CN108224549B - Intelligent heat supply control system - Google Patents
Intelligent heat supply control system Download PDFInfo
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- CN108224549B CN108224549B CN201810017514.6A CN201810017514A CN108224549B CN 108224549 B CN108224549 B CN 108224549B CN 201810017514 A CN201810017514 A CN 201810017514A CN 108224549 B CN108224549 B CN 108224549B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1006—Arrangement or mounting of control or safety devices for water heating systems
- F24D19/1009—Arrangement or mounting of control or safety devices for water heating systems for central heating
- F24D19/1015—Arrangement or mounting of control or safety devices for water heating systems for central heating using a valve or valves
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D2220/00—Components of central heating installations excluding heat sources
- F24D2220/04—Sensors
- F24D2220/042—Temperature sensors
Abstract
The invention discloses an intelligent heat supply control system which comprises an indoor temperature controller, an intelligent house-entering controller, an electric house-entering regulating valve, a data acquisition unit and a server. According to the intelligent heat supply control system, the indoor temperature is collected through the indoor temperature controller, or the circulating water temperature is collected through the intelligent house-entering controller, the indoor temperature signal or the circulating water temperature signal is transmitted to the server through the data collector, the server sends the control instruction of the electric house-entering regulating valve according to the indoor temperature signal or the circulating water temperature signal, and the data collector sends the control instruction of the electric house-entering regulating valve to the intelligent house-entering controller, so that the regulation of the electric house-entering regulating valve is realized, the balance of supply and demand is realized effectively by controlling the flow of hot water, accurate heat supply is realized according to the demand, the comfort demand of a heat user is met, and the energy consumption is reduced.
Description
Technical Field
The invention relates to heating equipment, in particular to an intelligent heating control system.
Background
The heating system in the prior art mainly comprises two parts, namely, a house entrance heating power inlet regulation part and a building heating power inlet regulation part, but the heating system in the prior art cannot obtain the indoor temperature of a user at the heating power inlet and cannot accurately regulate the house entrance flow and the building flow; in addition, in order to ensure the heating effect, heating companies generally increase the actual circulation flow of the pipeline for heating, so that a large amount of energy is wasted, and the hydraulic power and the heating power of a heating network are disordered.
Disclosure of Invention
The invention aims to provide an intelligent heat supply control system which can control an electric household inlet regulating valve through the indoor temperature of a user, so that the household inlet flow is reduced, and the energy is saved.
The technical scheme adopted by the invention for solving the technical problems is as follows: an intelligent heat supply control system comprises an indoor temperature controller, an intelligent house-entering controller, an electric house-entering regulating valve, a data collector and a server;
the indoor temperature controller is used for detecting indoor temperature and is in signal connection with the data collector so as to send the collected indoor temperature signal to the data collector;
the house-entering intelligent controller is used for collecting the temperature of circulating water passing through the house-entering electric regulating valve and controlling the house-entering electric regulating valve;
the intelligent house-entering controller is connected with the data acquisition unit through signals;
the data acquisition unit is in signal connection with the server so as to send the indoor temperature signal detected by the indoor temperature controller and the circulating water temperature signal detected by the intelligent home-entry controller to the server;
the server sends a control instruction of the household electric regulating valve according to the indoor temperature signal or the circulating water temperature signal;
and the data acquisition unit sends a control command of the home-entering electric regulating valve to the home-entering intelligent controller.
Optionally, the intelligent home-entry controller includes a control unit, a first power module, a second power module, a Lora wireless communication module, an FSK wireless communication module, a valve opening sensor, a water flow sensor socket, a temperature sensor module, an AD conversion module, and a motor control module;
the first power supply module is used for converting a +12V power supply into a +5V power supply, and the second power supply module is used for converting the +5V power supply into a +3.3V power supply;
the first power supply module is used for supplying power to the control unit, the valve opening sensor, the water flow sensor socket, the temperature sensor module, the AD conversion module and the motor control module, and the second power supply module is used for supplying power to the Lora wireless communication module and the FSK wireless communication module;
the Lora wireless communication module, the FSK wireless communication module, the valve opening sensor and the water flow sensor socket are in signal connection with the control unit; the temperature sensor assembly is in signal connection with the control unit through an AD conversion module, the control unit is in signal connection with the motor control module, and the motor control module is connected with a motor of the household electric regulating valve;
the valve opening sensor is mounted on the motor and used for detecting the rotation angle of the electronic rotor.
Optionally, the data collector includes a LORA communication system, an interface system, and a 3G communication system;
the LORA communication system comprises a first power supply module, a first controller, a LORA communication module and a first communication interface;
the first power supply module is used for supplying power to the first controller, the LORA communication module and the first communication interface;
the first communication interface and the LORA communication module are in signal connection with the first controller;
the interface system comprises an SIM card holder, a TF card holder, a second communication interface and a third communication interface;
the SIM card seat is in signal connection with the third communication interface;
the TF card holder is in signal connection with the second communication interface;
the 3G communication system comprises a second controller, a 3G communication module, a second power supply module, a 232 conversion circuit, a first level conversion circuit, a second level conversion circuit, a fourth communication interface, a fifth communication interface and a sixth communication interface;
the second controller is in signal connection with the 3G communication module;
the fourth communication interface is the same as the first communication interface in interface and is in communication connection with the first communication interface;
the fifth communication interface is the same as the second communication interface in interface and is in communication connection with the second communication interface;
the sixth communication interface is the same as the third communication interface in interface and is in communication connection with the third communication interface;
the fourth communication interface is in signal connection with the 3G communication module through a first level conversion circuit and a second level conversion circuit;
the fifth communication interface is in signal connection with the 3G communication module, part of terminals of the sixth communication interface are in signal connection with the 3G communication module, the other part of terminals of the sixth communication interface are connected with the 232 conversion circuit, and the 232 conversion circuit is connected with the 3G communication module through the first level conversion circuit and the second level conversion circuit.
Optionally, the indoor temperature controller is in signal connection with the data collector through a Lora communication module.
Optionally, the Lora wireless communication module of the intelligent home-entry controller is in signal connection with the Lora communication system of the data collector.
Optionally, the data collector is in signal connection with the server through a 3G communication system.
The invention has the following beneficial effects: according to the intelligent heat supply control system, the indoor temperature is collected through the indoor temperature controller, or the circulating water temperature is collected through the intelligent house-entering controller, the indoor temperature signal or the circulating water temperature signal is transmitted to the server through the data collector, the server sends the control instruction of the electric house-entering regulating valve according to the indoor temperature signal or the circulating water temperature signal, and the data collector sends the control instruction of the electric house-entering regulating valve to the intelligent house-entering controller, so that the regulation of the electric house-entering regulating valve is realized, the balance of supply and demand is realized effectively by controlling the flow of hot water, accurate heat supply is realized according to the demand, the comfort demand of a heat user is met, and the energy consumption is reduced.
