CN108202873B - 用于复合结构的导电紧固系统 - Google Patents
用于复合结构的导电紧固系统 Download PDFInfo
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- CN108202873B CN108202873B CN201710976154.8A CN201710976154A CN108202873B CN 108202873 B CN108202873 B CN 108202873B CN 201710976154 A CN201710976154 A CN 201710976154A CN 108202873 B CN108202873 B CN 108202873B
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- support structure
- fastener
- composite structure
- conductive paste
- composite
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Abstract
本发明涉及一种用于复合结构的导电紧固系统。用于将复合结构连接到支撑结构的导电紧固件系统包括复合结构孔,所述复合结构孔延伸穿过所述复合结构并且与至少部分地延伸穿过所述支撑结构的支撑结构孔共享公共轴线。紧固件包括具有外表面的柄,所述紧固件穿过所述复合结构孔且至少部分地穿过所述支撑结构孔并且在所述柄的所述外表面与所述复合结构孔的所述内表面之间提供环形空间。所述环形空间用导电膏填充,所述导电膏包括悬浮在粘合剂中的导电颗粒。
Description
技术领域
本公开总体涉及用于将复合结构连接到支撑结构的导电紧固系统。更具体地,本公开涉及用于复合结构与下层支撑结构之间的导电接头的紧固系统,以在雷击的情况下维持复合结构的完整性。
背景技术
飞机经常遭受雷击。事实上,飞机实际上在飞过云的带电区域时可以触发雷电。最初,雷电将附着至飞机的末端,诸如机头或翼尖。随着飞机飞过电闪区,电流将在离开另一末端(诸如机尾)之前流过外蒙皮和飞机的其他结构。飞机被设计成确保在该导电路径中没有间隙。虽然一些飞机由导电铝制蒙皮建造,但是较新式的飞机可具有由较不导电的复合材料制成的蒙皮。
复合材料包括两种或更多种组成材料,包括基质材料和增强材料。飞机蒙皮所使用的复合材料包括碳纤维增强聚合物(“CFRP”),其中聚合物树脂用作基质并用碳纤维增强。碳纤维比聚合物树脂更具导电性,并因此当雷击到配备有CFRP蒙皮的飞机时用作主导体。
与使用飞机外蒙皮的CFRP关联的一个问题是用于将形成蒙皮的CFRP面板连接到下层的支撑结构的装置。具体地,当穿过复合蒙皮钻孔以接收将复合蒙皮附着至支撑结构的螺栓或紧固件时,孔的内表面可能是粗糙的并且包括在纤维与金属紧固件之间形成间隙的凹痕。在雷击的情况下,这些间隙可能破坏穿过复合蒙皮的导电路径并且在CFRP/紧固件界面处产生静电力积聚,这可能通过焦耳加热而损伤复合蒙皮并且生成危险的火花。焦耳加热以及CFRP/紧固件柄界面处损伤背后的物理原因是由钻孔过程造成的纤维与紧固件之间的连接不足。剩余的连接纤维因雷电流的浪涌而过载,结果,过载的纤维将热量传递至相邻的树脂基质。虽然CFRP纤维因热量而有弹性,但是树脂快速加热,绝热并立即开始分解,生成热的气体和等离子体(单位为微秒)。树脂的加热和分解会在紧固件与CFRP之间的环面附近造成高的局部焦耳加热。除气和热等离子体将形成可传播穿过任何开放通路的冲击波。
为了防止这样的问题并且在纤维与紧固件之间提供可靠的连接,紧固件可涂覆有导电密封剂,替代地,可插入紧固件使之穿过导电套筒。当前可用的导电密封剂包括具有分散在树脂内的导电填料(诸如金属颗粒)的树脂或聚合物。因为颗粒在树脂内被间隔开(如图5所示),可以产生静电力,这可能导致树脂的降解以及过热气体和颗粒的形成。导电套筒仍可能在套筒与纤维之间留有间隙,因此也不能解决这个问题。此外,套筒的制造昂贵且安装耗时。
需要一种可靠且降低制造成本的用于以导电的方式将复合结构连接到金属紧固件的改进装置。
