CN108224549A - Heat supply intelligent control system - Google Patents
Heat supply intelligent control system Download PDFInfo
- Publication number
- CN108224549A CN108224549A CN201810017514.6A CN201810017514A CN108224549A CN 108224549 A CN108224549 A CN 108224549A CN 201810017514 A CN201810017514 A CN 201810017514A CN 108224549 A CN108224549 A CN 108224549A
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- China
- Prior art keywords
- pin
- communication interface
- house lead
- controller
- communication
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1006—Arrangement or mounting of control or safety devices for water heating systems
- F24D19/1009—Arrangement or mounting of control or safety devices for water heating systems for central heating
- F24D19/1015—Arrangement or mounting of control or safety devices for water heating systems for central heating using a valve or valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D2220/00—Components of central heating installations excluding heat sources
- F24D2220/04—Sensors
- F24D2220/042—Temperature sensors
Abstract
The invention discloses heat supply intelligent control system, including indoor temperature controller, house lead in intelligent controller, house lead in electric control valve, data collector and server.The heat supply intelligent control system of the present invention, indoor temperature is acquired by indoor temperature controller, or circulating water temperature is acquired by house lead in intelligent controller, and by data collector by the indoor temperature signal or circulating water temperature signal transmission to the server, server sends the control instruction of house lead in electric control valve according to indoor temperature signal or circulating water temperature signal, the control instruction of the house lead in electric control valve is sent to the house lead in intelligent controller by the data collector, so as to fulfill the adjusting of house lead in electric control valve, effectively by controlling hot water flow, realize the equilibrium of supply and demand, on-demand accurate heat supply, meet heat user comfort level demand, reduce energy consumption.
Description
Technical field
The present invention relates to a kind of heating equipment more particularly to a kind of heat supply intelligent control systems.
Background technology
Heating system of the prior art mainly includes house lead in consumer heat inlet and adjusts and two portions of building consumer heat inlet adjusting
Point, still, the heating system of the prior art can not obtain the indoor temperature of user at consumer heat inlet, also can not accurately into
Family flow and Lou Dong flows are adjusted；And to ensure heating effect, heat supply company is generally using the reality for increasing pipeline
Circular flow heats, and wastes a large amount of energy, also leads to heat supply network waterpower and thermal misadjustment.
Invention content
It is an object of the present invention to provide a kind of heat supply intelligent control systems, can be by the indoor temperature of user, and pass through this
Indoor temperature controls house lead in electric control valve, so as to reduce house lead in flow, has saved the energy.
The present invention solves technical problem and adopts the following technical scheme that：A kind of heat supply intelligent control system, including Indoor Temperature
Spend controller, house lead in intelligent controller, house lead in electric control valve, data collector and server；
The indoor temperature controller is used to detect indoor temperature, and the indoor temperature controller is adopted with the data
Storage signal connects, and the indoor temperature signal that it is acquired is sent to the data collector；
The house lead in intelligent controller controls institute for acquiring the circulating water temperature by the house lead in electric control valve
State house lead in electric control valve；
The house lead in intelligent controller signal is connected to data collector；
The data collector signal is connected to the server, the interior that the indoor temperature controller is detected
The circulating water temperature signal that temperature signal and the house lead in intelligent controller are detected is sent to the server；
The server sends the control of house lead in electric control valve according to the indoor temperature signal or circulating water temperature signal
System instruction；
The control instruction of the house lead in electric control valve is sent to the house lead in intelligent controller by the data collector.
Optionally, the house lead in intelligent controller includes control unit, the first power module, second source module, Lora
Wireless communication module, FSK wireless communication modules, valve opening sensor, water flow sensor socket, temperature sensor module,
AD conversion module and motor control module；
First power module is used to the power supply of+12V being converted to+5V power supplys, the second source module be used for will+
5V power supplys are converted to+3.3V power supplys；
First power module is used for described control unit, valve opening sensor, water flow sensor socket, temperature
It spends sensor assembly, AD conversion module and motor control module and power supply is provided, the second source module is used for the Lora
Wireless communication module and FSK wireless communication modules provide power supply；
The Lora wireless communication modules, FSK wireless communication modules, valve opening sensor and water flow sensor socket
Equal signal is connected to described control unit；The temperature sensor assembly is connected to the control list by AD conversion module signal
Member, described control unit signal are connected to the motor control module, and the motor control module is connected to house lead in motorized adjustment
The motor of valve；
The valve opening sensor is installed on the motor, for detecting the rotational angle of electronics rotor.
Optionally, the data collector includes LORA communication systems, interface system and 3G communication systems；
The LORA communication systems include the first power module, the first controller, LORA communication modules and the first communication and connect
Mouthful；
First power module is used to power to the first controller, LORA communication modules and the first communication interface；
First communication interface and the LORA communication modules signal are connected to first controller；
The interface system includes SIM card holder, TF card seat, the second communication interface and third communication interface；
The SIM card holder is connect with the third communication interface signal；
The TF card seat is connect with the second communication interface signal；
The 3G communication systems include second controller, 3G communication modules, second source module, 232 conversion circuits, first
Level shifting circuit, second electrical level conversion circuit, fourth communication interface, fifth communication interface and the 6th communication interface；
The second controller is connect with the 3G communication modules signal；
The fourth communication interface is identical with the interface of first communication interface, and is in communication with each other connection；
The fifth communication interface is identical with the interface of second communication interface, and is in communication with each other connection；
6th communication interface is identical with the interface of the third communication interface, and is in communication with each other connection；
The fourth communication interface is communicated mould by the first level shifting circuit and second electrical level conversion circuit with the 3G
Block signal connects；
The fifth communication interface is connect with the 3G communication modules signal, the part terminal letter of the 6th communication interface
Number the 3G communication modules are connected to, another part terminal is connected to 232 conversion circuits, and 232 conversion circuit passes through first
Level shifting circuit and second electrical level conversion circuit are connected to 3G communication modules.
