CN108207083A - The production method and its structure of wiring board - Google Patents
The production method and its structure of wiring board Download PDFInfo
- Publication number
- CN108207083A CN108207083A CN201611176648.XA CN201611176648A CN108207083A CN 108207083 A CN108207083 A CN 108207083A CN 201611176648 A CN201611176648 A CN 201611176648A CN 108207083 A CN108207083 A CN 108207083A
- Authority
- CN
- China
- Prior art keywords
- layer
- line layer
- patterned line
- patterned
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/05—Patterning and lithography; Masks; Details of resist
- H05K2203/0502—Patterning and lithography
- H05K2203/0531—Decalcomania, i.e. transfer of a pattern detached from its carrier before affixing the pattern to the substrate
Abstract
The present invention provides a kind of production method and its structure of wiring board.The production method of wiring board of the present invention includes being formed the first patterned line layer on the surface of circuit base plate, and the first patterned line layer exposes the surface of part circuit base plate.It is formed on the surface of part circuit base plate that patterned line layer is exposed in the first patterned line layer.The second patterned line layer is transferred on corresponding patterning adhesion layer.The present invention can produce the circuit board structure with thick metal fine road floor in a manner that circuit transfers and the patterning thickness metal fine road floor with different line widths is configured on circuit base plate.
Description
Technical field
The present invention relates to the production method and its structure of a kind of wiring board, and more particularly to a kind of thick metal fine road knot
The production method and its structure of the wiring board of structure.
Background technology
In the processing procedure of printed wiring board, in order to make the thread pattern of wiring board, half addition processing procedure of Improvement type
It is 40 microns (μm) that (modified semi-additive process, MSAP), which is often used to make line width on circuit base plate,
Following line layer.However, aforementioned processing procedure needs the equipment of great number and the investment of material so that the making of printed wiring board
The material and cost of manufacture of Cheng Suoxu significantly increases.In addition to this, thick metallic circuit layer, such as thick copper layer, it is difficult to by upper
The mode of half addition processing procedure of Improvement type stated completes so that the making applied in filament line structure of thick metallic circuit layer
On be restricted.
Invention content
The present invention provides a kind of manufacturing method of wiring board, is produced in a manner that circuit transfers with thick metal fine
The circuit board structure of road floor.
The present invention provides a kind of circuit board structure, and the patterning thickness metal fine road floor with different line widths is configured at line
On base board.
The production method of the wiring board of the present invention includes being formed the first patterned line layer on the surface of circuit base plate, and
And first patterned line layer expose the surface of part circuit base plate.Patterned line layer is formed in the first patterned line layer
The surface of part circuit base plate exposed.The second patterned line layer is transferred on corresponding patterning adhesion layer.
The circuit board structure of the present invention includes circuit base plate, the first patterned line layer, patterning adhesion layer and second
Patterned line layer.First patterned line layer is configured on the surface of circuit base plate, and exposes part circuit base plate
Surface.Patterning adhesion layer is configured on the surface of part circuit base plate that the first patterned line layer is exposed.Second figure
Case line layer correspondence is configured on patterning adhesion layer.In addition, the line width of the second patterned line layer is less than the first patterning
The line width of line layer.
In one embodiment of this invention, the production method of above-mentioned wiring board is additionally included in the second patterned circuit of transfer
Layer forms the second patterned line layer on a release layer before corresponding patterning adhesion layer.
In one embodiment of this invention, above-mentioned circuit base plate has the first loci, and release layer tool second aligns
Pattern, and the second patterned line layer is being transferred before on corresponding adhesion layer, first by first pair of bit patterns and second pair
Bit patterns are aligned.
In one embodiment of this invention, the production method of above-mentioned wiring board further includes to form dielectric layer in circuit base plate
On.Dielectric layer is covered in the first patterned line layer and the second patterned line layer, and is filled in the first patterned line layer
And second between patterned line layer.
In one embodiment of this invention, the method for above-mentioned formation patterning adhesion layer includes screen printing or spray printing.
In one embodiment of this invention, the surface of the first above-mentioned patterned line layer and the second patterned line layer
Surface is mutually flush.
In one embodiment of this invention, the line width of the second above-mentioned patterned line layer is less than the first patterned line layer
Line width.
In one embodiment of this invention, the line width of the first above-mentioned patterned line layer is greater than or equal to the first patterning
Line-spacing between the circuit of line layer.