发明内容
一种用于将复合结构连接到支撑结构的紧固件系统包括复合结构孔,所述复合结构孔延伸穿过所述复合结构并且与至少部分地延伸穿过所述支撑结构的支撑结构孔共享公共轴线。所述复合结构孔和支撑结构孔各具有围绕所述公共轴线的内表面。所述系统包括紧固件,所述紧固件包括具有外表面的柄,所述紧固件穿过所述复合结构孔且至少部分地穿过所述支撑结构孔并且在所述柄的所述外表面与所述复合结构孔的所述内表面之间提供环形空间。导电膏放置在所述环形空间中。所述导电膏包括悬浮在粘合剂中的导电颗粒,其中所述导电膏中的所述导电颗粒的体积超过所述导电膏中的所述粘合剂的体积。
还公开了一种复合结构与支撑结构之间的导电复合接头。所述复合结构定位成与所述支撑结构相邻并且包括延伸穿过所述复合结构的复合结构孔。所述支撑结构包括至少部分地延伸穿过所述支撑结构的支撑结构孔。所述复合结构孔和支撑结构孔是同轴的并且各具有内表面。所述连接件进一步包括紧固件,所述紧固件包括具有外表面的柄。所述紧固件穿过所述复合结构孔且至少部分地穿过所述支撑结构孔并且在所述柄的所述外表面与所述复合结构孔的所述内表面之间提供环形空间。导电膏放置在所述环形空间中。所述导电膏包括悬浮在粘合剂中的导电颗粒,其中所述导电颗粒的体积与布置在所述环形空间中的所述导电膏的总体积的比率超过0.70。
公开了一种将复合结构机械地且电连接到支撑结构的方法,该方法包括:将平均颗粒尺寸约30为微米的导电颗粒与粘合剂混合,以提供导电颗粒的体积与所述导电膏的总体积的比率至少约为0.70的导电膏;将所述复合结构定位成与所述支撑结构相邻;提供同轴地延伸穿过所述复合结构和支撑结构的孔;与所述支撑结构相反地形成与所述复合结构中的所述孔同轴的埋头孔;用所述导电膏至少部分地填充所述埋头孔和所述孔;提供具有布置在近侧头部与螺纹远端之间的柄的紧固件;插入所述紧固件穿过所述孔,使得所述头部布置在所述埋头孔中并且所述螺纹远端延伸超出所述支撑结构;将螺母以螺纹的方式联接到所述紧固件的所述螺纹远端上;以及拧紧所述螺母,从而提供位于所述复合结构、所述紧固件与所述导电膏之间的电接触或连接。
当结合附图阅读时,其他优点和特征将根据以下详细描述而变得显而易见。
附图说明
为了更全面地理解所公开的方法和设备,应参照附图里更详细说明的示例,其中:
图1是具有复合外蒙皮的飞机的侧视图;
图2是用紧固件将复合结构连接到支撑结构的紧固系统的剖视图;
图3是图2的紧固系统的部分剖视图,特别说明了通过穿过容纳紧固件的复合结构进行钻孔而造成的粗糙度和凹痕;
图4是图3中示出的紧固系统的另一部分剖视图,特别说明了在紧固件与复合结构之间的环形空间中使用导电膏,以在复合结构与紧固件之间提供导电性。
图5示意性地说明了具有不足量的导电颗粒的导电膏,以在复合结构与紧固件之间提供可靠的导电连接件;以及
图6示意性地说明了根据本公开制造的且包括足量导电颗粒的导电膏,以在复合结构(或者更具体地,复合结构的纤维)与紧固件之间提供可靠的导电连接件。
附图不一定按比例绘制并且可示意地和/或以局部视图说明公开的示例。在某些情形下,附图可省略对于理解所公开的方法和设备不是必需的或者致使其他细节难以察觉的细节。应当理解,当然,本公开不限于本文中说明的特定示例。
具体实施方式
图1图示了具有由复合材料(诸如CFRP或本领域技术人员已知的其他复合材料)制造的外蒙皮11的飞行器10。外蒙皮11形成机翼12和机身13的至少一部分,两者均包括内部燃料罐。
为了解决因雷击接合复合结构及其他EME所产生的问题,本公开揭示了用于将复合结构21连接到支撑结构22的紧固件系统20,如图2所示。紧固件系统20包括复合结构孔23,复合结构孔23延伸穿过复合结构21并且与至少部分地延伸穿过支撑结构22的支撑结构孔25共享公共轴线24。复合结构孔23和支撑结构孔25分别各具有内表面26、27。在图2至图4所示的示例中,复合结构孔23的内表面26是粗糙的,具有径向地远离紧固件28延伸到复合结构21中的凹痕44。内表面26的粗糙度是使复合结构孔23钻过复合结构21(通常包括纤维31)的结果。CFRP的塑料或树脂和纤维31的组合致使CFRP在钻孔、冲孔或形成复合结构孔23的其他手段期间容易碎裂,从而产生具有凹痕44的粗糙的内表面26。
