CN108253520A - Heat supply intelligent control system - Google Patents
Heat supply intelligent control system Download PDFInfo
- Publication number
- CN108253520A CN108253520A CN201810017526.9A CN201810017526A CN108253520A CN 108253520 A CN108253520 A CN 108253520A CN 201810017526 A CN201810017526 A CN 201810017526A CN 108253520 A CN108253520 A CN 108253520A
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- China
- Prior art keywords
- pin
- building
- communication interface
- communication
- controller
- Prior art date
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D19/00—Details
- F24D19/10—Arrangement or mounting of control or safety devices
- F24D19/1006—Arrangement or mounting of control or safety devices for water heating systems
- F24D19/1009—Arrangement or mounting of control or safety devices for water heating systems for central heating
- F24D19/1015—Arrangement or mounting of control or safety devices for water heating systems for central heating using a valve or valves
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24D—DOMESTIC- OR SPACE-HEATING SYSTEMS, e.g. CENTRAL HEATING SYSTEMS; DOMESTIC HOT-WATER SUPPLY SYSTEMS; ELEMENTS OR COMPONENTS THEREFOR
- F24D2220/00—Components of central heating installations excluding heat sources
- F24D2220/04—Sensors
- F24D2220/042—Temperature sensors
Abstract
The invention discloses heat supply intelligent control system, including indoor temperature controller, building intelligent controller, building electric control valve, data collector and server.The heat supply intelligent control system of the present invention, indoor temperature is acquired by indoor temperature controller, or circulating water temperature is acquired by building intelligent controller, and by data collector by the indoor temperature signal or circulating water temperature signal transmission to the server, server sends the control instruction of building electric control valve according to indoor temperature signal or circulating water temperature signal, the control instruction of the building electric control valve is sent to the building intelligent controller by the data collector, so as to fulfill the adjusting of building electric control valve, effectively by controlling hot water flow, realize the equilibrium of supply and demand, on-demand accurate heat supply, meet heat user comfort level demand, reduce energy consumption.
Description
Technical field
The present invention relates to a kind of heating equipment more particularly to a kind of heat supply intelligent control systems.
Background technology
Heating system of the prior art mainly includes house lead in consumer heat inlet and adjusts and two portions of building consumer heat inlet adjusting
Point, still, the heating system of the prior art can not obtain the indoor temperature of user at consumer heat inlet, also can not accurately into
Family flow and Lou Dong flows are adjusted；And to ensure heating effect, heat supply company is generally using the reality for increasing pipeline
Circular flow heats, and wastes a large amount of energy, also leads to heat supply network waterpower and thermal misadjustment.
Invention content
It is an object of the present invention to provide a kind of heat supply intelligent control systems, can be by the indoor temperature of user, and pass through this
Indoor temperature controls building electric control valve, so as to reduce the hot water flow for entering building, has saved the energy.
The present invention solves technical problem and adopts the following technical scheme that：A kind of heat supply intelligent control system, including Indoor Temperature
Spend controller, building intelligent controller, building electric control valve, data collector and server；
The indoor temperature controller is used to detect indoor temperature, and the indoor temperature controller is adopted with the data
Storage signal connects, and the indoor temperature signal that it is acquired is sent to the data collector；
The building intelligent controller controls institute for acquiring the circulating water temperature by the building electric control valve
State building electric control valve；
The building intelligent controller signal is connected to data collector；
The data collector signal is connected to the server, the interior that the indoor temperature controller is detected
The circulating water temperature signal that temperature signal or the building intelligent controller are detected is sent to the server；
The server sends building motorized adjustment according to the indoor temperature signal or the circulating water temperature signal
The control instruction of valve；
The control instruction of the building electric control valve is sent to the building intelligent controller by the data collector.
Optionally, the building intelligent controller includes control unit, the first power module, second source module, wireless
Communication module, valve opening sensor, temperature sensor assembly, AD conversion module and motor control module；
The power supply of+12V is converted to+5V power supplys by first power module, and the second source module is used for+5V electricity
Source is converted to+3.3V power supplys；
First power module is used for control unit, valve opening sensor, temperature sensor assembly, AD conversion mould
Block and motor control module power supply；The second source module is used to power to the wireless communication module；
The wireless communication module and valve opening sensor signal are connected to described control unit；
The temperature sensor assembly is connected to described control unit by AD conversion module signal；
Described control unit signal is connected to the motor control module, and the motor control module is connected to the building
The motor of electric control valve；
The valve opening sensor is installed on the motor, to detect the rotational angle of the motor.
