CN108197689A - 无源rfid电缆测温标签 - Google Patents
无源rfid电缆测温标签 Download PDFInfo
- Publication number
- CN108197689A CN108197689A CN201810215095.7A CN201810215095A CN108197689A CN 108197689 A CN108197689 A CN 108197689A CN 201810215095 A CN201810215095 A CN 201810215095A CN 108197689 A CN108197689 A CN 108197689A
- Authority
- CN
- China
- Prior art keywords
- capacitive coupling
- antenna
- passive rfid
- temperature measuring
- cable
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002184 metal Substances 0.000 claims abstract description 81
- 238000001514 detection method Methods 0.000 claims abstract description 6
- 230000008878 coupling Effects 0.000 claims description 62
- 238000010168 coupling process Methods 0.000 claims description 62
- 238000005859 coupling reaction Methods 0.000 claims description 62
- 238000004080 punching Methods 0.000 claims description 11
- 239000003292 glue Substances 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 8
- 238000005516 engineering process Methods 0.000 claims description 7
- 229920002379 silicone rubber Polymers 0.000 claims description 5
- 238000003825 pressing Methods 0.000 claims description 3
- 230000005611 electricity Effects 0.000 claims description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims 1
- 238000009434 installation Methods 0.000 abstract description 6
- 238000010586 diagram Methods 0.000 description 8
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 5
- 239000000741 silica gel Substances 0.000 description 5
- 229910002027 silica gel Inorganic materials 0.000 description 5
- 229960001866 silicon dioxide Drugs 0.000 description 5
- 239000002131 composite material Substances 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000009529 body temperature measurement Methods 0.000 description 1
- 230000035605 chemotaxis Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000011835 investigation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/0716—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor
- G06K19/0717—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips at least one of the integrated circuit chips comprising a sensor or an interface to a sensor the sensor being capable of sensing environmental conditions such as temperature history or pressure
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K7/00—Measuring temperature based on the use of electric or magnetic elements directly sensitive to heat ; Power supply therefor, e.g. using thermoelectric elements
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Theoretical Computer Science (AREA)
- Measuring Temperature Or Quantity Of Heat (AREA)
Abstract
Description
Claims (10)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810215095.7A CN108197689A (zh) | 2018-03-15 | 2018-03-15 | 无源rfid电缆测温标签 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201810215095.7A CN108197689A (zh) | 2018-03-15 | 2018-03-15 | 无源rfid电缆测温标签 |
Publications (1)
Publication Number | Publication Date |
---|---|
CN108197689A true CN108197689A (zh) | 2018-06-22 |
Family
ID=62595260
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201810215095.7A Pending CN108197689A (zh) | 2018-03-15 | 2018-03-15 | 无源rfid电缆测温标签 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN108197689A (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109307555A (zh) * | 2018-10-23 | 2019-02-05 | 中国人民解放军陆军工程大学 | 一种集成式温度传感射频同轴漏泄电缆 |
CN110027161A (zh) * | 2019-03-15 | 2019-07-19 | 华尔达(厦门)塑胶有限公司 | 一种带有天线的扎带的生产方法 |
CN110046689A (zh) * | 2019-05-07 | 2019-07-23 | 杭州电力设备制造有限公司 | 一种具有无线无源温度传感装置的配电箱 |
CN113310584A (zh) * | 2021-04-29 | 2021-08-27 | 贵州电网有限责任公司 | 一种适用于电力设备监测的智能无源无线RFID-LoRa测温方法及其系统 |
CN114720018A (zh) * | 2022-04-07 | 2022-07-08 | 中国电信股份有限公司 | 电源设备的监测系统、监测方法、电子设备及存储介质 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20080062046A1 (en) * | 2006-09-08 | 2008-03-13 | Intelleflex Corporation | Mounting structure for matching an rf integrated circuit with an antenna and rfid device implementing same |