紧固件28包括具有外表面33的柄32。紧固件28穿过复合结构孔23并且至少部分地穿过支撑结构孔25,导致柄32的外表面33与复合结构孔23的内表面26之间的环形空间34。紧固件28的柄32在头部35与螺纹远端36之间延伸,螺纹远端36以螺纹的方式接合螺母37。如图2至图4中图示的,拧紧螺母37导致复合结构21夹紧到支撑结构22。替代地,支撑结构孔25可以带有螺纹,并且紧固件28的螺纹远端36可以螺纹的方式联接到支撑结构22。
转到图5至图6,导电膏41布置在柄32的外表面33与复合结构孔23的内表面26之间的环形空间34中。如图6所示,导电膏41包括悬浮在粘合剂43中的导电颗粒42。如图6中示意性地示出的,导电颗粒42的体积超过环形空间34中的粘合剂43的体积。例如,导电颗粒42的体积与环形空间34中的导电膏41的总体积(即,导电颗粒42和粘合剂43的组合体积)的比率超过0.64。该比率提供了复合结构21的纤维31与紧固件28之间的适当连接。为了提供复合结构21的纤维31与紧固件28之间更好的连接,导电颗粒42的体积与环形空间34中的导电膏41的总体积的比率超过0.70。该比率(可被称为“填充因数”)必须足够高到提供纤维31与紧固件28之间的所需连接。如果可能,对于球形导电颗粒42,采用的比率或填充因数接近约0.74的理论最大值。采用接近或达到理论填充因数的比率增强了纤维31与紧固件28之间的连接可靠性。对于均匀大小的球形导电颗粒42,该比率或填充因数的理论最大值为导电膏41的总体积的74.048%
图6示出了接近或达到理论填充因数的球形导电颗粒42的填料。与图6中示出的密集填料相比,图5的导电膏41具有导电颗粒42的体积与导电膏41的总体积的较小比率。比率小于0.64,可能小于0.50,导致导电颗粒42之间的间隙并可能生成静电力,静电力可能导致树脂的降解以及过热气体的形成,这可能损害复合结构21的结构完整性。
导电颗粒42的尺寸是相关的。具体地,已经发现,沿着复合结构孔23的内表面26的凹痕44(因钻孔或冲孔而造成)的大小可平均约为100微米。为了用一个或多个导电颗粒42填充这些凹痕44,导电颗粒42可呈球形形状并且具有小于凹痕44的平均粒径或平均颗粒尺寸。在一个示例中,导电颗粒42具有约30微米以下的平均粒径。球形导电颗粒42可比其他可用形状更密集填充并且有助于将导电颗粒42的体积与导电膏41的总体积的比率增加至高于0.70的水平。将该比率增加至接近理论填充因数的水平的能力增强了纤维31与紧固件28之间的连接。
导电颗粒42用选自由铜、镍、铬、铝、其混合物及其合金组成的组的材料制成。不需要使用低熔点材料或合金,并且鉴于使用上面列出的更廉价和更丰富的材料可避免使用低熔点合金的成本。
适当粘性的导电膏41便于安装公开的紧固件系统20和/或紧固件28,从而降低制造成本。虽然导电膏41可具有小于10,000cP(厘泊)的粘度,但是典型的导电膏41将具有从约1500到约3000cP的范围内的粘度。相对较高的粘度使得技术人员在插入金属紧固件28之前容易将导电膏41施加到复合结构孔23。导电膏41可使用各种已知的施加器(诸如简单的挤压管)插入到复合结构孔23中。因此,导电膏41不需要专用的施加器。此外,导电膏41由于其最大或接近最大的填充填料(如图6所示)像不可压缩的导电粉末一样起作用,环形空间34中的导电膏41将具有与典型但昂贵的套筒干涉配合紧固件相同的机械(拉伸)性能。
如图2至图6所示,支撑结构孔25延伸穿过支撑结构22,并且紧固件28包括近端,近端包括头部35,头部布置成相对于柄32远离被布置成超出支撑结构22的螺纹远端36。螺纹远端36以螺纹的方式联接到螺母37,螺母布置成相对于支撑结构22远离复合结构21。复合结构孔23包括用于容纳紧固件28的头部35的埋头孔或凹部46。