Optionally, the indoor temperature controller is connect by Lora communication modules with the data collector signal.
Optionally, the Lora wireless communication modules of the house lead in intelligent controller communicate with the LORA of the data collector
System signal connects.
Optionally, the data collector is connect by 3G communication systems with server signal.
The present invention has the advantages that：The heat supply intelligent control system of the present invention, is adopted by indoor temperature controller
Set indoor temperature acquires circulating water temperature, and by data collector by the interior by house lead in intelligent controller
Temperature signal or circulating water temperature signal transmission are to the server, and server is according to indoor temperature signal or circulating water temperature
Signal sends the control instruction of house lead in electric control valve, and the data collector is by the control instruction of the house lead in electric control valve
The house lead in intelligent controller is sent to, so as to fulfill the adjusting of house lead in electric control valve, effectively by controlling hot water flow,
Realize the equilibrium of supply and demand, on-demand accurate heat supply meets heat user comfort level demand, reduces energy consumption.
Description of the drawings
Fig. 1 is the structure diagram of the heat supply intelligent control system of the present invention；
Fig. 2 is the structure diagram of the house lead in electric control valve of the present invention；
Fig. 3 is the structure diagram of the house lead in intelligent controller of the present invention；
Fig. 4 is the structure diagram of the control unit of the house lead in intelligent controller of the present invention；
Fig. 5 is the structure diagram of the first power module of the house lead in intelligent controller of the present invention；
Fig. 6 is the structure diagram of the second source module of the house lead in intelligent controller of the present invention；
Fig. 7 is the structure diagram of the Lora wireless communication modules of the house lead in intelligent controller of the present invention；
Fig. 8 is the structure diagram of the FSK wireless communication modules of the house lead in intelligent controller of the present invention；
Fig. 9 is the structure diagram of the valve opening sensor of the house lead in intelligent controller of the present invention；
Figure 10 is the structure diagram of the water flow sensor socket of the house lead in intelligent controller of the present invention；
Figure 11 is the structure diagram of the temperature sensor assembly of the house lead in intelligent controller of the present invention；
Figure 12 is the structure diagram of the AD conversion module of the house lead in intelligent controller of the present invention；
Figure 13 is the structure diagram of the motor control module of the house lead in intelligent controller of the present invention；
Figure 14 is the structure diagram of the indicating lamp module of the house lead in intelligent controller of the present invention；
Figure 15 is the structure diagram of the first power module of the data collector of the present invention；
Figure 16 is the structure diagram of the first controller of the data collector of the present invention；
Figure 17 is the structure diagram of the LORA communication modules of the data collector of the present invention；
Figure 18 is the structure diagram of the first communication interface of the data collector of the present invention；
Figure 19 is the structure diagram of the SIM card holder of the data collector of the present invention；
Figure 20 is the structure diagram of the TF card seat of the data collector of the present invention；
Figure 21 is the structure diagram of the second communication interface of the data collector of the present invention；
Figure 22 is the structure diagram of the third communication interface of the data collector of the present invention；
Figure 23 is the structure diagram of the second controller of the data collector of the present invention；
Figure 24 is the structure diagram of the 3G communication modules of the data collector of the present invention；
Figure 25 is the structure diagram of the second source module of the data collector of the present invention；
Figure 26 is the structure diagram of 232 conversion circuits of the data collector of the present invention；
Figure 27 is the structure diagram of the first level shifting circuit of the data collector of the present invention；
Figure 28 is the structure diagram of the second electrical level conversion circuit of the data collector of the present invention；
Figure 29 is the structure diagram of the fourth communication interface of the data collector of the present invention；
Figure 30 is the structure diagram of the fifth communication interface of the data collector of the present invention；
Figure 31 is the structure diagram of the 6th communication interface of the data collector of the present invention；
The mark in the figure shows：101- house lead in valve bodies；102- house lead in valve bases；103- house lead in valve base O-ring seals；
104- house valve flaps；105- house valve valve rods；106- cylindrical springs；107- house valve valve decks；108- house valve thrust pads；
109- house valve valve rod O-ring seals；110- house lead in valve middle port pads；111- house valve motors；112- turbines；The first protrusions of 113-
Portion；The second lug bosses of 114-；115- first baffles；116- second baffles；117- first pressure detection holes；118- second pressures are examined
Gaging hole；The first temperature detections of 119- hole.
Specific embodiment
Technical scheme of the present invention is further elaborated with reference to embodiment and attached drawing.
Embodiment 1
Present embodiments provide a kind of heat supply intelligent control system, including indoor temperature controller, house lead in intelligent controller,
House lead in electric control valve, data collector and server.
The indoor temperature controller is used to detect indoor temperature, and the indoor temperature controller is adopted with the data
Storage signal connects, and the indoor temperature signal that it is acquired is sent to the data collector；In the present embodiment, the room
Interior temperature controller is connect by Lora communication modules with the data collector signal, with reliable by the Lora channel radios
The remote wireless transmission of existing signal.