US7551141B1 (en) * | 2004-11-08 | 2009-06-23 | Alien Technology Corporation | RFID strap capacitively coupled and method of making same |
US20130271265A1 (en) * | 2011-07-27 | 2013-10-17 | David Finn | Capacitive coupling of an rfid tag with a touch screen device acting as a reader |
CN105303205A (zh) * | 2015-09-30 | 2016-02-03 | 杭州凯源电子有限公司 | 一种柔性无源标签、无源柔性测温装置及无线供电组网测温系统 |
US20170214142A1 (en) * | 2014-10-08 | 2017-07-27 | Rfmicron, Inc. | Radio frequency identification (rfid) moisture tag(s) and sensors with extended sensing via capillaries |
CN207946836U (zh) * | 2018-03-15 | 2018-10-09 | 国网辽宁省电力有限公司营口供电公司 | 无源rfid电缆测温标签 |
-
2018
- 2018-03-15 CN CN201810215095.7A patent/CN108197689A/zh active Pending
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7551141B1 (en) * | 2004-11-08 | 2009-06-23 | Alien Technology Corporation | RFID strap capacitively coupled and method of making same |
US20080062046A1 (en) * | 2006-09-08 | 2008-03-13 | Intelleflex Corporation | Mounting structure for matching an rf integrated circuit with an antenna and rfid device implementing same |
US20130271265A1 (en) * | 2011-07-27 | 2013-10-17 | David Finn | Capacitive coupling of an rfid tag with a touch screen device acting as a reader |
US20170214142A1 (en) * | 2014-10-08 | 2017-07-27 | Rfmicron, Inc. | Radio frequency identification (rfid) moisture tag(s) and sensors with extended sensing via capillaries |
CN105303205A (zh) * | 2015-09-30 | 2016-02-03 | 杭州凯源电子有限公司 | 一种柔性无源标签、无源柔性测温装置及无线供电组网测温系统 |
CN207946836U (zh) * | 2018-03-15 | 2018-10-09 | 国网辽宁省电力有限公司营口供电公司 | 无源rfid电缆测温标签 |
Cited By (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN109307555A (zh) * | 2018-10-23 | 2019-02-05 | 中国人民解放军陆军工程大学 | 一种集成式温度传感射频同轴漏泄电缆 |
CN110027161A (zh) * | 2019-03-15 | 2019-07-19 | 华尔达(厦门)塑胶有限公司 | 一种带有天线的扎带的生产方法 |
CN110046689A (zh) * | 2019-05-07 | 2019-07-23 | 杭州电力设备制造有限公司 | 一种具有无线无源温度传感装置的配电箱 |
CN113310584A (zh) * | 2021-04-29 | 2021-08-27 | 贵州电网有限责任公司 | 一种适用于电力设备监测的智能无源无线RFID-LoRa测温方法及其系统 |
CN114720018A (zh) * | 2022-04-07 | 2022-07-08 | 中国电信股份有限公司 | 电源设备的监测系统、监测方法、电子设备及存储介质 |
CN114720018B (zh) * | 2022-04-07 | 2024-04-05 | 中国电信股份有限公司 | 电源设备的监测系统、监测方法、电子设备及存储介质 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information | ||
CB02 | Change of applicant information |
Address after: No. 40 East Bohai Avenue, Zhanqian District, Yingkou City, Liaoning Province Applicant after: YINGKOU ELECTRIC POWER SUPPLY COMPANY OF STATE GRID LIAONING ELECTRIC POWER SUPPLY Co.,Ltd. Applicant after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Applicant after: SHENZHEN GENRACE TECHNOLOGY Co.,Ltd. Applicant after: STATE GRID CORPORATION OF CHINA Address before: No. 40 East Bohai Avenue, Zhanqian District, Yingkou City, Liaoning Province Applicant before: YINGKOU ELECTRIC POWER SUPPLY COMPANY OF STATE GRID LIAONING ELECTRIC POWER SUPPLY Co.,Ltd. Applicant before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Applicant before: SHENZHEN GENRACE TECHNOLOGY Co.,Ltd. Applicant before: State Grid Corporation of China |
|
TA01 | Transfer of patent application right | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20180711 Address after: No. 40 East Bohai Avenue, Zhanqian District, Yingkou City, Liaoning Province Applicant after: YINGKOU ELECTRIC POWER SUPPLY COMPANY OF STATE GRID LIAONING ELECTRIC POWER SUPPLY Co.,Ltd. Applicant after: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Applicant after: SHENZHEN GENRACE TECHNOLOGY Co.,Ltd. Applicant after: STATE GRID INFORMATION & TELECOMMUNICATION GROUP Co.,Ltd. Applicant after: STATE GRID CORPORATION OF CHINA Address before: No. 40 East Bohai Avenue, Zhanqian District, Yingkou City, Liaoning Province Applicant before: YINGKOU ELECTRIC POWER SUPPLY COMPANY OF STATE GRID LIAONING ELECTRIC POWER SUPPLY Co.,Ltd. Applicant before: BEIJING SMARTCHIP MICROELECTRONICS TECHNOLOGY Co.,Ltd. Applicant before: SHENZHEN GENRACE TECHNOLOGY Co.,Ltd. Applicant before: STATE GRID CORPORATION OF CHINA |