CN108206242A - Encapsulating structure of flexible OLED display and preparation method thereof - Google Patents
Encapsulating structure of flexible OLED display and preparation method thereof Download PDFInfo
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- CN108206242A CN108206242A CN201611179452.6A CN201611179452A CN108206242A CN 108206242 A CN108206242 A CN 108206242A CN 201611179452 A CN201611179452 A CN 201611179452A CN 108206242 A CN108206242 A CN 108206242A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/844—Encapsulations
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B82—NANOTECHNOLOGY
- B82Y—SPECIFIC USES OR APPLICATIONS OF NANOSTRUCTURES; MEASUREMENT OR ANALYSIS OF NANOSTRUCTURES; MANUFACTURE OR TREATMENT OF NANOSTRUCTURES
- B82Y30/00—Nanotechnology for materials or surface science, e.g. nanocomposites
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
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Abstract
The present invention relates to display technology fields, more particularly to a kind of encapsulating structure of flexible OLED display and preparation method thereof, by preparing the thin-film package composite film for including an at least material for the inoranic membrane of silicon-containing polymer on substrate, OLED to be encapsulated, and the silicon-containing polymer is added with nano material, due to being added with nano material of the particle size in Nano grade in silicon-containing polymer, therefore with the oxygen characteristic that preferably blocks water, so as to improve the oxygen effect that blocks water of OLED, reduce the thickness of thin-film packing structure, extend the service life of OLED, and since the particle size of nano material is very small, therefore any influence is not had to the quality of the inoranic membrane of silicon-containing polymer, the reduction of thin-film packing structure thickness simultaneously, to flexible OLED can soft bendable also have certain contribution.
Description
Technical field
The present invention relates to the encapsulating structures and its preparation of display technology field more particularly to a kind of flexible OLED display
Method.
Background technology
OLED, that is, Organic Light Emitting Diode (Organic Light-Emitting Diode), have self-luminous, high brightness,
The characteristics such as wide viewing angle, high contrast, deflection, low energy consumption, therefore widely paid close attention to, and as the display side of a new generation
Formula has started gradually to replace conventional liquid crystal, has been widely used in mobile phone screen, computer monitor, full-color TV etc..
Due to the material character of OLED device, easily gone bad by after moisture and oxygen invasion, therefore strictly to prevent to come
Enter device inside from the oxygen and moisture of ambient enviroment and touch sensitive organic substance and electrode.Because it is filled in organic light emission
Inside is put, the presence of moisture or oxygen easily causes the degeneration or failure of its characteristic, can make micro moisture organic
Compound layer is removed with electrode layer, blackspot is generated, so as to reduce device lifetime.Thus, to make OLED during long-term work
Degeneration and failure be inhibited, steady operation reaches enough service life, therefore to thin-film package (the thin film of OLED
Encapsulation, abbreviation TFE) the very high requirement of structure proposition.
The thin-film packing structure of current flexibility OLED is organic (organic)/inorganic (inorganic) composite stack film layer
Or multilayer inorganic film stacked structure, and due to the existing inorganic for preparing thin-film packing structure and organic material leakproofness not
By force；In order to achieve the purpose that excellent sealing effect, the thickness that needs to prepare inoranic membrane is 300~1000nm, the thickness of organic film
1um-10um；Even sometimes for packaging effect is promoted, the barrier layer that thickness is more than 50um can be also added on TFE
(barrier film) can thus greatly increase the thickness of OLED encapsulating structures, this is that those skilled in the art do not expect
It sees.
Invention content
In view of the above problems, the invention discloses a kind of encapsulating structure of flexible OLED display, including：
Substrate；
OLED device is set on the substrate；
Thin-film package composite film is formed on the substrate, the OLED device is packaged on the substrate；
Wherein, the thin-film package composite film includes an at least material and is the inoranic membrane of silicon-containing polymer, and described contain
Nano material is added in silicon polymer.