Moreover, the indoor temperature controller can also directly transmit control instruction to house lead in intelligence by data collector
Controller, house lead in intelligent controller control the motor of the house lead in electric control valve according to the control instruction.
The house lead in intelligent controller controls institute for acquiring the circulating water temperature by the house lead in electric control valve
House lead in electric control valve is stated, further, the house lead in intelligent controller is used to control the motor of the house lead in electric control valve
Rotation, so as to control the aperture of the house lead in electric control valve, realize the control of house lead in hot water flow.
The house lead in electric control valve is installed on house lead in hot water line, when the aperture of house lead in electric control valve changes,
The flow of the hot water in house lead in hot water line can be changed.
Moreover, the house lead in intelligent controller signal is connected to data collector.
The data collector signal is connected to the server, the interior that the indoor temperature controller is detected
The circulating water temperature signal that temperature signal and the house lead in intelligent controller are detected is sent to the server, the clothes
Business device sends the control instruction of house lead in electric control valve, the data according to the indoor temperature signal or circulating water temperature signal
The control instruction of the house lead in electric control valve is sent to the house lead in intelligent controller by collector.
It is highly preferred that the data collector is connect by 3G communication systems with the server signal, to be led to by 3G
Realize the whole city transmission of data in the base station of letter system；And the data collector is wireless by Lora with house lead in intelligent controller
Communication module signal connects, so that data collector can carry out group with indoor temperature controller and house lead in intelligent controller
Net.
When the present embodiment heat supply intelligent control system when in use, the server can connect the acquisition of multiple data
Device, and the data collector can connect multiple indoor temperature controllers and house lead in intelligent controller, that is, pass through a number
Multiple users can be managed according to collector.
In the present embodiment, it is preferable that the house lead in electric control valve include house lead in valve body 101, house lead in valve base 102,
House valve flap 104, house valve valve rod and house valve valve deck；
The house lead in valve body 101 is hollow structure, and one end of the house lead in valve body 101 is water inlet, and the other end is
Water outlet in the present embodiment, protrudes inwardly from the first lug boss for forming annular on the madial wall of the house lead in valve body 101,
Ring-shaped step is formed on the internal face of first lug boss, house lead in valve base is provided in the ring-shaped step, to pass through
The house lead in valve base forms fluid channel, it is highly preferred that be provided between the house lead in valve base and the ring-shaped step into
Family valve base O-ring seal, with by the house lead in valve base O-ring seal 103 realize house lead in valve base and ring-shaped step it
Between sealing.
House valve flap is provided on the house lead in valve base, by the rotation of the house valve flap, to open or close
Close the house lead in electric control valve and realize the adjusting of the house lead in motor-driven valve, in the present embodiment, the house lead in valve base and
House valve flap is prepared by ceramic material, so that having between the house lead in valve base and house valve flap good close
Envelope, and have smaller abrasion.
It is highly preferred that being formed with multiple scallop holes on the house lead in valve base, the house valve flap can be formed as face
The product fan shape bigger than the area of the scallop hole, so that the house valve flap can be completed to close the scallop hole,
At this point, the house lead in electric control valve is closed, it, can be gradually when the house valve flap is rotated from closed state
The scallop hole is opened, and house lead in electric control valve is caused to be in opening state.
House valve valve rod is fixedly installed on the house valve flap, to drive institute by the rotation of the house valve valve rod
The movement of house valve flap is stated, in the present embodiment, it is preferable that multiple blocks, the house lead in are formed on the house valve flap
The lower end of valve valve rod is between the block, so as to when the house valve valve rod rotates, drive the house valve valve
Valve rotates.
In the present embodiment, stepped counterbore, the upper end of the house valve flap are formed in the middle part of the house valve valve rod
Protrusion is formed with, the protrusion of the house valve flap is located in the counterbore, and in the bottom wall of the counterbore and house valve valve
Cylindrical spring is provided between valve so that house valve flap can compress house lead in valve base, improve the house valve flap and
Sealing performance between house lead in valve base.
Moreover, being protruded outward on the lateral wall of the house lead in valve body, the second lug boss of annular is formed, described second is convex
The portion of rising is hollow structure, and house valve valve deck is provided on second lug boss, and electricity is fixed on the house valve valve deck
Dynamic actuator, such as house valve motor etc.；The upper end of the house valve valve rod passes through the house valve valve deck, electronic is held with described
The rotor connection of row device, i.e., by the rotation of the Electric Actuator, can drive the house valve valve rod to rotate；The present embodiment
In, it is preferable that house lead in valve middle port pad is provided between the house valve valve deck and second lug boss, to pass through the house lead in
Valve middle port pads the sealing between existing house valve valve deck and the second lug boss.
In the present embodiment, house valve valve is provided between the peripheral surface of the house valve valve rod and the house valve valve deck
Bar O-ring seal, in the present embodiment, the house valve valve rod O-ring seal can be multiple, and multiple house valve valve rod O
Type sealing ring is arranged in parallel.
Step is formed on the house valve valve rod, is set between the step and the house valve valve deck of the house valve valve rod
House valve thrust pad is equipped with, the house valve thrust pad is prepared by graphite material, by the lubricating action of graphite material, to have
Effect ground is reduced in house valve valve rod rotation process, the frictional force between house valve valve rod and house valve valve deck.
