CN107142062A - A kind of high-efficiency heat conduction glue - Google Patents
A kind of high-efficiency heat conduction glue Download PDFInfo
- Publication number
- CN107142062A CN107142062A CN201710380813.1A CN201710380813A CN107142062A CN 107142062 A CN107142062 A CN 107142062A CN 201710380813 A CN201710380813 A CN 201710380813A CN 107142062 A CN107142062 A CN 107142062A
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- CN
- China
- Prior art keywords
- parts
- heat conduction
- efficiency heat
- graphene
- epoxy resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F263/00—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00
- C08F263/02—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00 on to polymers of vinyl esters with monocarboxylic acids
- C08F263/04—Macromolecular compounds obtained by polymerising monomers on to polymers of esters of unsaturated alcohols with saturated acids as defined in group C08F18/00 on to polymers of vinyl esters with monocarboxylic acids on to polymers of vinyl acetate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08F—MACROMOLECULAR COMPOUNDS OBTAINED BY REACTIONS ONLY INVOLVING CARBON-TO-CARBON UNSATURATED BONDS
- C08F283/00—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G
- C08F283/10—Macromolecular compounds obtained by polymerising monomers on to polymers provided for in subclass C08G on to polymers containing more than one epoxy radical per molecule
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K5/00—Heat-transfer, heat-exchange or heat-storage materials, e.g. refrigerants; Materials for the production of heat or cold by chemical reactions other than by combustion
- C09K5/08—Materials not undergoing a change of physical state when used
- C09K5/14—Solid materials, e.g. powdery or granular
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Polymers & Plastics (AREA)
- Combustion & Propulsion (AREA)
- Thermal Sciences (AREA)
- Materials Engineering (AREA)
- Physics & Mathematics (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of high-efficiency heat conduction glue, including epoxy resin, benzoyl peroxide, graphene, butyl acrylate, polyvinyl acetate and isocyanates bridging agent, its feed components by weight, 10 18 parts of 18 25 parts of the epoxy resin, 15 19 parts of benzoyl peroxide, 10 12 parts of graphene, 10 12 parts of butyl acrylate, 8 12 parts of polyvinyl acetate and isocyanates bridging agent.The problem of flexibility that heat-conducting glue of the present invention has solves conventional thermal conductive material fragility, and the product being made of heat-conducting glue of the present invention can greatly improve thermal diffusivity, its reliability is high, thermal conductivity is good, cementitiousness is strong, and wear-resisting, high temperature resistant, stability is good, it is nontoxic, environmental protection and the effect with energy-conserving and environment-protective.
Description
Technical field
The present invention relates to interface heat sink material field, more particularly to a kind of high-efficiency heat conduction glue.
Background technology
With microelectronic component integration density more and more higher, therefore the radiating requirements of microelectronic component also more and more higher, is opened
Sending out a kind of has the interface heat sink material of high thermal conductivity significant.Due to heat-conducting glue possess environment friendly and it is low into
This feature, gradually replaces conventional tin-lead solders interconnection material.However, the evolution of conventional pilot hot glue also runs into some bottlenecks,
As heat conductivility is not high, density is big, the problems such as stability is not high.
The content of the invention
The technical solution adopted for the present invention to solve the technical problems is：A kind of high-efficiency heat conduction glue is provided, it is characterized in that：Bag
Include epoxy resin, benzoyl peroxide, graphene, butyl acrylate, polyvinyl acetate and isocyanates bridging agent, its raw material
Each component by weight, described epoxy resin 18-25 parts, 15-19 parts of benzoyl peroxide, 10-12 parts of graphene, acrylic acid fourth
10-18 parts of 10-12 parts of ester, 8-12 parts of polyvinyl acetate and isocyanates bridging agent.
Preferably, described high-efficiency heat conduction glue, it is characterized in that：Its feed components by weight, includes epoxy resin
18 parts, 15 parts of benzoyl peroxide, 10 parts of graphene, 10 parts of butyl acrylate, 8 parts of polyvinyl acetate and isocyanates are built bridge
10 parts of agent.
Preferably, described high-efficiency heat conduction glue, it is characterized in that：The heat-conducting glue needs to prepare by epoxy resin, peroxide
Change the solvent that benzoyl, graphene combine the 50-80 to be formed parts.
Preferably, described high-efficiency heat conduction glue, it is characterized in that：Prepared by following methods：
(1) butyl acrylate and polyvinyl acetate of the component are dissolved in 80 parts of solvent, are put into mixer stirring
30-60min, obtains mixed material；
(2) isocyanates bridging agent is added in the mixed material obtained to step (1), dissolving is stirred well to, in 150-
Solidify 1h at 160 DEG C, obtain high-efficiency heat conduction glue.
The problem of flexibility that heat-conducting glue of the present invention has solves conventional thermal conductive material fragility, and use this hair
The product that bright described heat-conducting glue is made can greatly improve thermal diffusivity, and its reliability is high, and thermal conductivity is good, and cementitiousness is strong, wear-resisting,
High temperature resistant, stability is good, nontoxic, environmental protection and the effect with energy-conserving and environment-protective.