Based on above-mentioned, in the production method of the wiring board of multiple embodiments of the present invention, the first patterned line layer can
It is formed on circuit base plate.Then, patterning adhesion layer can be formed in the part circuit that the first patterned line layer is exposed
On the surface of substrate.Then, the second patterned line layer can be correspondingly formed by the mode of transfer on patterning adhesion layer.
Therefore, in embodiments of the invention, the first patterned line layer and the second patterned line layer can be respectively with different
Processing procedure mode is formed on circuit base plate.Particularly, the second patterned line layer is that circuit base plate is formed in a manner of transfer
On so that the second patterned line layer can have the line width small compared with the first patterned line layer, and reduce the first patterned lines
Line-spacing between road floor and the second patterned line layer.
To make the foregoing features and advantages of the present invention clearer and more comprehensible, special embodiment below, and attached drawing shown in cooperation
It is described in detail below.
Description of the drawings
Fig. 1 is the structure diagram of the wiring board according to one embodiment of the invention；
Fig. 2 is the structure diagram of the wiring board according to another embodiment of the present invention；
Fig. 3 A to Fig. 3 I are the flow diagrams of the production method of the wiring board of Fig. 1 and Fig. 2.
Reference sign：
10：Adhesive agent
50：Web plate
60：Release layer
62：Second pair of bit patterns
50a：Mesh openings
100：Wiring board
110：Circuit base plate
110a：Upper surface
110b：Lower surface
112：First alignment mark
120：First patterned line layer
130：Pattern adhesion layer
140：Second patterned line layer
150：Dielectric layer
160：Third patterned line layer
170：Conductive through hole
d1、d3：Line width
d2、d4：Line-spacing
Specific embodiment
Fig. 1 is the schematic diagram of the circuit board structure according to one embodiment of the invention.In the present embodiment, wiring board 100
Including circuit base plate 110, the first patterned line layer 120, patterning 130 and second patterned line layer 140 of adhesion layer.Such as
Shown in Fig. 1, in the present embodiment, the first patterned line layer 120 can be formed simultaneously the upper surface 110a in circuit base plate 110 with
And on the 110b of lower surface.In addition, patterning adhesion layer 130 is configured at the partial line that the first patterned line layer 120 is exposed
On base board 110.For example, patterning adhesion layer 130 is configured in the gap between the circuit of the first patterned line layer 120.
Furthermore the second patterned line layer 140 is accordingly configured on patterning adhesion layer 130.
As shown in Figure 1, the line-spacing d2 between the circuit of the first patterned line layer 120 is greater than or equal to the first patterned lines
The line width d1 of road floor 120.For example, the line-spacing d2 between the circuit of the first patterned line layer 120 is relative to the first pattern
The ratio for changing the line width d1 of line layer 120 is fallen in the range of 1 to 5.In the present embodiment, the second patterned line layer 140
The circuit both sides line-spacing d4 between the first patterned line layer 120 and line width d3 of the second patterned line layer 140 respectively
And equal to the line-spacing d2 between the first patterned line layer 120 circuit of itself.In the present embodiment, the second patterned circuit
The line width d3 of layer 140 e.g. falls the range 0.8 to 1.2 relative to the ratio of the line width d1 of the first patterned line layer 120
It is interior.In addition, the line-spacing d4 between the first patterned line layer 120 and the second patterned line layer 140 is less than the second patterned lines
The line width d3 of road floor 140.
For example, the line width d1 of the first patterned line layer 120 is smaller than 30 microns.Furthermore the first patterned circuit
Line-spacing d4 between 120 and second patterned line layer 140 of layer may be less than or equal to 10 microns.
In addition to this, in the present embodiment, the thickness of the first patterned line layer 120 is relative to the second patterned line layer
The ratio of 140 thickness is, for example, to fall in the range of 0.8 to 1.2.In general embodiment, the adhesion layer 130 in Fig. 1
Thickness it is very thin for the thickness of the second patterned line layer 140, therefore, the thickness of the second patterned line layer 140
The reducible thickness for being roughly equal to the first patterned line layer 120.In the present embodiment, the thickness example of the first patterned line layer 120
Such as it is greater than 50 microns.
Therefore, in the present embodiment, the first figure with thicker line thicknesses on the one hand can be formed on circuit base plate 110
120 and second patterned line layer 140 of case line layer, and on the other hand, the second patterned line layer 140 can compare the first figure
Case line layer has narrower line width d3.In addition, for comparing the line layer formed with single patterned processing procedure, the first figure
There can be relatively narrow line-spacing d4 between 120 and second patterned line layer 140 of case line layer (e.g. less than 10 microns).
