screen module is made to form Integral mask 1;LED light
Pearl 2 is welded on the surface of PCB module group substrates 3 by tin cream welding technique, and 2 size of LED lamp bead can be 0.5mm-1.5mm, upper screen
Display spacing afterwards can be 0.5mm-2.0mm.The Integral mask 1 be filled up completely forming LED to 2 gap of LED lamp bead
Lamp bead gap glue-line 1-2;Covering is carried out to 2 surface of LED lamp bead and forms LED lamp bead surface size 1-1, the LED light bead surface
The thickness of glue-line 1-1 is 0.02mm-0.2mm, and colloid surface includes plane or roughening matte surface or patterned surface processing, right
LED lamp bead 2 carries out totally-enclosed protection, improves the anticollision ability of display screen.
The display screen lamp bead that the prior art is realized need to carry out Darkening process, for improving the contrast of display screen.Due to LED
There is the problems such as difference batch, stable processing technique in lamp bead 2, there are aberration to avoid, and causes display screen aberration serious.The present invention
It can realize that the encapsulation of LED lamp bead 2 carries out water white transparency encapsulation using Integral mask 1, LED lamp bead 2 is included based on the saturating of QFN structures
Gelatin body encapsulating structure or the transparent colloid encapsulating structure based on TOP structures, 2 colloid transmissivity of LED lamp bead are 70%-95%;Gu
Change and form the colloid of Integral mask 1 as black colloid, allocated by water white transparency glue+black dose, the proportional region of allotment
It is 1:0.01—1:0.1, water white transparency glue includes epoxy resin, silicones, silica gel one or more of which and mixes, and hardens
Hardness is 50D-80D afterwards.Black dose of raising display screen contrast is called in mask encapsulating, can eliminate what 2 aberration of LED lamp bead was brought
Display screen flower screen.
In the present embodiment, carrying out the colloid of encapsulating can also be allocated by water white transparency colloid+other pigments, color
Depending on the ratio of glue and other pigments.
The present invention realizes the Integral mask of indoor small clearance display screen module using encapsulating technology, solves small spacing and shows
Aberration problem between display screen module can realize that display spacing is covered for the mask of the extra small clearance display screens of below 1.5mm, solution
Conventional masks technology of having determined covers problem to extra small clearance display screen;Meanwhile all standing protection is carried out to LED lamp bead 2, it improves
The waterproof ability of display screen and anticollision ability.
Obviously, the above embodiment of the present invention be only to clearly illustrate example of the present invention, and not be pair
The restriction of embodiments of the present invention.For those of ordinary skill in the art, may be used also on the basis of the above description
To make other variations or changes in different ways.There is no necessity and possibility to exhaust all the enbodiments.It is all this
All any modification, equivalent and improvement made within the spirit and principle of invention etc., should be included in the claims in the present invention
Protection domain within.
Claims (8)
1. a kind of LED display Integral mask based on encapsulating technology, including carrying the PCB module group substrates of IC and passing through
SMT modes are attached to several LED lamp beads on PCB module group substrates, which is characterized in that PCB module group substrates front, LED lamp bead
Between gap and LED light bead surface carry out encapsulating, form Integral mask after the colloid poured into is cured.
2. a kind of LED display Integral mask based on encapsulating technology according to claim 1, which is characterized in that when
When display screen matrix spacing is 0.5mm-2.0mm, LED lamp bead size is 0.5mm-1.5mm.
A kind of 3. LED display Integral mask based on encapsulating technology according to claim 1, which is characterized in that institute
It states LED lamp bead and includes the transparent colloid encapsulating structure based on QFN structures or the transparent colloid encapsulating structure based on TOP structures.
A kind of 4. LED display Integral mask based on encapsulating technology according to claim 3, which is characterized in that institute
LED lamp bead colloid transmissivity is stated as 70%-95%.
