CN108196432B - BPO photoresist ink-jet process - Google Patents
BPO photoresist ink-jet process Download PDFInfo
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- CN108196432B CN108196432B CN201810010168.9A CN201810010168A CN108196432B CN 108196432 B CN108196432 B CN 108196432B CN 201810010168 A CN201810010168 A CN 201810010168A CN 108196432 B CN108196432 B CN 108196432B
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 34
- 230000008569 process Effects 0.000 title claims abstract description 28
- 239000011521 glass Substances 0.000 claims abstract description 73
- 238000005507 spraying Methods 0.000 claims abstract description 16
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 claims abstract description 5
- 238000004140 cleaning Methods 0.000 claims abstract description 4
- 239000002184 metal Substances 0.000 claims abstract description 4
- 229910052751 metal Inorganic materials 0.000 claims abstract description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 28
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 24
- 239000010931 gold Substances 0.000 claims description 24
- 229910052737 gold Inorganic materials 0.000 claims description 24
- 230000001681 protective effect Effects 0.000 claims description 24
- 239000000377 silicon dioxide Substances 0.000 claims description 14
- 235000012239 silicon dioxide Nutrition 0.000 claims description 12
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 claims description 8
- 238000007747 plating Methods 0.000 claims description 4
- 239000012528 membrane Substances 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 14
- 235000019400 benzoyl peroxide Nutrition 0.000 description 50
- 239000004342 Benzoyl peroxide Substances 0.000 description 48
- 239000010410 layer Substances 0.000 description 21
- 239000006059 cover glass Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- OMPJBNCRMGITSC-UHFFFAOYSA-N Benzoylperoxide Chemical compound C=1C=CC=CC=1C(=O)OOC(=O)C1=CC=CC=C1 OMPJBNCRMGITSC-UHFFFAOYSA-N 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 239000003795 chemical substances by application Substances 0.000 description 2
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical class [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 description 2
- 239000003999 initiator Substances 0.000 description 2
- 239000011241 protective layer Substances 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 239000004793 Polystyrene Substances 0.000 description 1
- CDBYLPFSWZWCQE-UHFFFAOYSA-L Sodium Carbonate Chemical compound [Na+].[Na+].[O-]C([O-])=O CDBYLPFSWZWCQE-UHFFFAOYSA-L 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000007641 inkjet printing Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 150000001451 organic peroxides Chemical class 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
- -1 region Substances 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
- 239000000344 soap Substances 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000002834 transmittance Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/30—Imagewise removal using liquid means
- G03F7/32—Liquid compositions therefor, e.g. developers
- G03F7/322—Aqueous alkaline compositions
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
- G03F7/40—Treatment after imagewise removal, e.g. baking
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
The invention is suitable for the technical field of touch screens, and provides a BPO photoresist ink-jet process, which comprises the following steps: s1, placing the glass piece which is subjected to ITOpatten and Metal wiring in weak alkaline water for cleaning; s2, placing the cleaned glass piece on a table, debugging the table, and controlling a table voltage signal program, an ink-jet height, a running speed and a running track; directly spraying and printing the pattern required by people on the glass piece; s3, placing the glass piece subjected to ink jet in an exposure machine, and carrying out exposure operation; s4, placing the exposed glass piece in a developing device for developing operation; and S5, placing the developed glass piece in baking equipment for baking operation. The BPO photoresist ink-jet process provided by the invention can realize ink-jet operation of local BPO photoresist at the golden finger, can save BPO photoresist and save cost, and because the BPO photoresist with patterns is directly sprayed and printed at the golden finger, other parts of glass do not need to be covered by an auxiliary photomask during subsequent exposure and development, the production process is simpler, the production efficiency can be greatly improved, and the production time can be saved.
Description
Technical Field
The invention belongs to the technical field of touch screens, and particularly relates to a BPO photoresist ink-jet process.
Background
With the development of economy and the progress of society, touch screen terminal equipment such as mobile phones and tablet computers are increasingly popular with people, and people can perform various entertainment activities such as chatting and watching through the touch screen terminal equipment. The touch screen is an important component of the touch screen terminal device, and mainly plays roles in displaying and realizing human-computer interaction, wherein the ogs (one glass solution) capacitive screen is more and more widely applied due to the advantages of high light transmittance, high reaction speed, long service life, low production cost and the like.