Moreover, first baffle and second baffle, the first baffle and second baffle are additionally provided in the house lead in valve body
It is arranged in parallel, the both ends of the turbine wheel shaft of the turbine are rotatably supported at the first baffle and second baffle respectively, to work as
When water flows through the turbine, the flow of water can be detected；Preferably, the lower end of the first baffle and the house lead in valve body
Gap is formed between inner wall, and between being formed between the inner wall of the upper end of the second baffle and the house lead in valve body
Gap, so that flow can flow completely through the turbine, so as to improve the accuracy of detection of the flow of water.
In the present embodiment, between the axis of the horizontal direction of the axis of the house lead in valve base and the house lead in valve body
Angle is 120 °.
It is highly preferred that the house lead in valve body, the first lug boss and the second lug boss can pass through casting integrated molding.
First pressure detection hole 117 and second pressure detection hole 118, this implementation are further opened on the house lead in valve body 1
In example, the first pressure is located at the both sides of the first lug boss 113 with regard to detection hole 117 and second pressure detection hole 118 respectively, and
And the first temperature detection hole 119 is offered on second lug boss 114.
The house lead in intelligent controller includes control unit, the first power module, second source module, Lora wireless telecommunications
Module, FSK wireless communication modules, valve opening sensor, water flow sensor socket, temperature sensor module, AD conversion mould
Block and motor control module.
First power module is used to the power supply of+12V being converted to+5V power supplys (VDD), and the second source module is used
In+5V power supplys are converted to+3.3V power supplys (VCC).
First power module is used for described control unit, valve opening sensor, water flow sensor socket, temperature
It spends sensor assembly, AD conversion module and motor control module and power supply is provided, the second source module is used for the Lora
Wireless communication module and FSK wireless communication modules provide power supply.
In the present embodiment, described control unit includes the microcontroller of model SC91F732, the 7th pin of the microcontroller
It is grounded by switching, the 31st pin of the microcontroller is connected to+5V power supplys, the 32nd pin ground connection of the microcontroller.
The Lora wireless communication modules are connect with described control unit signal, to realize other equipment and control unit
Wireless telecommunications, in the present embodiment, the Lora wireless communication modules include chip, resistance R10, the resistance of model RA-01
R11, resistance R12, resistance R13 and resistance R34.
The 2nd pin ground connection of the chip of the model RA-01, the 3rd pin connection of the chip of the model RA-01
In+3.3V power supplys, the 4th pin of the chip of the model RA-01 is connected to the 5th pin of the microcontroller；The model
5th pin of the chip for RA-01 is connected to the 11st pin of microcontroller, and passes through resistance R10 and be connected to+3.3V power supplys；Institute
State the 9th pin ground connection of the chip of model RA-01, the 16th pin ground connection of the chip of the model RA-01, the model
12nd pin of the chip for RA-01 is connected to the 6th pin of microcontroller, and passes through resistance R34 and be connected to+3.3V power supplys；Institute
The 13rd pin for stating the chip of model RA-01 is connected to the 8th pin of the microcontroller, and passes through resistance R13 connections+3.3V
Power supply；14th pin of the chip of the model RA-01 is connected to the 9th pin of the microcontroller, and passes through resistance R12 and connect
It is connected to+3.3V power supplys；15th pin of the chip of the model RA-01 is connected to the 10th pin of the microcontroller, and leads to
It crosses resistance R11 and is connected to+3.3V power supplys.
The FSK wireless communication modules are connect with the single-chip microcomputer signal, to realize the nothing of other equipment and control unit
Line communicates, in the present embodiment, the FSK wireless communication modules include the chip of model YL7139RF, resistance R2, resistance R3,
Resistance R4 and resistance R5.
2nd pin of the chip of the model YL7139RF and the 10th pin ground connection, the model YL7139RF's
4th pin of chip is connected to the 18th pin of microcontroller, and the 6th pin of the chip of the model YL7139RF is connected to list
19th pin of piece machine, and pass through resistance R5 and be connected to+3.3V power supplys；7th pin of the chip of the model YL7139RF
The 20th pin of microcontroller is connected to, and passes through resistance R4 and is connected to+3.3V power supplys；The chip of the model YL7139RF
8th pin is connected to the 21st pin of microcontroller, and passes through resistance R3 and be connected to+3.3V power supplys, the model YL7139RF
The 9th pin of chip be connected to+3.3V power supplys.
The valve opening sensor is set on the rotor of the Electric Actuator, with by detecting Electric Actuator
Rotational angle obtains valve opening, and signal is connected to the microcontroller, the valve opening signal transmission detected to institute
Microcontroller is stated, the valve opening sensor includes the angular sensor of model SV01A103AEA01R00, the rotation
One end of angle of revolution sensor is connected to+5V power supplys, the other end ground connection of the angular sensor, and the rotation angle passes
The sliding end of sensor is connected to the 25th pin of microcontroller, and is grounded by capacitance C4 and resistance R30.
The water flow sensor receptacle signal is connected to the microcontroller, is pacified on the water flow sensor socket with working as
After filling water flow sensor, the water flow signal that the water flow sensor detects can be sent to the microcontroller, this reality
It applies in example, the 1st pin of the water flow sensor socket is connected to+5V power supplys, the 2nd pipe of the water flow sensor socket
Foot is connected to the 16th pin of microcontroller, the 3rd pin ground connection of the water flow sensor.
