CN105592640A - Flexible printed circuit fabricating method - Google Patents
Flexible printed circuit fabricating method Download PDFInfo
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- CN105592640A CN105592640A CN201410571224.8A CN201410571224A CN105592640A CN 105592640 A CN105592640 A CN 105592640A CN 201410571224 A CN201410571224 A CN 201410571224A CN 105592640 A CN105592640 A CN 105592640A
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- printed circuit
- transfer printing
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- base material
- flexible printed
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- 238000000034 method Methods 0.000 title claims abstract description 19
- 239000000463 material Substances 0.000 claims abstract description 97
- 238000010023 transfer printing Methods 0.000 claims abstract description 37
- 239000012530 fluid Substances 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims abstract description 14
- 238000000465 moulding Methods 0.000 claims description 34
- 238000002360 preparation method Methods 0.000 claims description 30
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 26
- 235000013870 dimethyl polysiloxane Nutrition 0.000 claims description 26
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 claims description 26
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 claims description 26
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 26
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 21
- 239000004020 conductor Substances 0.000 claims description 20
- 239000000741 silica gel Substances 0.000 claims description 19
- 229910002027 silica gel Inorganic materials 0.000 claims description 19
- 239000007787 solid Substances 0.000 claims description 17
- 229910001338 liquidmetal Inorganic materials 0.000 claims description 16
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 claims description 14
- 229910052733 gallium Inorganic materials 0.000 claims description 14
- 229910052738 indium Inorganic materials 0.000 claims description 8
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 claims description 8
- 239000004033 plastic Substances 0.000 claims description 8
- 229920003023 plastic Polymers 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 7
- 238000013461 design Methods 0.000 claims description 4
- 238000012546 transfer Methods 0.000 claims description 4
- RHZWSUVWRRXEJF-UHFFFAOYSA-N indium tin Chemical compound [In].[Sn] RHZWSUVWRRXEJF-UHFFFAOYSA-N 0.000 claims description 3
- 239000011229 interlayer Substances 0.000 claims description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 claims description 3
- 229910052753 mercury Inorganic materials 0.000 claims description 3
- 239000000284 extract Substances 0.000 claims description 2
- 239000000499 gel Substances 0.000 claims description 2
- 239000002082 metal nanoparticle Substances 0.000 claims description 2
- 150000001336 alkenes Chemical class 0.000 claims 1
- 239000000976 ink Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 239000002356 single layer Substances 0.000 abstract description 2
- 238000004806 packaging method and process Methods 0.000 abstract 2
- 239000005022 packaging material Substances 0.000 abstract 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 8
- 239000004800 polyvinyl chloride Substances 0.000 description 8
- 229910045601 alloy Inorganic materials 0.000 description 6
- 239000000956 alloy Substances 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 5
- 239000007943 implant Substances 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 239000002985 plastic film Substances 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000011148 porous material Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910021389 graphene Inorganic materials 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 238000007493 shaping process Methods 0.000 description 2
- 238000005507 spraying Methods 0.000 description 2
- LLYXJBROWQDVMI-UHFFFAOYSA-N 2-chloro-4-nitrotoluene Chemical compound CC1=CC=C([N+]([O-])=O)C=C1Cl LLYXJBROWQDVMI-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 241000562516 Thisbe Species 0.000 description 1
- 241000949477 Toona ciliata Species 0.000 description 1
- 238000010923 batch production Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- -1 dimethyl siloxane Chemical class 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 230000001050 lubricating effect Effects 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 238000003672 processing method Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 238000001291 vacuum drying Methods 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention relates to a flexible printed circuit fabricating method, and particularly relates to a method of fabricating a flexible printed circuit which is formed at one time on a plane, a curved surface or a three-dimensional surface. The fabricating method comprises a first step of drawing in which a conducting fluid material is used for drawing a pattern on the surface of a transfer printing substrate material, a second step of forming in which a curable flexible material is added to the surface to serve as a forming substrate material, a third step of transfer printing in which after the forming substrate material is curved, the transfer printing substrate material is removed, and a fourth step of packaging in which a packaging material is added to the forming substrate material to complete packaging. A single-layer or multi-layer circuit with a more complicated pattern can be fabricated in a simpler method, a three-dimensional printed circuit which is formed at one time on the plane or the curved surface can also be realized, and the application is wider.
Description
Technical field
The present invention relates to flexible printed circuit preparation method, relate in particular to one can plane,The preparation method of curved surface or the one-time formed flexible printed circuit of three-dimensional surface.
