CN108204988A - Diamond wire mass parameter detection device and its machined parameters adjustment method - Google Patents
Diamond wire mass parameter detection device and its machined parameters adjustment method Download PDFInfo
- Publication number
- CN108204988A CN108204988A CN201810084781.5A CN201810084781A CN108204988A CN 108204988 A CN108204988 A CN 108204988A CN 201810084781 A CN201810084781 A CN 201810084781A CN 108204988 A CN108204988 A CN 108204988A
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- Prior art keywords
- diamond wire
- measured
- mass parameter
- diamond
- detection device
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229910003460 diamond Inorganic materials 0.000 title claims abstract description 114
- 239000010432 diamond Substances 0.000 title claims abstract description 114
- 238000001514 detection method Methods 0.000 title claims abstract description 25
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000005286 illumination Methods 0.000 claims abstract description 4
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 28
- 239000002245 particle Substances 0.000 claims description 26
- 238000009826 distribution Methods 0.000 claims description 21
- 239000000428 dust Substances 0.000 claims description 16
- 239000007788 liquid Substances 0.000 claims description 15
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims description 15
- 229910052759 nickel Inorganic materials 0.000 claims description 14
- 238000007747 plating Methods 0.000 claims description 14
- 239000002253 acid Substances 0.000 claims description 13
- 239000003513 alkali Substances 0.000 claims description 9
- 239000000835 fiber Substances 0.000 claims 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims 1
- 239000010931 gold Substances 0.000 claims 1
- 229910052737 gold Inorganic materials 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 abstract description 20
- 230000008569 process Effects 0.000 description 4
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 3
- 230000008859 change Effects 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 241000208340 Araliaceae Species 0.000 description 1
- 235000005035 Panax pseudoginseng ssp. pseudoginseng Nutrition 0.000 description 1
- 235000003140 Panax quinquefolius Nutrition 0.000 description 1
- 229910000831 Steel Inorganic materials 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000004364 calculation method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 235000008434 ginseng Nutrition 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B11/00—Measuring arrangements characterised by the use of optical techniques
- G01B11/08—Measuring arrangements characterised by the use of optical techniques for measuring diameters
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/94—Investigating contamination, e.g. dust
- G01N2021/945—Liquid or solid deposits of macroscopic size on surfaces, e.g. drops, films, or clustered contaminants
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Polishing Bodies And Polishing Tools (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Metal Extraction Processes (AREA)
Abstract
The invention belongs to diamond wire manufacture fields to be measured, and in particular to diamond wire mass parameter detection device and its machined parameters adjustment method.Including detection light source and CCD camera, detection light source includes the back light and side-lit light source that are separately positioned on diamond wire both sides to be measured, back light vertical irradiation diamond wire to be measured, side-lit light source oblique illumination diamond wire to be measured, it is smooth area to be measured at the irradiation convergence of back light and side-lit light source, CCD camera acquisition is located at the mass parameter of diamond wire to be measured in smooth area to be measured.In the technical program, increase diamond wire mass parameter detection device on existing diamond wire apparatus for production line, not only cost is relatively low, the authenticity of the diamond wire mass parameter detected and comprehensive can be improved, and effectively the machined parameters of production line can be automatically adjusted in real time by above-mentioned mass parameter, to reach the stability of diamond wire product quality and reliability, meet the needs of client, reduce the loss of client.
Description
Technical field
The invention belongs to diamond wire manufacture fields to be measured, and in particular to diamond wire mass parameter detection device and its processing ginseng
Number adjustment method.
Background technology
Each mass parameter of the on-line checking of diamond wire production at present can only be as the reference data in production process, can not
User is supplied to, and single side face detection can only be carried out to diamond wire as quality report, data reliability is also poor, and use is two-sided
Detection then needs 2 sets of detecting systems, greatly increases cost；In terms of the accuracy of data, traditional vision detection system uses
Simple side irradiation mode, when particle and linear diameter to surface detect, hence it is evident that have larger gap with authentication data, it is impossible to make
For operation instruction process data.