In the present embodiment, the temperature sensor module is used to detect water temperature, and be set to the temperature detection hole 119
It is interior, for detecting through the water temperature into electric control valve, described control unit is connected to by AD conversion module signal,
Described control unit is sent to the temperature of the water detected, in the present embodiment, the temperature sensor module includes model
For the temperature sensor of PT1000, one end of the temperature sensor is connected to+5V power supplys, other end ground connection by resistance R20；
Resistance R21 and resistance R22 series connection, and it is connected to+5V power supplys and ground；The temperature sensor leads to resistance R20 one end connecting
It crosses resistance R24 and is connected to AD conversion module, meanwhile, the resistance R21 is connected with one end that resistance R23 is connected by resistance R23
In AD conversion module.
Preferably, the AD conversion module includes the chip of model ADS1115, the chip of the model ADS1115
The 1st pin, the 2nd pin and the 3rd pin+5V power supplys are connected to by resistance R19, the temperature sensor and resistance R20
One end of connection is connected to the 7th pin of the chip of model ADS1115, the resistance R21 and resistance R23 by resistance R24
One end of connection is connected to the 6th pin of AD conversion module, the 9th pipe of the chip of the model ADS1115 by resistance R23
Foot is connected to the 29th pin of microcontroller, and passes through resistance R18 and be connected to+5V power supplys, the chip of the model ADS1115
10th pin is connected to the 28th pin of the microcontroller, and passes through resistance R17 and be connected to+5V power supplys.
The motor control module is connected to described control unit, under the control of described control unit, to realize motor
Rotation.The motor control module includes resistance R9, resistance R7, resistance R8, resistance R6, capacitance E1, triode Q1, triode
Q2, field-effect tube Q3, field-effect tube Q4 and capacitance C3.
1st pin of the microcontroller is connected to+5V power supplys, the 2nd pipe of the microcontroller by resistance R9 and resistance R7
Foot is connected to+5V power supplys by resistance R8 and resistance R6；+ 5V the power supplys are grounded by capacitance E1；The base of the triode Q1
Pole is connected to the junction of resistance R8 and resistance R8, the emitter connection+5V power supplys of the triode Q1, the triode Q1's
Collector is connected to the collector of the triode Q2 by capacitance C3, and the base stage of the triode Q2 is connected to resistance R9 and electricity
The junction of R7 is hindered, the emitter of the triode Q2 is connected to+5V power supplys.
The grid of the field-effect tube Q3 is connected to the 2nd pin of the microcontroller, and the drain electrode of the field-effect tube Q3 connects
Ground, the source electrode of the field-effect tube Q3 are connected to the collector of the triode Q1；The grid of the field-effect tube Q4 is connected to
1st pin of the microcontroller, the grounded drain of the field-effect tube Q4, the source electrode of the field-effect tube Q4 are connected to described three
The collector of pole pipe Q2.
The motor is connected to the source electrode of the field-effect tube Q3 and the source electrode of field-effect tube Q4.
The house lead in intelligent controller further includes indicating lamp module, specifically, the 12nd pin of the microcontroller and the 13rd
Pin is connected to+5V power supplys by the first light emitting diode and resistance R32；14th pin of the microcontroller and the 15th pin
+ 5V power supplys are connected to by the second light emitting diode and resistance R33 ,+5V the power supplys shine two by resistance R31 and third
Pole pipe is grounded.
In the present embodiment, the data collector includes LORA communication systems, interface system and 3G communication systems.
The LORA communication systems include the first power module, the first controller, LORA communication modules and the first communication and connect
Mouthful.
The DC power supply of externally input (such as+9V) is converted to the direct current of+5V and+3.3V by first power module
Power supply, and for powering to the first controller, LORA communication modules and the first communication interface.
In the present embodiment, first power module can include the first circuit and second circuit, and first circuit is used
In+9V power supplys are converted to+5V power supplys, such as pass through the chip of model 1117-5.0 and realize；The second circuit be used for will+
The power supply of 5V is converted to the power supply of+3.3V, such as is realized by the chip of model 1117-3.3.
First controller is the microcontroller of model SC92F732-16, and the first pin of first controller connects
It is connected to+5V power supplys, the 2nd pin ground connection of first controller.
The LORA communication modules signal is connected to first controller, so that other equipment can pass through the LORA
Communication module is connect with first controller signals, wherein, the LORA communication modules include the chip of model RA-01,
2nd pin of the chip of the model RA-01 and the 9th pin ground connection, the 3rd pin of the chip of the model RA-01 connect
+ 3.3V power supplys are connected to, the 4th pin of the chip of the model RA-01 is connected to the 12nd pin of first controller, institute
The 5th pin for stating the chip of model RA-01 is connected to the 11st pin of first controller, and passes through resistance R1 and be connected to
+ 3.3V power supplys, the 12nd pin of the chip of the model RA-01 is connected to the 8th pin of first controller, and passes through
Resistance R5 is connected to+3.3V power supplys；13rd pin of the chip of the model RA-01 is connected to the of first controller
7 pins, and pass through resistance R4 and be connected to+3.3V power supplys；14th pin of the chip of the model RA-01 is connected to described
4th pin of one controller, and pass through resistance R3 and be connected to+3.3V power supplys, the 15th pin of the chip of the model RA-01
The 3rd pin of first controller is connected to, and passes through resistance R2 and is connected to+3.3V power supplys；The core of the model RA-01
The 16th pin ground connection of piece.
The first communication interface signal is connected to first controller, to realize that first controller is set with other
Standby connection (such as passing through serial communication line), in the present embodiment, the 1st pin of first communication interface is connected to+5V
Power supply, the 2nd pin of first communication interface and the 4th pin ground connection, the 5th pin of first communication interface are connected to institute
The 5th pin of the first controller is stated, the 6th pin of first communication interface is connected to the 6th pin of first controller,
8th pin of first communication interface is connected to the 16th pin of first controller by resistance R6.