Background technology
The general hard copper foil substrate that adopts of traditional printed circuit board processing, outside modern comfortSee and the diversified development of application scenarios, electronics processing to lightweight, thin thickness, flexible,Stretchable flexible circuit has produced a large amount of demands. And, flexible circuit LCDs,In the portable electric appts such as digital camera, mobile phone, notebook computer, all there is good applicationProspect. Traditional hard circuit cannot meet above-mentioned requirements, thereby, have and process simple, one-tenthThe flexible circuit of the features such as this is cheap becomes the product of industry active demand already.
Flexible circuit board acceptable substrate is PI (polyimides) copper-clad plate at present, and it canFree bend, coiling, folding, can require to arrange arbitrarily according to space layout, can be in three-dimensionalSpace is mobile and flexible arbitrarily, can reach integrated that components and parts assembling is connected with wire; AlsoThere is excellent radiating effect and solderability and be easy to the advantages such as load, integrated cost be lower. But withTime also to have disposable initial cost high, complex manufacturing technology, the shortcoming such as retractility is limited.
In recent years, some are studied taking PDMS (dimethyl siloxane) silica gel as flexible electrical roadbedMaterial, by directly writing at PDMS, mask spray printing or etch conduit, recharges conductor fluidMode is printed on circuit on PDMS base material, for the manufacture of flexible circuit provides new selection.But, due to the flexible material surface elasticities such as PDMS and frictional force larger, in its surface notEasily realize directly writing of conductor fluid by printing type, be more difficult to print complicated circuit. And coveringUnder mould auxiliary, although can draw the circuit of relative complex by modes such as spraying, smear,But due to the stronger mobility of conductor fluid material and the wetability feature weak to substrate, nothingMethod is guaranteed the precision of processing circuit. And etch the method for conduit at PDMS by masterplate,When PDMS separates with masterplate, because dimensional contraction deformation easily occurs in the variation of conduit bearing capacityDamage with fine structure.
In addition, the occasion of some special applications, requires circuit to be distributed as the vertical of different spaces planeBody structure, but above-mentioned technology can only rely on polylith to rely on, cannot process a straight formingThree-dimensional surface printed circuit.
Because the processing method of traditional PD MS flexible circuit cannot fundamentally solve above-mentioned askingTopic, and then make the processing link of general PDMS flexible circuit more loaded down with trivial details, consuming time, costAlso will greatly promote, be difficult to realize real batch production and large-scale application. Therefore, forAbove deficiency, the invention provides a kind of flexibility simple to operate, with low cost stretchable flatThe preparation method of face, curved surface or three-dimensional surface printed circuit.
Summary of the invention
(1) technical problem that will solve
The technical problem to be solved in the present invention is compared with existing PDMS flexible circuit, thisThe bright stretchable plane of a kind of flexibility simple to operate, with low cost, curved surface or the solid of providingThe preparation method of surface printed circuit.
(2) technical scheme
In order to solve the problems of the technologies described above, the invention provides a kind of preparation of flexible printed circuitMethod. The method comprises the following steps:
S1: draw, on the surface of transfer printing base material, draw a design with conductor fluid material;
S2: moulding, on described surface, add curable flexible material, as moulding substrate materialMaterial;
S3: transfer printing, after described moulding base material solidifies, transfer printing base material is removed;
S4: encapsulation, on described moulding base material, add encapsulating material, complete encapsulation.
Preferably, the flexible circuit that described step S4 is completed, by heeling-in, break-through, stackingMode realizes the preparation of the multi-layer flexible circuit of connection.
Preferably, described printed circuit in the time of multiple-level stack, the mode of communicating of each interlayer beInsert between layers solid conduction thing; Or in advance solid conduction thing is connected in transfer processIn described moulding base material; Or heeling-in solid conduction or non-conductive thing, after process to be formedExtract out, thereby form the duct connecting between layers.
Preferably, described printed circuit is two dimensional surface circuit, or curved surface circuit, or circuit dividesBe distributed in the stereo circuit of multiple Different Plane, curved surface.
Preferably, described surface is two dimensional surface or curved surface; Position is described transfer printing substrateThe sheet surface of material or planar surface, or the solid figure being formed by described transfer printing base materialEach inside and outside surface of shape thing, or fitted in advance by described transfer printing sheet of base material or flat boardIf the inside and outside surface of three-dimensional shape material.
Preferably, described conductor fluid material is with described transfer printing base material, described moulding baseThe deformation of bottom material, stretch generation corresponding deformation, stretching, and keep in described step S1The material that in described pattern, the break-make of circuit and local relative geometrical relation do not change.