The invention also discloses a kind of preparation methods of the encapsulating structure of flexible OLED display, which is characterized in that including：
One substrate is provided；
OLED device is prepared on the substrate；
A thin-film package composite film is prepared, the OLED device is packaged on the substrate；
Wherein, the thin-film package composite film includes an at least material and is the inoranic membrane of silicon-containing polymer, and described contain
Nano material is added in silicon polymer.
Foregoing invention has the following advantages that or advantageous effect：
The invention discloses a kind of encapsulating structure of flexible OLED display and preparation method thereof, by being made on substrate
The standby thin-film package composite film including an at least material for the inoranic membrane of silicon-containing polymer, OLED is encapsulated, and should
Silicon-containing polymer is added with nano material, due to being added with nano material of the particle size in Nano grade in silicon-containing polymer,
Therefore with the oxygen characteristic that preferably blocks water, so as to improve the oxygen effect that blocks water of OLED, the thickness of thin-film packing structure is reduced,
Extend the service life of OLED, and since the particle size of nano material is very small, to the quality of the inoranic membrane of silicon-containing polymer
Do not have any influence, while the reduction of thin-film packing structure thickness, to flexible OLED can soft bendable also have certain tribute
It offers.
Description of the drawings
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, the present invention and its feature, outer
Shape and advantage will become more apparent.Identical label indicates identical part in whole attached drawings.Not can according to than
Example draws attached drawing, it is preferred that emphasis is shows the purport of the present invention.
Fig. 1 is the schematic diagram of the encapsulating structure of flexible OLED display in the embodiment of the present invention；
Fig. 2 is the method flow diagram for the encapsulating structure that flexible OLED display is prepared in the embodiment of the present invention.
Specific embodiment
The present invention is further illustrated with specific embodiment below in conjunction with the accompanying drawings, but not as the limit of the present invention
It is fixed.
Embodiment one：
As shown in Figure 1, the present embodiment is related to a kind of encapsulating structure of flexible OLED display, including substrate 1, it is set to base
OLED device 2 on plate 1 is formed on substrate 1, thin-film package composite membrane OLED device 2 being packaged on substrate 1
Layer 3；Wherein, thin-film package composite film includes the inoranic membrane that an at least material is silicon-containing polymer, and in the silicon-containing polymer
Added with nano material, due to being added with nano material of the particle size in Nano grade in silicon-containing polymer, have more
The good oxygen characteristic that blocks water, so as to improve the oxygen effect that blocks water of OLED, reduces the thickness of thin-film packing structure, extends OLED's
Service life, and since the particle size of nano material is very small, the quality of the inoranic membrane of silicon-containing polymer is not had any
It influences；Optionally, which is TFT (thin film transistor (TFT)) array substrate.
In an optional embodiment of the present invention, above-mentioned nano material is nano silicon dioxide (SiO2), three oxygen of nanometer
Change two aluminium (Al2O3), nano aluminum nitride (AlN), nano-titanium oxide (TiO2), nano zircite (ZrO2), nano magnesia
(MgO) or nanometer (HfO2) hafnium oxide etc..
In an optional embodiment of the present invention, above-mentioned silicon-containing polymer is polyoxy SiClx, poly- silicon oxynitride, poly- carbon nitrogen
SiClx, poly- silicon oxide carbide, poly- carbon silicon oxynitride or poly- silicon nitride etc..
In an optional embodiment of the present invention, the thinner thickness of above-mentioned inoranic membrane, specifically, the thickness of the inoranic membrane
For 50nm~10um (such as 50nm, 1um, 5um or 10um etc.).