An OGS capacitive screen is formed by directly forming an ITO (Indium Tin Oxides, abbreviated as ITO, i.e., Indium Tin oxide) conductive film, a sensor, etc. on a protective glass, i.e., the protective glass plays a role in both touch sensor and protection, since the ITO conductive film needs to be electrically connected with an FPC (Flexible Printed Circuit, abbreviated as FPC) in a touch screen terminal device, a gold finger electrically connected with the ITO conductive film, etc. needs to be arranged on the protective glass, and then the gold finger is connected with the FPC to electrically connect the ITO conductive film, etc. with the FPC, thereby implementing a touch function of the OGS capacitive screen.
In the production of the existing OGS capacitive screen, after the production of the ITO conductive film and the gold finger is completed, a blank layer is further required to be sprayed on the protective glass to blank the ITO conductive film and to form an OC photoresist protective layer by spraying an OC photoresist (also called as a protective layer photoresist) to protect the ITO conductive film and the gold finger, and in order to prevent the blank layer and the OC photoresist layer from covering the gold finger on the protective glass, a BPO photoresist material is firstly sprayed on the whole surface of the protective glass, and then the other parts of the glass except the gold finger are covered by an auxiliary mask, and then a BPO photoresist pattern covering the gold finger is obtained by development to protect the gold finger, and then after the blank layer and the OC photoresist layer are sprayed, the BPO photoresist pattern is removed by development and etching to expose the gold finger, but since the area of the gold finger only occupies one fifteenth of the glass area, after the BPO photoresist material is sprayed on the whole surface, the rest of the BPO photoresist which is not developed is shielded by the auxiliary photomask, which causes waste, and when the BPO photoresist pattern is obtained by developing, other positions of the protective glass need to be shielded by the auxiliary photomask, and the like, so that the process is troublesome and the practicability is not strong.
Wherein, regarding the BPO: BPO is a white fine-grained or powdery aqueous solid, a diacyl organic peroxide. The chemical name, Dibenzoyl peroxide (the english name is Dibenzoyl peroxide) and Benzoyl peroxide (Benzoyl peroxide), the common name is initiator BPO; the chemical formula is as follows: c14H10O4. Used as an initiator for polymerization reactions (such as polystyrene, polyacrylic), a curing agent for unsaturated resins, and a vulcanizing agent for silicone rubber. The BPO photoresist is a negative protective photoresist, specifically a photosensitive resin, like BM photoresist and OC photoresist.
Disclosure of Invention
The invention aims to overcome the defects of waste of BPO photoresist materials, troublesome process and poor practicability caused by spraying BPO photoresist patterns on protective glass in the prior art, and provides a BPO photoresist ink-jet process.
The invention is realized by the following steps: a BPO photoresist ink jet process comprising:
s1, placing a glass piece which is subjected to ITOpatten and Metal wiring in weak alkaline water for cleaning, wherein the glass piece comprises at least one piece of protective glass, and each piece of protective glass comprises a gold finger;
s2, placing the cleaned glass piece on a table, starting the table, and controlling a voltage signal program, an ink-jet height, a running speed and a running track of the table; directly spraying and printing a required pattern on the glass piece;
s3, placing the glass piece subjected to ink jet in an exposure machine, starting the exposure machine, and carrying out exposure operation;
s4, placing the exposed glass piece in a developing device, starting the developing device, and carrying out developing operation, wherein the developing solution in the developing device is a tetramethylammonium hydroxide solution with the concentration of 1.80-2.50%;
and S5, placing the developed glass piece in baking equipment, and starting the baking equipment to perform baking operation.
As a preferable scheme of the present invention, in the step S2, the viscosity of the BPO photoresist in the inkjet platform is 5-10 mpa · S, the spraying height of the inkjet platform is 5-30mm, the spraying speed of the inkjet platform is 150-200mm/S, and the operating voltage of the inkjet platform is 12-20V.
As a preferable embodiment of the present invention, in the step S3, the exposure energy of the exposure machine is 800 and 1000 mj/cm.
As a preferable scheme of the present invention, in the step S5, the baking temperature of the baking equipment is 120 ℃ to 140 ℃, and the baking time is 3 min to 5 min.
As a preferred embodiment of the present invention, after the step S5, the method further includes:
and S6, plating a silicon dioxide film layer on the BPO photoresist ink-jet surface of the baked glass piece.