Drawings
FIG. 1 is a schematic structural diagram of an intelligent heating control system according to the present invention;
FIG. 2 is a schematic structural diagram of the electric home-entry control valve of the present invention;
FIG. 3 is a schematic structural diagram of an intelligent home-entry controller according to the present invention;
FIG. 4 is a schematic structural diagram of a control unit of the intelligent home-entry controller according to the present invention;
FIG. 5 is a schematic structural diagram of a first power module of the intelligent home-entry controller according to the present invention;
FIG. 6 is a schematic structural diagram of a second power module of the intelligent home-entry controller according to the present invention;
FIG. 7 is a schematic structural diagram of a Lora wireless communication module of the intelligent home-entry controller according to the present invention;
FIG. 8 is a schematic structural diagram of an FSK wireless communication module of the home-entry intelligent controller according to the present invention;
fig. 9 is a schematic structural diagram of a valve opening sensor of the intelligent home-entry controller according to the present invention;
FIG. 10 is a schematic structural diagram of a water flow sensor socket of the intelligent home-entry controller of the present invention;
FIG. 11 is a schematic structural diagram of a temperature sensor assembly of the intelligent home-entry controller of the present invention;
FIG. 12 is a schematic structural diagram of an AD conversion module of the intelligent home-entry controller according to the present invention;
FIG. 13 is a schematic structural diagram of a motor control module of the intelligent home-entry controller of the present invention;
FIG. 14 is a schematic structural diagram of an indicator light module of the intelligent home-entry controller according to the present invention;
FIG. 15 is a schematic structural diagram of a first power module of the data collector of the present invention;
FIG. 16 is a schematic structural diagram of a first controller of the data collector of the present invention;
FIG. 17 is a schematic structural diagram of a LORA communication module of the data collector of the present invention;
FIG. 18 is a schematic structural diagram of a first communication interface of the data collector of the present invention;
fig. 19 is a schematic structural diagram of a SIM card socket of the data collector of the present invention;
FIG. 20 is a schematic structural diagram of a TF card holder of the data collector of the present invention;
FIG. 21 is a schematic structural diagram of a second communication interface of the data collector of the present invention;
FIG. 22 is a schematic structural diagram of a third communication interface of the data collector of the present invention;
FIG. 23 is a schematic structural diagram of a second controller of the data collector of the present invention;
FIG. 24 is a schematic structural diagram of a 3G communication module of the data collector of the present invention;
FIG. 25 is a schematic structural diagram of a second power module of the data collector of the present invention;
FIG. 26 is a schematic structural diagram of a 232 conversion circuit of the data collector of the present invention;
fig. 27 is a schematic structural diagram of a first level shift circuit of the data collector of the present invention;
FIG. 28 is a schematic structural diagram of a second level shift circuit of the data collector of the present invention;
FIG. 29 is a schematic structural diagram of a fourth communication interface of the data collector of the present invention;
FIG. 30 is a schematic structural diagram of a fifth communication interface of the data collector of the present invention;
FIG. 31 is a schematic structural diagram of a sixth communication interface of the data collector of the present invention;
the notation in the figures means: 101-a service valve body; 102-service valve seat; 103-an O-shaped sealing ring of a valve seat of the service valve; 104-an entrance valve flap; 105-service valve stem; 106-cylindrical spring; 107-service valve cover; 108-service valve thrust pad; 109-an O-shaped sealing ring of a valve rod of the service valve; 110-service valve central port pad; 111-service valve motor; 112-a turbine; 113-a first boss; 114-a second boss; 115-a first baffle; 116-a second baffle; 117-first pressure sensing hole; 118-a second pressure sensing port; 119-first temperature detection hole.
Detailed Description
The technical solution of the present invention is further described below with reference to the following embodiments and the accompanying drawings.
Example 1
The embodiment provides a heat supply intelligent control system, which comprises an indoor temperature controller, an intelligent home-entering controller, an electric home-entering regulating valve, a data acquisition unit and a server.
The indoor temperature controller is used for detecting indoor temperature and is in signal connection with the data collector so as to send the collected indoor temperature signal to the data collector; in this embodiment, indoor temperature controller pass through Lora communication module with data collection station signal connection to through Lora wireless communication realizes the remote wireless transmission of signal.
And the indoor temperature controller can also directly send a control instruction to the home-entering intelligent controller through the data acquisition unit, and the home-entering intelligent controller controls the motor of the home-entering electric regulating valve according to the control instruction.
The intelligent household-entering controller is used for collecting the temperature of circulating water passing through the household-entering electric regulating valve and controlling the household-entering electric regulating valve, and further, the intelligent household-entering controller is used for controlling the rotation of a motor of the household-entering electric regulating valve, so that the opening of the household-entering electric regulating valve is controlled, and the control of the flow of household hot water is realized.
The household electric regulating valve is arranged on the household hot water pipeline, and when the opening of the household electric regulating valve is changed, the flow of hot water in the household hot water pipeline can be changed.
And the intelligent home-entrance controller is connected with the data acquisition unit through signals.
The data collector is in signal connection with the server so as to send an indoor temperature signal detected by the indoor temperature controller and a circulating water temperature signal detected by the home-entry intelligent controller to the server, the server sends a control instruction of the home-entry electric regulating valve according to the indoor temperature signal or the circulating water temperature signal, and the data collector sends the control instruction of the home-entry electric regulating valve to the home-entry intelligent controller.
More preferably, the data collector is in signal connection with the server through a 3G communication system, so as to realize city-wide transmission of data through a base station of the 3G communication system; and the data acquisition unit is in signal connection with the intelligent home-entry controller through the Lora wireless communication module, so that the data acquisition unit can be networked with the indoor temperature controller and the intelligent home-entry controller.
When the intelligent heat supply control system is used, the server can be connected with a plurality of data collectors, the data collectors can be connected with a plurality of indoor temperature controllers and intelligent house-entry controllers, and a plurality of users can be managed through one data collector.
In this embodiment, preferably, the service electric regulating valve includes a service valve body 101, a service valve seat 102, a service valve flap 104, a service valve stem, and a service valve cover;
the service valve body 101 is of a hollow structure, one end of the service valve body 101 is a water inlet, and the other end of the service valve body 101 is a water outlet, in this embodiment, an inner side wall of the service valve body 101 protrudes inward to form an annular first protruding portion, an annular step is formed on an inner wall surface of the first protruding portion, a service valve seat is arranged in the annular step to form a fluid passage through the service valve seat, and more preferably, a service valve seat O-shaped sealing ring is arranged between the service valve seat and the annular step to seal the service valve seat and the annular step through the service valve seat O-shaped sealing ring 103.
The service valve seat is provided with a service valve clack, so that the service electric regulating valve is opened or closed through the rotation of the service valve clack, and the service electric regulating valve is regulated.
More preferably, the service valve seat is formed with a plurality of fan-shaped holes, and the service valve flap may be formed in a fan shape having an area larger than that of the fan-shaped holes, so that the service valve flap can complete the closing of the fan-shaped holes, and at this time, the service electric control valve is in a closed state, and when the service valve flap rotates from the closed state, the fan-shaped holes can be gradually opened, and the service electric control valve is in an open state.
Preferably, a plurality of stop blocks are formed on the service valve clack, and the lower end of the service valve rod is located between the stop blocks, so that the service valve clack can be driven to rotate when the service valve rod rotates.
In this embodiment, a stepped counter bore is formed in the middle of the valve rod of the service valve, a protrusion is formed at the upper end of the valve flap of the service valve, the protrusion of the valve flap of the service valve is located in the counter bore, and a cylindrical spring is arranged between the bottom wall of the counter bore and the valve flap of the service valve, so that the valve flap of the service valve can press the valve seat of the service valve, and the sealing performance between the valve flap of the service valve and the valve seat of the service valve is improved.
The outer side wall of the service valve body protrudes outwards to form an annular second boss, the second boss is of a hollow structure, a service valve cover is arranged on the second boss, and an electric actuator, such as a service valve motor, is fixed on the service valve cover; the upper end of the valve rod of the service valve penetrates through the valve cover of the service valve and is connected with the rotor of the electric actuator, namely, the valve rod of the service valve can be driven to rotate through the rotation of the electric actuator; in this embodiment, preferably, an entrance valve middle opening pad is disposed between the entrance valve cover and the second protruding portion, so that sealing between the entrance valve cover and the second protruding portion is achieved through the entrance valve middle opening pad.