导电紧固件系统20将复合结构21(诸如飞机蒙皮)物理连接和电连接到支撑结构22。复合结构21定位成与支撑结构22相邻、在支撑结构22顶部或者在支撑结构22下方。复合结构21包括延伸穿过复合结构21的复合结构孔23,并且支撑结构22包括至少部分地延伸穿过支撑结构22的支撑结构孔25。在图2至图6中,复合结构孔23包括用于容纳紧固件28的头部35的埋头孔或凹部46。此外,支撑结构孔25延伸穿过支撑结构22,并且头部35和螺母37的组合将复合结构21和支撑结构22夹紧在一起。替代配置可以包括:提供沿着支撑结构孔25的内表面27的螺纹,以接合紧固件28的螺纹远端36,从而将复合结构21连接或夹紧到支撑结构22。复合结构孔23和支撑结构孔25是同轴的,每者均分别具有内表面26、27。紧固件28包括具有外表面33的柄32。紧固件28穿过复合结构孔23并且至少部分地穿过支撑结构孔25,从而在柄32的外表面33与分别为复合结构孔23和支撑结构孔25的内表面26、27之间提供环形空间34。导电膏41布置在环形空间34中并且可在插入紧固件28之前施加导电膏41。导电膏41包括悬浮在粘合剂43中的足量导电颗粒42,使得导电颗粒42的体积与布置在环形空间34中的导电膏41的总体积的比率超过0.70,如图6所示。
还公开了将复合结构21机械地和导电地连接到支撑结构22的方法。该方法包括:将平均颗粒尺寸约为30微米的导电颗粒42与粘合剂43混合,以提供导电颗粒42的体积与导电膏41的总体积的比率约为0.74的导电膏41。复合结构21被定位成与支撑结构22相邻。该方法进一步包括:形成分别同轴地延伸穿过复合结构21和支撑结构22的孔23、25;以及在复合结构21中形成埋头孔46,埋头孔46与复合结构孔23同轴且相对于复合结构21远离支撑结构22。该方法还包括:用导电膏41至少部分地填充埋头孔46和复合结构孔23。提供紧固件28,紧固件28具有布置在近侧头部35与螺纹远端36之间的柄32。该方法进一步包括:插入紧固件28穿过复合结构孔23和支撑结构孔25,使得头部35布置在埋头孔46中,螺纹远端36延伸超出支撑结构22,并且环形空间34用导电膏41填充。在将螺母37以螺纹的方式联接到紧固件28的螺纹远端36上之后,拧紧螺母37。
此外,本公开包括根据以下条款的实施方式:
1、一种用于将复合结构连接到支撑结构的紧固件系统,该紧固件系统包括:
复合结构孔,所述复合结构孔延伸穿过所述复合结构并且与至少部分地延伸穿过所述支撑结构的支撑结构孔共享公共轴线,所述复合结构孔和支撑结构孔各具有围绕所述公共轴线的内表面;
紧固件,所述紧固件包括具有外表面的柄,所述紧固件穿过所述复合结构孔且至少部分地穿过所述支撑结构孔并且在所述柄的所述外表面与所述复合结构孔的所述内表面之间提供环形空间;以及
导电膏,所述导电膏布置在所述环形空间中,所述导电膏包括悬浮在粘合剂中的导电颗粒,其中所述导电膏中的所述导电颗粒的体积超过所述导电膏中的所述粘合剂的体积。
2、根据条款1所述的紧固件系统,其中,所述导电颗粒的所述体积与所述环形空间中的所述导电膏的总体积的比率超过0.64。
3、根据条款1所述的紧固件系统,其中,所述导电颗粒的所述体积与所述环形空间中的所述导电膏的总体积的比率超过0.70。
4、根据条款3所述的紧固件系统,其中,所述导电颗粒为球形。
5、根据条款1所述的紧固件系统,其中,所述导电颗粒的所述体积与所述环形空间中的所述导电膏的总体积的比率约为0.74。
6、根据条款5所述的紧固件系统,其中,所述导电颗粒为球形并且具有约30微米的平均粒径。
7、根据条款1所述的紧固件系统,其中,所述导电颗粒用选自所述由铜、镍、铬、铝、其混合物及其合金组成的组的材料制成。
8、根据条款1所述的紧固件系统,其中,所述导电膏的粘度小于10,000cP。
9、根据条款1所述的紧固件系统,其中,所述导电膏的粘度介于从约1500到约3000cP的范围内。
10、根据条款1所述的紧固件系统,其中,所述支撑结构孔延伸穿过所述支撑结构,所述紧固件包括近端,所述近端包括头部,所述头部布置成相对于所述柄远离被布置成超出所述支撑结构的螺纹远端,所述螺纹远端以螺纹的方式联接到螺母,所述螺母布置成相对于所述支撑结构远离所述复合结构。
11、根据条款10所述的紧固件系统,其中,所述复合结构孔包括凹部,所述凹部用于容纳所述紧固件的所述头部。
12、一种复合结构与支撑结构之间的导电连接件,该导电连接件包括:
所述复合结构,所述复合结构定位成与所述支撑结构相邻;
所述复合结构包括延伸穿过所述复合结构的复合结构孔,并且所述支撑结构包括至少部分地延伸穿过所述支撑结构的支撑结构孔,所述复合结构孔和支撑结构孔是同轴的,所述复合结构孔和支撑结构孔各具有内表面;
紧固件,所述紧固件包括具有外表面的柄,所述紧固件穿过所述复合结构孔且至少部分地穿过所述支撑结构孔并且在所述柄的所述外表面与所述复合结构孔的所述内表面之间提供环形空间;以及
导电膏,所述导电膏布置在所述环形空间中,所述导电膏包括悬浮在粘合剂中的导电颗粒,其中所述导电颗粒的体积与布置在所述环形空间中的所述导电膏的总体积的比率超过0.70。
13、根据条款12所述的导电连接件,其中,所述导电颗粒为球形并且具有约30微米的平均颗粒尺寸。
14、根据条款13所述的导电连接件,其中,所述导电颗粒的所述体积与所述环形空间中的所述导电膏的总体积的比率约为0.74。
15、根据条款12所述的导电连接件,其中,所述导电颗粒用选自所述由铜、镍、铬、铝、其混合物及其合金组成的组的材料制成。
16、根据条款12所述的导电连接件,其中,所述导电膏的粘度小于10,000cP。
17、根据条款12所述的导电连接件,其中,所述导电膏的粘度介于从约1500到约3000cP的范围内。
18、根据条款12所述的导电连接件,其中,所述紧固件包括近端,所述近端包括头部,所述头部从布置在所述支撑结构外侧的螺纹远端、与所述柄相反地布置,所述螺纹远端以螺纹的方式联接到螺母,所述螺母从所述复合结构、与所述支撑结构相反地布置。
19、根据条款18所述的导电连接件,其中,所述复合结构孔包括凹部,所述凹部用于容纳所述紧固件的所述头部。
20、一种借助中断穿过所述复合结构的导电路径将复合结构连接到支撑结构的方法,该方法包括:
将平均颗粒尺寸约30为微米的导电颗粒与粘合剂混合,以提供导电颗粒的体积与所述导电膏的总体积的比率约为0.74的导电膏;
将所述复合结构定位成与所述支撑结构相邻;
提供同轴地延伸穿过所述复合结构和支撑结构的孔;
与所述支撑结构相反地形成与所述复合结构中的所述孔同轴的埋头孔;
用所述导电膏至少部分地填充所述埋头孔和所述孔;
提供具有布置在近侧头部与螺纹远端之间的柄的紧固件;
插入所述紧固件穿过所述孔,使得所述头部布置在所述埋头孔中并且所述螺纹远端延伸超出所述支撑结构;
将螺母以螺纹的方式联接到所述紧固件的所述螺纹远端上;以及
拧紧所述螺母,从而提供所述复合结构、所述紧固件与所述导电膏之间的电接触。
工业应用性
所公开的紧固系统可用于将复合结构(诸如飞行器的复合外蒙皮)连接到支撑结构。在雷击的情况下,复合外蒙皮到下层金属结构之间的导电连接件提供经过复合蒙皮的连续电流并且避免可能损伤复合蒙皮的静电力的积聚。
虽然仅阐述了某些示例,但是替代和修改将根据以上描述对本领域技术人员是显而易见的。这些及其他替代视为等同物并且在本公开及随附权利要求书的精神和范围内。
Claims (11)
1.一种用于将复合结构(21)连接到支撑结构(22)的紧固件系统(20),该紧固件系统包括:
复合结构孔(23),所述复合结构孔延伸穿过所述复合结构并且与至少部分地延伸穿过所述支撑结构的支撑结构孔(25)共享公共轴线(24),所述复合结构孔和支撑结构孔均具有围绕所述公共轴线的内表面;
紧固件(28),所述紧固件包括具有外表面(33)的柄(32),所述紧固件穿过所述复合结构孔且至少部分地穿过所述支撑结构孔并且在所述柄的所述外表面与所述复合结构孔的所述内表面之间提供环形空间(34);以及
导电膏(41),所述导电膏布置在所述环形空间中,所述导电膏包括悬浮在粘合剂(43)中的导电颗粒(42),其中所述导电膏中的所述导电颗粒的体积超过所述导电膏中的所述粘合剂的体积,
其中,所述复合结构孔(23)的所述内表面具有凹痕(44),所述导电颗粒(42)呈球形形状并且具有小于所述凹痕(44)的平均粒径。
2.根据权利要求1所述的紧固件系统(20),其中,所述导电颗粒(42)的所述体积与所述环形空间(34)中的所述导电膏(41)的总体积的比率超过0.64。