Optionally, the data collector includes LORA communication systems, interface system and 3G communication systems；
The LORA communication systems include the first power module, the first controller, LORA communication modules and the first communication and connect
Mouthful；
First power module is used to power to the first controller, LORA communication modules and the first communication interface；
First communication interface and the LORA communication modules signal are connected to first controller；
The interface system includes SIM card holder, TF card seat, the second communication interface and third communication interface；
The SIM card holder is connect with the third communication interface signal；
The TF card seat is connect with the second communication interface signal；
The 3G communication systems include second controller, 3G communication modules, second source module, 232 conversion circuits, first
Level shifting circuit, second electrical level conversion circuit, fourth communication interface, fifth communication interface and the 6th communication interface；
The second controller is connect with the 3G communication modules signal；
The fourth communication interface is identical with the interface of first communication interface, and is in communication with each other connection；
The fifth communication interface is identical with the interface of second communication interface, and is in communication with each other connection；
6th communication interface is identical with the interface of the third communication interface, and is in communication with each other connection；
The fourth communication interface is communicated mould by the first level shifting circuit and second electrical level conversion circuit with the 3G
Block signal connects；
The fifth communication interface is connect with the 3G communication modules signal, the part terminal letter of the 6th communication interface
Number the 3G communication modules are connected to, another part terminal is connected to 232 conversion circuits, and 232 conversion circuit passes through first
Level shifting circuit and second electrical level conversion circuit are connected to 3G communication modules.
Optionally, the indoor temperature controller is connect by Lora communication modules with the data collector signal.
Optionally, the LORA communication systems of the wireless communication module of the building intelligent controller and the data collector
Signal connects.
Optionally, the data collector is connect by 3G communication systems with server signal.
The present invention has the advantages that：The heat supply intelligent control system of the present invention, is adopted by indoor temperature controller
Set indoor temperature acquires circulating water temperature, and by data collector by the interior by building intelligent controller
Temperature signal either circulating water temperature signal transmission to the server server according to indoor temperature signal or circulating water temperature
The control instruction that signal sends building electric control valve is spent, the data collector refers to the control of the building electric control valve
Order is sent to the building intelligent controller, so as to fulfill the adjusting of building electric control valve, effectively by controlling hot water stream
Amount, realizes the equilibrium of supply and demand, and on-demand accurate heat supply meets heat user comfort level demand, reduces energy consumption.
Description of the drawings
Fig. 1 is the structure diagram of the heat supply intelligent control system of the present invention；
Fig. 2 is the structure diagram of the building electric control valve of the present invention；
Fig. 3 is the structure diagram of the building intelligent controller of the present invention；
Fig. 4 is the structure diagram of the first power module of the building intelligent controller of the present invention；
Fig. 5 is the structure diagram of the control unit of the building intelligent controller of the present invention；
Fig. 6 is the structure diagram of the second source module of the building intelligent controller of the present invention；
Fig. 7 is the structure diagram of the wireless communication module of the building intelligent controller of the present invention；
Fig. 8 is the structure diagram of the valve opening sensor of the building intelligent controller of the present invention；
Fig. 9 is the structure diagram of the temperature sensor assembly of the building intelligent controller of the present invention；
Figure 10 is the structure diagram of the AD conversion module of the building intelligent controller of the present invention；
Figure 11 is the structure diagram of the motor control module of the building intelligent controller of the present invention；
Figure 12 is the structure diagram of the first power module of the data collector of the present invention；
Figure 13 is the structure diagram of the first controller of the data collector of the present invention；
Figure 14 is the structure diagram of the LORA communication modules of the data collector of the present invention；
Figure 15 is the structure diagram of the first communication interface of the data collector of the present invention；
Figure 16 is the structure diagram of the SIM card holder of the data collector of the present invention；
Figure 17 is the structure diagram of the TF card seat of the data collector of the present invention；
Figure 18 is the structure diagram of the second communication interface of the data collector of the present invention；
Figure 19 is the structure diagram of the third communication interface of the data collector of the present invention；
Figure 20 is the structure diagram of the second controller of the data collector of the present invention；
Figure 21 is the structure diagram of the 3G communication modules of the data collector of the present invention；
Figure 22 is the structure diagram of the second source module of the data collector of the present invention；
Figure 23 is the structure diagram of 232 conversion circuits of the data collector of the present invention；
Figure 24 is the structure diagram of the first level shifting circuit of the data collector of the present invention；
Figure 25 is the structure diagram of the second electrical level conversion circuit of the data collector of the present invention；
Figure 26 is the structure diagram of the fourth communication interface of the data collector of the present invention；
Figure 27 is the structure diagram of the fifth communication interface of the data collector of the present invention；
Figure 28 is the structure diagram of the 6th communication interface of the data collector of the present invention；
The mark in the figure shows：201- buildings valve body；202- buildings valve base；203- buildings valve base O-ring seal；
204- buildings valve flap；205- buildings valve valve rod；206- buildings valve flap spring；207- buildings valve valve deck；208- buildings valve stops
Pushing pad；209- buildings valve valve rod O-ring seal；210- buildings valve middle port pad；211- buildings valve motor；212- spring pads；213-
Third protrusion portion；The 4th lug bosses of 214-；215- third pressure sensing ports；The 4th pressure sensing ports of 216-；217- second temperatures
Detection hole.
Specific embodiment
Technical scheme of the present invention is further elaborated with reference to embodiment and attached drawing.
Embodiment 1
Present embodiments provide a kind of heat supply intelligent control system, including indoor temperature controller, building intelligent controller,
Building electric control valve, data collector and server.
The indoor temperature controller is used to detect indoor temperature, and the indoor temperature controller is adopted with the data
Storage signal connects, and the indoor temperature signal that it is acquired is sent to the data collector；In the present embodiment, the room
Interior temperature controller is connect by Lora communication modules with the data collector signal, with reliable by the Lora channel radios
The remote wireless transmission of existing signal.
Moreover, the indoor temperature controller can also directly transmit control instruction to building intelligence by data collector
Controller, building intelligent controller control the motor of the building electric control valve according to the control instruction.
The building intelligent controller controls institute for acquiring the circulating water temperature by the building electric control valve
Building electric control valve is stated, further, the building intelligent controller is used to control the motor of the building electric control valve
Rotation, so as to control the aperture of the building electric control valve, realize the control of building hot water flow.
The building electric control valve is installed on building hot water line, when the aperture of building electric control valve changes,
The flow of the hot water in building hot water line can be changed.
Moreover, the building intelligent controller signal is connected to data collector.
The data collector signal is connected to the server, the interior that the indoor temperature controller is detected
The circulating water temperature signal that temperature signal or the building intelligent controller are detected is sent to the server, the clothes
Business device sends building according to the circulating water temperature signal that the indoor temperature signal or the building intelligent controller are detected
The control instruction of the building electric control valve is sent to the building by the control instruction of electric control valve, the data collector
Intelligent controller.
It is highly preferred that the data collector is connect by 3G communication systems with the server signal, to be led to by 3G
Realize the whole city transmission of data in the base station of letter system；And the data collector passes through Lora with the building intelligent controller
Wireless communication module signal connects, so that data collector can be carried out with indoor temperature controller and Lou Dong intelligent controllers
Networking.
When the present embodiment heat supply intelligent control system when in use, the server can connect the acquisition of multiple data
Device, and the data collector can connect multiple indoor temperature controllers and Lou Dong intelligent controllers, that is, pass through a number
Multiple buildings can be managed according to collector.
The building electric control valve includes building valve body, building valve base, building valve flap, building valve valve rod and building
Valve valve deck.
The building valve body is hollow structure, and one end of the building valve body is water inlet, and the other end is water outlet,
In the present embodiment, the third protrusion portion for forming annular is protruded inwardly from the madial wall of the building valve body, it is convex in the third
Ring-shaped step is formed on the internal face in the portion of rising, building valve base is provided in the ring-shaped step, to pass through the building valve
Valve seat forms fluid channel, it is highly preferred that it is O-shaped to be provided with building valve base between the building valve base and the ring-shaped step
Sealing ring, to realize the sealing between building valve base and ring-shaped step by the building valve base O-ring seal.
Building valve flap is provided on the building valve base, is turned on and off with the rotation by the building valve flap
The building electric control valve, in the present embodiment, the building valve base and Lou Dong valve flaps are prepared by ceramic material, with
So that having good sealing between the building valve base and Lou Dong valve flaps, and there is smaller abrasion.
It is highly preferred that being formed with multiple scallop holes on the building valve base, the building valve flap can be formed as face
The product fan shape bigger than the area of the scallop hole, so that the building valve flap can be completed to close the scallop hole,
At this point, the building electric control valve is closed, it, can be gradually when the building valve flap is rotated from closed state
The scallop hole is opened, and building electric control valve is caused to be in opening state and realizes the adjusting of building electric control valve.
Building valve valve rod, axial line and the building of the building valve valve rod are fixedly installed on the building valve flap
The axial line of valve flap is identical, the movement of the building valve flap is driven with the rotation by the building valve valve rod, for example, institute
It states and squared counter bore is offered on building valve flap, the cross section of one end of the building valve valve rod is also rectangular, and be inserted in
In squared counter bore on the building valve flap；In the present embodiment, flange is formed on the side wall of the building valve valve rod, it is described
Building valve flap spring is provided between flange and Lou Dong valve flaps, i.e., one end top of described building valve flap spring is set on described
It on flange, such as is located on the flange of the building valve valve rod by spring pad top, the other end of the building valve flap spring
Top is set on the building valve flap, so that building valve flap can compress building valve base, improves building valve flap and building
Sealing performance between valve base.
Moreover, being protruded outward on the lateral wall of the building valve body, the 4th lug boss of annular is formed, the described 4th is convex
The portion of rising is hollow structure, and building valve valve deck is provided on the 4th lug boss, and electricity is fixed on the building valve valve deck
Dynamic actuator, such as building valve motor etc.；The upper end of the building valve valve rod passes through the building valve valve deck, electronic is held with described
The rotor connection of row device, i.e., by the rotation of the Electric Actuator, can drive the building valve valve rod to rotate；The present embodiment
In, it is preferable that building valve middle port pad is provided between the building valve valve deck and the 4th lug boss, to pass through the building
Valve middle port pads the sealing between existing building valve valve deck and the 4th lug boss.
In the present embodiment, building valve valve is provided between the peripheral surface of the building valve valve rod and the building valve valve deck
Bar O-ring seal, in the present embodiment, the building valve valve rod O-ring seal can be multiple, and multiple building valve valve rod O
Type sealing ring is arranged in parallel.
Building valve thrust pad, the building valve are provided between the flange of the building valve valve rod and the building valve valve deck
Thrust pad is prepared by graphite material, by the lubricating action of graphite material, to be effectively reduced building valve valve rod rotation process
In, the frictional force between building valve valve rod and building valve valve deck.
In the present embodiment, between the axis of the horizontal direction of the axis of the building valve base and the building valve body
Angle is 120 °.
215 and the 4th pressure sensing port 216 of third pressure sensing port, this implementation are further opened on the building valve body 1
In example, the first pressure is located at the both sides in third protrusion portion 213 with regard to 215 and the 4th pressure sensing port 216 of detection hole respectively, and
And it is further opened with second temperature detection hole 217 on the building valve body 201.
It is highly preferred that the building valve body, third protrusion portion and the 4th lug boss can pass through casting integrated molding.
The building intelligent controller includes control unit, the first power module, second source module, wireless telecommunications mould
Block, valve opening sensor, temperature sensor assembly, AD conversion module and motor control module.
First power module is used to the power supply of+12V being converted to+5V power supplys (VDD), and the second source module is used
In+5V power supplys are converted to+3.3V power supplys (VCC).
First power module is used for control unit, valve opening sensor, temperature sensor assembly, AD conversion mould
Block and motor control module power supply；The second source module is used to power to the wireless communication module.
In the present embodiment, described control unit includes the microcontroller of model SC92F7322, the 1st pipe of the microcontroller
Foot connection+5V power supplys, the 2nd pin ground connection of the microcontroller, the 5th pin of the microcontroller are described by switching S3 ground connection
6th pin of microcontroller is by switching S2 ground connection, and the 10th pin of the microcontroller is by switching S1 ground connection；The microcontroller
1st pin is connected to+5V power supplys；The 2nd pin ground connection of the microcontroller.
The wireless communication module is connect with described control unit signal, and circuit is connected to the second source mould
Block, to realize the wireless telecommunications of other equipment and control unit, in the present embodiment, the wireless communication module includes model
Chip, resistance R7, resistance R8, resistance R9, resistance R10, resistance R11 and the resistance R12 of RA-01.
The 2nd pin ground connection of the chip of the model RA-01, the 3rd pin connection of the chip of the model RA-01
In+3.3V power supplys, the 4th pin of the chip of the model RA-01 is connected to the 14th pin of the microcontroller, and passes through
Resistance R8 is connected to+3.3V power supplys；5th pin of the chip of the model RA-01 is connected to the 13rd pin of microcontroller, and
+ 3.3V power supplys are connected to by resistance R7；The 9th pin ground connection of the chip of the model RA-01, the model RA-01
Chip the 16th pin ground connection, the 12nd pin of the chip of the model RA-01 is connected to the 20th pin of microcontroller, and
+ 3.3V power supplys are connected to by resistance R12；13rd pin of the chip of the model RA-01 is connected to the microcontroller
19th pin, and pass through resistance R11 connection+3.3V power supplys；14th pin of the chip of the model RA-01 is connected to described
18th pin of microcontroller, and pass through resistance R10 and be connected to+3.3V power supplys；15th pin of the chip of the model RA-01
The 17th pin of the microcontroller is connected to, and passes through resistance R9 and is connected to+3.3V power supplys.
The valve opening sensor is set on the motor, to detect the rotational angle of the motor, and is thus obtained
To the aperture of building electric control valve, the valve opening sensor signal is connected to the microcontroller, the valve detected
Door opening amount signal is transmitted to the microcontroller, and in the present embodiment, the valve opening sensor includes the rotation of model PT15NV
Angle of revolution sensor, one end of the angular sensor are connected to+5V power supplys, the other end of the angular sensor
Ground connection, the sliding end of the angular sensor are connected to the 7th pin of microcontroller, and pass through capacitance C6 and resistance R27
Ground connection.
The temperature sensor assembly is set in the temperature detection hole, and is passed through AD conversion module signal and be connected to institute
Control unit is stated, the temperature of the water detected is sent to described control unit, in the present embodiment, the temperature sensor group
Part includes the temperature sensor of model PT1000, and one end of the temperature sensor is connected to+5V power supplys by resistance R13,
The other end is grounded；Resistance R14 and resistance R15 series connection, and it is connected to+5V power supplys and ground；The temperature sensor connects with resistance R13
The one end connect is connected to AD conversion module by resistance R18, meanwhile, the resistance R14 passes through electricity with resistance R15 one end connected
Resistance R17 is connected to AD conversion module.
Preferably, the AD conversion module includes the chip of model ADS1115, the chip of the model ADS1115
The 1st pin, the 2nd pin and the 3rd pin+5V power supplys are connected to by resistance R16, the temperature sensor and resistance R13
One end of connection is connected to the 5th pin of the chip of model ADS1115, the resistance R14 and resistance R15 by resistance R18
One end of connection is connected to the 4th pin of AD conversion module, the 9th pipe of the chip of the model ADS1115 by resistance R17
Foot is connected to the 12nd pin of microcontroller, and passes through resistance R22 and be connected to+5V power supplys, the chip of the model ADS1115
10th pin is connected to the 11st pin of the microcontroller, and passes through resistance R25 and be connected to+5V power supplys.
The motor control module is connected to described control unit, under the control of described control unit, to realize motor
Rotation；In the present embodiment, the motor control module includes the chip of model RZ7889, the core of the model RZ7889
1st pin of piece is connected to+5V power supplys by resistance R5, and is connected to the 8th pin of the microcontroller, the model
2nd pin of the chip of RZ7889 is connected to+5V power supplys by resistance R6, and is connected to the 9th pin of microcontroller；The model
The 3rd pin ground connection of chip for RZ7889, the 4th pin of the chip of the model RZ7889 is connected to+5V power supplys, described
7th pin of the chip of model RZ7889 and the 8th pin are connected to a wire connection terminal of motor, the model RZ7889
Chip the 5th pin and the 6th pin be connected to another wire connection terminal of the motor, and two wiring of the motor
Capacitance C3 is connected between terminal.
The building intelligent controller further includes indicating lamp module, specifically, the 15th pin of the microcontroller and the 16th
Pin is connected to+5V power supplys by the first light emitting diode and resistance R29；3rd pin of the microcontroller passes through the second hair
Optical diode and resistance R30 are connected to+5V power supplys, and+5V the power supplys are grounded by resistance R28 and third light emitting diode.
In the present embodiment, the data collector includes LORA communication systems, interface system and 3G communication systems.
The LORA communication systems include the first power module, the first controller, LORA communication modules and the first communication and connect
Mouthful.
The DC power supply of externally input (such as+9V) is converted to the direct current of+5V and+3.3V by first power module
Power supply, and for powering to the first controller, LORA communication modules and the first communication interface.
In the present embodiment, first power module can include the first circuit and second circuit, and first circuit is used
In+9V power supplys are converted to+5V power supplys, such as pass through the chip of model 1117-5.0 and realize；The second circuit be used for will+
The power supply of 5V is converted to the power supply of+3.3V, such as is realized by the chip of model 1117-3.3.
First controller is the microcontroller of model SC92F732-16, and the first pin of first controller connects
It is connected to+5V power supplys, the 2nd pin ground connection of first controller.
The LORA communication modules signal is connected to first controller, so that other equipment can pass through the LORA
Communication module is connect with first controller signals, wherein, the LORA communication modules include the chip of model RA-01,
2nd pin of the chip of the model RA-01 and the 9th pin ground connection, the 3rd pin of the chip of the model RA-01 connect
+ 3.3V power supplys are connected to, the 4th pin of the chip of the model RA-01 is connected to the 12nd pin of first controller, institute
The 5th pin for stating the chip of model RA-01 is connected to the 11st pin of first controller, and passes through resistance R1 and be connected to
+ 3.3V power supplys, the 12nd pin of the chip of the model RA-01 is connected to the 8th pin of first controller, and passes through
Resistance R5 is connected to+3.3V power supplys；13rd pin of the chip of the model RA-01 is connected to the of first controller
7 pins, and pass through resistance R4 and be connected to+3.3V power supplys；14th pin of the chip of the model RA-01 is connected to described
4th pin of one controller, and pass through resistance R3 and be connected to+3.3V power supplys, the 15th pin of the chip of the model RA-01
The 3rd pin of first controller is connected to, and passes through resistance R2 and is connected to+3.3V power supplys；The core of the model RA-01
The 16th pin ground connection of piece.
The first communication interface signal is connected to first controller, to realize that first controller is set with other
Standby connection (such as passing through serial communication line), in the present embodiment, the 1st pin of first communication interface is connected to+5V
Power supply, the 2nd pin of first communication interface and the 4th pin ground connection, the 5th pin of first communication interface are connected to institute
The 5th pin of the first controller is stated, the 6th pin of first communication interface is connected to the 6th pin of first controller,
8th pin of first communication interface is connected to the 16th pin of first controller by resistance R6.
The interface system includes SIM card holder, TF card seat, the second communication interface and third communication interface；
1st pin of the SIM card holder is connected to the 12nd pin of third communication interface, the 2nd pin of the SIM card holder
The 8th pin of the third communication interface is connected to, the 3rd pin of the SIM card holder is connected to the third communication interface
10th pin, the 4th pin of the SIM card holder are connected to the 6th pin of the third communication interface, and the 6th of the SIM card holder the
Pin is grounded.
1st pin of the TF card seat is connected to the 3rd pin of second communication interface, the 2nd pipe of the TF card seat
Foot is connected to the 4th pin of second communication interface, and the 3rd pin of the TF card seat is connected to second communication interface
6th pin, the 4th pin of the TF card seat are connected to the 9th pin of second communication interface, the 5th pipe of the TF card seat
Foot is connected to the 5th pin of second communication interface, the 6th pin ground connection of the TF card seat, the 7th pin of the TF card seat
The 8th pin of second communication interface is connected to, the 8th pin of the TF card seat is connected to the of second communication interface
7 pins.