In this embodiment, a plurality of service valve rod O-shaped sealing rings are provided between the circumferential surface of the service valve rod and the service valve cover.
The valve rod of the service valve is provided with a step, a service valve thrust pad is arranged between the step of the valve rod of the service valve and the valve cover of the service valve, and the service valve thrust pad is prepared from a graphite material so as to effectively reduce the friction force between the valve rod of the service valve and the valve cover of the service valve in the rotation process of the valve rod of the service valve through the lubricating action of the graphite material.
Moreover, a first baffle and a second baffle are further arranged in the valve body of the service valve, the first baffle and the second baffle are arranged in parallel, and two ends of a turbine shaft of the turbine are respectively and rotatably supported on the first baffle and the second baffle so as to detect the flow of water when the water flows through the turbine; preferably, a gap is formed between the lower end of the first baffle and the inner wall of the service valve body, and a gap is formed between the upper end of the second baffle and the inner wall of the service valve body, so that water can completely flow through the turbine, thereby improving the detection accuracy of the flow rate of water.
In this embodiment, an included angle between an axis of the service valve seat and an axis of the service valve body in the horizontal direction is 120 °.
More preferably, the service valve body, the first boss and the second boss may be integrally formed by casting.
The service valve body 1 is further provided with a first pressure detection hole 117 and a second pressure detection hole 118, in this embodiment, the first pressure detection hole 117 and the second pressure detection hole 118 are respectively located at two sides of the first protrusion 113, and the second protrusion 114 is provided with a first temperature detection hole 119.
The intelligent home-entry controller comprises a control unit, a first power supply module, a second power supply module, a Lora wireless communication module, an FSK wireless communication module, a valve opening sensor, a water flow sensor socket, a temperature sensor module, an AD conversion module and a motor control module.
The first power module is used for converting a +12V power supply into a +5V power supply (VDD), and the second power module is used for converting the +5V power supply into a +3.3V power supply (VCC).
First power module is used for to the control unit, valve opening sensor, water flow sensor socket, temperature sensor module, AD conversion module and motor control module provide the power, second power module is used for to Lora wireless communication module and FSK wireless communication module provide the power.
In this embodiment, the control unit includes a single chip microcomputer with a model SC91F732, a 7 th pin of the single chip microcomputer is grounded through a switch, a 31 th pin of the single chip microcomputer is connected to a +5V power supply, and a 32 th pin of the single chip microcomputer is grounded.
The Lora wireless communication module is in signal connection with the control unit to realize wireless communication between other equipment and the control unit, and in the embodiment, the Lora wireless communication module comprises a chip with the model of RA-01, a resistor R10, a resistor R11, a resistor R12, a resistor R13 and a resistor R34.
The 2 nd pin of the chip with the model of RA-01 is grounded, the 3 rd pin of the chip with the model of RA-01 is connected to a +3.3V power supply, and the 4 th pin of the chip with the model of RA-01 is connected to the 5 th pin of the singlechip; the 5 th pin of the chip with the model RA-01 is connected with the 11 th pin of the singlechip, and is connected with a +3.3V power supply through a resistor R10; the 9 th pin of the chip with the model of RA-01 is grounded, the 16 th pin of the chip with the model of RA-01 is grounded, and the 12 th pin of the chip with the model of RA-01 is connected to the 6 th pin of the singlechip and is connected to a +3.3V power supply through a resistor R34; the 13 th pin of the chip with the model of RA-01 is connected with the 8 th pin of the singlechip, and is connected with a +3.3V power supply through a resistor R13; the 14 th pin of the chip with the model of RA-01 is connected to the 9 th pin of the singlechip, and is connected to a +3.3V power supply through a resistor R12; and the 15 th pin of the chip with the model of RA-01 is connected to the 10 th pin of the singlechip, and is connected to a +3.3V power supply through a resistor R11.
The FSK wireless communication module is in signal connection with the single chip microcomputer to achieve wireless communication between other equipment and the control unit, and in the embodiment, the FSK wireless communication module comprises a chip of which the model is YL7139RF, a resistor R2, a resistor R3, a resistor R4 and a resistor R5.
The 2 nd pin and the 10 th pin of the chip with the model YL7139RF are grounded, the 4 th pin of the chip with the model YL7139RF is connected to the 18 th pin of the singlechip, the 6 th pin of the chip with the model YL7139RF is connected to the 19 th pin of the singlechip and is connected to a +3.3V power supply through a resistor R5; the 7 th pin of the chip with the model number YL7139RF is connected with the 20 th pin of the singlechip, and is connected with a +3.3V power supply through a resistor R4; the 8 th pin of the chip with the model YL7139RF is connected to the 21 st pin of the single chip microcomputer and is connected to a +3.3V power supply through a resistor R3, and the 9 th pin of the chip with the model YL7139RF is connected to the +3.3V power supply.
The valve opening sensor set up in on electric actuator's the rotor to rotation angle through detecting electric actuator obtains the valve opening, and signal connection in the singlechip, with the valve opening signal transmission who detects it extremely the singlechip, the valve opening sensor includes that the model is SV01A103AEA01R 00's rotation angle sensor, rotation angle sensor's one end is connected in +5V power, rotation angle sensor's the other end ground connection, rotation angle sensor's slip end is connected in the 25 th pin of singlechip to through electric capacity C4 and resistance R30 ground connection.
The water flow sensor socket is connected with the single chip microcomputer through signals, so that after the water flow sensor is installed on the water flow sensor socket, water flow signals detected by the water flow sensor can be sent to the single chip microcomputer, in the embodiment, a1 st pin of the water flow sensor socket is connected with a +5V power supply, a 2 nd pin of the water flow sensor socket is connected with a 16 th pin of the single chip microcomputer, and a 3 rd pin of the water flow sensor is grounded.
In this embodiment, the temperature sensor module is configured to detect a water temperature, is disposed in the temperature detection hole 119, and is configured to detect the water temperature entering the electric control valve, and is connected to the control unit through an AD conversion module in a signal manner so as to send the detected water temperature to the control unit, in this embodiment, the temperature sensor module includes a temperature sensor of type PT1000, one end of the temperature sensor is connected to a +5V power supply through a resistor R20, and the other end of the temperature sensor is grounded; the resistor R21 and the resistor R22 are connected in series and are connected to a +5V power supply and the ground; one end of the temperature sensor connected with the resistor R20 is connected with the AD conversion module through a resistor R24, and meanwhile, one end of the resistor R21 connected with the resistor R23 is connected with the AD conversion module through a resistor R23.
Preferably, the AD conversion module includes a chip of which the model is ADs1115, the 1 st pin, the 2 nd pin and the 3 rd pin of the chip of which the model is ADs1115 are all connected to a +5V power supply through a resistor R19, one end of the temperature sensor connected with a resistor R20 is connected to the 7 th pin of the chip of which the model is ADs1115 through a resistor R24, one end of the resistor R21 connected with the resistor R23 is connected to the 6 th pin of the AD conversion module through a resistor R23, the 9 th pin of the chip of which the model is ADs1115 is connected to the 29 th pin of the single chip microcomputer and is connected to a +5V power supply through a resistor R18, the 10 th pin of the chip of which the model is ADs1115 is connected to the 28 th pin of the single chip microcomputer and is connected to a +5V power supply through a resistor R17.
