CN105950025A - High-conductivity thermally conductive glue - Google Patents
High-conductivity thermally conductive glue Download PDFInfo
- Publication number
- CN105950025A CN105950025A CN201610337894.2A CN201610337894A CN105950025A CN 105950025 A CN105950025 A CN 105950025A CN 201610337894 A CN201610337894 A CN 201610337894A CN 105950025 A CN105950025 A CN 105950025A
- Authority
- CN
- China
- Prior art keywords
- parts
- heat
- conducting glue
- silica gel
- organic silica
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
Abstract
The invention relates to high-conductivity thermally conductive glue, made from by weight: 30-50 parts of graphene particles, 10-15 parts of aliphatic polyamide, 20-28 parts of organic silica gel, 4-8 parts of alpha-cyanoacrylate, 20-30 parts of thermally conductive glue matrix, 3-5 parts of polyisobutene and 10-12 parts of acrylic acid monomer. The high-conductivity thermally conductive glue described herein is good in thermal conductivity, high in adhesive power, wear-resistant, tolerant to high temperature, good in stability, nontoxic and environment-friendly.
Description
Technical field
The present invention relates to heat sink material field, interface, particularly relate to the heat-conducting glue of a kind of high-conductivity energy.
Background technology
Along with microelectronic component integration density is more and more higher, the radiating requirements of microelectronic component is more and more higher, therefore, develops a kind of interface heat sink material with high thermal conductivity significant.Owing to heat-conducting glue possesses environment friendly and low cost feature, the most gradually replace conventional tin-lead solders interconnection material.But, conventional pilot hot glue evolution also runs into some bottlenecks, and as the highest in heat conductivility, density is big, the problems such as stability is the highest.
Summary of the invention
The technical solution adopted for the present invention to solve the technical problems is: provide the heat-conducting glue of a kind of high-conductivity energy, it is characterized in that: include Graphene granule, fatty polyamide, organic silica gel, a-cyanoacrylate, heat-conducting glue matrix, polyisobutylene and acrylic monomers, its feed components by weight, described Graphene granule 30-50 part, fatty polyamide 10-15 part, organic silica gel 20-28 part, a-cyanoacrylate 4-8 part, heat-conducting glue matrix 20-30 part, polyisobutylene 3-5 part and acrylic monomers 10-12 part.
As preferably, the heat-conducting glue of described high-conductivity energy, it is characterized in that: its feed components by weight, comprises Graphene granule 38 parts, fatty polyamide 15 parts, organic silica gel 28 parts, a-cyanoacrylate 4 parts, heat-conducting glue matrix 20 parts, polyisobutylene 3 parts and acrylic monomers 11 parts.
As preferably, described high-conductivity can heat-conducting glue, it is characterized in that: described organic silica gel is the mixture of methyl-silicone oil, methyl vinyl silicone rubber, methyl phenyl silicone resin.
As preferably, described high-conductivity can heat-conducting glue, it is characterized in that: prepared by following method:
(1) raw material mixing: the raw material of described quality component adds to double planetary mixer stirring successively, and mixing time is
60～90min；
(2) moulding by casting: the sizing material after step (1) being stirred according to Production requirement is transferred to double roller forming machine molding；
(3) solidification: being allowed to solidify by UV solidifying channel by the material after step (2) moulding by casting, hardening time is 3～8min.
The heat-conducting glue of high-conductivity of the present invention energy, heat conductivity is good, and cementitiousness is strong, wear-resisting, high temperature resistant, and good stability is nontoxic, environmental protection.
Detailed description of the invention
The heat-conducting glue of a kind of high-conductivity of the present invention energy, the heat-conducting glue of a kind of high-conductivity energy is provided, including Graphene granule, fatty polyamide, organic silica gel, a-cyanoacrylate, heat-conducting glue matrix, polyisobutylene and acrylic monomers, its feed components by weight, described Graphene granule 30-50 part, fatty polyamide 10-15 part, organic silica gel 20-28 part, a-cyanoacrylate 4-8 part, heat-conducting glue matrix 20-30 part, polyisobutylene 3-5 part and acrylic monomers 10-12 part.
As preferably, the heat-conducting glue of described high-conductivity energy, it is characterized in that: its feed components by weight, comprises Graphene granule 38 parts, fatty polyamide 15 parts, organic silica gel 28 parts, a-cyanoacrylate 4 parts, heat-conducting glue matrix 20 parts, polyisobutylene 3 parts and acrylic monomers 11 parts.
As preferably, described high-conductivity can heat-conducting glue, it is characterized in that: described organic silica gel is the mixture of methyl-silicone oil, methyl vinyl silicone rubber, methyl phenyl silicone resin.