In an optional embodiment of the present invention, above-mentioned thin-film package composite film 3 includes thin-film encapsulation layer 31 and position
Material on thin-film encapsulation layer 31 is the inoranic membrane 32 of the silicon-containing polymer added with nano material；It illustrates only and adds in figure
It is located at situation on thin-film encapsulation layer 31 (i.e. added with nano material added with the inoranic membrane 32 of the silicon-containing polymer of nano material
The inoranic membrane 32 of silicon-containing polymer be located at the situation of 3 top layer of thin-film package composite film)；It certainly should be added with nano material
The inoranic membrane 32 of silicon-containing polymer also can be in any one or more layers (such as intermediate one layer in thin-film package composite film 3
Or intermediate three layers or the bottom and top layer)；Even thin-film package composite film 3 includes multiple film layers, then film can be set to seal
Fill the inoranic membrane of any film layer or arbitrary several film layers for the silicon-containing polymer added with nano material in composite film 3；
This can be by those skilled in the art according to concrete technology Demand Design.
In an optional embodiment of the present invention, thin-film encapsulation layer 31 includes several inorganic material films being sequentially overlapped
Or the organic material film and inorganic material film of several alternately superpositions；Wherein, the material of organic material film can be methacrylaldehyde
Based polyalcohol, silicon-based polymer or epoxy-based polymerization object etc.；The material of inorganic material film is silicon nitride (SiNx), silica
(SiO2), alchlor (Al2O3), titanium dioxide (TiO2), zirconium dioxide (ZrO2), magnesia (MgO) or hafnium oxide
(HfO2) etc..
Embodiment two：
As shown in Fig. 2, the present embodiment is related to a kind of preparation method of the encapsulating structure of flexible OLED display, specifically,
This includes the following steps：
Step S1 provides a substrate, which is tft array substrate.
Step S2, prepares OLED device on substrate, prepares the OLED device and includes anode, hole injection layer, hole
The organic function layers such as transport layer, luminescent layer, electron transfer layer, electron injecting layer and cathode, due to being prepared on substrate
OLED device and the improved emphasis of non-present invention, are not just repeated herein.
Step S3 prepares a thin-film package composite film, OLED device is packaged on substrate；Wherein, film seals
It fills composite film and includes the inoranic membrane that an at least material is silicon-containing polymer, and nano material is added in the silicon-containing polymer,
To improve the oxygen effect that blocks water of OLED, the thickness of thin-film packing structure is reduced, extends the service life of OLED.
In an optional embodiment of the present invention, using the polyoxy SiClx added with nano material, poly- silicon oxynitride, gather
Carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride or poly- silicon nitride prepare the inoranic membrane that above-mentioned material is silicon-containing polymer.
In an optional embodiment of the present invention, above-mentioned nano material is nano silicon dioxide (SiO2), three oxygen of nanometer
Change two aluminium (Al2O3), nano aluminum nitride (AlN), nano-titanium oxide (TiO2), nano zircite (ZrO2), nano magnesia
(MgO) or nanometer (HfO2) hafnium oxide etc..
In an optional embodiment of the present invention, the thickness for preparing the inoranic membrane that above-mentioned material is silicon-containing polymer is
50nm~10um.
In an optional embodiment of the present invention, the step of above-mentioned steps S3, specifically includes：
Step S31 prepares a thin-film encapsulation layer, OLED device is packaged on substrate.
In an optional embodiment of the present invention, it is thin including several inorganic material being sequentially overlapped to prepare thin-film encapsulation layer
Film prepares organic material film and inorganic material film that thin-film encapsulation layer includes several alternately superpositions.Wherein, it prepares organic
The material of material film is acryl polymer, silicon-based polymer or epoxy-based polymerization object etc.；Prepare inorganic material film
Material is silicon nitride, silica, alchlor, titanium dioxide, zirconium dioxide, magnesia or hafnium oxide etc..
Step S32 provides silicon-containing polymer, and adds nano material in the silicon-containing polymer.
Step S33 prepares nothing using the above-mentioned silicon-containing polymer added with nano material in the upper surface of thin-film encapsulation layer
Machine film.