The motor control module is connected to the control unit so as to realize the rotation of the motor under the control of the control unit. The motor control module comprises a resistor R9, a resistor R7, a resistor R8, a resistor R6, a capacitor E1, a triode Q1, a triode Q2, a field-effect tube Q3, a field-effect tube Q4 and a capacitor C3.
The 1 st pin of the single chip microcomputer is connected to a +5V power supply through a resistor R9 and a resistor R7, and the 2 nd pin of the single chip microcomputer is connected to the +5V power supply through a resistor R8 and a resistor R6; the +5V power supply is grounded through a capacitor E1; the base electrode of the triode Q1 is connected to the connection position of the resistor R8 and the resistor R8, the emitter electrode of the triode Q1 is connected with the +5V power supply, the collector electrode of the triode Q1 is connected to the collector electrode of the triode Q2 through the capacitor C3, the base electrode of the triode Q2 is connected to the connection position of the resistor R9 and the resistor R7, and the emitter electrode of the triode Q2 is connected with the +5V power supply.
The grid electrode of the field effect transistor Q3 is connected to the No. 2 pin of the singlechip, the drain electrode of the field effect transistor Q3 is grounded, and the source electrode of the field effect transistor Q3 is connected to the collector electrode of the triode Q1; the grid electrode of the field effect transistor Q4 is connected to the 1 st pin of the singlechip, the drain electrode of the field effect transistor Q4 is grounded, and the source electrode of the field effect transistor Q4 is connected to the collector electrode of the triode Q2.
The motors are respectively connected with the source electrode of the field effect transistor Q3 and the source electrode of the field effect transistor Q4.
The intelligent home-entrance controller also comprises an indicator light module, and specifically, a 12 th pin and a 13 th pin of the single chip microcomputer are connected to a +5V power supply through a first light-emitting diode and a resistor R32; the 14 th pin and the 15 th pin of the single chip microcomputer are connected to a +5V power supply through a second light-emitting diode and a resistor R33, and the +5V power supply is grounded through a resistor R31 and a third light-emitting diode.
In this embodiment, the data collector includes a LORA communication system, an interface system, and a 3G communication system.
The LORA communication system includes a first power module, a first controller, a LORA communication module, and a first communication interface.
The first power module converts an externally input (e.g., +9V) dc power into +5V and +3.3V dc power and is used to supply power to the first controller, the LORA communication module, and the first communication interface.
In this embodiment, the first power module may include a first circuit and a second circuit, where the first circuit is configured to convert a +9V power into a +5V power, for example, by using a chip of a model 1117-5.0; the second circuit is used for converting a +5V power supply into a +3.3V power supply, and is realized by a chip with a model number of 1117-3.3.
The first controller is a single chip microcomputer with the model number of SC92F732-16, a first pin of the first controller is connected to a +5V power supply, and a 2 nd pin of the first controller is grounded.
The LORA communication module is in signal connection with the first controller so that other equipment can be in signal connection with the first controller through the LORA communication module, wherein, the LORA communication module comprises a chip with the model of RA-01, the 2 nd pin and the 9 th pin of the chip with the model of RA-01 are grounded, the 3 rd pin of the chip with the model of RA-01 is connected with a +3.3V power supply, the 4 th pin of the chip with the model RA-01 is connected with the 12 th pin of the first controller, the 5 th pin of the chip with the model RA-01 is connected with the 11 th pin of the first controller, the chip is connected to a +3.3V power supply through a resistor R1, and the 12 th pin of the chip with the model RA-01 is connected to the 8 th pin of the first controller and is connected to the +3.3V power supply through a resistor R5; the 13 th pin of the chip with the model RA-01 is connected to the 7 th pin of the first controller and is connected to a +3.3V power supply through a resistor R4; the 14 th pin of the chip with the model RA-01 is connected to the 4 th pin of the first controller and is connected to a +3.3V power supply through a resistor R3, and the 15 th pin of the chip with the model RA-01 is connected to the 3 rd pin of the first controller and is connected to the +3.3V power supply through a resistor R2; and the 16 th pin of the chip with the model RA-01 is grounded.
In this embodiment, the 1 st pin of the first communication interface is connected to a +5V power supply, the 2 nd pin and the 4 th pin of the first communication interface are grounded, the 5 th pin of the first communication interface is connected to the 5 th pin of the first controller, the 6 th pin of the first communication interface is connected to the 6 th pin of the first controller, and the 8 th pin of the first communication interface is connected to the 16 th pin of the first controller through a resistor R6.
The interface system comprises an SIM card holder, a TF card holder, a second communication interface and a third communication interface;
a1 st pin of the SIM card holder is connected to a 12 th pin of a third communication interface, a 2 nd pin of the SIM card holder is connected to an 8 th pin of the third communication interface, a 3 rd pin of the SIM card holder is connected to a10 th pin of the third communication interface, a 4 th pin of the SIM card holder is connected to a 6 th pin of the third communication interface, and the 6 th pin of the SIM card holder is grounded.
The 1 st pin of the TF cassette is connected to the 3 rd pin of the second communication interface, the 2 nd pin of the TF cassette is connected to the 4 th pin of the second communication interface, the 3 rd pin of the TF cassette is connected to the 6 th pin of the second communication interface, the 4 th pin of the TF cassette is connected to the 9 th pin of the second communication interface, the 5 th pin of the TF cassette is connected to the 5 th pin of the second communication interface, the 6 th pin of the TF cassette is grounded, the 7 th pin of the TF cassette is connected to the 8 th pin of the second communication interface, and the 8 th pin of the TF cassette is connected to the 7 th pin of the second communication interface.
The 2 nd pin of the second communication interface is grounded, and the 1 st pin, the 3 rd pin, the 5 th pin and the 4 th pin of the third communication interface are respectively connected to a +5V power supply through LED diodes, so that when the pins are at a low level, the corresponding LED diodes are turned on.
And the 2 nd pin of the third communication interface is grounded through a reset switch.
The 3G communication system comprises a second controller, a 3G communication module, a second power supply module, a 232 conversion circuit, a first level conversion circuit, a second level conversion circuit, a fourth communication interface, a fifth communication interface and a sixth communication interface.
The second controller is the singlechip that the model is FM8PC71AS-C03-14, the 1 st pin of second controller is connected in +5V power, the 14 th pin ground connection of second controller, the 12 th pin of second controller passes through resistance R20 and connects in triode Q3's base, triode Q3's emitter ground, the 10 th pin DOG5 of second controller is connected in the 19 th pin of first level conversion circuit.