As preferably, described high-conductivity can heat-conducting glue, it is characterized in that: prepared by following method:
(1) raw material mixing: the raw material of described quality component adds to double planetary mixer stirring successively, and mixing time is
60～90min；
(2) moulding by casting: the sizing material after step (1) being stirred according to Production requirement is transferred to double roller forming machine molding；
(3) solidification: being allowed to solidify by UV solidifying channel by the material after step (2) moulding by casting, hardening time is 3～8min.
The above is only the preferred embodiment of the present invention, is not limited to the present invention, it is noted that
For those skilled in the art, on the premise of without departing from the technology of the present invention principle, it is also possible to make some improvement and modification, these improve and modification also should be regarded as protection scope of the present invention.
Claims (4)
1. the heat-conducting glue of a high-conductivity energy, it is characterized in that: include Graphene granule, fatty polyamide, organic silica gel, a-cyanoacrylate, heat-conducting glue matrix, polyisobutylene and acrylic monomers, its feed components by weight, described Graphene granule 30-50 part, fatty polyamide 10-15 part, organic silica gel 20-28 part, a-cyanoacrylate 4-8 part, heat-conducting glue matrix 20-30 part, polyisobutylene 3-5 part and acrylic monomers 10-12 part.
2. the heat-conducting glue of high-conductivity energy as claimed in claim 1, it is characterized in that: its feed components by weight, comprises Graphene granule 38 parts, fatty polyamide 15 parts, organic silica gel 28 parts, a-cyanoacrylate 4 parts, heat-conducting glue matrix 20 parts, polyisobutylene 3 parts and acrylic monomers 11 parts.
3. the heat-conducting glue of the high-conductivity energy as described in claim 1-2, is characterized in that: described organic silica gel is the mixture of methyl-silicone oil, methyl vinyl silicone rubber, methyl phenyl silicone resin.
4. the heat-conducting glue of the high-conductivity energy as described in claim 1-2, is characterized in that: prepared by following method:
(1) raw material mixing: the raw material of described quality component adds to double planetary mixer stirring successively, and mixing time is 60～90min；
(2) moulding by casting: the sizing material after step (1) being stirred according to Production requirement is transferred to double roller forming machine molding
；
(3) solidification: being allowed to solidify by UV solidifying channel by the material after step (2) moulding by casting, hardening time is 3～8min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610337894.2A CN105950025A (en) | 2016-05-22 | 2016-05-22 | High-conductivity thermally conductive glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610337894.2A CN105950025A (en) | 2016-05-22 | 2016-05-22 | High-conductivity thermally conductive glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN105950025A true CN105950025A (en) | 2016-09-21 |
Family
ID=56912056
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610337894.2A Pending CN105950025A (en) | 2016-05-22 | 2016-05-22 | High-conductivity thermally conductive glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN105950025A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107129773A (en) * | 2017-05-25 | 2017-09-05 | 钱龙风 | A kind of conducting resinl of high-conductivity energy |
| CN107586530A (en) * | 2017-09-13 | 2018-01-16 | 石永明 | A kind of heat-conducting glue with antioxygenic property |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433098A (en) * | 2011-09-19 | 2012-05-02 | 常州合润新材料科技有限公司 | Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method |
| CN104830248A (en) * | 2015-04-27 | 2015-08-12 | 上海上大瑞沪微系统集成技术有限公司 | Heat-conducting glue with high thermal conductivity and preparation method thereof |
| CN105086922A (en) * | 2015-08-07 | 2015-11-25 | 东莞市新星有机硅科技有限公司 | Novel organic silicon heat conduction adhesive and preparation method thereof |
| CN105368330A (en) * | 2015-11-23 | 2016-03-02 | 苏州盖德精细材料有限公司 | Alpha-cyanoacrylate heat-conducting glue and preparation method thereof |
-
2016
- 2016-05-22 CN CN201610337894.2A patent/CN105950025A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102433098A (en) * | 2011-09-19 | 2012-05-02 | 常州合润新材料科技有限公司 | Graphene-filled isotropic high-performance heat-conducting adhesive and preparation method |
| CN104830248A (en) * | 2015-04-27 | 2015-08-12 | 上海上大瑞沪微系统集成技术有限公司 | Heat-conducting glue with high thermal conductivity and preparation method thereof |
| CN105086922A (en) * | 2015-08-07 | 2015-11-25 | 东莞市新星有机硅科技有限公司 | Novel organic silicon heat conduction adhesive and preparation method thereof |
| CN105368330A (en) * | 2015-11-23 | 2016-03-02 | 苏州盖德精细材料有限公司 | Alpha-cyanoacrylate heat-conducting glue and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107129773A (en) * | 2017-05-25 | 2017-09-05 | 钱龙风 | A kind of conducting resinl of high-conductivity energy |
| CN107586530A (en) * | 2017-09-13 | 2018-01-16 | 石永明 | A kind of heat-conducting glue with antioxygenic property |
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| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20160921 |