As a preferred embodiment of the present invention, after the step S6, the method further includes:
and S7, spraying OC light resistor on the silicon dioxide film layer.
As a preferred embodiment of the present invention, after the step S7, the method further includes:
s8, placing the glass piece after the OC process in film stripping equipment for membrane stripping.
As a preferable aspect of the present invention, in the step S1, the glass member includes a plurality of the cover glasses.
In a preferred embodiment of the present invention, in step S2, the nozzle has more than 1000 nozzles with a radius of 10-20um, and the on-off state of the nozzles is controlled by a voltage signal program, so as to directly jet print the desired pattern on the glass workpiece.
Compared with the prior art, the BPO photoresist ink-jet process provided by the invention can realize ink-jet operation of local BPO photoresist at the golden finger by adopting an ink-jet machine station, does not need to spray BPO photoresist on the whole surface of the protective glass, can save BPO photoresist and save cost, and has simple production process, greatly improved production efficiency and saved production time because the BPO photoresist is only sprayed at the golden finger and other parts of the protective glass are not needed to be shielded by using an auxiliary photomask during subsequent exposure and development.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
The drawings are only for purposes of illustrating and explaining the present invention and are not to be construed as limiting the scope of the present invention.
FIG. 1 is a schematic flow chart of a BPO photoresist ink-jet process according to an embodiment of the present invention;
FIG. 2 is a schematic flow chart of a BPO photoresist ink-jet process according to an embodiment of the present invention;
FIG. 3 is a schematic structural view of a glass according to an embodiment of the present invention (a plurality of cover glasses are uniformly distributed);
FIG. 4 is a schematic view of the structure of a cover glass according to an embodiment of the present invention (when the BPO photoresist pattern is not etched).
The reference numbers illustrate:
1. protecting glass;
2. a golden finger;
3. a silicon dioxide film layer;
4. an OC photoresist layer;
5. BPO photoresist pattern.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
Examples
Referring to fig. 1, the BPO photoresist ink-jet process includes:
s1, putting a glass piece which is subjected to ITOpatten and Metal wiring in weak alkaline water for cleaning, wherein the glass piece comprises at least one piece of protective glass 1, and each piece of protective glass 1 comprises a gold finger 2;
the alkalescent water is also called weak alkaline water and soda water, soap water and the like are common in life, particularly water resources with the pH value of 7.0-8.5, and the alkalescent water can effectively clean glass pieces and cannot damage the glass pieces.
S2, placing the cleaned glass piece on a table, starting the table, and controlling a voltage signal program, an ink-jet height, a running speed and a running track of the table; directly spraying and printing a required pattern on the glass piece; (ii) a
Wherein, the parameters of the ink jet machine (i.e. the inkjet machine on the market) are set after the glass piece is placed on the ink jet platform, and the needed BPO pattern is directly jet-printed,
s3, placing the glass piece subjected to ink jet in an exposure machine, starting the exposure machine, and carrying out exposure operation;
specifically, in this embodiment, the exposure machine may be a common exposure apparatus in the market, which is not described herein.
And S4, placing the exposed glass piece in a developing device (the developing device is common in the market), starting the developing device, and carrying out developing operation, wherein the developing solution in the developing device can be a tetramethylammonium hydroxide solution (TMAH solution) with the concentration of 1.80-2.50%.
And S5, placing the developed glass piece in baking equipment, and starting the baking equipment to perform baking operation.
To sum up, as shown in fig. 4, the BPO photoresist sprayed on the gold finger 2 is exposed, developed, and baked to polymerize the BPO, and then the machine directly prints the required pattern to protect the gold finger 2, thereby saving the BPO photoresist and the production cost, and further avoiding using an auxiliary mask to cover other portions of the glass during exposure and development.
In the above, in the present embodiment, in step S2, in order to ensure the local BPO photoresist ink-jetting effect (e.g., uniformity) at the gold finger 2, it is preferable that the viscosity of the BPO photoresist in the ink-jet stage is 5-10cps (mpa · S), the spraying height of the ink-jet stage is 5-30mm (mm), the spraying speed of the ink-jet stage is 150-.