Preferably, described transfer printing base material is for to have high tack to described conductor fluid material,And keep the fluid of drawing the described pattern in described step S1 that unnecessary mobile material does not occur.
Preferably, described moulding base material is to have flexibility; Can liquid form describedOn transfer printing base material, cover, wrap up or fill, and curing molding; To described conductionFluent material has high tack, and the material that can be separated with described transfer printing base material.
Preferably, described encapsulating material is the gummed paper identical or close with described moulding base materialMaterial, or the flexible closed material of plastics, rubber film.
Preferably, described conductor fluid material is gallium, mercury, gallium indium, the liquid gold of gallium indium tin room temperatureBelong to, or the conductor fluid made of Graphene, CNT, metal nanoparticle; Described transfer printingBase material is PVC plastics; Described moulding base material is PDMS silica gel; Described encapsulation materialMaterial is PDMS silica gel or sulphurated siliastic.
(3) beneficial effect
Technique scheme tool of the present invention has the following advantages: material requested is easy to preparation, makesTechnique is simple, with low cost, does not need can obtain having good flexibility and draftability with adhesiveFlexible circuit, and the liquid metal circuit obtaining is easily repaired. With existing PDMS flexibilityCircuit is compared, and it is more complicated that the present invention not only can produce figure by more simple methodSingle or multiple lift circuit, can also realize plane, curved surface and one-time formed three-dimensional printingCircuit, the scope of application is more extensive.
Brief description of the drawings
Fig. 1 is the preparation method's of flexible printed circuit provided by the invention method flow diagram;
Fig. 2 (a), Fig. 2 (b), Fig. 2 (c), Fig. 2 (d), Fig. 2 (e) are that the present invention carriesPreparation method's schematic diagram of the flexible printed circuit in simple flat surface of confession;
Fig. 3 is preparation method's schematic diagram of layer flexible printed circuit provided by the invention;
Fig. 4 (a) is the preparation side of the flexible printed circuit on three-dimensional surface provided by the inventionMethod schematic diagram;
Fig. 4 (b) is the preparation side of the flexible printed circuit on three-dimensional surface provided by the inventionThe A-A generalized section of method.
In figure: 1:PVC plastic tab; 2: liquid metal circuit; 3: mould; 4:PDMSSilica gel; 5: solid implant; 6: intercommunicating pore; 7: stereo shaping substrate.
Detailed description of the invention
Below in conjunction with drawings and Examples, the specific embodiment of the present invention is done further to retouch in detailState. Following examples are used for illustrating the present invention, but are not used for limiting the scope of the invention.
As shown in Figure 1, the preparation method's of flexible printed circuit provided by the invention method flowFigure.
This preparation method comprises the following steps:
S1: draw, on the surface of transfer printing base material, draw a design with conductor fluid material;
S2: moulding, add from the teeth outwards curable flexible material, as moulding base material;Wherein, surface is two dimensional surface or curved surface; Position is the sheet surface of transfer printing base materialOr planar surface, or in each of the three-dimensional shape material being formed by described transfer printing base material,Outer surface, or by described transfer printing sheet of base material or dull and stereotyped fit in default three-dimensional shape materialInside and outside surface.
S3: transfer printing, after described moulding base material solidifies, transfer printing base material is removed;
S4: encapsulation, on described moulding base material, add encapsulating material, complete encapsulation.
Further, the flexible circuit that step S4 is completed, by heeling-in, break-through, stacking sideFormula realizes the preparation of the multi-layer flexible circuit being communicated with. Wherein, printed circuit in the time of multiple-level stack,The mode of communicating of each interlayer is to insert between the layers solid conduction thing; Or in transfer processIn advance solid conduction thing is connected in described moulding base material; Or heeling-in solid conduction or non-Conducting objects, extracts out after process to be formed, thereby forms the duct connecting between layers.
Further, printed circuit is two dimensional surface circuit, or curved surface circuit, or circuit distributesIn the stereo circuit of multiple Different Plane, curved surface.
Further, conductor fluid material is the shape with transfer printing base material, moulding base materialBecome, stretching produces corresponding deformation, stretching, and keeps the logical of circuit in the pattern in step S1The material disconnected and local relative geometrical relation does not change. Wherein, conductor fluid material be gallium,The room temperature liquid metals such as mercury, gallium indium, gallium indium tin, or Graphene, CNT, metal nanoThe conductor fluids that particle is made etc., as limit.
Further, transfer printing base material is for to have high tack to conductor fluid material, and maintenanceThere is not unnecessary mobile material in the fluid of the pattern in plot step S1. Wherein, transfer printing substrateMaterial is taking PVC plastics as example, not as limit.