In an optional embodiment of the present invention, using hot evaporation (Thermal deposition), spin coating (spin-
Coating), spray (spray-coating), silk-screen printing (screen printing), ink jet printing (ink-jetting),
Drop coating (dispensing), sputtering (sputtering), vacuum deposition (vacuum deposition), ion beam vapor deposition (e-
Beam thermal evaporation), atomic layer deposition (ALD), chemical vapor deposition (CVD) or ion beam assisted depositing
(IBAD) method prepares the inoranic membrane that above-mentioned material is silicon-containing polymer in the upper surface of thin-film encapsulation layer.
Wherein, chemical vapor deposition can be plasma reinforced chemical vapour deposition (PECVD), high-density plasma chemistry gas
Mutually deposition (HDP-CVD), inductively coupled plasma chemical vapor deposition (ICP-CVD), capacitiveiy coupled plasma chemical vapor deposition
Product (CCP-CVD), surface wave plasma chemical vapour deposition technique (SWP-CVD) etc..
It is not difficult to find that the present embodiment is the corresponding method of embodiment with the encapsulating structure of above-mentioned flexible OLED display
Embodiment, the present embodiment can work in coordination implementation with the embodiment of the encapsulating structure of above-mentioned flexible OLED display.Above-mentioned flexibility
The relevant technical details mentioned in the embodiment of the encapsulating structure of OLED display screen are still effective in the present embodiment, in order to reduce
It repeats, which is not described herein again.Correspondingly, the relevant technical details mentioned in present embodiment are also applicable in above-mentioned flexibility OLED
In the embodiment of the encapsulating structure of display screen.
Presently preferred embodiments of the present invention is described above.It is to be appreciated that the invention is not limited in above-mentioned
Particular implementation, wherein the equipment and structure be not described in detail to the greatest extent are construed as giving reality with the common mode in this field
It applies；Any those skilled in the art, without departing from the scope of the technical proposal of the invention, all using the disclosure above
Methods and technical content technical solution of the present invention is made many possible changes and modifications or be revised as equivalent variations etc.
Embodiment is imitated, this is not affected the essence of the present invention.Therefore, every content without departing from technical solution of the present invention, foundation
The technical spirit any simple modifications, equivalents, and modifications made to the above embodiment of the present invention, still fall within the present invention
In the range of technical solution protection.
Claims (17)
1. a kind of encapsulating structure of flexible OLED display, which is characterized in that including：
Substrate；
OLED device is set on the substrate；And
Thin-film package composite film is formed on the substrate, the OLED device is packaged on the substrate；
Wherein, the thin-film package composite film includes the inoranic membrane that an at least material is silicon-containing polymer, and described siliceous poly-
It closes and nano material is added in object.
2. the encapsulating structure of flexible OLED display as described in claim 1, which is characterized in that the nano material is selected from and receives
Rice silica, nanometer alchlor, nano aluminum nitride, nano-titanium oxide, nano zircite, nano magnesia and nano oxidized
Any one of hafnium material or combination.
3. the encapsulating structure of flexible OLED display as described in claim 1, which is characterized in that the silicon-containing polymer is selected from
Polyoxy SiClx, poly- silicon oxynitride, any one of poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride and poly- silicon nitride material
Expect or combination.
4. the encapsulating structure of flexible OLED display as described in claim 1, which is characterized in that the thickness of the inoranic membrane is
50nm~10um.
5. the encapsulating structure of flexible OLED display as described in claim 1, which is characterized in that the thin-film package composite membrane
Layer includes thin-film encapsulation layer and the inoranic membrane on the thin-film encapsulation layer.
6. the encapsulating structure of flexible OLED display as claimed in claim 5, which is characterized in that the thin-film encapsulation layer includes
Several inorganic material films being sequentially overlapped.
7. the encapsulating structure of flexible OLED display as claimed in claim 5, which is characterized in that the thin-film encapsulation layer includes
The organic material film and inorganic material film of several alternately superpositions；
The material of the organic material film is selected from acryl polymer, silicon-based polymer and epoxy-based polymerization object.
8. the encapsulating structure of flexible OLED display as claimed in claims 6 or 7, which is characterized in that the inorganic material is thin
The material of film appointing in silicon nitride, silica, alchlor, titanium dioxide, zirconium dioxide, magnesia and hafnium oxide
A kind of material or combination.
9. a kind of preparation method of flexible OLED display encapsulating structure, which is characterized in that including：
One substrate is provided；
OLED device is prepared on the substrate；And
A thin-film package composite film is prepared, the OLED device is packaged on the substrate；
Wherein, the thin-film package composite film includes the inoranic membrane that an at least material is silicon-containing polymer, and described siliceous poly-
It closes and nano material is added in object.
10. the preparation method of flexible OLED display encapsulating structure as claimed in claim 9, which is characterized in that using addition
There are the polyoxy SiClx of nano material, poly- silicon oxynitride, poly- carbonitride of silicium, poly- silicon oxide carbide, poly- carbon silicon oxynitride or poly- silicon nitride
Prepare the inoranic membrane.
11. the preparation method of flexible OLED display encapsulating structure as claimed in claim 9, which is characterized in that the nanometer
Material word selection nano silicon dioxide, nanometer alchlor, nano aluminum nitride, nano-titanium oxide, nano zircite, nano magnesia
Or any one of nano-hafnium oxide material or combination.
12. the preparation method of flexible OLED display encapsulating structure as claimed in claim 9, which is characterized in that described inorganic
Film prepares thickness as 50nm~10um.
13. the preparation method of flexible OLED display encapsulating structure as claimed in claim 9, which is characterized in that the preparation
One thin-film package composite film, the step of OLED device is packaged on the substrate, include：
A thin-film encapsulation layer is prepared, the OLED device is packaged on the substrate；
Silicon-containing polymer is provided, and nano material is added in the silicon-containing polymer；And
The inoranic membrane is prepared in the upper surface of the thin-film encapsulation layer using the silicon-containing polymer added with nano material.
14. the preparation method of flexible OLED display encapsulating structure as claimed in claim 13, which is characterized in that described in preparation
The step of thin-film encapsulation layer, is including being sequentially overlapped several inorganic material films.
15. the preparation method of flexible OLED display encapsulating structure as claimed in claim 13, which is characterized in that described in preparation
The step of thin-film encapsulation layer, includes several organic material films and inorganic material film of alternately superposition；
Wherein, the material for preparing the organic material film is selected from acryl polymer, silicon-based polymer and epoxy-based polymerization
Object.
16. the flexible OLED display encapsulating structure as described in claims 14 or 15, which is characterized in that prepare the inorganic material
Expect the material of film in silicon nitride, silica, alchlor, titanium dioxide, zirconium dioxide, magnesia and hafnium oxide
Any material or combination.
17. the preparation method of flexible OLED display encapsulating structure as claimed in claim 13, which is characterized in that steamed using heat
Plating, spin coating, spraying, silk-screen printing, ink jet printing, drop coating, sputtering, vacuum deposition, ion beam vapor deposition, atomic layer deposition, chemistry
The method of vapor deposition or ion beam assisted depositing prepares the inoranic membrane in the upper surface of the thin-film encapsulation layer.
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| CN201611179452.6A CN108206242A (en) | 2016-12-19 | 2016-12-19 | Encapsulating structure of flexible OLED display and preparation method thereof |
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Cited By (2)
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| CN110246985A (en) * | 2019-06-21 | 2019-09-17 | 京东方科技集团股份有限公司 | Electroluminescent device, preparation method and display device |
| CN113629210A (en) * | 2021-07-27 | 2021-11-09 | 深圳市华星光电半导体显示技术有限公司 | Packaging structure, display panel and manufacturing method of display panel |
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Application publication date: 20180626 |