Fig. 1 is refer again to, in the present embodiment, circuit base plate 110 also has the first alignment mark 112, with via example
When the mode of screen printing forms patterning adhesion layer 130 in this way, the contraposition between web plate and circuit base plate 110 is carried out, to increase
Into aligning accuracy made of screen printing.In addition, in the present embodiment, patterning adhesion layer 130 can also ink-jet mode
It is formed.
Fig. 2 is the schematic diagram of the circuit board structure according to another embodiment of the present invention.The when reality with Fig. 1 of the present embodiment
Applying the difference of example, be only that can in the first patterned line layer 120 and the second patterned line layer 140 on circuit base plate 110
It is further formed dielectric layer 150.Dielectric layer 150 covers the first patterned line layer 120 and the second patterned line layer 140, and
And it is filled between it.In addition, third patterned line layer 160, which can correspond to the first patterned dielectric layer 120, is formed in dielectric layer 150
On.Furthermore conductive through hole 170 can be formed in dielectric layer 150 and through dielectric layer 150, dielectric is configured to be electrically connected
Third patterned line layer 160 on 150 surface of layer and the first patterned line layer 120 for being covered in the lower section of dielectric layer 150.
In the present embodiment, dielectric layer 150, conductive through hole 170 therethrough and third patterned line layer 160 are repeatably folded
It puts and is formed in 140 top of the first patterned line layer 120 and the second patterned line layer, to be formed with multi-layer laminate structure
Wiring board 100.
Fig. 3 A to Fig. 3 I are the flow diagrams of the production method of the wiring board of Fig. 1 and Fig. 2.In the present embodiment, it is formed
The method of wiring board 100 includes following steps.As shown in Figure 3A, the first patterned line layer 120 is respectively formed in circuit base
The upper surface 110a of plate 110 and lower surface 110b, wherein line-spacing d2 between the circuit of the first patterned line layer 120 relative to
The ratio of the line width d1 of circuit is fallen in the range of 1 to 5.In general, the ratio size of line-spacing d2 and line width d1 can be 3.
Then, B is please referred to Fig.3, on the part surface of circuit base plate 110 exposed in the first patterned line layer 120, that is,
Gap between the circuit of first patterned line layer 120 as depicted, in a manner of being, for example, screen printing or ink-jet
Form patterning adhesion layer 130.
Specifically, as shown in Figure 3B, in the present embodiment, adhesive agent 10 can pass through 50 wire mark of web plate in the first patterning
Between the circuit of line layer 120.Adhesive agent 10 arrow direction can be coated with, and through the mesh openings 50a of web plate 50 along figure
The portion of upper surface 110a between the circuit of the first patterned line layer 120 is injected, in the upper surface 110a of circuit base plate 110
Form patterning adhesion layer 130.Therefore, patterning adhesion layer 130 can be exposed between the circuit of the first patterned line layer 120
Gap in.In addition, screen printing processing step same as described above is repeated on the lower surface 110b of circuit base plate 110, with online
Also patterning adhesion layer 130 is formed on the lower surface 110b of base board 110.
C is please referred to Fig.3, after the formation of adhesion layer 130 is patterned, web plate 50 can be removed, subsequent to continue
Fabrication steps.Then, D is please referred to Fig.3, the second patterned line layer 140 can be first via seeming the patterned processing procedure mode of laser
It is formed on release layer 60.In addition, as shown in Figure 3D, release layer 60 has second pair of bit patterns 62, for release layer 60 and line
Base board 110 is aligned.
Then, as shown in FIGURE 3 E, the second patterned line layer 140 on release layer 60 is transferred to circuit in the direction of the arrow
On the upper surface 110a of substrate 110, and on the lower surface 110b of circuit base plate 110 repeat same steps.Specifically, into
Before the above-mentioned printing process of row, release layer 60 can be first in a manner of being, for example, image contraposition, by second pair of bit patterns 62 and line
First pair of bit patterns 112 on base board 110 are to align.Then, the second patterned line layer 140 on release layer 60 can
It is accordingly configured on patterning adhesion layer 130 so that the second patterned line layer 140 is attached via patterning adhesion layer 130
On the surface of the part circuit base plate 110 between being exposed to the circuit of the first patterned line layer 120.