The 3G communication module is a chip of SIM 5360; the 1 st pin and the 2 nd pin of the chip of the SIM5360 are grounded, and the 3 rd pin of the chip of the SIM5360 is connected to the collector of the triode Q3; the 4 th pin of the chip of the SIM5360 is grounded through a capacitor C7 and is connected to the 11 th pin of the second controller, and the 5 th pin of the chip of the SIM5360 is grounded; the 10 th pin of the chip of the SIM5360 is grounded, the 11 th pin of the chip of the SIM5360 is connected to VBUS (+5V) through a resistor R4, and is grounded through a capacitor C12 and a capacitor E9 respectively; the 14 th pin of the chip of the SIM5360 is grounded; the 15 th pin of the chip of the SIM5360 is connected to a +1.8V power supply; a 17 th pin of the chip of the SIM5360 is connected to a 3 rd pin of an ESD protection chip TVS5 (model number PRTR5V0U2X) through a resistor R5, a1 st pin of the ESD protection chip TVS5 is grounded, and a 2 nd pin of the ESD protection chip TVS5 is connected to an 18 th pin of the chip of the SIM5360 through a resistor R6; the 4 th pin of the ESD protection chip TVS5 is connected to the 20 th pin of the chip of the SIM 5360; a 19 th pin of the chip of the SIM5360 is connected to a 3 rd pin of a TVS6 of an ESD protection chip through a resistor R7, a1 st pin of the TVS6 of the ESD protection chip is grounded, a 4 th pin of the TVS6 of the ESD protection chip is connected to a 20 th pin of the chip of the SIM5360, and the 20 th pin of the chip of the SIM5360 is grounded through a capacitor C8, a capacitor C9 and a capacitor E7, respectively; the 81 st pin of the chip of the SIM5360 is grounded; the 37 th pin, the 38 th pin, the 39 th pin, the 40 th pin and the 41 th pin of the chip of the SIM5360 are grounded; the 42 th pin of the chip of the SIM5360 is grounded through a capacitor E6 and a capacitor C6 respectively, and is connected to a +3.3V power supply through a resistor Rsc and a reversely connected diode D1 and the anode of a battery, and the cathode of the battery is grounded; the 43 rd pin of the chip of the SIM5360 is grounded; the 44 th pin of the chip of the SIM5360 is connected to VDDE (+ 3.3V); the 48 th pin of the chip of the SIM5360 is connected to the base electrode of a triode Q2 through a resistor R10, and the emitter electrode of the triode Q2 is grounded; the 51 st pin of the chip of the SIM5360 is connected to the base electrode of a triode Q1 through a resistor R8, and the emitter electrode of the triode Q1 is grounded; the 57 th pin and the 58 th pin of the chip of the SIM5360 are grounded, and the 59 th pin of the chip of the SIM5360 is connected to the 3G antenna; the 60 th pin, the 61 st pin, the 64 th pin, the 65 th pin and the 66 th pin of the chip of the SIM5360 are grounded; the 62 th pin and the 63 th pin of the chip of the SIM5360 are connected to VBATT + (+ 4.2V); the 72 th pin, the 77 th pin, the 78 th pin and the 80 th pin of the chip of the SIM5360 are grounded; the 79 th pin of the chip of the SIM5360 is connected to the GPS antenna.
The fourth communication interface is the same as the first communication interface in interface and is in communication connection with the first communication interface; in this embodiment, the 1 st pin of the fourth communication interface is connected to a +5V power supply, and the 3 rd pin of the fourth communication interface is connected to VDD; the 2 nd pin and the 4 th pin of the fourth communication interface are grounded; the 5 th pin of the fourth communication interface is connected to the 20 th pin of the first level shift circuit, the sixth pin of the fourth communication interface is connected to the 20 th pin of the second level shift circuit, the 7 th pin of the fourth communication interface is connected to the 19 th pin of the second level shift circuit, the 10 th pin of the fourth communication interface is connected to a +36V power supply, and the 8 th pin of the fourth communication interface is connected to the 4 th pin of the sixth communication interface.
In this embodiment, a 2 nd pin of the fifth communication interface is grounded, a 3 rd pin of the fifth communication interface is connected with a 24 th pin of the chip of the SIM5360, a 4 th pin of the fifth communication interface is connected with a 25 th pin of the chip of the SIM5360, a 5 th pin of the fifth communication interface is connected with a 26 th pin of the chip of the SIM5360, a 6 th pin of the fifth communication interface is connected with a 21 st pin of the chip of the SIM5360, a 7 th pin of the fifth communication interface is connected with a 23 th pin of the chip of the SIM5360, an 8 th pin of the fifth communication interface is connected with a 22 th pin of the chip of the SIM5360, and a 9 th pin of the fifth communication interface is connected to VDDE; the 4 th pin of the fifth communication interface is grounded through a resistor R3.
The sixth communication interface and the third communication interface have the same interface and are communicatively connected to each other, in this embodiment, a1 st pin of the sixth communication interface is connected to a collector of a transistor Q2, and a 2 nd pin of the sixth communication interface is connected to a collector of the transistor Q3; the 3 rd pin of the sixth communication interface is connected to the collector of the triode Q1; the 5 th pin of the sixth communication interface is grounded through a resistor R12, and the 6 th pin of the sixth communication interface is connected to the 17 th pin of the chip of the SIM5360 through a resistor R5; the 8 th pin of the sixth communication interface is connected to the 18 th pin of the chip of the SIM5360 through a resistor R6; the 10 th pin of the sixth communication interface is connected to the 19 th pin of the chip of the SIM5360 through a resistor R7; the 12 th pin of the sixth communication interface is connected to the 20 th pin of the chip of the SIM 5360; a 14 th pin of the sixth communication interface is connected to a +5V power supply; a 16 th pin of the sixth communication interface is grounded; the 11 th pin of the sixth communication interface is connected to the 14 th pin of the 232 conversion circuit, and the 13 th pin of the sixth communication interface is connected to the 13 th pin of the 232 conversion circuit; and the 15 th pin of the sixth communication interface is connected to the 19 th pin of the second level shift circuit.
The 232 conversion circuit comprises a chip with a model of MAX232, wherein a1 st pin of the 232 conversion circuit is connected to a 3 rd pin thereof through a capacitor C14, a 2 nd pin of the 232 conversion circuit is connected to a +5V power supply through a capacitor C13, a 16 th pin of the 232 conversion circuit is connected to a +5V power supply, a 4 th pin of the 232 conversion circuit is connected to a 5 th pin thereof through a capacitor C15, a 6 th pin of the 232 conversion circuit is grounded through a capacitor C16, a 15 th pin of the 232 conversion circuit is grounded, an 11 th pin of the 232 conversion circuit is connected to a 21 th pin of the first level conversion circuit, and a 12 th pin of the 232 conversion circuit is connected to a 21 th pin of the second level conversion circuit.
The first level conversion circuit comprises a chip with a model number SN74LVC8T245, a1 st pin of the first level conversion circuit is connected to a +1.8V power supply, a 2 nd pin of the first level conversion circuit is grounded through a resistor R27, a 3 rd pin of the first level conversion circuit is connected to an 8 th pin of the 3G communication module, a 4 th pin of the first level conversion circuit is connected to a 71 th pin of the 3G communication module, a 4 th pin of the first level conversion circuit is connected to a 50 th pin of the 3G communication module, and 6 th to 13 th pins of the first level conversion circuit are grounded; the 22 nd pin of the first level shift circuit is grounded, and the 23 rd pin and the 24 th pin of the first level shift circuit are connected to a +5V power supply.
The second level conversion circuit comprises a chip with a model number of SN74LVC8T245, a1 st pin of the second level conversion circuit is connected to a +1.8V power supply, a 2 nd pin of the second level conversion circuit is grounded, a 3 rd pin of the second level conversion circuit is connected to a 7 th pin of the 3G communication module, a 4 th pin of the second level conversion circuit is connected to a 68 th pin of the 3G communication module, a 4 th pin of the second level conversion circuit is connected to a 53 th pin of the 3G communication module, and the 7 th pin to the 13 th pin of the second level conversion circuit are grounded; a 22 th pin of the second level conversion circuit is grounded, and a 23 th pin and a 24 th pin of the second level conversion circuit are connected to a +5V power supply; the 20 th pin of the second level shift circuit is grounded through a resistor R19 and a capacitor C11.