5. a kind of LED display Integral mask based on encapsulating technology according to claim 1, which is characterized in that Gu
Change and form the colloid of Integral mask and allocated by water white transparency glue+black dose, the proportional region of allotment is 1:0.01—1:
0.1, the water white transparency glue includes epoxy resin, silicones, silica gel one or more of which and mixes, and hardness is after hardening
50D-80D。
A kind of 6. LED display Integral mask based on encapsulating technology according to claim 1, which is characterized in that institute
State be formed by curing Integral mask colloid can be low-temperature setting adhesive or high temperature setting glue, be molded and complete semi-solid preparation
Afterwards, then cured.
A kind of 7. LED display Integral mask based on encapsulating technology according to claim 1, which is characterized in that institute
The colloid thickness for stating the covering of LED light bead surface is 0.02mm-0.2mm.
A kind of 8. LED display Integral mask based on encapsulating technology according to claim 7, which is characterized in that institute
The colloid surface for stating LED lamp bead includes plane or roughening matte surface or patterned surface processing.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810175659.9A CN108230933A (en) | 2018-03-02 | 2018-03-02 | A kind of LED display Integral mask based on encapsulating technology |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810175659.9A CN108230933A (en) | 2018-03-02 | 2018-03-02 | A kind of LED display Integral mask based on encapsulating technology |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108230933A true CN108230933A (en) | 2018-06-29 |
Family
ID=62662616
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810175659.9A Pending CN108230933A (en) | 2018-03-02 | 2018-03-02 | A kind of LED display Integral mask based on encapsulating technology |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108230933A (en) |
Cited By (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109155118A (en) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | Show the preparation process and display screen of screen cover |
CN109192748A (en) * | 2018-09-26 | 2019-01-11 | 利亚德光电股份有限公司 | LED display module |
CN109616026A (en) * | 2019-01-30 | 2019-04-12 | 华域视觉科技(上海)有限公司 | Improve the method and LED display of LED static state screen display effect |
CN109637383A (en) * | 2019-01-18 | 2019-04-16 | 深圳市洲明科技股份有限公司 | LED display module and its treatment process and processing equipment |
CN109872645A (en) * | 2019-03-19 | 2019-06-11 | 深圳市洲明科技股份有限公司 | Waterproof LED display screen |
CN110299083A (en) * | 2019-06-12 | 2019-10-01 | 厦门强力巨彩光电科技有限公司 | A kind of LED display glue-pouring method |
CN110808244A (en) * | 2019-10-29 | 2020-02-18 | 长春希龙显示技术有限公司 | LED display unit surface packaging method based on modeling technology |
CN111019579A (en) * | 2019-12-26 | 2020-04-17 | 苏州晶台光电有限公司 | Thermochromic packaging adhesive and preparation method and application thereof |
CN111326081A (en) * | 2020-03-20 | 2020-06-23 | 深圳视爵光旭电子有限公司 | Preparation method of novel display screen external member and special clamp |
CN111416030A (en) * | 2020-04-01 | 2020-07-14 | 苏州晶台光电有限公司 | Processing method for whitening of splicing seams between COB modules |
CN111477121A (en) * | 2020-05-26 | 2020-07-31 | 深圳市洲明科技股份有限公司 | Manufacturing method of L ED display screen |
WO2020252657A1 (en) * | 2019-06-18 | 2020-12-24 | 深圳金立翔视效科技有限公司 | Display device, and display system |
CN112150936A (en) * | 2019-06-28 | 2020-12-29 | 深圳市洲明科技股份有限公司 | LED display module and glue filling method thereof |
CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
CN113724607A (en) * | 2020-05-26 | 2021-11-30 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
CN115294862A (en) * | 2022-05-27 | 2022-11-04 | 深圳爱克莱特科技股份有限公司 | Display screen |
Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2833895Y (en) * | 2005-07-25 | 2006-11-01 | 刘振亮 | Grating stripe LED luminotron and grating stripe luminous surface display module |
CN101325018A (en) * | 2008-07-01 | 2008-12-17 | 深圳市锐拓显示技术有限公司 | High-contrast LED display module group |
CN201667346U (en) * | 2010-01-18 | 2010-12-08 | 佛山市国星光电股份有限公司 | Surface-picked and placed LED apparatus and display screen using same |
CN102122463A (en) * | 2011-03-24 | 2011-07-13 | 李海涛 | Chip LED (light emitting diode) display screen and manufacturing method thereof |
CN103208239A (en) * | 2013-04-01 | 2013-07-17 | 长春希达电子技术有限公司 | LED (light emitting diode) display unit panel with shading films |
CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
CN103531108A (en) * | 2013-10-30 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display screen and packaging method thereof |
CN107731121A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of double-deck glue LED display and its processing method |
CN107731122A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of gelatin LED display and its processing method |
-
2018
- 2018-03-02 CN CN201810175659.9A patent/CN108230933A/en active Pending
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN2833895Y (en) * | 2005-07-25 | 2006-11-01 | 刘振亮 | Grating stripe LED luminotron and grating stripe luminous surface display module |
CN101325018A (en) * | 2008-07-01 | 2008-12-17 | 深圳市锐拓显示技术有限公司 | High-contrast LED display module group |
CN201667346U (en) * | 2010-01-18 | 2010-12-08 | 佛山市国星光电股份有限公司 | Surface-picked and placed LED apparatus and display screen using same |
CN102122463A (en) * | 2011-03-24 | 2011-07-13 | 李海涛 | Chip LED (light emitting diode) display screen and manufacturing method thereof |
CN103208239A (en) * | 2013-04-01 | 2013-07-17 | 长春希达电子技术有限公司 | LED (light emitting diode) display unit panel with shading films |
CN203300159U (en) * | 2013-07-09 | 2013-11-20 | 深圳市华海诚信电子显示技术有限公司 | Chip-on-board packaging technology based light-emitting diode (LED) display screen |
CN103531108A (en) * | 2013-10-30 | 2014-01-22 | 广东威创视讯科技股份有限公司 | Light-emitting diode (LED) display screen and packaging method thereof |
CN107731121A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of double-deck glue LED display and its processing method |
CN107731122A (en) * | 2017-11-28 | 2018-02-23 | 深圳市秀狐科技有限公司 | A kind of gelatin LED display and its processing method |
Cited By (24)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109155118A (en) * | 2018-07-20 | 2019-01-04 | 深圳市雷迪奥视觉技术有限公司 | Show the preparation process and display screen of screen cover |
WO2020014958A1 (en) * | 2018-07-20 | 2020-01-23 | 深圳市雷迪奥视觉技术有限公司 | Display screen mask preparation process and display screen |
US11345095B2 (en) | 2018-07-20 | 2022-05-31 | Roe Visual Co., Ltd. | Manufacturing process of display screen cover |
CN109192748A (en) * | 2018-09-26 | 2019-01-11 | 利亚德光电股份有限公司 | LED display module |
CN109637383A (en) * | 2019-01-18 | 2019-04-16 | 深圳市洲明科技股份有限公司 | LED display module and its treatment process and processing equipment |
CN109637383B (en) * | 2019-01-18 | 2022-01-14 | 深圳市洲明科技股份有限公司 | LED display module and processing technology and processing equipment thereof |
CN109616026A (en) * | 2019-01-30 | 2019-04-12 | 华域视觉科技(上海)有限公司 | Improve the method and LED display of LED static state screen display effect |
CN109872645A (en) * | 2019-03-19 | 2019-06-11 | 深圳市洲明科技股份有限公司 | Waterproof LED display screen |
CN109872645B (en) * | 2019-03-19 | 2021-09-24 | 深圳市洲明科技股份有限公司 | Waterproof LED display screen |
CN110299083A (en) * | 2019-06-12 | 2019-10-01 | 厦门强力巨彩光电科技有限公司 | A kind of LED display glue-pouring method |
CN110299083B (en) * | 2019-06-12 | 2021-10-22 | 厦门强力巨彩光电科技有限公司 | Glue pouring method for LED display screen |
WO2020252657A1 (en) * | 2019-06-18 | 2020-12-24 | 深圳金立翔视效科技有限公司 | Display device, and display system |
CN112150936A (en) * | 2019-06-28 | 2020-12-29 | 深圳市洲明科技股份有限公司 | LED display module and glue filling method thereof |