Then, as illustrated in Figure 3 F, release layer 60 can be removed by the mode of heating or ultraviolet light.In this implementation
In example, since the adhesive agent 10 of patterning adhesion layer 130 sticks together strength more than release layer for the second patterned line layer 140
60 and the second adhesion between patterned line layer 140, therefore, release layer 60 is heated or ultraviolet light after, can be easily
Ground is removed from the surface of the second patterned line layer 140, and will not cause the second patterned line layer 140 in circuit base plate
The phenomenon that stripping is generated on 110 surface.
As shown in Figure 3 G, after release layer 60 removes, that is, the upper surface 110a of circuit base plate 110 and lower surface 110b is completed
On the first patterned line layer 120 and the second patterned line layer 140 making.
It in the present embodiment, can be in forming the with different line widths on circuit base plate 110 via above-mentioned processing procedure mode
One patterned line layer 120 and the second patterned line layer 140, and the first patterned line layer 120 and the second patterned lines
Road floor 140 is, for example, to be made of metal materials such as copper.Specifically, as shown in Fig. 1 and Fig. 3 G, the second patterned line layer
140 line width d3 is, for example, to fall in the range of 0.8 to 1.2 relative to the ratio of the line width d1 of the first patterned line layer 120,
And the thickness of the first patterned line layer 120 is, for example, to fall relative to the ratio of the thickness of the second patterned line layer 140
In the range of 0.8 to 1.2.In addition, the line width of the first patterned line layer 120 is, for example, to be less than 30 microns, and first patterns
Gap between 120 and second patterned line layer 140 of line layer is, for example, to be less than 20 microns.In other words, compared to single
The line layer that patterning process step is formed, can be made with relatively narrow line width and line-spacing by the processing procedure mode of the present embodiment but
Still possess the metallic circuit layer of thicker line thick (e.g. more than 50 microns), overcome general half addition processing procedure of Improvement type unfavorable
In make thick metal fine road floor the shortcomings that.
H is please referred to Fig.3, it can be into one on the first patterned line layer 120 to complete and the second figure line layer 140
Step forms dielectric layer 150.Dielectric layer 150 covers the first patterned line layer 120 and the second patterned line layer 140 and fills
In the gap between it.In the present embodiment, the composition material of dielectric layer 150 is, for example, but is not limited to photosensitive imaging dielectric
(photo imagable dielectric, PID) resin.
Then, as shown in fig. 31, in the present embodiment, dielectric layer 150 can be in a manner of machine drilling or Laser drill pair
The first patterned line layer 120 is answered to form multiple perforations, and through due to carrying out the processing procedures such as metal layer plating and etching in perforation
Form conductive through hole 170.In addition, third patterned line layer 160 can correspond to the first patterned line layer 120 and conductive through hole
170 are formed on dielectric layer 150.First patterned line layer 120 is via conductive through hole 170 and third patterned line layer 160
It is electrically connected.In the present embodiment, the system of above-mentioned dielectric layer 150, conductive through hole 170 and third patterned conductive layer 160
Journey mode is repeatably applied to 140 top of the first patterned line layer 120 and the second patterned line layer, has weight to be formed
The wiring board 100 of multiple laminated construction.
In conclusion in the production method of the wiring board of multiple embodiments of the present invention, the first patterned line layer and the
Two patterned line layers are formed in a manner of different processing procedures on circuit base plate respectively.What the second patterned line layer can transfer
Mode is formed in on the circuit base plate of the first patterned line layer to have completed.Since the second patterned line layer is
It is formed on circuit base plate in a manner of transfer, therefore, patterned line layer is formed compared to single patterned fabrication steps
Mode, can have smaller line-spacing between first and second patterned line layer.In addition, the line of multiple embodiments of the present invention
Road plate manufacturing method thereof causes the first patterned line layer and the second patterned line layer line thicknesses that can be not only restricted to line between it
Away from size, and the line construction of wiring board is caused while line-spacing reduces, can still to possess thicker line thicknesses.Therefore, originally
The wiring board manufacturing method thereof of multiple embodiments of invention can be applicable in the making of the wiring board with thick metal fine line structure.
Although the present invention is disclosed as above with embodiment, however, it is not to limit the invention, any technical field
Middle tool usually intellectual, it is without departing from the spirit and scope of the present invention, therefore of the invention when can make a little change and retouching
Protection domain subject to be defined depending on claim.
Claims (10)
1. a kind of production method of wiring board, which is characterized in that including：
The first patterned line layer is formed on the surface of circuit base plate, and first patterned line layer exposes part
The surface of the circuit base plate；
Patterning adhesion layer is formed in the surface of the part circuit base plate that first patterned line layer is exposed；With
And
The second patterned line layer is transferred on the corresponding patterning adhesion layer.