Invention content
The purpose of the present invention is：Diamond wire mass parameter detection device and its machined parameters adjustment method are provided, to gram
Take it is above-mentioned in the prior art the defects of.
The adopted technical solution is that：
Diamond wire mass parameter detection device, including pedestal and the side-lit light source being fixed on pedestal and CCD camera,
It is characterized in that：The back light being fixed on the pedestal is further included, the back light is arranged on diamond wire to be measured
Side, vertical irradiation diamond wire to be measured are smooth area to be measured at the irradiation convergence of back light and side-lit light source, CCD camera acquisition
The mass parameter of diamond wire to be measured in smooth area to be measured.
Further, the mass parameter includes Buddha's warrior attendant linear diameter to be measured and surface particles distribution density.
Further, the back light, side-lit light source and CCD camera are fixed on by adjustable support on pedestal respectively.
Further, it is fixed with prism group on the debugging stent of the back light.
Further, wire-crossing wheel group is set on the pedestal, and diamond wire to be measured is wrapped between wire-crossing wheel group, and is in stretch
State.
Further, the side-lit light source includes two LED light fibres.
The present invention also provides diamond wire machined parameters adjustment methods, are characterized in that：Include the following steps：
Vertical irradiation is carried out to diamond wire to be measured, acquires diamond wire diameter parameters to be measured in real time；
Oblique illumination is carried out to diamond wire to be measured, acquires diamond wire surface particles distribution density parameter to be measured in real time；
According to collected diamond wire diameter parameters to be measured and surface particles distribution density parameter, image is generated, debugging is treated
Diamond wire machined parameters are surveyed, including：Diamond dust concentration in electroplate liquid, nickel plating current strength, acid and alkali cleansing solution temperature and producing line speed
Degree.
Further, specifically, when collected diamond wire diameter parameters to be measured are gradually reduced in real time, then nickel plating electricity is improved
Intensity of flow；When real-time collected diamond wire diameter parameters to be measured gradually increase, then nickel plating current strength is reduced.
Further, specifically, collected diamond wire surface particles distribution density parameter to be measured is less than predetermined threshold in real time
During value, then diamond dust concentration in electroplate liquid is improved, reduce producing line speed；Diamond wire surface particles distribution to be measured collected in real time
When density parameter is higher than predetermined threshold, then diamond dust concentration in electroplate liquid is reduced, improve producing line speed.
Further, specifically, being shown in described image, when dirty, subtle burr is distributed in the surface of diamond wire to be measured
When, acid and alkali cleansing solution temperature is improved, when the surface of diamond wire to be measured is uniform, reduces acid and alkali cleansing solution temperature.
The beneficial effects of the invention are as follows：In the technical program, increase diamond wire on existing diamond wire apparatus for production line
Mass parameter detection device, not only cost is relatively low, can improve the authenticity of the diamond wire mass parameter detected and comprehensive,
And effectively the machined parameters of production line can be automatically adjusted in real time by above-mentioned mass parameter, to reach diamond wire production
The stability and reliability of quality, meet the needs of client, reduce the loss of client.
Description of the drawings
Fig. 1 is the diamond wire mass parameter structure of the detecting device schematic diagram that embodiment provides；
Fig. 2 is the diamond wire mass parameter detection device vertical view that embodiment provides；
In figure, 1-CCD cameras, 2- back lights, 3- side-lit light sources, 4- diamond wires, 5- debugging stent, 6- prism groups, 7-
Wire-crossing wheel group.
Specific embodiment
Below in conjunction with the attached drawing of the present invention, technical scheme of the present invention is clearly and completely described.Based on this hair
Embodiment in bright, the every other implementation that those of ordinary skill in the art are obtained without creative efforts
Example, shall fall within the protection scope of the present invention.
As Figure 1-Figure 2, the present embodiment provides a kind of diamond wire mass parameter detection device, including pedestal, Yi Jigu
The side-lit light source and CCD camera being scheduled on pedestal, further include the back light being fixed on pedestal, and back light is arranged on to be measured
Diamond wire side, vertical irradiation diamond wire to be measured are smooth area to be measured at the irradiation convergence of back light and side-lit light source, CCD phases
Machine acquisition is located at the mass parameter of diamond wire to be measured in smooth area to be measured.