Embodiment
There is provided a kind of high-efficiency heat conduction glue, including epoxy resin, benzoyl peroxide first for a kind of high-efficiency heat conduction glue of the present invention
Acyl, graphene, butyl acrylate, polyvinyl acetate and isocyanates bridging agent, its feed components by weight, the ring
18-25 parts of oxygen tree fat, 15-19 parts of benzoyl peroxide, 10-12 parts of graphene, 10-12 parts of butyl acrylate, polyvinyl acetate
10-18 parts of 8-12 parts of ester and isocyanates bridging agent.
Preferably, described high-efficiency heat conduction glue, it is characterized in that：Its feed components by weight, includes epoxy resin
18 parts, 15 parts of benzoyl peroxide, 10 parts of graphene, 10 parts of butyl acrylate, 8 parts of polyvinyl acetate and isocyanates are built bridge
10 parts of agent.
Preferably, described high-efficiency heat conduction glue, it is characterized in that：The heat-conducting glue needs to prepare by epoxy resin, peroxide
Change the solvent that benzoyl, graphene combine the 50-80 to be formed parts.
Preferably, described high-efficiency heat conduction glue, it is characterized in that：Prepared by following methods：
(1) butyl acrylate and polyvinyl acetate of the component are dissolved in 80 parts of solvent, are put into mixer stirring
30-60min, obtains mixed material；
(2) isocyanates bridging agent is added in the mixed material obtained to step (1), dissolving is stirred well to, in 150-
Solidify 1h at 160 DEG C, obtain high-efficiency heat conduction glue.
Described above is only the preferred embodiment of the present invention, is not intended to limit the invention, it is noted that for this
For the those of ordinary skill of technical field, without departing from the technical principles of the invention, some improvement can also be made
And modification, these improvement and modification also should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of high-efficiency heat conduction glue, it is characterized in that：Including epoxy resin, benzoyl peroxide, graphene, butyl acrylate, poly-
Vinylacetate and isocyanates bridging agent, its feed components by weight, described epoxy resin 18-25 parts, benzoyl peroxide
5-19 parts of formyl chloride-1,10-12 parts of graphene, 10-12 parts of butyl acrylate, 8-12 parts of polyvinyl acetate and isocyanates are built bridge
10-18 parts of agent.
2. high-efficiency heat conduction glue as claimed in claim 1, it is characterized in that：Its feed components by weight, includes epoxy resin
18 parts, 15 parts of benzoyl peroxide, 10 parts of graphene, 10 parts of butyl acrylate, 8 parts of polyvinyl acetate and isocyanates are built bridge
10 parts of agent.
3. the high-efficiency heat conduction glue as described in claim 1-2, it is characterized in that：The heat-conducting glue needs to prepare by epoxy resin, mistake
BP, graphene combine the solvent of the 50-80 to be formed parts.
4. the high-efficiency heat conduction glue as described in claim 1-2, it is characterized in that：Prepared by following methods：
(1) butyl acrylate and polyvinyl acetate of the component are dissolved in 80 parts of solvent, are put into mixer stirring
30-60min, obtains mixed material；
(2) isocyanates bridging agent is added in the mixed material obtained to step (1), dissolving is stirred well to, in 150-
Solidify 1h at 160 DEG C, obtain high-efficiency heat conduction glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710380813.1A CN107142062A (en) | 2017-05-25 | 2017-05-25 | A kind of high-efficiency heat conduction glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710380813.1A CN107142062A (en) | 2017-05-25 | 2017-05-25 | A kind of high-efficiency heat conduction glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107142062A true CN107142062A (en) | 2017-09-08 |
Family
ID=59779840
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710380813.1A Pending CN107142062A (en) | 2017-05-25 | 2017-05-25 | A kind of high-efficiency heat conduction glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107142062A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107586530A (en) * | 2017-09-13 | 2018-01-16 | 石永明 | A kind of heat-conducting glue with antioxygenic property |
| CN107739587A (en) * | 2017-09-18 | 2018-02-27 | 苏州汉瑞森光电科技股份有限公司 | A kind of LED crystal-bonding adhesives of graphene-containing and preparation method thereof |
| CN110922912A (en) * | 2019-12-02 | 2020-03-27 | 苏州泰仑电子材料有限公司 | High-temperature-resistant olefine acid ester high-viscosity adhesive tape and preparation method thereof |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103045128A (en) * | 2012-12-28 | 2013-04-17 | 宁波大榭开发区综研化学有限公司 | Heat conduction adhesive and preparation method of adhesive tape employing same |
| CN105885756A (en) * | 2016-05-22 | 2016-08-24 | 周淑华 | Efficient heat-conducting glue |
-
2017
- 2017-05-25 CN CN201710380813.1A patent/CN107142062A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103045128A (en) * | 2012-12-28 | 2013-04-17 | 宁波大榭开发区综研化学有限公司 | Heat conduction adhesive and preparation method of adhesive tape employing same |
| CN105885756A (en) * | 2016-05-22 | 2016-08-24 | 周淑华 | Efficient heat-conducting glue |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107586530A (en) * | 2017-09-13 | 2018-01-16 | 石永明 | A kind of heat-conducting glue with antioxygenic property |
| CN107739587A (en) * | 2017-09-18 | 2018-02-27 | 苏州汉瑞森光电科技股份有限公司 | A kind of LED crystal-bonding adhesives of graphene-containing and preparation method thereof |
| CN110922912A (en) * | 2019-12-02 | 2020-03-27 | 苏州泰仑电子材料有限公司 | High-temperature-resistant olefine acid ester high-viscosity adhesive tape and preparation method thereof |
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| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170908 |
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