CN108192510A - A kind of heat conduction film - Google Patents
A kind of heat conduction film Download PDFInfo
- Publication number
- CN108192510A CN108192510A CN201711386315.4A CN201711386315A CN108192510A CN 108192510 A CN108192510 A CN 108192510A CN 201711386315 A CN201711386315 A CN 201711386315A CN 108192510 A CN108192510 A CN 108192510A
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- CN
- China
- Prior art keywords
- parts
- heat conduction
- boron nitride
- conduction film
- aluminium oxide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The present invention relates to a kind of heat conduction films, including modified acrylic oligomer, aluminium oxide, halogen-free epoxy resin, acrylate adhesive, boron nitride, titanium dioxide and ethyl acetate, its feed components by weight, 7 10 parts of 15 30 parts of the modified acrylic oligomer, 20 30 parts of aluminium oxide, 10 20 parts of halogen-free epoxy resin, 20 30 parts of acrylate adhesive, 8 15 parts of boron nitride, 49 parts of titanium dioxide and ethyl acetate.Heat conduction film of the present invention, thermal conductivity is good, and cementitiousness is strong, and wear-resisting, high temperature resistant, stability is good, nontoxic, environmental protection.
Description
Technical field
The present invention relates to interface heat sink material field more particularly to a kind of heat conduction films.
Background technology
As microelectronic component integration density is higher and higher, the radiating requirements of microelectronic component are also higher and higher, therefore, open
The interface heat sink material that sending out a kind of has high thermal conductivity is of great significance.Due to heat-conducting glue have environment friendly and it is low into
This feature gradually replaces conventional tin-lead solders interconnection material.However, the evolution of conventional pilot hot glue also encounters some bottlenecks,
Such as the problems such as heat conductivility is not high, density is big, and stability is not high.
Invention content
The technical solution adopted by the present invention to solve the technical problems is：A kind of heat conduction film is provided, it is characterized in that：Including
Modified acrylic oligomer, aluminium oxide, halogen-free epoxy resin, acrylate adhesive, boron nitride, titanium dioxide and acetic acid second
Ester, feed components by weight, described modified acrylic oligomer 15-30 parts, 20-30 parts of aluminium oxide, Halogen asphalt mixtures modified by epoxy resin
7-10 parts of 10-20 parts of fat, 20-30 parts of acrylate adhesive, 8-15 parts of boron nitride, 4-9 parts of titanium dioxide and ethyl acetate.
Preferably, the heat conduction film, it is characterized in that：Its feed components by weight, includes modified acroleic acid
26 parts of oligomer, 30 parts of aluminium oxide, 14 parts of halogen-free epoxy resin, 22 parts of acrylate adhesive, 15 parts of boron nitride, titanium dioxide
5 parts and 7 parts of ethyl acetate.
Preferably, the heat conduction film, it is characterized in that：The boron nitride is methyl-silicone oil, zinc powder, aluminium oxide it is mixed
Close object.
Preferably, the heat conduction film, it is characterized in that：It is prepared by following methods：
The raw material of the quality component is added in blender successively and is stirred, mixing time is 60 ± 30min；Then will
Sizing material after stirring is transferred to the molding of double roller molding machine；Finally by 3~8min hardening times to obtain the final product.
Heat conduction film of the present invention, thermal conductivity is good, and cementitiousness is strong, and wear-resisting, high temperature resistant, stability is good, nontoxic, ring
It protects.
Specific embodiment
A kind of heat conduction film of the present invention, provides a kind of heat conduction film, including modified acrylic oligomer, oxidation
Aluminium, halogen-free epoxy resin, acrylate adhesive, boron nitride, titanium dioxide and ethyl acetate, feed components are by weight
Meter, described modified acrylic oligomer 15-30 parts, 20-30 parts of aluminium oxide, 10-20 parts of halogen-free epoxy resin, acrylate gluing
7-10 parts of 20-30 parts of agent, 8-15 parts of boron nitride, 4-9 parts of titanium dioxide and ethyl acetate.
Preferably, the heat conduction film, it is characterized in that：Its feed components by weight, includes modified acroleic acid
26 parts of oligomer, 30 parts of aluminium oxide, 14 parts of halogen-free epoxy resin, 22 parts of acrylate adhesive, 15 parts of boron nitride, titanium dioxide
5 parts and 7 parts of ethyl acetate.
Preferably, the heat conduction film, it is characterized in that：The boron nitride is methyl-silicone oil, zinc powder, aluminium oxide it is mixed
Close object.
Preferably, the heat conduction film, it is characterized in that：It is prepared by following methods：
The raw material of the quality component is added in blender successively and is stirred, mixing time is 60 ± 30min；Then will
Sizing material after stirring is transferred to the molding of double roller molding machine；Finally by 3~8min hardening times to obtain the final product.
The above is only the preferred embodiment of the present invention, is not intended to restrict the invention, it is noted that for this
For the those of ordinary skill of technical field, without departing from the technical principles of the invention, several improvement can also be made
And modification, these improvements and modifications also should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of heat conduction film, it is characterized in that：Including modified acrylic oligomer, aluminium oxide, halogen-free epoxy resin, acrylate
Adhesive, boron nitride, titanium dioxide and ethyl acetate, feed components by weight, the modified acrylic oligomer 15-
30 parts, 20-30 parts of aluminium oxide, 10-20 parts of halogen-free epoxy resin, 20-30 parts of acrylate adhesive, 8-15 parts of boron nitride, two
7-10 parts of 4-9 parts of titanium oxide and ethyl acetate.
2. heat conduction film as described in claim 1, it is characterized in that：Its feed components by weight, includes modified acroleic acid
26 parts of oligomer, 30 parts of aluminium oxide, 14 parts of halogen-free epoxy resin, 22 parts of acrylate adhesive, 15 parts of boron nitride, titanium dioxide
5 parts and 7 parts of ethyl acetate.
3. the heat conduction film as described in claim 1-2, it is characterized in that：The boron nitride is methyl-silicone oil, zinc powder, aluminium oxide
Mixture.
4. the heat conduction film as described in claim 1-2, it is characterized in that：It is prepared by following methods：
The raw material of the quality component is added in blender successively and is stirred, mixing time is 60 ± 30min；Then will
Sizing material after stirring is transferred to the molding of double roller molding machine；Finally by 3~8min hardening times to obtain the final product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711386315.4A CN108192510A (en) | 2017-12-20 | 2017-12-20 | A kind of heat conduction film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711386315.4A CN108192510A (en) | 2017-12-20 | 2017-12-20 | A kind of heat conduction film |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108192510A true CN108192510A (en) | 2018-06-22 |
Family
ID=62583459
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711386315.4A Pending CN108192510A (en) | 2017-12-20 | 2017-12-20 | A kind of heat conduction film |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108192510A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107254262A (en) * | 2017-05-25 | 2017-10-17 | 钱龙风 | A kind of heat conduction film |
-
2017
- 2017-12-20 CN CN201711386315.4A patent/CN108192510A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107254262A (en) * | 2017-05-25 | 2017-10-17 | 钱龙风 | A kind of heat conduction film |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180622 |