Mass parameter includes Buddha's warrior attendant linear diameter to be measured and surface particles distribution density.
Back light, side-lit light source and CCD camera are fixed on by adjustable support on pedestal respectively.
Prism group is fixed on the debugging stent of back light.
Wire-crossing wheel group is set on pedestal, and diamond wire to be measured is wrapped between wire-crossing wheel group, and in straight condition.
Side-lit light source includes two LED light fibres.
The present embodiment also provides a kind of diamond wire machined parameters adjustment method, includes the following steps：
Vertical irradiation is carried out to diamond wire to be measured, acquires diamond wire diameter parameters to be measured in real time；
Oblique illumination is carried out to diamond wire to be measured, acquires diamond wire surface particles distribution density parameter to be measured in real time；
According to collected diamond wire diameter parameters to be measured and surface particles distribution density parameter, image is generated, debugging is treated
Diamond wire machined parameters are surveyed, including：Diamond dust concentration in electroplate liquid, nickel plating current strength, acid and alkali cleansing solution temperature and producing line speed
Degree.
Specifically, when collected diamond wire diameter parameters to be measured are gradually reduced in real time, then nickel plating current strength is improved；It is real
When collected diamond wire diameter parameters to be measured when gradually increasing, then reduce nickel plating current strength.
Specifically, when collected diamond wire surface particles distribution density parameter to be measured is less than predetermined threshold in real time, then carry
Diamond dust concentration in high electroplate liquid reduces producing line speed；Real-time collected diamond wire surface particles distribution density parameter to be measured
During higher than predetermined threshold, then diamond dust concentration in electroplate liquid is reduced, improve producing line speed.
Specifically, being shown in image, when dirty, subtle burr is distributed in the surface of diamond wire to be measured, it is clear to improve soda acid
Wash temperature when the surface of diamond wire to be measured is uniform, reduces acid and alkali cleansing solution temperature.
In the course of work, it using backlight source of parallel light, can prevent size from deformity occurs, effectively improve the essence of detected size
Degree, the demand produced at present of diamond wire are controlled at 1 μm of precision, it is therefore desirable to using the highlighting backlight of similar directional light.When
It when needing to detect particle, needs to observe positive distribution of particles situation, it is therefore desirable to which front carries out polishing, in order to preferably observe
The distribution situation of particle, using sidelight form, this form light can improve the contrast for adopting figure on the surface of particle, facilitate meter
Calculation machine software is calculated, using highlighted just because it is contemplated that diamond wire in process of production, needs high-speed motion, therefore exposes
Degree need to be controlled in 10 microseconds hereinafter, such can just collect clearly picture, raising accuracy of detection and accuracy.
The quality of diamond wire production mainly has relationship, diamond wire production warp with the distribution density of the diameter of line and surface particles
When crossing novel visual detecting system, the acquisition of image is carried out by closing and opening backlight and sidelight, backlight is opened and sidelight
It closes, this when figure is adopted by ccd cameras and can realized and the diameter of diamond wire is detected, when backlight is closed and sidelight is opened,
Detection to the distribution of particles density data on diamond wire surface can be realized by adopting figure by ccd cameras.
Diamond wire is in process of manufacture, mainly with current parameters in electroplate liquid when diamond dust concentration, nickel plating etc., acid
Alkaline cleaner temperature is related with speed of production.After qualitative data by detection system unified test, according to the changing rule of qualitative data,
It can be realized by the production technology adjustment relevant technological parameter of system call interception and the quality of production of diamond wire is adjusted, ensured
Stability in the entire production process of production line reduces bad, raising production efficiency.