In the above, specifically, in the present embodiment, in step S3, on the premise of ensuring a better exposure effect, in order to save the exposure cost (reduce the exposure power as much as possible), the exposure energy of the exposure machine may be preferably 800 and 1000 mj/cm, and more preferably 900 mj/cm.
In the above, specifically, in the present embodiment, in step S3, the baking device may be a commercially available baking device, and in order to ensure a better baking effect and baking speed, the baking temperature of the baking device is preferably 120 ℃ to 140 ℃, and the baking time is preferably 3 min to 5min (minutes).
Preferably, as shown in fig. 2, in this embodiment, after step S5, the method may further include:
and S6, plating a silicon dioxide film layer 3 on the BPO photoresist ink-jet surface of the baked glass piece.
Specifically, for example, the BPO photoresist sprayed surface of the glass after baking is coated with the silicon dioxide film layer 3 by vacuum magnetron continuous plating deposition, and the silicon dioxide film layer 3 is used as a blanking layer, so that the blanking effect can be achieved, and the phenomenon that a user observes an ITO pattern in the protective glass 1 and experiences poor feeling when using the protective glass is avoided.
Preferably, as shown in fig. 2, in this embodiment, after step S6, the method further includes:
s7, spraying OC light resistor on the silicon dioxide film layer 3.
Specifically, as shown in fig. 4, an OC photoresist is sprayed on the silicon dioxide film 3 to form an OC photoresist layer 4 covering the silicon dioxide film 3, and the OC photoresist layer 4 can protect the internal structure.
Preferably, as shown in fig. 2, in this embodiment, after step S7, the method further includes:
s8, placing the glass piece after the OC process in a film stripping device for membrane stripping,
specifically, as shown in FIG. 3, although the BPO is covered by the silica and OC, the BPO coating is about 10-15um thick, which is much larger than the thickness of the OC layer (1.5-2 um) and the thickness of the silica (less than 1000A), and the stripping solution can dissolve the BPO from the side surface. Meanwhile, the silicon dioxide layer 3 and the OC photoresist layer 4 on the BPO photoresist pattern 5 will also fall off along with the peeling of the BPO photoresist pattern 5, thereby exposing the gold finger 2 covered and protected by the BPO photoresist pattern 5.
It is understood that, in the present embodiment, as shown in fig. 3, in step S1, in step S1, the glass piece includes at least 1 piece of protective glass 1, and of course, in the present embodiment, it is preferable that a plurality of pieces of protective glass 1 are uniformly distributed on the glass piece to facilitate alignment of the position of the nozzle and the position of the gold finger 2, and each piece of protective glass 1 is provided with the gold finger 2.
And in step S2, the number of nozzles is greater than 1000 (typically 1000-.
Further, as shown in fig. 3 and 4, the cover glass 1 on the glass member is cut to a predetermined size to obtain a plurality of cover glasses 1 in which the gold fingers 2 are covered and protected by the BPO resist pattern 5, and the production efficiency is high.
The BPO photoresist ink-jet process provided by the invention can save BPO photoresist and save cost by directly spraying and printing the required pattern on the glass piece by adopting the ink-jet process, and in addition, as the BPO photoresist is only sprayed at the position of the golden finger 2, other parts of the protective glass do not need to be covered by using an auxiliary photomask during subsequent exposure and development, the production process is simpler, the production efficiency can be greatly improved, and the production time can be saved.
The following points need to be explained:
in the embodiments and drawings of the present invention, the same reference numerals refer to the same meanings unless otherwise defined.
(2) In the drawings of the embodiments of the present invention, only the structures related to the embodiments of the present invention are referred to, and other structures may refer to general designs.
(3) In the drawings used to describe embodiments of the invention, the thickness of a layer or region is exaggerated for clarity. It will be understood that when an element such as a layer, film, region, or substrate is referred to as being "on" or "under" another element, it can be "directly on" or "under" the other element or intervening elements may be present.
(4) Features from the same embodiment of the invention and from different embodiments may be combined with each other without conflict.
The present invention is not limited to the above preferred embodiments, and any modification, equivalent replacement or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
- A BPO photoresist ink jet process, comprising:s1, placing a glass piece which is subjected to ITOpatten and Metal wiring in weak alkaline water for cleaning, wherein the glass piece comprises at least one piece of protective glass, and each piece of protective glass comprises a gold finger;s2, placing the cleaned glass piece on a table, starting the table, and controlling a voltage signal program, an ink-jet height, a running speed and a running track of the table; directly spraying and printing the gold finger into a required pattern;s3, placing the glass piece subjected to ink jet in an exposure machine, starting the exposure machine, and carrying out exposure operation;s4, placing the exposed glass piece in a developing device, starting the developing device, and carrying out developing operation, wherein the developing solution in the developing device is a tetramethylammonium hydroxide solution with the concentration of 1.80-2.50%;and S5, placing the developed glass piece in baking equipment, and starting the baking equipment to perform baking operation.
- 2. The BPO photoresist ink-jet process of claim 1, wherein in the step S2, the viscosity of the BPO photoresist in the ink-jet platform is 5-10 mPas, the spraying height of the ink-jet platform is 5-30mm, the spraying speed of the ink-jet platform is 150-200mm/S, and the operating voltage of the ink-jet platform is 12-20V.
- 3. The BPO photoresist ink jet process of claim 1, wherein in step S3, the exposure energy of the exposure machine is 800-1000 mJ/cm.
- 4. The BPO photoresist inkjet process according to claim 1, wherein in the step S5, the baking temperature of the baking device is 120 ℃ to 140 ℃ and the baking time is 3 min to 5 min.
- 5. The BPO photo-resist inkjet process according to claim 1, further comprising, after the step S5:and S6, plating a silicon dioxide film layer on the BPO photoresist ink-jet surface of the baked glass piece.
- 6. The BPO photo-resist inkjet process according to claim 5, further comprising, after the step S6:and S7, spraying OC light resistor on the silicon dioxide film layer.
- 7. The BPO photo-inkjet process according to claim 6, further comprising, after the step S7:s8, placing the glass piece after the OC process in film stripping equipment for membrane stripping.
- 8. The BPO photo-resist inkjet process according to claim 7, wherein in the step S1, the glass member includes a plurality of the protective glasses.
- 9. The BPO photo-resist inkjet process according to claim 8, wherein in the step S2, the number of nozzles is equal to the number of gold fingers, and the positions of the nozzles correspond to the positions of the gold fingers one by one.
- 10. The BPO photoresist inkjet process according to claim 8, wherein in step S2, the nozzles have a radius larger than 1000, and the on/off states of the nozzles are controlled by a voltage signal program, so as to directly print the desired pattern on the gold finger.
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| CN201810010168.9A CN108196432B (en) | 2018-01-05 | 2018-01-05 | BPO photoresist ink-jet process |
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| CN201810010168.9A CN108196432B (en) | 2018-01-05 | 2018-01-05 | BPO photoresist ink-jet process |
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| CN108196432B true CN108196432B (en) | 2021-10-22 |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353815A (en) * | 2013-02-04 | 2013-10-16 | 芜湖长信科技股份有限公司 | Capacitor screen OGS shadow eliminating structure and manufacturing process thereof |
| WO2014162983A1 (en) * | 2013-04-05 | 2014-10-09 | 富士フイルム株式会社 | Pattern forming method, electronic device and method for manufacturing same |
| CN104714698A (en) * | 2015-04-09 | 2015-06-17 | 合肥鑫晟光电科技有限公司 | Touch substrate as well as production method thereof and touch display panel |
| CN105291620A (en) * | 2015-11-19 | 2016-02-03 | 江苏汉印机电科技股份有限公司 | Ink-jet printing and manufacturing method for OGS touch screen light resistor frame |
-
2018
- 2018-01-05 CN CN201810010168.9A patent/CN108196432B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103353815A (en) * | 2013-02-04 | 2013-10-16 | 芜湖长信科技股份有限公司 | Capacitor screen OGS shadow eliminating structure and manufacturing process thereof |
| WO2014162983A1 (en) * | 2013-04-05 | 2014-10-09 | 富士フイルム株式会社 | Pattern forming method, electronic device and method for manufacturing same |
| CN104714698A (en) * | 2015-04-09 | 2015-06-17 | 合肥鑫晟光电科技有限公司 | Touch substrate as well as production method thereof and touch display panel |
| CN105291620A (en) * | 2015-11-19 | 2016-02-03 | 江苏汉印机电科技股份有限公司 | Ink-jet printing and manufacturing method for OGS touch screen light resistor frame |
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| CN108196432A (en) | 2018-06-22 |
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