3.根据权利要求1所述的紧固件系统(20),其中,所述导电颗粒(42)的所述体积与所述环形空间(34)中的所述导电膏(41)的总体积的比率超过0.70。
4.根据权利要求1所述的紧固件系统(20),其中,所述导电颗粒(42)的所述体积与所述环形空间(34)中的所述导电膏(41)的总体积的比率约为0.74。
5.根据权利要求4所述的紧固件系统(20),其中,所述导电颗粒(42)具有约30微米的平均粒径。
6.根据权利要求1至5中的任一项所述的紧固件系统(20),其中,所述导电颗粒(42)用选自由铜、镍、铬、铝、它们的混合物及它们的合金组成的组中的材料制成。
7.根据权利要求1至5中的任一项所述的紧固件系统(20),其中,所述导电膏(41)的粘度小于10000 cP。
8.根据权利要求1至5中的任一项所述的紧固件系统(20),其中,所述导电膏(41)的粘度介于从1500到3000 cP的范围内。
9.根据权利要求1至5中的任一项所述的紧固件系统(20),其中,所述支撑结构孔(25)延伸穿过所述支撑结构(22),所述紧固件(28)包括近端,所述近端包括头部(35),所述头部布置成相对于所述柄(32)远离被布置成超出所述支撑结构的螺纹远端(36),所述螺纹远端以螺纹的方式联接到螺母(37),所述螺母(37)布置成相对于所述支撑结构远离所述复合结构(21)。
10.根据权利要求9所述的紧固件系统(20),其中,所述复合结构孔(23)包括埋头孔(46),所述埋头孔用于容纳所述紧固件(28)的所述头部(35)。
11.一种将复合结构(21)机械地及导电地连接到支撑结构(22)的方法,该方法包括:
将平均颗粒尺寸约为30微米的导电颗粒(42)与粘合剂(43)混合,以提供导电膏(41),其中导电颗粒的体积与所述导电膏的总体积的比率约为0.74;
将所述复合结构定位成与所述支撑结构相邻;
提供同轴地延伸穿过所述复合结构和支撑结构的孔,以形成复合结构孔(23)和支撑结构孔(25);
与所述支撑结构相反地形成与所述复合结构孔同轴的埋头孔(46);
用所述导电膏至少部分地填充所述埋头孔和同轴地延伸穿过所述复合结构和所述支撑结构的所述孔;
提供具有布置在近侧头部(35)与螺纹远端(36)之间的柄(32)的紧固件(28);
插入所述紧固件以穿过同轴地延伸穿过所述复合结构和所述支撑结构的所述孔,使得所述头部布置在所述埋头孔中并且所述螺纹远端延伸超出所述支撑结构;
将螺母(37)以螺纹的方式联接到所述紧固件的所述螺纹远端上;以及
拧紧所述螺母,从而提供在所述复合结构、所述紧固件与所述导电膏之间的电接触,
其中,所述复合结构孔(23)的内表面具有凹痕(44),所述导电颗粒(42)呈球形形状并且具有小于所述凹痕(44)的平均粒径。
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2016
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- 2017-10-19 CN CN201710976154.8A patent/CN108202873B/zh active Active
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BR102017024958B1 (pt) | 2023-10-31 |
JP2018101605A (ja) | 2018-06-28 |
BR102017024958A2 (pt) | 2018-10-30 |
EP3339186A1 (en) | 2018-06-27 |
US20180170576A1 (en) | 2018-06-21 |
EP3339186B1 (en) | 2021-08-04 |
BR102017024958A8 (pt) | 2022-09-27 |
US10640232B2 (en) | 2020-05-05 |
JP7032896B2 (ja) | 2022-03-09 |
CN108202873A (zh) | 2018-06-26 |
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