The indoor temperature controller comprises a temperature sensor, a single chip microcomputer and a Lora wireless communication module, and the circuit structure of the indoor temperature controller is the same as that of the intelligent home-entry controller, and the indoor temperature controller is not detailed one by one.
The intelligent heat supply control system of the embodiment collects indoor temperature through an indoor temperature controller or collects circulating water temperature through an intelligent house-entering controller, the indoor temperature signal or the circulating water temperature signal is transmitted to the server through a data collector, the server sends a control instruction of the electric house-entering regulating valve according to the indoor temperature signal or the circulating water temperature signal, the data collector sends the control instruction of the electric house-entering regulating valve to the intelligent house-entering controller, so that the electric house-entering regulating valve is regulated, balance of supply and demand is realized effectively by controlling hot water flow, accurate heat supply is realized according to the demand, the comfort level demand of a heat user is met, and energy consumption is reduced.
The sequence of the above embodiments is only for convenience of description and does not represent the advantages and disadvantages of the embodiments.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (1)
1. An intelligent heat supply control system is characterized by comprising an indoor temperature controller, an intelligent house-entering controller, an electric house-entering regulating valve, a data acquisition unit and a server;
the service electric regulating valve comprises a service valve body, a service valve seat, a service valve clack, a service valve rod and a service valve cover;
the service valve body is of a hollow structure, one end of the service valve body is a water inlet, the other end of the service valve body is a water outlet, an annular first bulge part is formed on the inner side wall of the service valve body and protrudes inwards, an annular step is formed on the inner wall surface of the first bulge part, a service valve seat is arranged in the annular step, and a service valve seat O-shaped sealing ring is arranged between the service valve seat and the annular step; the valve seat of the service valve is provided with a service valve clack;
a plurality of fan-shaped holes are formed in the valve seat of the service valve, and the valve clack of the service valve is formed into a fan-shaped shape with the area larger than that of the fan-shaped holes;
the valve clack of the service valve is fixedly provided with a valve rod of the service valve, a plurality of stop blocks are formed on the valve clack of the service valve, and the lower end of the valve rod of the service valve is positioned between the stop blocks;
a stepped counter bore is formed in the middle of the valve rod of the service valve, a bulge is formed at the upper end of the valve clack of the service valve, the bulge of the valve clack of the service valve is positioned in the counter bore, and a cylindrical spring is arranged between the bottom wall of the counter bore and the valve clack of the service valve;
the outer side wall of the service valve body protrudes outwards to form an annular second boss, the second boss is of a hollow structure, a service valve cover is arranged on the second boss, and a motor is fixed on the service valve cover; the upper end of the valve rod of the service valve penetrates through the valve cover of the service valve and is connected with the rotor of the motor, and a service valve middle opening pad is arranged between the valve cover of the service valve and the second bulge;
a plurality of service valve rod O-shaped sealing rings are arranged between the circumferential surface of the service valve rod and the service valve cover, and the plurality of service valve rod O-shaped sealing rings are arranged in parallel;
a step is formed on the valve rod of the service valve, and a service valve thrust pad is arranged between the step of the valve rod of the service valve and the valve cover of the service valve;
a first baffle and a second baffle are further arranged in the service valve body and are arranged in parallel, and two ends of a turbine shaft of the turbine are rotatably supported on the first baffle and the second baffle respectively; a gap is formed between the lower end of the first baffle and the inner wall of the service valve body, and a gap is formed between the upper end of the second baffle and the inner wall of the service valve body, so that water flow can completely flow through the turbine;
an included angle between the axis of the service valve seat and the axis of the service valve body in the horizontal direction is 120 degrees;
the service valve body is also provided with a first pressure detection hole and a second pressure detection hole, the first pressure detection hole and the second pressure detection hole are respectively positioned at two sides of the first bulge, and the second bulge is provided with a first temperature detection hole;
the indoor temperature controller is used for detecting indoor temperature and is in signal connection with the data collector so as to send the collected indoor temperature signal to the data collector;
the house-entering intelligent controller is used for collecting the temperature of circulating water passing through the house-entering electric regulating valve and controlling the house-entering electric regulating valve;
the intelligent house-entering controller is connected with the data acquisition unit through signals;
the data acquisition unit is in signal connection with the server so as to send the indoor temperature signal detected by the indoor temperature controller and the circulating water temperature signal detected by the intelligent home-entry controller to the server;
the server sends a control instruction of the household electric regulating valve according to the indoor temperature signal or the circulating water temperature signal;
the data acquisition unit sends a control command of the home-entering electric regulating valve to the home-entering intelligent controller;
the intelligent home-entrance controller comprises a control unit, a first power supply module, a second power supply module, a Lora wireless communication module, an FSK wireless communication module, a valve opening sensor, a water flow sensor socket, a temperature sensor module, an AD conversion module and a motor control module;
the first power supply module is used for converting a +12V power supply into a +5V power supply, and the second power supply module is used for converting the +5V power supply into a +3.3V power supply;
the first power supply module is used for supplying power to the control unit, the valve opening sensor, the water flow sensor socket, the temperature sensor module, the AD conversion module and the motor control module, and the second power supply module is used for supplying power to the Lora wireless communication module and the FSK wireless communication module;
the Lora wireless communication module, the FSK wireless communication module, the valve opening sensor and the water flow sensor socket are in signal connection with the control unit; the temperature sensor assembly is in signal connection with the control unit through an AD conversion module, the control unit is in signal connection with the motor control module, and the motor control module is connected with a motor of the household electric regulating valve;
the valve opening sensor is arranged on the motor and used for detecting the rotation angle of the electronic rotor;
the data acquisition unit comprises an LORA communication system, an interface system and a 3G communication system;
the LORA communication system comprises a first power supply module, a first controller, a LORA communication module and a first communication interface;
the first power supply module is used for supplying power to the first controller, the LORA communication module and the first communication interface;
the first communication interface and the LORA communication module are in signal connection with the first controller;
the interface system comprises an SIM card holder, a TF card holder, a second communication interface and a third communication interface;
the SIM card seat is in signal connection with the third communication interface;
the TF card holder is in signal connection with the second communication interface;
the 3G communication system comprises a second controller, a 3G communication module, a second power supply module, a 232 conversion circuit, a first level conversion circuit, a second level conversion circuit, a fourth communication interface, a fifth communication interface and a sixth communication interface;