CN112150936B (en) * | 2019-06-28 | 2022-12-27 | 深圳市洲明科技股份有限公司 | LED display module and glue filling method thereof |
CN110808244A (en) * | 2019-10-29 | 2020-02-18 | 长春希龙显示技术有限公司 | LED display unit surface packaging method based on modeling technology |
CN111019579A (en) * | 2019-12-26 | 2020-04-17 | 苏州晶台光电有限公司 | Thermochromic packaging adhesive and preparation method and application thereof |
WO2021184416A1 (en) * | 2020-03-20 | 2021-09-23 | 深圳视爵光旭电子有限公司 | Novel display screen kit manufacturing method |
CN111326081A (en) * | 2020-03-20 | 2020-06-23 | 深圳视爵光旭电子有限公司 | Preparation method of novel display screen external member and special clamp |
CN111416030A (en) * | 2020-04-01 | 2020-07-14 | 苏州晶台光电有限公司 | Processing method for whitening of splicing seams between COB modules |
CN111477121A (en) * | 2020-05-26 | 2020-07-31 | 深圳市洲明科技股份有限公司 | Manufacturing method of L ED display screen |
CN113724607A (en) * | 2020-05-26 | 2021-11-30 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
CN113724607B (en) * | 2020-05-26 | 2023-05-02 | 深圳市洲明科技股份有限公司 | Manufacturing method of LED display module |
CN112992958A (en) * | 2020-07-21 | 2021-06-18 | 重庆康佳光电技术研究院有限公司 | LED display unit, LED display screen and manufacturing method thereof |
CN115294862A (en) * | 2022-05-27 | 2022-11-04 | 深圳爱克莱特科技股份有限公司 | Display screen |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN108230933A (en) | A kind of LED display Integral mask based on encapsulating technology | |
TW558775B (en) | Package of compound type LED | |
CN208315167U (en) | A kind of LED display panel | |
JP5153950B1 (en) | Light emitting diode | |
JP2008263154A (en) | Phosphor-powder-application process of light-emitting diode | |
CN110098306A (en) | A kind of integration packaging display module | |
DE102018116643A1 (en) | LIGHT-EMITTING SENSOR DEVICE AND MANUFACTURING METHOD THEREFOR | |
CN103165039A (en) | High-contrast light-emitting diode (LED) display module and production method thereof | |
CN101521257B (en) | White-light LED package structure with prefabricated fluorescent powder film and preparation method | |
JP2000269555A (en) | Surface mounting type light emitting diode and manufacture of the same | |
CN103208239A (en) | LED (light emitting diode) display unit panel with shading films | |
CN109328378A (en) | The manufacturing method of display device and display device | |
CN106905455A (en) | A kind of refractive index is 1.50 photochromic resin lens and preparation method thereof | |
CN207651486U (en) | A kind of high definition LED display modular structure | |
CN208173133U (en) | A kind of LED display Integral mask based on encapsulating technology | |
CN107946292A (en) | A kind of method for packing that LED display modules are realized by inkjet printing technology | |
CN206022416U (en) | A kind of surface-mount type all-colour LED element of packing colloid surface black | |
US9281455B2 (en) | LED packaging structure having concave lens structure at light-emitting side of LED chip | |
CN104253197B (en) | Light-emitting device and its manufacture method | |
CN101436628A (en) | Technological process for coating fluorescent powder of high-power chip | |
CN206401316U (en) | CSP LEDs | |
CN107346801A (en) | LED integrated encapsulation structures and its method for packing | |
WO2014199728A1 (en) | Epoxy resin composition for optical semiconductor reflectors, thermosetting resin composition for optical semiconductor devices, lead frame for optical semiconductor devices obtained using said thermosetting resin composition for optical semiconductor devices, sealed optical semiconductor element, and optical semiconductor device | |
CN206194784U (en) | Outdoor LED support | |
CN209447844U (en) | A kind of LED lamp bead of near-infrared no red light point |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
RJ01 | Rejection of invention patent application after publication | ||
RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |