CN108214278A - Retainer ring and polissoir - Google Patents
Retainer ring and polissoir Download PDFInfo
- Publication number
- CN108214278A CN108214278A CN201611143913.4A CN201611143913A CN108214278A CN 108214278 A CN108214278 A CN 108214278A CN 201611143913 A CN201611143913 A CN 201611143913A CN 108214278 A CN108214278 A CN 108214278A
- Authority
- CN
- China
- Prior art keywords
- lateral wall
- place plane
- retainer ring
- recess sidewall
- madial wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
Abstract
The embodiment of the present invention provides a kind of retainer ring for surrounding polished workpiece and maintaining polished workpiece and polishing underlay relative position.Above-mentioned retainer ring has madial wall, lateral wall, connect bottom surface and the multiple grooves of madial wall and lateral wall, wherein lateral wall is around madial wall, there is lead angle between bottom surface and lateral wall, and in polishing process, bottom surface is contacted with polishing underlay, plurality of groove is located on bottom surface, each groove has the first recess sidewall relative to each other and the second recess sidewall, and first recess sidewall place plane and madial wall place plane holder acute angle and with the place plane holder obtuse angle of lateral wall, the place plane of second recess sidewall and the place plane holder obtuse angle of madial wall and with the place plane holder acute angle of lateral wall, there is lead angle wherein between the first recess sidewall and madial wall, and second has lead angle between recess sidewall and lateral wall.Polissoir with above-mentioned retainer ring is also provided.
Description
Technical field
The embodiment of the present invention relates to a kind of retainer ring and polissoir, it is particularly a kind of around polished workpiece and
Maintain the retainer ring of polished workpiece and polishing underlay relative position and the polissoir with above-mentioned retainer ring.
Background technology
With the progress of industry, flatening process is often adopted to the technique for producing various assemblies.In flatening process
In, CMP process is often industry and is used.Chemically-mechanicapolish polish (chemical mechanical
Polishing, CMP) technique be by polishing underlay be attached at polishing plummer on, allow be loaded into rubbing head polished workpiece and
Polishing underlay is in contact with each other and carries out relative motion, to remove the surface layer of partially polished object, and makes its surface gradually flat, comes
Reach the purpose of planarization.In general, retainer ring on rubbing head is set, available for keeping the position of polished workpiece, is prevented
Only polished workpiece skids off in a cmp process, but since retainer ring can also contact, and then make in polishing process with polishing underlay
The loss of polishing underlay accelerates, and increases manufacture cost.
Invention content
The embodiment of the present invention provides one kind around polished workpiece and maintains polished workpiece position opposite with polishing underlay
The retainer ring put.Retainer ring has bottom surface and the multiple grooves of madial wall, lateral wall, connection madial wall and lateral wall,
China and foreign countries' side wall ring has lead angle between madial wall, bottom surface and lateral wall, and in polishing process, bottom surface and polishing underlay
Contact, plurality of groove are located on bottom surface, each groove has the first recess sidewall relative to each other and the second groove side
Wall, and the place plane holder acute angle of the place plane of the first recess sidewall and madial wall and blunt with the place plane holder of lateral wall
Angle, the place plane of the second recess sidewall and the place plane holder obtuse angle of madial wall and with the place plane holder acute angle of lateral wall,
Wherein between the first recess sidewall and madial wall there is lead angle, and there is lead angle between the second recess sidewall and lateral wall.
The embodiment of the present invention provides one kind around polished workpiece and maintains polished workpiece position opposite with polishing underlay
The retainer ring put.Retainer ring has bottom surface and the multiple grooves of madial wall, lateral wall, connection madial wall and lateral wall,
Middle lateral wall presss from both sides obtuse angle, and throwing for inclined-plane and around madial wall between the place plane of bottom surface and the place plane of lateral wall
In light technique, bottom surface is contacted with polishing underlay, and plurality of groove is located on bottom surface, each groove has relative to each other the
One recess sidewall and the second recess sidewall, and the place plane holder acute angle of the place plane of the first recess sidewall and madial wall and with
The place plane holder obtuse angle of lateral wall, the place plane of the second recess sidewall and the place plane holder obtuse angle of madial wall and with outside
The place plane holder acute angle of wall, wherein between the first recess sidewall and madial wall have lead angle, and the second recess sidewall and
There is lead angle between lateral wall.
The embodiment of the present invention provides a kind of polissoir.Polissoir includes rubbing head, polishing underlay and polished work
Part.Rubbing head is mounted with above-mentioned retainer ring.Polishing underlay is set on polishing turntable.Polished workpiece is located on polishing underlay
In side and retainer ring, wherein there is gap, wherein being polished technique between polished workpiece and the madial wall of retainer ring
In, the bottom surface of polished workpiece and retainer ring is contacted with polishing underlay.
There is based on above-mentioned, between the bottom surface of the retainer ring of the embodiment of the present invention and lateral wall lead angle, retainer ring
There is the groove on obtuse angle and the bottom surface of retainer ring to be passed through between madial wall and position lateral wall respectively between bottom surface and lateral wall
The acute angle and/or obtuse angle of lead angle so that be in contact in a cmp process with the bottom surface of retainer ring object (such as：Polishing underlay)
It avoids, by sharp keen wedge angle shock, effectively reducing polishing underlay loss (wear out) and improving the pot life of polishing underlay
(available time), and then extend the service life of polishing underlay and reduce manufacture cost.
Description of the drawings
According to following detailed description and institute's accompanying drawings is coordinated to understand the embodiment of the present invention.It should be noted that according to this
The general job of industry, various features are not drawn to scale.In fact, for clear explanation, may arbitrarily amplify or
Reduce the size of component.
Figure 1A is the schematic diagram of the retainer ring according to some embodiment of the present invention.
Figure 1B is the partial schematic diagram of the retainer ring in Figure 1A.
Fig. 2A is the upper schematic diagram of the retainer ring in Figure 1A.
Fig. 2 B are the local upper schematic diagram of the retainer ring in Fig. 2A.
Fig. 3 is the schematic side view of the retainer ring according to some embodiment of the present invention.
Fig. 4 is the schematic side view of the retainer ring according to some embodiment of the present invention.
Fig. 5 is the schematic side view of the retainer ring according to some embodiment of the present invention.
Fig. 6 is the diagrammatic cross-section of the polissoir according to some embodiment of the present invention.
Fig. 7 is the schematic top plan view of the polissoir according to some embodiment of the present invention.
Drawing reference numeral explanation
100a、100b、100c：Retainer ring；
110：Madial wall；
120：Lateral wall；
130：Bottom surface；
140：Groove；
141：First recess sidewall；
142：Second recess sidewall；
143：Groove bottom surface；
150：Top surface；
200：Polissoir；
210：Polish turntable；
220：Polishing underlay；
222：Polish groove；
230：Rubbing head；
240：Polished workpiece；
250：Elastic component；
260：Rebuild component；
270：Polish nozzle for liquid；
280：Polishing fluid；
A、B：Rotation direction；
C：Moving direction；
CR：Intermediate region；
D：Spacing；
ER：End region；
P110、P120、P130、P150、P141、P142：Plane；
R：The rotation center of polishing underlay；
W、W1：Width；
θA、θB、θC、θD、θ1、θ2：Angle.
Specific embodiment
Following disclosure provides many different embodiments or examples of the different characteristic for the provided target of implementation.
Component discussed below and the specific example of setting be in order to convey this exposure in a simplified manner for the purpose of.Certainly, these
Only example rather than to limit.For example, it in being described below, is formed above fisrt feature or in fisrt feature
Second feature may include that second feature and fisrt feature are formed as the embodiment being in direct contact, and also may include second feature and the
Additional features can be formed between one feature so that the embodiment that second feature can be not directly contacted with fisrt feature.In addition, this
Same or similar component is referred to disclosed in identical element numbers and/or letter can be used in various examples.Element numbers
Reuse be for the sake of simple and clear, and be not offered as each embodiment to be discussed and/or setting in itself it
Between relationship.
In addition, for ease of a component or feature and another component or the relationship of feature depicted in description attached drawing,
Can be used herein for example " ... under ", " in ... lower section ", " lower part ", " ... on ", " in ... top ", " top " and similar
The spatially relative term of term.Other than orientation depicted in attached drawing, the spatially relative term is intended to cover component and exists
Using or operation when be differently directed.Equipment can be otherwise oriented and (be rotated by 90 ° or in other orientations), and sky used herein
Between relative terms correspondingly make explanations.
In addition, term " first " described in text, " second " etc., use in the text is primarily to facilitate in description figure
Shown similar or different component or feature, and can mutually be exchanged according to the sequence of narration appearance or the description of context
It uses.
Figure 1A is the schematic diagram of the retainer ring according to some embodiment of the present invention.Figure 1B is that the part of the retainer ring of Figure 1A shows
It is intended to.Fig. 2A is the upper schematic diagram of the retainer ring in Figure 1A.Fig. 2 B are the local upper schematic diagram of the retainer ring in Fig. 2A.Figure
3 be the schematic side view of the retainer ring according to some embodiment of the present invention, and wherein Fig. 3 is the side view of the retainer ring of Figure 1A.
In the embodiment of the present invention, retainer ring 100a substantially has circular cylindrical, please refers to the thin portion explanation of lower section.
Figure 1A is please referred to, in some embodiments, retainer ring 100a includes madial wall 110, lateral wall 120, bottom surface
130th, multiple grooves 140 and top surface 150.
In some embodiments, referring to Figure 1A, Fig. 2A and Fig. 2 B, madial wall 110 and lateral wall 120 are respective
To be cyclic annular and positioned opposite to each other, wherein madial wall 110 is set in lateral wall 120, and lateral wall 120 is around madial wall 110.
In some embodiments, lateral wall 120 does not contact madial wall 110.For example, example between lateral wall 120 and madial wall 110
There is constant spacing L in this way, as shown in Figure 1A, Figure 1B, Fig. 2A and Fig. 2 B.However, the embodiment of the present invention is without being limited thereto, at it
In its embodiment, for example without constant spacing between lateral wall 120 and madial wall 110.
In some embodiments, please continue to refer to Figure 1A, Fig. 2A and Fig. 2 B, bottom surface 130 is phase each other with top surface 150
To setting, the place plane P of bottom surface 130130It is parallel to the place plane P of top surface 150150.In some embodiments, bottom surface
130 connection madial walls 110 and lateral wall 120, and top surface 150 connects madial wall 110 and lateral wall 120.In some implementations
In mode, between madial wall 110 and lateral wall 120, madial wall 110 is located at lateral wall 120 for bottom surface 130 and top surface 150
Between bottom surface 130 and top surface 150.In other words, bottom surface 130 and top surface 150 respectively with madial wall 110 and lateral wall 120
Relative side connection.According to above-mentioned framework, retainer ring 100a has circular cylindrical.
In some embodiments, the place plane P of madial wall 110110Place plane P perpendicular to bottom surface 130130And
The place plane P of top surface 150150, as shown in Figure 1B.
In some embodiments, it please refers to Fig.3, the place plane P of lateral wall 120120Perpendicular to the place of bottom surface 130
Plane P130And the place plane P of top surface 150150.In other words, in some embodiments, lateral wall 120 is relative to bottom surface
130 and top surface 150 be vertical plane (as shown in Figure 3), the place plane P of lateral wall 120120With the place plane of bottom surface 130
P130And the place plane P of top surface 150130Between have right angle.In some embodiments, as shown in figure 3, bottom surface 130 with
And there is lead angle between lateral wall 120.However, the embodiment of the present invention is without being limited thereto.
In some embodiments, as shown in Figure 1B, multiple grooves 140 are located on bottom surface 130, wherein each groove
140 have the first recess sidewall 141 relative to each other and the second recess sidewall 142 and connect the first recess sidewall 141 and the
The groove bottom surface 143 of two recess sidewalls 142.In some embodiments, there is identical between every two adjacent grooves 140
Away from D, as shown in Figure 3.
In some embodiments, the place plane P of the first recess sidewall 141141With the place plane P of madial wall 110110
Between have for acute angle angle thetaΛAnd with the place plane P of lateral wall 120120Between have for obtuse angle angle thetaB, and second
The place plane P of recess sidewall 142142With the place plane P of madial wall 110110Between have for obtuse angle angle thetaDAnd with it is outer
The place plane P of side wall 120120Between have for acute angle angle thetaC, wherein the first recess sidewall 141 and madial wall 110 it
Between have lead angle, and between the second recess sidewall 142 and lateral wall 120 have lead angle.
For example, as shown in Figure 1B, the place plane P of the first recess sidewall 141141With the place plane of madial wall 110
P110Between accompany acute angle (i.e.：Angle thetaA) and with the place plane P of lateral wall 120120Between accompany obtuse angle (i.e.：Angle thetaB),
In between the first recess sidewall 141 and madial wall 110 have lead angle；On the other hand, the place plane of the second recess sidewall 142
P142With the place plane P of madial wall 110110Between accompany obtuse angle (i.e.：Angle thetaD) and with the place plane P of lateral wall 120120
Between accompany acute angle (i.e.：Angle thetaC), wherein having lead angle between the second recess sidewall 142 and lateral wall 120.However, this
Inventive embodiments are not limited.
In other words, in embodiments of the present invention, have between the first recess sidewall 141 and madial wall 110 through the sharp of lead angle
Angle simultaneously has obtuse angle between lateral wall 120, has obtuse angle and and lateral wall between the second recess sidewall 142 and madial wall 110
There is the acute angle through lead angle between 120.
In some embodiments, each groove 140 includes intermediate region CR and is located at intermediate region CR two respectively
Two end region ER of side are located at centre wherein being more than positioned at the width W1 of the groove bottom surface 143 of two end region ER
The width W of the groove bottom surface 143 of region CR.In some embodiments, the material of retainer ring 100a is selected from polyether-ether-ketone
(PEEK), polyethylene (POM), polyphenylene sulfide (PPS), polyamidoimide (PAI) or polyetherimide (PEI).In addition, upper
It states in the embodiment of the present invention, for clarity, multiple grooves 140 are all to be formed to be painted with straight-line groove, but the present invention is real
Example is applied to be not limited.In other embodiments, multiple grooves 140 can also be by arc groove, irregular non-rectilinear
Groove, or combination are formed.It, can be by the polishing fluid used in CMP process from retainer ring through the presence of multiple grooves 140
The madial wall 110 of 100a is discharged toward the lateral wall 120 of retainer ring 100a.
As above-mentioned, the retainer ring of the embodiment of the present invention is penetrated between bottom surface and lateral wall with recessed on lead angle and bottom surface
Slot respectively between madial wall and position lateral wall have acute angle and/or obtuse angle through lead angle so that in a cmp process with retainer ring
Bottom surface be in contact object (such as：Polishing underlay) it avoids, by sharp keen wedge angle shock, effectively reducing polishing underlay loss
And improve the pot life of polishing underlay, and then extend the service life of polishing underlay and reduce manufacture cost.
In some embodiments, it is not parallel to positioned at the place plane of the bottom surface of two end region ER 130 in being located at
Between region CR both sides bottom surface 130 place plane (not being painted).For example, positioned at the bottom surface of two end region ER 130
From the place plane of bottom surface 130 that is located at intermediate region CR both sides, angle extends toward top surface 150 at a sharp angle.It accordingly, can be into
One step reduces the contact polishing area between bottom surface 130 and polishing underlay, and reduces polishing underlay loss.In specific embodiment
In, above-mentioned sharp angle is less than 3 degree, and the right embodiment of the present invention is without being limited thereto.
Fig. 4 is the schematic side view of the retainer ring according to some embodiment of the present invention, and wherein Fig. 4 is the retainer ring of Figure 1A
Another side view of aspect.The retainer ring 100b of Fig. 4 is similar therefore same or similar to the retainer ring 100a of Figure 1A to Fig. 3
Component with identical or similar symbolic indication, and be not repeated to illustrate.Retainer ring 100b and Figure 1A's to Fig. 3 of Fig. 4 consolidates
Determine ring 100a main differences to be in the lateral wall 120 of retainer ring 100b is not orthogonal to bottom surface 130 and top surface 150.
In some embodiments, it please refers to Fig.4, the place plane P of lateral wall 120120It is not orthogonal to the institute of bottom surface 130
In plane P130And also it is not orthogonal to the place plane P of top surface 150150.In other words, lateral wall 120 relative to bottom surface 130 and
Top surface 150 is inclined-plane (as shown in Figure 4), the place plane P120 of lateral wall 120 and the place plane P of bottom surface 130150It is staggered
And there is angle theta 1, wherein angle theta 1 is obtuse angle, on the other hand, the place plane P of lateral wall 120120With the place of top surface 150
Plane P150Staggered and with angle theta 2, wherein angle theta 2 is acute angle.In some embodiments, as shown in figure 4, bottom surface 130
And there is lead angle between lateral wall 120.
Fig. 5 is the schematic side view of the retainer ring according to some embodiment of the present invention, and wherein Fig. 5 is the retainer ring of Figure 1A
Another side view of aspect.The retainer ring 100c of Fig. 5 is similar therefore same or similar to the retainer ring 100a of Figure 1A to Fig. 3
Component with identical or similar symbolic indication, and be not repeated to illustrate.Retainer ring 100c and Figure 1A's to Fig. 3 of Fig. 5 consolidates
Determine ring 100a main differences to be in can not have lead angle, and retainer ring 100c between bottom surface 130 and lateral wall 120
The place plane P of lateral wall 120120It is not orthogonal to the place plane P of bottom surface 130130And the place plane P of top surface 150150.
In some embodiments, Fig. 5 is please referred to, lateral wall 120 is inclined-plane relative to bottom surface 130 and top surface 150, lateral wall 120
Place plane P120With the place plane P of bottom surface 130130Staggered and with angle theta 1, wherein angle theta 1 is obtuse angle, the opposing party
Face, the place plane P of lateral wall 120120With the place plane P of top surface 150150It is staggered and with angle theta 2, wherein angle theta 2
For acute angle.
Accordingly, the retainer ring of the embodiment of the present invention has obtuse angle for inclined-plane and between bottom surface 130 through lateral wall so that
Even if in a cmp process, the bottom surface of retainer ring mutually rubs with polishing underlay and retainer ring abrasion is caused to reduce with height, retainer ring
Bottom surface and lateral wall between can still keep with obtuse angle, it is ensured that polishing underlay long-time polish after still can avoid by sharp
The wedge angle of profit is hit, and is reduced polishing underlay and is lost and improves the pot life of polishing underlay, to extend the use longevity of polishing underlay
It orders and reduces manufacture cost.
Fig. 6 is the diagrammatic cross-section of the polissoir according to some embodiment of the present invention.7 be to implement according to some present invention
The schematic top plan view of the polissoir of example.Fig. 6 and Fig. 7 are please also refer to, in some embodiments, polissoir 200 includes throwing
Light turntable 210, polishing underlay 220, rubbing head 230 and polished workpiece 240.In some embodiments, polissoir 200
Further include elastomer 250, trimming component 260 and polishing nozzle for liquid 270 and polishing fluid 280.
In some embodiments, it as shown in fig. 6, polishing turntable 210 is, for example, to carry polishing underlay 220, polishes
Liner 220 is, for example, to be attached on the surface of polishing turntable 210, to polish polished workpiece 240.In some embodiments
In, polishing underlay 220 has multiple polishing grooves 222, and to accommodate polishing fluid 280, plurality of polishing groove 222 includes tool
There are multiple annular recess centered on the rotation center R of polishing underlay 220.In some embodiments, polishing underlay 220
It is made of in this way polymeric substrate, polymeric substrate can be thermosetting resin (thermosetting resin) or thermoplastic
Property resin (thermoplastic resin) synthesized polymeric substrate, the embodiment of the present invention is not particularly limited polishing underlay
220 material and the shape of polishing groove 222.
Fig. 6 is please referred to, in some embodiments, rubbing head 230 is mounted with fixation above polishing underlay 220
Ring, polished workpiece 240 (being, for example, semiconductor chip) and elastomer 250, wherein above-mentioned retainer ring is, for example, Figure 1A to Fig. 3
Retainer ring 100a.In simple terms, as shown in Figure 1A, Figure 1B, Fig. 2A, Fig. 2 B and Fig. 3, retainer ring 100a include madial wall 110,
Lateral wall 120, bottom surface 130 and multiple grooves 140.Lateral wall 120 is around madial wall 110.Bottom surface 130 connects madial wall 110
And lateral wall 120.Multiple grooves 140 are located on bottom surface 130, and wherein each groove 140 is recessed with relative to each other first
141 and second recess sidewall 142 of groove sidewall, and the one of which of the first recess sidewall 141 and the second recess sidewall 142 with it is interior
Side wall 110 is with the acute angle through lead angle and with lateral wall 120 with obtuse angle, the first recess sidewall 141 and the second recess sidewall
142 another one is with madial wall 110 with obtuse angle and with lateral wall 120 with the acute angle through lead angle.Every two adjacent grooves 140
Between have identical spacing.However, in other embodiments, the retainer ring being loaded on rubbing head 230 can also be Fig. 4
Retainer ring 100b is (i.e.：Lateral wall 120 between inclined-plane, bottom surface 110 and lateral wall 120 have lead angle) or Fig. 5 retainer ring
100c is (i.e.：Lateral wall 120 between inclined-plane, bottom surface 110 and lateral wall 120 do not have lead angle), the embodiment of the present invention not with
This is limited.
In some embodiments, as shown in fig. 6, retainer ring 100a is engaged in rubbing head 230 with elastomer 250, wherein
Elastomer 250 is folded between rubbing head 230 and polished workpiece 240, and polished workpiece 240 is located at the interior of retainer ring 100a
Portion is (i.e.：Polished workpiece 240 is by 110 collar of madial wall).In some embodiments, polished workpiece 240 is to be covered in
The outer surface (but not contacted with retainer ring 100a) of elastomer 250 so that in polishing process, rubbing head 230 can be by solid
Determine ring 100a and apply pressure with elastomer 250, and then retainer ring 100a and polished workpiece 240 are pressed on polishing underlay 220
Surface on, therefore the polished face of polished workpiece 240 and the bottom surface 110 of retainer ring 100a are able to and polishing underlay 220
It is in contact.
In some embodiments, when polishing turntable 210 follows a fixed rotation direction rotation, patch can be driven simultaneously
The polishing underlay 220 on 210 surface of polishing turntable is invested, and polishing underlay 220 is made to can follow identical with polishing turntable 210 turn
Dynamic direction rotates.Similarly, rubbing head 230 follows same rotation direction rotation, can drive and is covered on outside elastomer 250 simultaneously
The polished workpiece 240 on surface, and polished workpiece 240 is made to follow the rotation direction rotation identical with rubbing head 230.Citing comes
It says, as shown in Figures 6 and 7, it is, for example, rotation direction A to polish the rotation direction of turntable 210 with the rotation direction of rubbing head 220,
So that polishing underlay 220 carries out relative motion with rubbing head 230.In some embodiments, rubbing head 230 is in addition to along rotation
A rotations in direction are outer, can also follow moving direction C sliding and swayings back and forth simultaneously, can drive simultaneously and be covered on 250 outer surface of elastomer
Polished workpiece 240, and polished workpiece 240 is made to can follow moving direction C sliding and swayings back and forth, is polished technique,
So that the contact between polished workpiece 240 and polishing underlay 220 will not be confined to a certain specific region, can help to make throwing
Optical speed and the uniformity more become with steady, and enable polishing process evenly.
Please continue to refer to Fig. 6 and Fig. 7, in some embodiments, component 260 is rebuild and to supply polishing fluid 280
Polishing nozzle for liquid 270 be located at the top of polishing underlay 220.In some embodiments, in polishing process, nozzle for liquid 270 is polished
Polishing fluid 280 is provided, but it is not contacted with polishing underlay 220.In some embodiments, in polishing process, component 260 is rebuild
It is contacted with polishing underlay 220 to be polished, thereby reforms the polishing groove 222 on polishing underlay 220.Such as Fig. 6 and Fig. 7 institutes
Show, polishing nozzle for liquid 270 is not rotated/moved, and trimming component 260 follows the rotation direction opposite with polishing turntable 210 (i.e.：Turn
Dynamic direction B) rotation.In some embodiments, trimming component 260 is, for example, the diamond finishing device with diamond disc.
Have on lead angle and bottom surface in conclusion the retainer ring of the embodiment of the present invention is penetrated between bottom surface and lateral wall
Groove respectively between madial wall and position lateral wall have acute angle and/or obtuse angle through lead angle so that in a cmp process with fixation
The polishing underlay that the bottom surface of ring is in contact avoids, by sharp keen wedge angle shock, effectively reducing polishing underlay and being lost and improve polishing
The pot life of liner, and then extend the service life of polishing underlay and reduce manufacture cost.In addition, the embodiment of the present invention is consolidated
Determine ring has obtuse angle for inclined-plane and between bottom surface 130 through lateral wall so that even if in a cmp process, the bottom surface of retainer ring
It mutually rubs with polishing underlay and retainer ring abrasion is caused to reduce with height, can still keep having between the bottom surface of retainer ring and lateral wall
There is obtuse angle, it is ensured that polishing underlay can still avoid, by sharp keen wedge angle shock, reducing polishing underlay damage after long-time polishes
The pot life of polishing underlay is consumed and improves, to extend the service life of polishing underlay and reduce manufacture cost.
The embodiment of the present invention provides one kind around polished workpiece and maintains polished workpiece position opposite with polishing underlay
The retainer ring put, wherein retainer ring have madial wall, lateral wall, connection madial wall and the bottom surface of lateral wall and multiple recessed
Slot, wherein lateral wall have lead angle, and in polishing process, bottom surface is with throwing around madial wall between bottom surface and lateral wall
Light gasket contacts, plurality of groove are located on bottom surface, each groove has the first recess sidewall and second relative to each other
Recess sidewall, and the place plane holder acute angle of the place plane of the first recess sidewall and madial wall and with the place plane of lateral wall
Press from both sides obtuse angle, the place plane of the second recess sidewall and the place plane holder obtuse angle of madial wall and sharp with the place plane holder of lateral wall
Angle wherein having lead angle between the first recess sidewall and madial wall, and has between the second recess sidewall and lateral wall and leads
Angle.
The embodiment of the present invention provides one kind around polished workpiece and maintains polished workpiece position opposite with polishing underlay
The retainer ring put, wherein retainer ring have madial wall, lateral wall, connection madial wall and the bottom surface of lateral wall and multiple recessed
Slot, wherein lateral wall is inclined-planes and surround madial wall, and obtuse angle is pressed from both sides between the place plane of bottom surface and the place plane of lateral wall, and
In polishing process, bottom surface is contacted with polishing underlay, and plurality of groove is located on bottom surface, each groove has relative to each other
The first recess sidewall and the second recess sidewall, and the place plane holder acute angle of the place plane of the first recess sidewall and madial wall
And with the place plane holder obtuse angle of lateral wall, the place plane of the second recess sidewall and the place plane holder obtuse angle of madial wall and with
The place plane holder acute angle of lateral wall, wherein there is lead angle, and the second recess sidewall between the first recess sidewall and madial wall
And there is lead angle between lateral wall.
The embodiment of the present invention provides a kind of polissoir, and wherein polissoir includes rubbing head, polishing underlay and waits to throw
Light workpiece.Rubbing head is mounted with retainer ring, and wherein retainer ring has madial wall, lateral wall, connection madial wall and lateral wall
Bottom surface and multiple grooves, wherein lateral wall there is lead angle, and polishing between bottom surface and lateral wall around madial wall
In technique, bottom surface is contacted with polishing underlay, and plurality of groove is located on bottom surface, each groove has relative to each other first
Recess sidewall and the second recess sidewall, and the place plane holder acute angle of the place plane of the first recess sidewall and madial wall and with it is outer
The place plane holder obtuse angle of side wall, the place plane of the second recess sidewall and the place plane holder obtuse angle of madial wall and and lateral wall
Place plane holder acute angle, wherein have lead angle between the first recess sidewall and madial wall, and the second recess sidewall and outer
There is lead angle between side wall.Polishing underlay is set on polishing turntable.Polished workpiece is located above polishing underlay and fixed
In ring, wherein there is gap between polished workpiece and the madial wall of retainer ring, wherein in technique is polished, polished work
The bottom surface of part and retainer ring is contacted with polishing underlay.
Finally it should be noted that：The above various embodiments is only to illustrate the technical solution of the embodiment of the present invention rather than to it
Limitation；Although the embodiment of the present invention is described in detail with reference to foregoing embodiments, those of ordinary skill in the art
It should be understood that：It can still modify to the technical solution recorded in foregoing embodiments either to which part or
All technical features carries out equivalent replacement；And it these modifications or replaces, it does not separate the essence of the corresponding technical solution this hair
The range of bright each embodiment technical solution.
Claims (10)
1. a kind of exist around polished workpiece and the polished workpiece of maintenance and the retainer ring of polishing underlay relative position, feature
There is madial wall, lateral wall, the bottom surface for connecting the madial wall and the lateral wall and multiple recessed in, the retainer ring
Slot,
Wherein described lateral wall has lead angle, and polishing around the madial wall between the bottom surface and the lateral wall
In technique, the bottom surface is contacted with the polishing underlay,
Wherein the multiple groove is located on the bottom surface, each groove has the first recess sidewall and second relative to each other
Recess sidewall, and the place plane holder acute angle of the place plane of first recess sidewall and the madial wall and with the outside
The place plane holder obtuse angle of wall, the place plane of second recess sidewall and the place plane holder obtuse angle of the madial wall and with
The place plane holder acute angle of the lateral wall,
There is lead angle, and second recess sidewall and described between wherein described first recess sidewall and the madial wall
There is lead angle between lateral wall.
2. retainer ring according to claim 1, which is characterized in that wherein the multiple groove equidistant arrangement is in the bottom surface
On.
3. retainer ring according to claim 1, which is characterized in that wherein described lateral wall is inclined-plane, and the bottom surface
Obtuse angle is pressed from both sides between place plane and the place plane of the lateral wall.
4. retainer ring according to claim 1, which is characterized in that the material of wherein described retainer ring be selected from polyether-ether-ketone,
Polyethylene, polyphenylene sulfide, polyamidoimide or polyetherimide.
5. a kind of exist around polished workpiece and the polished workpiece of maintenance and the retainer ring of polishing underlay relative position, feature
There is madial wall, lateral wall, the bottom surface for connecting the madial wall and the lateral wall and multiple recessed in, the retainer ring
Slot,
Wherein described lateral wall is for inclined-plane and around the madial wall, the place plane of the bottom surface and the place of the lateral wall
Obtuse angle being pressed from both sides between plane, and in polishing process, the bottom surface is contacted with the polishing underlay,
Wherein the multiple groove is located on the bottom surface, each groove has the first recess sidewall and second relative to each other
Recess sidewall, and the place plane holder acute angle of the place plane of first recess sidewall and the madial wall and with the outside
The place plane holder obtuse angle of wall, the place plane of second recess sidewall and the place plane holder obtuse angle of the madial wall and with
The place plane holder acute angle of the lateral wall,
There is lead angle, and second recess sidewall and described between wherein described first recess sidewall and the madial wall
There is lead angle between lateral wall.
6. retainer ring according to claim 5, which is characterized in that wherein the multiple groove equidistant arrangement is in the bottom surface
On.
7. retainer ring according to claim 5, which is characterized in that wherein each groove is recessed with more connecting described first
The groove bottom surface of groove sidewall and second recess sidewall, and each groove includes：
Intermediate region and two end regions for being located at intermediate region both sides respectively, wherein positioned at described two end regions
The width of the groove bottom surface is more than the width of the groove bottom surface positioned at the intermediate region.
8. a kind of polissoir, which is characterized in that including：
Rubbing head is mounted with retainer ring, wherein the retainer ring has madial wall, lateral wall, the connection madial wall and institute
The bottom surface of lateral wall and multiple grooves are stated,
Wherein described lateral wall has lead angle, and polishing around the madial wall between the bottom surface and the lateral wall
In technique, the bottom surface is contacted with the polishing underlay,
Wherein the multiple groove is located on the bottom surface, each groove has the first recess sidewall and second relative to each other
Recess sidewall, and the place plane holder acute angle of the place plane of first recess sidewall and the madial wall and with the outside
The place plane holder obtuse angle of wall, the place plane of second recess sidewall and the place plane holder obtuse angle of the madial wall and with
The place plane holder acute angle of the lateral wall,
There is lead angle, and second recess sidewall and described between wherein described first recess sidewall and the madial wall
There is lead angle between lateral wall；
Polishing underlay is set on polishing turntable；And
Workpiece is polished, above the polishing underlay and in the retainer ring, wherein the polished face of buffer's part
There is gap between the inside side walls of the retainer ring,
Wherein, in technique is polished, the polished face of the polishing workpiece and the bottom surface and the institute of the retainer ring
State polishing underlay contact.
9. polissoir according to claim 8, which is characterized in that wherein the multiple groove equidistant arrangement is in the bottom
On face.
10. polissoir according to claim 8, which is characterized in that wherein described lateral wall is inclined-plane, and the bottom surface
Place plane and the lateral wall place plane between press from both sides obtuse angle.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611143913.4A CN108214278A (en) | 2016-12-13 | 2016-12-13 | Retainer ring and polissoir |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611143913.4A CN108214278A (en) | 2016-12-13 | 2016-12-13 | Retainer ring and polissoir |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108214278A true CN108214278A (en) | 2018-06-29 |
Family
ID=62637372
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611143913.4A Pending CN108214278A (en) | 2016-12-13 | 2016-12-13 | Retainer ring and polissoir |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108214278A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004268194A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Polishing device, polishing guide ring and abrasion determining method of polishing guide ring |
| CN1694784A (en) * | 2002-10-02 | 2005-11-09 | 恩辛格合成材料技术Gbr公司 | Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| CN2780407Y (en) * | 2003-09-19 | 2006-05-17 | 应用材料有限公司 | Fixed ring on carrier head in polishing device used for chemical machinery |
| DE102006062017A1 (en) * | 2006-12-29 | 2008-07-03 | Advanced Micro Devices, Inc., Sunnyvale | Holding ring for chemical-mechanical polishing device, has polishing cushion side surface, and normal surface of border area and normal surface of polishing cushion side surface that has spikes angle |
| CN101331003A (en) * | 2005-05-24 | 2008-12-24 | 安格斯公司 | Cmp retaining ring |
-
2016
- 2016-12-13 CN CN201611143913.4A patent/CN108214278A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1694784A (en) * | 2002-10-02 | 2005-11-09 | 恩辛格合成材料技术Gbr公司 | Retaining ring for holding semiconductor wafers in a chemical-mechanical polishing device |
| JP2004268194A (en) * | 2003-03-07 | 2004-09-30 | Seiko Epson Corp | Polishing device, polishing guide ring and abrasion determining method of polishing guide ring |
| CN2780407Y (en) * | 2003-09-19 | 2006-05-17 | 应用材料有限公司 | Fixed ring on carrier head in polishing device used for chemical machinery |
| CN101331003A (en) * | 2005-05-24 | 2008-12-24 | 安格斯公司 | Cmp retaining ring |
| DE102006062017A1 (en) * | 2006-12-29 | 2008-07-03 | Advanced Micro Devices, Inc., Sunnyvale | Holding ring for chemical-mechanical polishing device, has polishing cushion side surface, and normal surface of border area and normal surface of polishing cushion side surface that has spikes angle |
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| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20180629 |
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| RJ01 | Rejection of invention patent application after publication |