The 2nd pin ground connection of second communication interface, the 1st pin, the 3rd pin, the 5th pipe of the third communication interface
Foot and the 4th pin are connected to+5V power supplys by LED diodes respectively, corresponding when these pins is low levels, to light
LED diodes.
Moreover, the 2nd pin of the third communication interface is also grounded by reset switch.
The 3G communication systems include second controller, 3G communication modules, second source module, 232 conversion circuits, first
Level shifting circuit, second electrical level conversion circuit, fourth communication interface, fifth communication interface and the 6th communication interface.
The second controller is the microcontroller of model FM8PC71AS-C03-14, and the 1st of the second controller manages
Foot is connected to+5V power supplys, the 14th pin ground connection of the second controller, and the 12nd pin of the second controller passes through resistance
R20 is connected to the base stage of triode Q3, the emitter ground connection of triode Q3, the 10th pin DOG5 connections of the second controller
In the 19th pin of the first level shifting circuit.
The 3G communication modules are the chip of SIM5360；1st pin of the chip of the SIM5360 and the 2nd pin connect
Ground, the 3rd pin of the chip of the SIM5360 are connected to the collector of the triode Q3；The of the chip of the SIM5360
4 pins are grounded by capacitance C7, and are connected to the 11st pin of the second controller, the 5th pipe of the chip of the SIM5360
Foot is grounded；The 10th pin ground connection of the chip of the SIM5360, the 11st pin of the chip of the SIM5360 pass through resistance R4
VBUS (+5V) is connected to, and is grounded respectively by capacitance C12 and capacitance E9；14th pin of the chip of the SIM5360 connects
Ground；15th pin of the chip of the SIM5360 is connected to+1.8V power supplys；17th pin of the chip of the SIM5360 passes through
Resistance R5 is connected to the 3rd pin of ESD protection chip TVS5 (model PRTR5V0U2X), the ESD protection chips TVS5's
1st pin is grounded, and the 2nd pin of ESD protection chip TVS5 is connected to the of the chip of the SIM5360 by resistance R6
18 pins；The 4th pin of the ESD protection chips TVS5 is connected to the 20th pin of the chip of the SIM5360；It is described
19th pin of the chip of SIM5360 is connected to the 3rd pin of ESD protection chips TVS6 by resistance R7, and the ESD protects core
The 1st pin ground connection of piece TVS6, the 4th pin of the ESD protection chips TVS6 are connected to the 20th of the chip of the SIM5360
Pin, and the 20th pin of the chip of the SIM5360 is grounded respectively by capacitance C8, capacitance C9 and capacitance E7；It is described
The 81st pin ground connection of the chip of SIM5360；37th pin of the chip of the SIM5360, the 38th pin, the 39th pin,
40 pins and the 41st pin ground connection；42nd pin of the chip of the SIM5360 is grounded respectively by capacitance E6 and capacitance C6, and
And the power supply of+3.3V is connected to by the diode D1 of resistance Rsc and reversal connection and is connected to the anode of battery, the battery
Cathode ground connection；The 43rd pin ground connection of the chip of the SIM5360；44th pin of the chip of the SIM5360 is connected to
VDDE(+3.3V)；48th pin of the chip of the SIM5360 is connected to the base stage of triode Q2 by resistance R10, and described three
The emitter ground connection of pole pipe Q2；51st pin of the chip of the SIM5360 is connected to the base stage of triode Q1 by resistance R8,
The emitter ground connection of the triode Q1；57th pin of the chip of the SIM5360 and the 58th pin ground connection are described
59th pin of the chip of SIM5360 is connected to 3G antennas；60th pin of the chip of the SIM5360, the 61st pin, the 64th
Pin, the 65th pin and the 66th pin ground connection；62nd pin of the chip of the SIM5360 and the 63rd pin are connected to VBATT+
(+4.2V)；The 72nd pin, the 77th pin, the 78th pin and the 80th pin ground connection of the chip of the SIM5360；It is described
79th pin of the chip of SIM5360 is connected to GPS antenna.
The fourth communication interface is identical with the interface of first communication interface, and is in communication with each other connection；The present embodiment
In, the 1st pin of the fourth communication interface is connected to+5V power supplys, and the 3rd pin of the fourth communication interface is connected to VDD；
2nd pin of the fourth communication interface and the 4th pin ground connection；5th pin of the fourth communication interface is connected to the first electricity
20th pin of flat conversion circuit, the 6th pin of the fourth communication interface are connected to the of the second electrical level conversion circuit
20 pins, the 7th pin of the fourth communication interface are connected to the 19th pin of the second electrical level conversion circuit, and the described 4th
10th pin of communication interface is connected to+36V power supplys, and the 8th pin of the fourth communication interface is connected to the 6th communication interface
The 4th pin.
The fifth communication interface is identical with the interface of second communication interface, and is in communication with each other connection, the present embodiment
In, the 2nd pin of the fifth communication interface is grounded, the 3rd pin of the fifth communication interface and the chip of the SIM5360
The connection of the 24th pin, the 4th pin of the fifth communication interface connect with the 25th pin of the chip of the SIM5360, institute
The 5th pin for stating fifth communication interface is connect with the 26th pin of the chip of the SIM5360, and the of the fifth communication interface
6 pins are connect with the 21st pin of the chip of the SIM5360, the 7th pin and the SIM5360 of the fifth communication interface
Chip the connection of the 23rd pin, the 22nd pin of the 8th pin of the fifth communication interface and the chip of the SIM5360 connects
It connects, the 9th pin of the fifth communication interface is connected to VDDE；4th pin of the fifth communication interface is connect by resistance R3
Ground.
6th communication interface is identical with the interface of the third communication interface, and is in communication with each other connection, the present embodiment
In, the 1st pin of the 6th communication interface is connected to the collector of triode Q2, the 2nd pin of the 6th communication interface
It is connected to the collector of the triode Q3；3rd pin of the 6th communication interface is connected to the current collection of the triode Q1
Pole；5th pin of the 6th communication interface is grounded by resistance R12, and the 6th pin of the 6th communication interface passes through resistance
R5 is connected to the 17th pin of the chip of the SIM5360；8th pin of the 6th communication interface is connected to by resistance R6
18th pin of the chip of the SIM5360；10th pin of the 6th communication interface is connected to described by resistance R7
19th pin of the chip of SIM5360；12nd pin of the 6th communication interface is connected to the of the chip of the SIM5360
20 pins；14th pin of the 6th communication interface is connected to+5V power supplys；16th pin of the 6th communication interface connects
Ground；11st pin of the 6th communication interface is connected to the 14th pin of 232 conversion circuits, and the of the 6th communication interface
13 pins are connected to the 13rd pin of 232 conversion circuits；15th pin of the 6th communication interface is connected to second electrical level and turns
Change the 19th pin of circuit.
232 conversion circuit includes the chip of model MAX232, and the 1st pin of 232 conversion circuit passes through electricity
Holding C14 and be connected to its 3rd pin, the 2nd pin of 232 conversion circuit is connected to+5V power supplys by capacitance C13, and described 232
16th pin of conversion circuit is connected to+5V power supplys, the 4th pin of 232 conversion circuit by capacitance C15 be connected to its
5 pins, the 6th pin of 232 conversion circuit are grounded by capacitance C16, the 15th pin ground connection of 232 conversion circuit,
11st pin of 232 conversion circuit is connected to the 21st pin of first level shifting circuit, 232 conversion circuit
The 12nd the 21st pin for being connected to the second electrical level conversion circuit.
First level shifting circuit includes the chip of model SN74LVC8T245, first level shifting circuit
The 1st pin be connected to+1.8V power supplys, the 2nd pin of first level shifting circuit is grounded by resistance R27, described
3rd pin of one level shifting circuit is connected to the 8th pin of the 3G communication modules, and the of first level shifting circuit
4 pins are connected to the 71st pin of the 3G communication modules, and the 4th pin of first level shifting circuit is connected to the 3G
50th pin of communication module, the 6th pin to the 13rd pin of first level shifting circuit are grounded；First level turns
The 22nd pin ground connection of circuit is changed, the 23rd pin and the 24th pin of first level shifting circuit are connected to+5V power supplys.
The second electrical level conversion circuit includes the chip of model SN74LVC8T245, the second electrical level conversion circuit
The 1st pin be connected to+1.8V power supplys, the 2nd pin ground connection of the second electrical level conversion circuit, the second electrical level conversion electricity
3rd pin on road is connected to the 7th pin of the 3G communication modules, and the 4th pin of the second electrical level conversion circuit is connected to
68th pin of the 3G communication modules, the 4th pin of the second electrical level conversion circuit are connected to the 3G communication modules
53rd pin, the 7th pin to the 13rd pin of the second electrical level conversion circuit are grounded；The of the second electrical level conversion circuit
22 pins are grounded, and the 23rd pin and the 24th pin of the second electrical level conversion circuit are connected to+5V power supplys；The second electrical level
20th pin of conversion circuit is grounded by resistance R19 and capacitance C11.
The indoor temperature controller includes temperature sensor, microcontroller and Lora wireless communication modules, circuit structure
It is identical with the circuit structure in the building intelligent controller, it is no longer described in detail one by one herein.
The heat supply intelligent control system of the present embodiment acquires indoor temperature by indoor temperature controller or passes through building
Intelligent controller acquisition circulating water temperature, and by data collector by the indoor temperature signal or circulating water temperature
Signal transmission to the server, server sends building motorized adjustment according to indoor temperature signal or circulating water temperature signal
The control instruction of the building electric control valve is sent to the building and intelligently controlled by the control instruction of valve, the data collector
Device processed so as to fulfill the adjusting of building electric control valve, effectively by controlling hot water flow, realizes the equilibrium of supply and demand, on demand essence
Quasi- heat supply meets heat user comfort level demand, reduces energy consumption.
The sequencing of above example is not only for ease of description, represent the quality of embodiment.