2. the production method of wiring board according to claim 1, which is characterized in that be additionally included in transfer second pattern
Change line layer before on the corresponding patterning adhesion layer, form second patterned line layer on release layer.
3. the production method of wiring board according to claim 2, which is characterized in that the circuit base plate has multiple first
To bit patterns, and the release layer has multiple second pair of bit patterns, and is transferring second patterned line layer in right
Before on the adhesion layer answered, first the multiple first pair of bit patterns and the multiple second pair of bit patterns are aligned.
4. the production method of wiring board according to claim 1, which is characterized in that further include to form dielectric layer in the line
On base board, wherein the dielectric layer is covered in first patterned line layer and second patterned line layer, and
And it is filled between first patterned line layer and the second change line layer.
5. the production method of wiring board according to claim 1, which is characterized in that form the side of the patterning adhesion layer
Method includes screen printing or ink-jet.
6. the production method of wiring board according to claim 1, which is characterized in that the thickness of first patterned line layer
Degree relative to the ratio of the thickness of second patterned line layer is fallen in the range of 0.8 to 1.2.
7. the production method of wiring board according to claim 1, which is characterized in that the line of second patterned line layer
The ratio of the wide line width relative to first patterned line layer is fallen in the range of 0.8 to 1.2.
8. a kind of circuit board structure, which is characterized in that including：
Circuit base plate；
First patterned line layer is configured on the surface of the circuit base plate, and exposes the part circuit base plate
Surface；
Adhesion layer is patterned, is configured at the surface of the part circuit base plate that first patterned line layer is exposed
On；And
Second patterned line layer, it is corresponding to be configured on the patterning adhesion layer, wherein second patterned line layer
Line width relative to the ratio of the line width of first patterned line layer is fallen in the range of 0.8 to 1.2.
9. circuit board structure according to claim 8, which is characterized in that the thickness of first patterned line layer is opposite
In the ratio of the thickness of second patterned line layer be to fall in the range of 0.8 to 1.2.
10. circuit board structure according to claim 8, which is characterized in that the circuit of first patterned line layer it
Between line-spacing relative to the ratio of the line width of first patterned line layer fallen in the range of 1 to 5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611176648.XA CN108207083A (en) | 2016-12-19 | 2016-12-19 | The production method and its structure of wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611176648.XA CN108207083A (en) | 2016-12-19 | 2016-12-19 | The production method and its structure of wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108207083A true CN108207083A (en) | 2018-06-26 |
Family
ID=62601815
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611176648.XA Withdrawn CN108207083A (en) | 2016-12-19 | 2016-12-19 | The production method and its structure of wiring board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108207083A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585591A (en) * | 2003-07-30 | 2005-02-23 | 日本东北先锋公司 | Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| CN101686599A (en) * | 2008-09-24 | 2010-03-31 | 欣兴电子股份有限公司 | Circuit structure of circuit board and manufacture method thereof |
| US20150319868A1 (en) * | 2014-05-01 | 2015-11-05 | Tong Hsing Electronic Industries, Ltd. | Multilayer circuit board and method for manufacturing the same |
| CN105592640A (en) * | 2014-10-22 | 2016-05-18 | 中国科学院理化技术研究所 | Flexible printed circuit fabricating method |
| JP2016111301A (en) * | 2014-12-10 | 2016-06-20 | 富士通株式会社 | Wiring board and manufacturing method thereof |
-
2016
- 2016-12-19 CN CN201611176648.XA patent/CN108207083A/en not_active Withdrawn
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1585591A (en) * | 2003-07-30 | 2005-02-23 | 日本东北先锋公司 | Flexible circuit board mounted with semiconductor chip and method for mounting semiconductor chip |
| CN101686599A (en) * | 2008-09-24 | 2010-03-31 | 欣兴电子股份有限公司 | Circuit structure of circuit board and manufacture method thereof |
| US20150319868A1 (en) * | 2014-05-01 | 2015-11-05 | Tong Hsing Electronic Industries, Ltd. | Multilayer circuit board and method for manufacturing the same |
| CN105592640A (en) * | 2014-10-22 | 2016-05-18 | 中国科学院理化技术研究所 | Flexible printed circuit fabricating method |
| JP2016111301A (en) * | 2014-12-10 | 2016-06-20 | 富士通株式会社 | Wiring board and manufacturing method thereof |
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Application publication date: 20180626 |