The surface particles distribution of diamond wire is an important parameter, such as when the distribution of particles for detecting diamond wire surface
When less, then show the concentration of diamond dust in electroplate liquid not enough and line speed is too fast, this when first is to need to increase
Diamond dust improves the concentration of diamond dust, and industrial personal computer provides communication signal to PLC controller at this time, passes through PLC controller control machine
Tool action carries out the addition of diamond dust, and second is the speed for reducing producing line, and equipment is reduced by PLC controller control instruction complete machine
Running speed.Otherwise when detecting that diamond wire surface particles are more and when being unevenly distributed easy reunion, industrial personal computer provides communication letter
Number to PLC controller, then PLC controller improves the speed of service of producing line by sending out instruction, and being carried out at the same time reduces in electroplate liquid
The concentration of diamond dust, this when are instructed by PLC controller, the addition to liquid case progress liquid, and diamond dust is dense in reduction liquid
Degree.
When dirty, subtle burr is distributed with by the surface particles of Machine Vision Detection to diamond wire, show
Soda acid cleaning process is not thorough, and is needed to improve the temperature of soda acid cleaning at this time, cleaning dynamics is increased, when detecting line than more uniform
When, then it needs to reduce the temperature of acid and alkali cleansing solution, prevents excessive loss's wire busbar so that steel wire busbar attenuates, so as to shadow
Ring the quality of diamond wire.
Diamond wire be electroplated after diameter, be an important data, when detecting the linear diameter that routinely produces
When data change, current parameters when needing to nickel plating are adjusted, and the linear diameter for producing finished product is by original busbar line
Diameter adds nickel plating layer thick, therefore the variation of line footpath, is influenced by nickel plating technology；When vision system detects that Buddha's warrior attendant linear diameter has
After the trend that becomes smaller, then high current parameter is needed, carry out the thickening of nickel coating, reach the qualified demand of production, when detecting Buddha's warrior attendant
Linear diameter has change trend, then shows that coating thickeies, need to carry out reduction adjustment to current parameters.The tune of these current parameters
It is whole, all it is that signal is provided to PLC controller system by industrial personal computer, real-time current parameter is adjusted by PLC controller.
The above description is merely a specific embodiment, but protection scope of the present invention is not limited thereto, any
Those familiar with the art in the technical scope disclosed by the present invention, can readily occur in change or replacement, should all contain
Lid is within protection scope of the present invention.Therefore, protection scope of the present invention should be based on the protection scope of the described claims.
Claims (10)
1. diamond wire mass parameter detection device, including pedestal and the side-lit light source being fixed on pedestal and CCD camera,
It is characterized in that：The back light being fixed on the pedestal is further included, the back light is arranged on diamond wire side to be measured, hangs down
Diamond wire to be measured is directly irradiated, is located to be measured for smooth area to be measured, CCD camera acquisition at the irradiation convergence of back light and side-lit light source
The mass parameter of diamond wire to be measured in light area.
2. diamond wire mass parameter detection device according to claim 1, it is characterised in that：The mass parameter includes treating
Survey Buddha's warrior attendant linear diameter and surface particles distribution density.
3. diamond wire mass parameter detection device according to claim 2, it is characterised in that：The back light, sidelight
Light source and CCD camera are fixed on by adjustable support on pedestal respectively.
4. diamond wire mass parameter detection device according to claim 3, it is characterised in that：The debugging of the back light
Prism group is fixed on stent.
5. diamond wire mass parameter detection device according to claim 4, it is characterised in that：Line was set on the pedestal
Wheel group, diamond wire to be measured are wrapped between wire-crossing wheel group, and in straight condition.
6. diamond wire mass parameter detection device according to claim 5, it is characterised in that：The side-lit light source includes two
LED light fibre.
7. diamond wire machined parameters adjustment method, it is characterised in that：Include the following steps：
Vertical irradiation is carried out to diamond wire to be measured, acquires diamond wire diameter parameters to be measured in real time；
Oblique illumination is carried out to diamond wire to be measured, acquires diamond wire surface particles distribution density parameter to be measured in real time；
According to collected diamond wire diameter parameters to be measured and surface particles distribution density parameter, image is generated, debugs gold to be measured
Firm line machined parameters, including：Diamond dust concentration in electroplate liquid, nickel plating current strength, acid and alkali cleansing solution temperature and producing line speed.