Finally it should be noted that：The above embodiments are merely illustrative of the technical solutions of the present invention, rather than its limitations；Although
The present invention is described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that：It still may be used
To modify to the technical solution recorded in foregoing embodiments or carry out equivalent replacement to which part technical characteristic；
And these modification or replace, various embodiments of the present invention technical solution that it does not separate the essence of the corresponding technical solution spirit and
Range.
Claims (6)
1. a kind of heat supply intelligent control system, which is characterized in that including indoor temperature controller, building intelligent controller, Lou Dong
Electric control valve, data collector and server；
The indoor temperature controller is used to detect indoor temperature, and the indoor temperature controller and the data collector
Signal connects, and the indoor temperature signal that it is acquired is sent to the data collector；
The building intelligent controller controls the building for acquiring the circulating water temperature by the building electric control valve
Electric control valve；
The building intelligent controller signal is connected to data collector；
The data collector signal is connected to the server, the indoor temperature that the indoor temperature controller is detected
The circulating water temperature signal that signal or the building intelligent controller are detected is sent to the server；
The server sends building electric control valve according to the indoor temperature signal or the circulating water temperature signal
Control instruction；
The control instruction of the building electric control valve is sent to the building intelligent controller by the data collector.
2. heat supply intelligent control system according to claim 1, which is characterized in that the building intelligent controller includes control
Unit processed, the first power module, second source module, wireless communication module, valve opening sensor, temperature sensor assembly,
AD conversion module and motor control module；
The power supply of+12V is converted to+5V power supplys by first power module, and the second source module is used to turn+5V power supplys
It is changed to+3.3V power supplys；
First power module be used for control unit, valve opening sensor, temperature sensor assembly, AD conversion module and
Motor control module is powered；The second source module is used to power to the wireless communication module；
The wireless communication module and valve opening sensor signal are connected to described control unit；
The temperature sensor assembly is connected to described control unit by AD conversion module signal；
Described control unit signal is connected to the motor control module, and it is electronic that the motor control module is connected to the building
The motor of regulating valve；
The valve opening sensor is installed on the motor, to detect the rotational angle of the motor.
3. heat supply intelligent control system according to claim 2, which is characterized in that the data collector leads to including LORA
Letter system, interface system and 3G communication systems；
The LORA communication systems include the first power module, the first controller, LORA communication modules and the first communication interface；
First power module is used to power to the first controller, LORA communication modules and the first communication interface；
First communication interface and the LORA communication modules signal are connected to first controller；
The interface system includes SIM card holder, TF card seat, the second communication interface and third communication interface；
The SIM card holder is connect with the third communication interface signal；
The TF card seat is connect with the second communication interface signal；
The 3G communication systems include second controller, 3G communication modules, second source module, 232 conversion circuits, the first level
Conversion circuit, second electrical level conversion circuit, fourth communication interface, fifth communication interface and the 6th communication interface；
The second controller is connect with the 3G communication modules signal；
The fourth communication interface is identical with the interface of first communication interface, and is in communication with each other connection；
The fifth communication interface is identical with the interface of second communication interface, and is in communication with each other connection；
6th communication interface is identical with the interface of the third communication interface, and is in communication with each other connection；
The fourth communication interface is believed by the first level shifting circuit and second electrical level conversion circuit with the 3G communication modules
Number connection；
The fifth communication interface is connect with the 3G communication modules signal, and the part terminal signals of the 6th communication interface connect
The 3G communication modules are connected to, another part terminal is connected to 232 conversion circuits, and 232 conversion circuit passes through the first level
Conversion circuit and second electrical level conversion circuit are connected to 3G communication modules.
4. heat supply intelligent control system according to claim 3, which is characterized in that the indoor temperature controller passes through
Lora communication modules are connect with the data collector signal.
5. heat supply intelligent control system according to claim 4, which is characterized in that the building intelligent controller it is wireless
Communication module is connect with the LORA communication system signals of the data collector.
6. heat supply intelligent control system according to claim 5, which is characterized in that the data collector is communicated by 3G
System is connect with server signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810017526.9A CN108253520B (en) | 2018-01-09 | 2018-01-09 | Intelligent heat supply control system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810017526.9A CN108253520B (en) | 2018-01-09 | 2018-01-09 | Intelligent heat supply control system |
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| CN108253520A true CN108253520A (en) | 2018-07-06 |
| CN108253520B CN108253520B (en) | 2020-07-31 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109751661A (en) * | 2018-12-06 | 2019-05-14 | 青岛农业大学 | Distant heating regulating system and method based on low power consumption network |
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| CN105115030A (en) * | 2015-09-14 | 2015-12-02 | 王志强 | Intelligent room temperature control system and method |
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| CN106765530A (en) * | 2016-12-28 | 2017-05-31 | 湖南信熙智控科技有限公司 | One kind is based on Internet of Things energy-conserving and environment-protective heating control system |
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| EP1037124B1 (en) * | 1999-03-18 | 2005-06-08 | Wolfgang Rothengass | Apparatus for the control of any domestic functional device |
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| CN106444495A (en) * | 2016-09-22 | 2017-02-22 | 山东二十度智慧供热股份有限公司 | Multifunctional intelligent control terminal system used for centralized heat supply |
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