the second controller is in signal connection with the 3G communication module;
the fourth communication interface is the same as the first communication interface in interface and is in communication connection with the first communication interface;
the fifth communication interface is the same as the second communication interface in interface and is in communication connection with the second communication interface;
the sixth communication interface is the same as the third communication interface in interface and is in communication connection with the third communication interface;
the fourth communication interface is in signal connection with the 3G communication module through a first level conversion circuit and a second level conversion circuit;
the fifth communication interface is in signal connection with the 3G communication module, part of terminals of the sixth communication interface are in signal connection with the 3G communication module, the other part of terminals of the sixth communication interface are connected with a 232 conversion circuit, and the 232 conversion circuit is connected with the 3G communication module through a first level conversion circuit and a second level conversion circuit;
the control unit comprises a single chip microcomputer with the model number of SC91F732, the 7 th pin of the single chip microcomputer is grounded through a switch, the 31 st pin of the single chip microcomputer is connected to a +5V power supply, and the 32 nd pin of the single chip microcomputer is grounded;
the Lora wireless communication module comprises a chip with the model of RA-01, a resistor R10, a resistor R11, a resistor R12, a resistor R13 and a resistor R34;
the 2 nd pin of the chip with the model of RA-01 is grounded, the 3 rd pin of the chip with the model of RA-01 is connected to a +3.3V power supply, and the 4 th pin of the chip with the model of RA-01 is connected to the 5 th pin of the singlechip; the 5 th pin of the chip with the model RA-01 is connected with the 11 th pin of the singlechip, and is connected with a +3.3V power supply through a resistor R10; the 9 th pin of the chip with the model of RA-01 is grounded, the 16 th pin of the chip with the model of RA-01 is grounded, and the 12 th pin of the chip with the model of RA-01 is connected to the 6 th pin of the singlechip and is connected to a +3.3V power supply through a resistor R34; the 13 th pin of the chip with the model of RA-01 is connected with the 8 th pin of the singlechip, and is connected with a +3.3V power supply through a resistor R13; the 14 th pin of the chip with the model of RA-01 is connected to the 9 th pin of the singlechip, and is connected to a +3.3V power supply through a resistor R12; the 15 th pin of the chip with the model RA-01 is connected to the 10 th pin of the single chip microcomputer and is connected to a +3.3V power supply through a resistor R11;
the FSK wireless communication module comprises a chip with the model number YL7139RF, a resistor R2, a resistor R3, a resistor R4 and a resistor R5;
the 2 nd pin and the 10 th pin of the chip with the model YL7139RF are grounded, the 4 th pin of the chip with the model YL7139RF is connected to the 18 th pin of the singlechip, the 6 th pin of the chip with the model YL7139RF is connected to the 19 th pin of the singlechip and is connected to a +3.3V power supply through a resistor R5; the 7 th pin of the chip with the model number YL7139RF is connected with the 20 th pin of the singlechip, and is connected with a +3.3V power supply through a resistor R4; the 8 th pin of the chip with the model YL7139RF is connected to the 21 st pin of the singlechip and is connected to a +3.3V power supply through a resistor R3, and the 9 th pin of the chip with the model YL7139RF is connected to the +3.3V power supply;
the temperature sensor module comprises a temperature sensor with the model number of PT1000, one end of the temperature sensor is connected to a +5V power supply through a resistor R20, and the other end of the temperature sensor is grounded; the resistor R21 and the resistor R22 are connected in series and are connected to a +5V power supply and the ground; one end of the temperature sensor, which is connected with the resistor R20, is connected with the AD conversion module through a resistor R24, and one end of the resistor R21, which is connected with the resistor R23, is connected with the AD conversion module through a resistor R23;
the AD conversion module comprises a chip with the model of ADS1115, wherein the 1 st pin, the 2 nd pin and the 3 rd pin of the chip with the model of ADS1115 are connected to a +5V power supply through resistors R19, one end of the temperature sensor, which is connected with a resistor R20, is connected to the 7 th pin of the chip with the model of ADS1115 through a resistor R24, one end of the resistor R21, which is connected with a resistor R23, is connected to the 6 th pin of the AD conversion module through a resistor R23, the 9 th pin of the chip with the model of ADS1115 is connected to the 29 th pin of the singlechip and is connected to the +5V power supply through a resistor R18, and the 10 th pin of the chip with the model of ADS1115 is connected to the 28 th pin of the singlechip and is connected to the +5V power supply through a resistor R39;
the motor control module comprises a resistor R9, a resistor R7, a resistor R8, a resistor R6, a capacitor E1, a triode Q1, a triode Q2, a field-effect tube Q3, a field-effect tube Q4 and a capacitor C3;
the 1 st pin of the single chip microcomputer is connected to a +5V power supply through a resistor R9 and a resistor R7, and the 2 nd pin of the single chip microcomputer is connected to the +5V power supply through a resistor R8 and a resistor R6; the +5V power supply is grounded through a capacitor E1; the base electrode of the triode Q1 is connected with the connection part of a resistor R8 and a resistor R8, the emitter electrode of the triode Q1 is connected with a +5V power supply, the collector electrode of the triode Q1 is connected with the collector electrode of the triode Q2 through a capacitor C3, the base electrode of the triode Q2 is connected with the connection part of the resistor R9 and a resistor R7, and the emitter electrode of the triode Q2 is connected with the +5V power supply;
the grid electrode of the field effect transistor Q3 is connected to the No. 2 pin of the singlechip, the drain electrode of the field effect transistor Q3 is grounded, and the source electrode of the field effect transistor Q3 is connected to the collector electrode of the triode Q1; the grid electrode of the field effect transistor Q4 is connected to the 1 st pin of the singlechip, the drain electrode of the field effect transistor Q4 is grounded, and the source electrode of the field effect transistor Q4 is connected to the collector electrode of the triode Q2;
the motors are respectively connected with the source electrode of the field effect transistor Q3 and the source electrode of the field effect transistor Q4;
the second controller is a single chip microcomputer with the model number FM8PC71AS-C03-14, the 1 st pin of the second controller is connected to a +5V power supply, the 14 th pin of the second controller is grounded, the 12 th pin of the second controller is connected to the base electrode of a triode Q3 through a resistor R20, the emitter electrode of the triode Q3 is grounded, and the 10 th pin DOG5 of the second controller is connected to the 19 th pin of the first level conversion circuit;
the 3G communication module is a chip of SIM 5360; the 1 st pin and the 2 nd pin of the chip of the SIM5360 are grounded, and the 3 rd pin of the chip of the SIM5360 is connected to the collector of the triode Q3; the 4 th pin of the chip of the SIM5360 is grounded through a capacitor C7 and is connected to the 11 th pin of the second controller, and the 5 th pin of the chip of the SIM5360 is grounded; the 10 th pin of the chip of the SIM5360 is grounded, the 11 th pin of the chip of the SIM5360 is connected to VBUS through a resistor R4 and is grounded through a capacitor C12 and a capacitor E9 respectively; the 14 th pin of the chip of the SIM5360 is grounded; the 15 th pin of the chip of the SIM5360 is connected to a +1.8V power supply; the 17 th pin of the chip of the SIM5360 is connected to the 3 rd pin of the ESD protection chip TVS5 through a resistor R5, the 1 st pin of the ESD protection chip TVS5 is grounded, and the 2 nd pin of the ESD protection chip TVS5 is connected to the 18 th pin of the chip of the SIM5360 through a resistor R6; the 4 th pin of the ESD protection chip TVS5 is connected to the 20 th pin of the chip of the SIM 5360; a 19 th pin of the chip of the SIM5360 is connected to a 3 rd pin of a TVS6 of an ESD protection chip through a resistor R7, a1 st pin of the TVS6 of the ESD protection chip is grounded, a 4 th pin of