Further, moulding base material is to have flexibility; Can turn described by liquid formOn substrates printed material, cover, wrap up or fill, and curing molding; To conductor fluid materialMaterial has high tack the material that can be separated with transfer printing base material. Wherein, moulding substrateMaterial is PDMS silica gel, not as limit.
Further, encapsulating material is the gummed paper material identical or close with moulding base material,Or the flexible closed material of plastics, rubber film, described encapsulating material is PDMS silica gel or sulfurationSilicon rubber etc., as limit.
Embodiment mono-, Fig. 2 describes the flexible print in simple flat surface provided by the invention in detailThe preparation method of circuit.
Further, as shown in Fig. 2 (a), use gallium indium room temperature liquid metal alloy, at PVCOn (polyvinyl chloride) plastic tab 1, draw and the objective circuit liquid metal circuit of mirror image each other2. Liquid metal circuit 2 can directly be printed by liquid metal printer, also can be by coveringFilm spraying or the mode of smearing are drawn.
Further, as shown in Fig. 2 (b), mould 3 is placed on PVC plastic sheet 1 to mouldThe selection of dimension of tool 3 is only to expose the size of liquid metal circuit 2. The effect of mould 3 is to makePDMS silica gel 4 is regular shape while solidifying, prevents that PVC plastic sheet 1 is subjected to displacement simultaneously.Liquid PDMS silica gel 4 is poured in mould 3, after treating diffusion evenly. Put into vacuum dryIn dry case, design temperature, between 60 DEG C～80 DEG C, gets final product curing molding afterwards, also can for one hourBe placed directly under room temperature and place and within 48 hours, be cured above moulding.
Further, as shown in Fig. 2 (c), after treating the complete curing molding of PDMS silica gel 4,Slowly PVC plastic sheet 1 is removed, circuit can be transferred on PDMS silica gel 4.
Further, as shown in Fig. 2 (d), components and parts are inserted or are attached to PDMS silica gel 4On circuit on, then by mould 3 be placed in top, pour liquid PDMS silica gel into, by first devicePart and liquid metal circuit 2 encapsulate.
Further, as shown in Fig. 2 (e), be cured by above-mentioned same method,Obtain the stretchable flexible circuit of packaged individual layer.
Embodiment bis-, Fig. 3 describes the preparation of layer flexible printed circuit provided by the invention in detailMethod.
Further, layer flexible can stretch circuit can be by, obtains according to embodiment mono-methodSome individual layer circuit be bonded together and obtain. For example, all silica gel materials are PDMS, canTo fit by plasma treatment bonding technology.
Further, the mode of communicating between multilayer circuit is that solid implant 5 is erected atThe position that needs multilayer circuit to connect on PVC plastic sheet 1, and be coated with in solid implant 5 sidesBrush one deck gallium indium room temperature liquid metal alloy or lubricant. Fill out by the method in above-described embodiment oneFill PDMS silica gel 4 and prepare single-layer flex circuit, and then the flexible circuit obtaining is taking out solidAfter implant 5, form intercommunicating pore 6. Brush one deck gallium indium room temperature liquid metal alloy or lubricating oilEffect be easy to solid implant 5 to extract from PDMS silica gel 4 and do not cause silica gelDamage. Multilayer circuit is piled poststack, has the place gallium indium room temperature liquid metal alloy of intercommunicating pore 6Fill. Wherein, liquid metal alloy taking gallium indium room temperature liquid metal alloy as example, not with thisBe limited.
Embodiment tri-, Fig. 4 describes the flexible print on three-dimensional surface provided by the invention in detailThe preparation method of circuit.
Further, as shown in Fig. 4 (a), Fig. 4 (b), stereo shaping substrate 7 has oneTruncated cone-shaped inner surface, is plotted in liquid metal circuit 2 on the inner bottom surface and N-Side surf of truncated cone-shaped.First PDMS silica gel 4 is poured in truncated cone-shaped, round platform is filled completely, or at suitable mouldUnder tool booster action, make 4, PDMS silica gel cover the very thin one deck of truncated cone-shaped inner surface, thenPut into vacuum drying chamber curing molding. After solidifying, transfer printing PDMS silica gel 4 can be taken out,To the round table-like three-dimensional transfer printing substrate that is printed on the patterns such as circuit. Afterwards components and parts are inserted or are attached toOn the circuit of round table-like three-dimensional transfer printing substrate, then pour liquid PDMS silica gel into suitable dimensionTruncated cone-shaped mould, will be placed on truncated cone-shaped mould and carry out with the round table-like solid of components and partsEncapsulation. The flexibility that just can obtain a packaged truncated cone-shaped surface after solidifying can stretching three-dimensionalPrinted circuit.