The interface system includes SIM card holder, TF card seat, the second communication interface and third communication interface；
1st pin of the SIM card holder is connected to the 12nd pin of third communication interface, the 2nd pin of the SIM card holder
The 8th pin of the third communication interface is connected to, the 3rd pin of the SIM card holder is connected to the third communication interface
10th pin, the 4th pin of the SIM card holder are connected to the 6th pin of the third communication interface, and the 6th of the SIM card holder the
Pin is grounded.
1st pin of the TF card seat is connected to the 3rd pin of second communication interface, the 2nd pipe of the TF card seat
Foot is connected to the 4th pin of second communication interface, and the 3rd pin of the TF card seat is connected to second communication interface
6th pin, the 4th pin of the TF card seat are connected to the 9th pin of second communication interface, the 5th pipe of the TF card seat
Foot is connected to the 5th pin of second communication interface, the 6th pin ground connection of the TF card seat, the 7th pin of the TF card seat
The 8th pin of second communication interface is connected to, the 8th pin of the TF card seat is connected to the of second communication interface
7 pins.
The 2nd pin ground connection of second communication interface, the 1st pin, the 3rd pin, the 5th pipe of the third communication interface
Foot and the 4th pin are connected to+5V power supplys by LED diodes respectively, corresponding when these pins is low levels, to light
LED diodes.
Moreover, the 2nd pin of the third communication interface is also grounded by reset switch.
The 3G communication systems include second controller, 3G communication modules, second source module, 232 conversion circuits, first
Level shifting circuit, second electrical level conversion circuit, fourth communication interface, fifth communication interface and the 6th communication interface.
The second controller is the microcontroller of model FM8PC71AS-C03-14, and the 1st of the second controller manages
Foot is connected to+5V power supplys, the 14th pin ground connection of the second controller, and the 12nd pin of the second controller passes through resistance
R20 is connected to the base stage of triode Q3, the emitter ground connection of triode Q3, the 10th pin DOG5 connections of the second controller
In the 19th pin of the first level shifting circuit.
The 3G communication modules are the chip of SIM5360；1st pin of the chip of the SIM5360 and the 2nd pin connect
Ground, the 3rd pin of the chip of the SIM5360 are connected to the collector of the triode Q3；The of the chip of the SIM5360
4 pins are grounded by capacitance C7, and are connected to the 11st pin of the second controller, the 5th pipe of the chip of the SIM5360
Foot is grounded；The 10th pin ground connection of the chip of the SIM5360, the 11st pin of the chip of the SIM5360 pass through resistance R4
VBUS (+5V) is connected to, and is grounded respectively by capacitance C12 and capacitance E9；14th pin of the chip of the SIM5360 connects
Ground；15th pin of the chip of the SIM5360 is connected to+1.8V power supplys；17th pin of the chip of the SIM5360 passes through
Resistance R5 is connected to the 3rd pin of ESD protection chip TVS5 (model PRTR5V0U2X), the ESD protection chips TVS5's
1st pin is grounded, and the 2nd pin of ESD protection chip TVS5 is connected to the of the chip of the SIM5360 by resistance R6
18 pins；The 4th pin of the ESD protection chips TVS5 is connected to the 20th pin of the chip of the SIM5360；It is described
19th pin of the chip of SIM5360 is connected to the 3rd pin of ESD protection chips TVS6 by resistance R7, and the ESD protects core
The 1st pin ground connection of piece TVS6, the 4th pin of the ESD protection chips TVS6 are connected to the 20th of the chip of the SIM5360
Pin, and the 20th pin of the chip of the SIM5360 is grounded respectively by capacitance C8, capacitance C9 and capacitance E7；It is described
The 81st pin ground connection of the chip of SIM5360；37th pin of the chip of the SIM5360, the 38th pin, the 39th pin,
40 pins and the 41st pin ground connection；42nd pin of the chip of the SIM5360 is grounded respectively by capacitance E6 and capacitance C6, and
And the power supply of+3.3V is connected to by the diode D1 of resistance Rsc and reversal connection and is connected to the anode of battery, the battery
Cathode ground connection；The 43rd pin ground connection of the chip of the SIM5360；44th pin of the chip of the SIM5360 is connected to
VDDE(+3.3V)；48th pin of the chip of the SIM5360 is connected to the base stage of triode Q2 by resistance R10, and described three
The emitter ground connection of pole pipe Q2；51st pin of the chip of the SIM5360 is connected to the base stage of triode Q1 by resistance R8,
The emitter ground connection of the triode Q1；57th pin of the chip of the SIM5360 and the 58th pin ground connection are described
59th pin of the chip of SIM5360 is connected to 3G antennas；60th pin of the chip of the SIM5360, the 61st pin, the 64th
Pin, the 65th pin and the 66th pin ground connection；62nd pin of the chip of the SIM5360 and the 63rd pin are connected to VBATT+
(+4.2V)；The 72nd pin, the 77th pin, the 78th pin and the 80th pin ground connection of the chip of the SIM5360；It is described
79th pin of the chip of SIM5360 is connected to GPS antenna.