the TVS6 of the ESD protection chip is connected to a 20 th pin of the chip of the SIM5360, and the 20 th pin of the chip of the SIM5360 is grounded through a capacitor C8, a capacitor C9 and a capacitor E7, respectively; the 81 st pin of the chip of the SIM5360 is grounded; the 37 th pin, the 38 th pin, the 39 th pin, the 40 th pin and the 41 th pin of the chip of the SIM5360 are grounded; the 42 th pin of the chip of the SIM5360 is grounded through a capacitor E6 and a capacitor C6 respectively, and is connected to a +3.3V power supply through a resistor Rsc and a reversely connected diode D1 and the anode of a battery, and the cathode of the battery is grounded; the 43 rd pin of the chip of the SIM5360 is grounded; the 44 th pin of the chip of the SIM5360 is connected to VDDE; the 48 th pin of the chip of the SIM5360 is connected to the base electrode of a triode Q2 through a resistor R10, and the emitter electrode of the triode Q2 is grounded; the 51 st pin of the chip of the SIM5360 is connected to the base electrode of a triode Q1 through a resistor R8, and the emitter electrode of the triode Q1 is grounded; the 57 th pin and the 58 th pin of the chip of the SIM5360 are grounded, and the 59 th pin of the chip of the SIM5360 is connected to the 3G antenna; the 60 th pin, the 61 st pin, the 64 th pin, the 65 th pin and the 66 th pin of the chip of the SIM5360 are grounded; the 62 th pin and the 63 th pin of the chip of the SIM5360 are connected to VBATT +; the 72 th pin, the 77 th pin, the 78 th pin and the 80 th pin of the chip of the SIM5360 are grounded; the 79 th pin of the chip of the SIM5360 is connected with a GPS antenna;
the 1 st pin of the fourth communication interface is connected to a +5V power supply, and the 3 rd pin of the fourth communication interface is connected to VDD; the 2 nd pin and the 4 th pin of the fourth communication interface are grounded; a 5 th pin of the fourth communication interface is connected to a 20 th pin of the first level shift circuit, a sixth pin of the fourth communication interface is connected to a 20 th pin of the second level shift circuit, a 7 th pin of the fourth communication interface is connected to a 19 th pin of the second level shift circuit, a10 th pin of the fourth communication interface is connected to a +36V power supply, and a 8 th pin of the fourth communication interface is connected to a 4 th pin of the sixth communication interface;
a 2 nd pin of the fifth communication interface is grounded, a 3 rd pin of the fifth communication interface is connected with a 24 th pin of the chip of the SIM5360, a 4 th pin of the fifth communication interface is connected with a 25 th pin of the chip of the SIM5360, a 5 th pin of the fifth communication interface is connected with a 26 th pin of the chip of the SIM5360, a 6 th pin of the fifth communication interface is connected with a 21 st pin of the chip of the SIM5360, a 7 th pin of the fifth communication interface is connected with a 23 th pin of the chip of the SIM5360, an 8 th pin of the fifth communication interface is connected with a 22 th pin of the chip of the SIM5360, and a 9 th pin of the fifth communication interface is connected to VDDE; the 4 th pin of the fifth communication interface is grounded through a resistor R3;
a1 st pin of the sixth communication interface is connected to a collector of a transistor Q2, and a 2 nd pin of the sixth communication interface is connected to a collector of the transistor Q3; the 3 rd pin of the sixth communication interface is connected to the collector of the triode Q1; the 5 th pin of the sixth communication interface is grounded through a resistor R12, and the 6 th pin of the sixth communication interface is connected to the 17 th pin of the chip of the SIM5360 through a resistor R5; the 8 th pin of the sixth communication interface is connected to the 18 th pin of the chip of the SIM5360 through a resistor R6; the 10 th pin of the sixth communication interface is connected to the 19 th pin of the chip of the SIM5360 through a resistor R7; the 12 th pin of the sixth communication interface is connected to the 20 th pin of the chip of the SIM 5360; a 14 th pin of the sixth communication interface is connected to a +5V power supply; a 16 th pin of the sixth communication interface is grounded; the 11 th pin of the sixth communication interface is connected to the 14 th pin of the 232 conversion circuit, and the 13 th pin of the sixth communication interface is connected to the 13 th pin of the 232 conversion circuit; a 15 th pin of the sixth communication interface is connected to a 19 th pin of the second level shift circuit;
the 232 conversion circuit comprises a chip with a model of MAX232, wherein a1 st pin of the 232 conversion circuit is connected to a 3 rd pin thereof through a capacitor C14, a 2 nd pin of the 232 conversion circuit is connected to a +5V power supply through a capacitor C13, a 16 th pin of the 232 conversion circuit is connected to a +5V power supply, a 4 th pin of the 232 conversion circuit is connected to a 5 th pin thereof through a capacitor C15, a 6 th pin of the 232 conversion circuit is grounded through a capacitor C16, a 15 th pin of the 232 conversion circuit is grounded, an 11 th pin of the 232 conversion circuit is connected to a 21 th pin of the first level conversion circuit, and a 12 th pin of the 232 conversion circuit is connected to a 21 th pin of the second level conversion circuit;
the first level conversion circuit comprises a chip with a model number SN74LVC8T245, a1 st pin of the first level conversion circuit is connected to a +1.8V power supply, a 2 nd pin of the first level conversion circuit is grounded through a resistor R27, a 3 rd pin of the first level conversion circuit is connected to an 8 th pin of the 3G communication module, a 4 th pin of the first level conversion circuit is connected to a 71 th pin of the 3G communication module, a 4 th pin of the first level conversion circuit is connected to a 50 th pin of the 3G communication module, and 6 th to 13 th pins of the first level conversion circuit are grounded; a 22 nd pin of the first level conversion circuit is grounded, and a 23 rd pin and a 24 th pin of the first level conversion circuit are connected to a +5V power supply;
the second level conversion circuit comprises a chip with a model number of SN74LVC8T245, a1 st pin of the second level conversion circuit is connected to a +1.8V power supply, a 2 nd pin of the second level conversion circuit is grounded, a 3 rd pin of the second level conversion circuit is connected to a 7 th pin of the 3G communication module, a 4 th pin of the second level conversion circuit is connected to a 68 th pin of the 3G communication module, a 4 th pin of the second level conversion circuit is connected to a 53 th pin of the 3G communication module, and the 7 th pin to the 13 th pin of the second level conversion circuit are grounded; a 22 th pin of the second level conversion circuit is grounded, and a 23 th pin and a 24 th pin of the second level conversion circuit are connected to a +5V power supply; the 20 th pin of the second level shift circuit is grounded through a resistor R19 and a capacitor C11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810017514.6A CN108224549B (en) | 2018-01-09 | 2018-01-09 | Intelligent heat supply control system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
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| CN109240138A (en) * | 2018-10-11 | 2019-01-18 | 河北工大科雅能源科技股份有限公司 | intelligent control valve |
| CN109751661A (en) * | 2018-12-06 | 2019-05-14 | 青岛农业大学 | Distant heating regulating system and method based on low power consumption network |
| CN112228951A (en) * | 2020-10-15 | 2021-01-15 | 博彦多彩数据科技有限公司 | Edge analysis control method and regional cooling and heating control system |
| CN112879984A (en) * | 2021-01-27 | 2021-06-01 | 诸暨市富瑞普科技有限公司 | Novel water mixer and control system thereof |
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| CN105115030A (en) * | 2015-09-14 | 2015-12-02 | 王志强 | Intelligent room temperature control system and method |
| CN106444495A (en) * | 2016-09-22 | 2017-02-22 | 山东二十度智慧供热股份有限公司 | Multifunctional intelligent control terminal system used for centralized heat supply |
| CN106765530A (en) * | 2016-12-28 | 2017-05-31 | 湖南信熙智控科技有限公司 | One kind is based on Internet of Things energy-conserving and environment-protective heating control system |
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| EP1037124B1 (en) * | 1999-03-18 | 2005-06-08 | Wolfgang Rothengass | Apparatus for the control of any domestic functional device |
| CN105115030A (en) * | 2015-09-14 | 2015-12-02 | 王志强 | Intelligent room temperature control system and method |
| CN106444495A (en) * | 2016-09-22 | 2017-02-22 | 山东二十度智慧供热股份有限公司 | Multifunctional intelligent control terminal system used for centralized heat supply |
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