In sum, the invention provides a kind of flexible print electricity simple to operate, with low costThe preparation method on road. The present invention not only can produce figure more by more simple methodComplicated single or multiple lift circuit, can also realize plane, curved surface and one-time formed solidPrinted circuit, the scope of application is more extensive.
Finally it should be noted that: above embodiment is only in order to technical scheme of the present invention to be described, andNon-to its restriction; Although the present invention is had been described in detail with reference to previous embodiment, abilityThe those of ordinary skill in territory is to be understood that: the skill that it still can be recorded aforementioned each embodimentArt scheme is modified, or part technical characterictic is wherein equal to replacement; And these are repaiiedChange or replace, not making the essence of appropriate technical solution depart from various embodiments of the present invention technical sideThe spirit and scope of case.
Claims (10)
1. a preparation method for flexible printed circuit, is characterized in that, comprises the following steps:
S1: draw, on the surface of transfer printing base material, draw a design with conductor fluid material;
S2: moulding, on described surface, add curable flexible material, as moulding substrate materialMaterial;
S3: transfer printing, after described moulding base material solidifies, transfer printing base material is removed;
S4: encapsulation, on described moulding base material, add encapsulating material, complete encapsulation.
2. the preparation method of flexible printed circuit according to claim 1, is characterized in that,The flexible circuit that described step S4 is completed, is realized and being communicated with by heeling-in, break-through, stack mannerThe preparation of multi-layer flexible circuit.
3. the preparation method of flexible printed circuit according to claim 2, is characterized in that,Described printed circuit is in the time of multiple-level stack, and the mode of communicating of each interlayer is to insert between the layersEnter solid conduction thing; Or in transfer process, in advance solid conduction thing is connected in to described moulding baseIn bottom material; Or heeling-in solid conduction or non-conductive thing, after process to be formed, extract out, thus shapeBecome the duct connecting between layers.
4. according to the preparation method of the flexible printed circuit described in any one in claim 1-3,It is characterized in that, described printed circuit is two dimensional surface circuit, or curved surface circuit, or circuit dividesBe distributed in the stereo circuit of multiple Different Plane, curved surface.
5. according to the preparation method of the flexible printed circuit described in any one in claim 1-3,It is characterized in that, described surface is two dimensional surface or curved surface; Position is described transfer printing substrateThe sheet surface of material or planar surface, or the solid figure being formed by described transfer printing base materialEach inside and outside surface of shape thing, or fitted in advance by described transfer printing sheet of base material or flat boardIf the inside and outside surface of three-dimensional shape material.
6. the preparation method of flexible printed circuit according to claim 5, is characterized in that,Described conductor fluid material be with the deformation of described transfer printing base material, described moulding base material,Stretch and produce corresponding deformation, stretching, and keep circuit in the described pattern in described step S1Break-make and the material that do not change of local relative geometrical relation.
7. the preparation method of flexible printed circuit according to claim 6, is characterized in that,Described transfer printing base material is for to have high tack to described conductor fluid material, and institute is drawn in maintenanceThere is not unnecessary mobile material in the fluid of stating the described pattern in step S1.
8. the preparation method of flexible printed circuit according to claim 7, is characterized in that,Described moulding base material is to have flexibility; Can liquid form at described transfer printing base materialOn cover, wrap up or fill, and curing molding; Described conductor fluid material is had to heightTack, and the material that can be separated with described transfer printing base material.
9. the preparation method of flexible printed circuit according to claim 8, is characterized in that,Described encapsulating material is the gummed paper material identical or close with described moulding base material, or plastics,The flexible closed material of rubber film.
10. the preparation method of flexible printed circuit according to claim 9, its feature existsIn, described conductor fluid material is gallium, mercury, gallium indium, gallium indium tin room temperature liquid metal, or stoneThe conductor fluid that China ink alkene, CNT, metal nanoparticle are made; Described transfer printing base materialFor PVC plastics; Described moulding base material is PDMS silica gel; Described encapsulating material is PDMSSilica gel or sulphurated siliastic.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201410571224.8A CN105592640B (en) | 2014-10-22 | 2014-10-22 | A kind of preparation method of flexible printed circuit |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410571224.8A CN105592640B (en) | 2014-10-22 | 2014-10-22 | A kind of preparation method of flexible printed circuit |
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| CN105592640A true CN105592640A (en) | 2016-05-18 |
| CN105592640B CN105592640B (en) | 2019-02-15 |
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