The fourth communication interface is identical with the interface of first communication interface, and is in communication with each other connection；The present embodiment
In, the 1st pin of the fourth communication interface is connected to+5V power supplys, and the 3rd pin of the fourth communication interface is connected to VDD；
2nd pin of the fourth communication interface and the 4th pin ground connection；5th pin of the fourth communication interface is connected to the first electricity
20th pin of flat conversion circuit, the 6th pin of the fourth communication interface are connected to the of the second electrical level conversion circuit
20 pins, the 7th pin of the fourth communication interface are connected to the 19th pin of the second electrical level conversion circuit, and the described 4th
10th pin of communication interface is connected to+36V power supplys, and the 8th pin of the fourth communication interface is connected to the 6th communication interface
The 4th pin.
The fifth communication interface is identical with the interface of second communication interface, and is in communication with each other connection, the present embodiment
In, the 2nd pin of the fifth communication interface is grounded, the 3rd pin of the fifth communication interface and the chip of the SIM5360
The connection of the 24th pin, the 4th pin of the fifth communication interface connect with the 25th pin of the chip of the SIM5360, institute
The 5th pin for stating fifth communication interface is connect with the 26th pin of the chip of the SIM5360, and the of the fifth communication interface
6 pins are connect with the 21st pin of the chip of the SIM5360, the 7th pin and the SIM5360 of the fifth communication interface
Chip the connection of the 23rd pin, the 22nd pin of the 8th pin of the fifth communication interface and the chip of the SIM5360 connects
It connects, the 9th pin of the fifth communication interface is connected to VDDE；4th pin of the fifth communication interface is connect by resistance R3
Ground.
6th communication interface is identical with the interface of the third communication interface, and is in communication with each other connection, the present embodiment
In, the 1st pin of the 6th communication interface is connected to the collector of triode Q2, the 2nd pin of the 6th communication interface
It is connected to the collector of the triode Q3；3rd pin of the 6th communication interface is connected to the current collection of the triode Q1
Pole；5th pin of the 6th communication interface is grounded by resistance R12, and the 6th pin of the 6th communication interface passes through resistance
R5 is connected to the 17th pin of the chip of the SIM5360；8th pin of the 6th communication interface is connected to by resistance R6
18th pin of the chip of the SIM5360；10th pin of the 6th communication interface is connected to described by resistance R7
19th pin of the chip of SIM5360；12nd pin of the 6th communication interface is connected to the of the chip of the SIM5360
20 pins；14th pin of the 6th communication interface is connected to+5V power supplys；16th pin of the 6th communication interface connects
Ground；11st pin of the 6th communication interface is connected to the 14th pin of 232 conversion circuits, and the of the 6th communication interface
13 pins are connected to the 13rd pin of 232 conversion circuits；15th pin of the 6th communication interface is connected to second electrical level and turns
Change the 19th pin of circuit.
232 conversion circuit includes the chip of model MAX232, and the 1st pin of 232 conversion circuit passes through electricity
Holding C14 and be connected to its 3rd pin, the 2nd pin of 232 conversion circuit is connected to+5V power supplys by capacitance C13, and described 232
16th pin of conversion circuit is connected to+5V power supplys, the 4th pin of 232 conversion circuit by capacitance C15 be connected to its
5 pins, the 6th pin of 232 conversion circuit are grounded by capacitance C16, the 15th pin ground connection of 232 conversion circuit,
11st pin of 232 conversion circuit is connected to the 21st pin of first level shifting circuit, 232 conversion circuit
The 12nd the 21st pin for being connected to the second electrical level conversion circuit.
First level shifting circuit includes the chip of model SN74LVC8T245, first level shifting circuit
The 1st pin be connected to+1.8V power supplys, the 2nd pin of first level shifting circuit is grounded by resistance R27, described
3rd pin of one level shifting circuit is connected to the 8th pin of the 3G communication modules, and the of first level shifting circuit
4 pins are connected to the 71st pin of the 3G communication modules, and the 4th pin of first level shifting circuit is connected to the 3G
50th pin of communication module, the 6th pin to the 13rd pin of first level shifting circuit are grounded；First level turns
The 22nd pin ground connection of circuit is changed, the 23rd pin and the 24th pin of first level shifting circuit are connected to+5V power supplys.
The second electrical level conversion circuit includes the chip of model SN74LVC8T245, the second electrical level conversion circuit
The 1st pin be connected to+1.8V power supplys, the 2nd pin ground connection of the second electrical level conversion circuit, the second electrical level conversion electricity
3rd pin on road is connected to the 7th pin of the 3G communication modules, and the 4th pin of the second electrical level conversion circuit is connected to
68th pin of the 3G communication modules, the 4th pin of the second electrical level conversion circuit are connected to the 3G communication modules
53rd pin, the 7th pin to the 13rd pin of the second electrical level conversion circuit are grounded；The of the second electrical level conversion circuit
22 pins are grounded, and the 23rd pin and the 24th pin of the second electrical level conversion circuit are connected to+5V power supplys；The second electrical level
20th pin of conversion circuit is grounded by resistance R19 and capacitance C11.
The indoor temperature controller includes temperature sensor, microcontroller and Lora wireless communication modules, circuit structure
It is identical with the circuit structure in the house lead in intelligent controller, it is no longer described in detail one by one herein.