8. diamond wire machined parameters adjustment method according to claim 7, it is characterised in that：Specifically, it collects in real time
Diamond wire diameter parameters to be measured when being gradually reduced, then improve nickel plating current strength；Real-time collected Buddha's warrior attendant linear diameter to be measured
When parameter gradually increases, then nickel plating current strength is reduced.
9. diamond wire machined parameters adjustment method according to claim 7, it is characterised in that：Specifically, it collects in real time
Diamond wire surface particles distribution density parameter to be measured be less than predetermined threshold when, then improve diamond dust concentration in electroplate liquid, reduce
Producing line speed；When real-time collected diamond wire surface particles distribution density parameter to be measured is higher than predetermined threshold, then plating is reduced
Diamond dust concentration in liquid improves producing line speed.
10. diamond wire machined parameters adjustment method according to claim 7, it is characterised in that：Specifically, in described image
Display when dirty, subtle burr is distributed in the surface of diamond wire to be measured, improves acid and alkali cleansing solution temperature, when diamond wire to be measured
Surface it is uniform when, reduce acid and alkali cleansing solution temperature.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810084781.5A CN108204988A (en) | 2018-01-29 | 2018-01-29 | Diamond wire mass parameter detection device and its machined parameters adjustment method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810084781.5A CN108204988A (en) | 2018-01-29 | 2018-01-29 | Diamond wire mass parameter detection device and its machined parameters adjustment method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108204988A true CN108204988A (en) | 2018-06-26 |
Family
ID=62606501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201810084781.5A Pending CN108204988A (en) | 2018-01-29 | 2018-01-29 | Diamond wire mass parameter detection device and its machined parameters adjustment method |
Country Status (1)
| Country | Link |
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| CN (1) | CN108204988A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2010012644A2 (en) * | 2008-07-31 | 2010-02-04 | Eads Deutschland Gmbh | Optical particle detector and detection method |
| CN102352523A (en) * | 2011-11-09 | 2012-02-15 | 长沙岱勒新材料科技有限公司 | Heat treatment method for electroplated diamond wire saw |
| CN102890039A (en) * | 2011-07-22 | 2013-01-23 | 浙江思博恩新材料科技有限公司 | Method and device for detecting density and distribution of diamond wire abrasive particles |
| CN106926375A (en) * | 2017-04-25 | 2017-07-07 | 镇江仁德新能源科技有限公司 | A kind of diamond fretsaw on-line measuring device |
| CN206520107U (en) * | 2017-04-25 | 2017-09-26 | 镇江仁德新能源科技有限公司 | A kind of diamond fretsaw on-line measuring device |
| CN107299378A (en) * | 2017-05-26 | 2017-10-27 | 杨凌美畅新材料有限公司 | A kind of manufacture method of high efficiency cutting silicon chip diamond wire |
| CN207798704U (en) * | 2018-01-29 | 2018-08-31 | 江苏泓麒智能科技有限公司 | Diamond wire mass parameter detection device |
-
2018
- 2018-01-29 CN CN201810084781.5A patent/CN108204988A/en active Pending
Patent Citations (7)
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|---|---|---|---|---|
| WO2010012644A2 (en) * | 2008-07-31 | 2010-02-04 | Eads Deutschland Gmbh | Optical particle detector and detection method |
| CN102890039A (en) * | 2011-07-22 | 2013-01-23 | 浙江思博恩新材料科技有限公司 | Method and device for detecting density and distribution of diamond wire abrasive particles |
| CN102352523A (en) * | 2011-11-09 | 2012-02-15 | 长沙岱勒新材料科技有限公司 | Heat treatment method for electroplated diamond wire saw |
| CN106926375A (en) * | 2017-04-25 | 2017-07-07 | 镇江仁德新能源科技有限公司 | A kind of diamond fretsaw on-line measuring device |
| CN206520107U (en) * | 2017-04-25 | 2017-09-26 | 镇江仁德新能源科技有限公司 | A kind of diamond fretsaw on-line measuring device |
| CN107299378A (en) * | 2017-05-26 | 2017-10-27 | 杨凌美畅新材料有限公司 | A kind of manufacture method of high efficiency cutting silicon chip diamond wire |
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Non-Patent Citations (1)
| Title |
|---|
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