The heat supply intelligent control system of the present embodiment, by indoor temperature controller acquire indoor temperature or by into
Family intelligent controller acquisition circulating water temperature, and by data collector by the indoor temperature signal or circulating water temperature
Signal transmission to the server, server sends house lead in electric control valve according to indoor temperature signal or circulating water temperature signal
Control instruction, the control instruction of the house lead in electric control valve is sent to the house lead in intelligent control by the data collector
Device so as to fulfill the adjusting of house lead in electric control valve, effectively by controlling hot water flow, realizes the equilibrium of supply and demand, on demand precisely
Heat supply meets heat user comfort level demand, reduces energy consumption.
The sequencing of above example is not only for ease of description, represent the quality of embodiment.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
To modify to the technical solution recorded in foregoing embodiments or carry out equivalent replacement to which part technical characteristic；
And these modification or replace, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (6)
1. a kind of heat supply intelligent control system, which is characterized in that including indoor temperature controller, house lead in intelligent controller, house lead in
Electric control valve, data collector and server；
The indoor temperature controller is used to detect indoor temperature, and the indoor temperature controller and the data collector
Signal connects, and the indoor temperature signal that it is acquired is sent to the data collector；
The house lead in intelligent controller for acquiring through the circulating water temperature of the house lead in electric control valve, and control it is described into
Family electric control valve；
The house lead in intelligent controller signal is connected to data collector；
The data collector signal is connected to the server, the indoor temperature that the indoor temperature controller is detected
The circulating water temperature signal that signal and the house lead in intelligent controller are detected is sent to the server；
The control that the server sends house lead in electric control valve according to the indoor temperature signal or circulating water temperature signal refers to
It enables；
The control instruction of the house lead in electric control valve is sent to the house lead in intelligent controller by the data collector.
2. heat supply intelligent control system according to claim 1, which is characterized in that the house lead in intelligent controller includes control
Unit processed, the first power module, second source module, Lora wireless communication modules, FSK wireless communication modules, valve opening pass
Sensor, water flow sensor socket, temperature sensor module, AD conversion module and motor control module；
First power module is used to the power supply of+12V being converted to+5V power supplys, and the second source module is used for+5V electricity
Source is converted to+3.3V power supplys；
First power module is used to pass to described control unit, valve opening sensor, water flow sensor socket, temperature
Sensor module, AD conversion module and motor control module provide power supply, and the second source module is used for wireless to the Lora
Communication module and FSK wireless communication modules provide power supply；
The Lora wireless communication modules, FSK wireless communication modules, valve opening sensor and water flow sensor socket are believed
Number it is connected to described control unit；The temperature sensor assembly is connected to described control unit by AD conversion module signal,
Described control unit signal is connected to the motor control module, and the motor control module is connected to house lead in electric control valve
Motor；
The valve opening sensor is installed on the motor, for detecting the rotational angle of electronics rotor.
3. heat supply intelligent control system according to claim 2, which is characterized in that the data collector leads to including LORA
Letter system, interface system and 3G communication systems；
The LORA communication systems include the first power module, the first controller, LORA communication modules and the first communication interface；
First power module is used to power to the first controller, LORA communication modules and the first communication interface；
First communication interface and the LORA communication modules signal are connected to first controller；
The interface system includes SIM card holder, TF card seat, the second communication interface and third communication interface；
The SIM card holder is connect with the third communication interface signal；
The TF card seat is connect with the second communication interface signal；
The 3G communication systems include second controller, 3G communication modules, second source module, 232 conversion circuits, the first level
Conversion circuit, second electrical level conversion circuit, fourth communication interface, fifth communication interface and the 6th communication interface；
The second controller is connect with the 3G communication modules signal；
The fourth communication interface is identical with the interface of first communication interface, and is in communication with each other connection；
The fifth communication interface is identical with the interface of second communication interface, and is in communication with each other connection；
6th communication interface is identical with the interface of the third communication interface, and is in communication with each other connection；
The fourth communication interface is believed by the first level shifting circuit and second electrical level conversion circuit with the 3G communication modules
Number connection；
The fifth communication interface is connect with the 3G communication modules signal, and the part terminal signals of the 6th communication interface connect
The 3G communication modules are connected to, another part terminal is connected to 232 conversion circuits, and 232 conversion circuit passes through the first level
Conversion circuit and second electrical level conversion circuit are connected to 3G communication modules.
4. heat supply intelligent control system according to claim 3, which is characterized in that the indoor temperature controller passes through
Lora communication modules are connect with the data collector signal.
5. heat supply intelligent control system according to claim 4, which is characterized in that the Lora of the house lead in intelligent controller
Wireless communication module is connect with the LORA communication system signals of the data collector.
6. heat supply intelligent control system according to claim 5, which is characterized in that the data collector is communicated by 3G
System is connect with server signal.
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| CN201810017514.6A CN108224549B (en) | 2018-01-09 | 2018-01-09 | Intelligent heat supply control system |
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| CN201810017514.6A CN108224549B (en) | 2018-01-09 | 2018-01-09 | Intelligent heat supply control system |
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| CN109240138A (en) * | 2018-10-11 | 2019-01-18 | 河北工大科雅能源科技股份有限公司 | intelligent control valve |
| CN109751661A (en) * | 2018-12-06 | 2019-05-14 | 青岛农业大学 | Distant heating regulating system and method based on low power consumption network |
| CN112228951A (en) * | 2020-10-15 | 2021-01-15 | 博彦多彩数据科技有限公司 | Edge analysis control method and regional cooling and heating control system |
| CN112879984A (en) * | 2021-01-27 | 2021-06-01 | 诸暨市富瑞普科技有限公司 | Novel water mixer and control system thereof |
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| CN108224549B (en) | 2020-05-08 |
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