CN103131136B - Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material - Google Patents
Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material Download PDFInfo
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- CN103131136B CN103131136B CN201310073934.3A CN201310073934A CN103131136B CN 103131136 B CN103131136 B CN 103131136B CN 201310073934 A CN201310073934 A CN 201310073934A CN 103131136 B CN103131136 B CN 103131136B
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Abstract
The invention discloses a high-molecular LED (Light Emitting Diode) radiation material. The high-molecular LED radiation material disclosed by the invention has the advantages of simpler preparation process and forming process, low cost, light weight and high heat-conducting velocity; and a radiator manufactured through a formula can be used for a long time at 200 DEG C and is more than 8 years in aging life.
Description
Technical field
The present invention relates to polymer heat sink material and preparation method thereof.
Background technology
That applies in lighting field along with LED popularizes, and the heat dissipation problem of high-powered LED lamp has become its obstruction further developed, existing LED lamp heat sink, most employing is with the aluminum design of radiating fin, its moulding process is comparatively complicated, and weight is comparatively large, and cost is higher.
Summary of the invention
The technical problem that the present invention mainly solves is to provide a kind of polymer LED heat sink material and preparation method thereof, easy to prepare, and production technique is simple, and the radiator heat-dissipation made is effective.
For solving the problems of the technologies described above, the invention provides polymer LED heat sink material, this formula comprises first component and second component, and composition and the mass fraction of described first component are as follows:
665 organosilicon epoxy resins 75 ~ 85 parts
FB heat-resistant fireproof heat-reactive phenolic resin 15 ~ 25 parts
Filler 15 ~ 25 parts
Composition and the mass fraction of described second component are as follows:
Wherein, described filler be selected from Graphite Powder 99, ultra tiny ferrophosphorus powder, Shawinigan black, polybenzoate powder one or more.
Wherein, described filler is dry more than 30 minutes and the filler obtained after being cooled to 20 DEG C ~ 35 DEG C at 110 DEG C ~ 120 DEG C.
Present invention also offers the preparation method of polymer LED heat sink material, the raw material preparing described polymer LED heat sink material comprises raw material first and raw material second, described raw material first comprises 665 organosilicon epoxy resins, FB heat-resistant fireproof heat-reactive phenolic resin and filler, described raw material second comprises 200# Versamid, polyethylene polyamine, N-303 trihydroxy-polyether glycol, DMP-302, 4, 6-tri-(dimethylamino methyl) phenol, KH-550 coupling agent, zinc powder, antioxidant 1010, UV light absorber UV-327 and filler, described filler comprises Graphite Powder 99, ultra tiny ferrophosphorus powder, one or more of Shawinigan black and polybenzoate powder, its preparation method comprises following steps:
A. 665 organosilicon epoxy resins and FB heat-resistant fireproof heat-reactive phenolic resin are stirred at 25 DEG C ~ 30 DEG C, then filler is added and is stirred well to and mix;
B. other raw materials in raw material second except filler are stirred at 25 DEG C ~ 30 DEG C, then filler is added and is stirred well to and mix;
C. by raw material first and raw material second with 1: 1 ratio mix and insert in mould after stirring, at 100 DEG C, place imperial mould after 1 hour.
The invention has the beneficial effects as follows: preparation process and moulding process are all fairly simple, and cost is low, lightweight, and heat conduction rate is high, the scatterer made with this formula can at 200 DEG C life-time service, aging life-span is greater than 8 years.
Embodiment
By describing technology contents of the present invention, structural attitude in detail, being realized object and effect, be explained in detail below in conjunction with embodiment.
Embodiment 1:
Filler comprises the Graphite Powder 99 and Shawinigan black that ratio is 1:1, at 120 DEG C dry 30 minutes and be cooled to 25 DEG C stand-by;
First component comprises: 665 organosilicon epoxy resin 80kg, FB heat-resistant fireproof heat-reactive phenolic resin 20kg, filler 20kg, after 665 organosilicon epoxy resins and FB heat-resistant fireproof heat-reactive phenolic resin are stirred at 25 DEG C ~ 30 DEG C, filler is slowly added and be stirred well to mix stand-by;
Second component comprises: 200# Versamid 20kg, polyethylene polyamine (PEPA) 12kg, N-303 trihydroxy-polyether glycol 37kg, DMP-302,4,6-tri-(dimethylamino methyl) phenol 3kg, KH-550 coupling agent 0.5kg, zinc powder 1kg, antioxidant 1010 is 0.1kg, UV light absorber UV-327 is 0.1kg, filler 46kg, after the component except filler is stirred at 25 DEG C ~ 30 DEG C, filler is slowly added and be stirred well to mix stand-by;
First component and second component are inserted in mould after stirring after the ratio mixing of 1: 1, at 100 DEG C, places imperial mould after 1 hour namely make scatterer.
Embodiment 2:
Filler comprises Graphite Powder 99, polybenzoate powder and the Shawinigan black that ratio is 1:1:1, at 110 DEG C dry 40 minutes and be cooled to 25 DEG C stand-by;
First component comprises 665 organosilicon epoxy resin 85kg, FB heat-resistant fireproof heat-reactive phenolic resin 25kg, filler 25kg, after 665 organosilicon epoxy resins and FB heat-resistant fireproof heat-reactive phenolic resin are stirred at 25 DEG C ~ 30 DEG C, filler is slowly added and be stirred well to mix stand-by;
Second component comprises 200# Versamid 25kg, polyethylene polyamine (PEPA) 14kg, N-303 trihydroxy-polyether glycol 40kg, DMP-302,4,6-tri-(dimethylamino methyl) phenol 4kg, KH-550 coupling agent 0.6kg, zinc powder 1.1kg, antioxidant 1010 is 0.09kg, UV light absorber UV-327 is 0.12kg, filler 48kg, after the component except filler is stirred at 25 DEG C ~ 30 DEG C, filler is slowly added and be stirred well to mix stand-by;
First component and second component are inserted in mould after stirring after the ratio mixing of 1: 1, at 100 DEG C, places imperial mould after 1 hour namely make scatterer.
Embodiment 3:
Filler comprises the ultra tiny ferrophosphorus powder and Shawinigan black that ratio is 1:1, at 115 DEG C dry 40 minutes and be cooled to 25 DEG C stand-by;
First component comprises 665 organosilicon epoxy resin 75kg, FB heat-resistant fireproof heat-reactive phenolic resin 15kg, filler 15kg, after 665 organosilicon epoxy resins and FB heat-resistant fireproof heat-reactive phenolic resin are stirred at 25 DEG C ~ 30 DEG C, filler is slowly added and be stirred well to mix stand-by;
Second component comprises 200# Versamid 15kg, polyethylene polyamine (PEPA) 10kg, N-303 trihydroxy-polyether glycol 35kg, DMP-302,4,6-tri-(dimethylamino methyl) phenol 2kg, KH-550 coupling agent 0.4kg, zinc powder 0.9kg, antioxidant 1010 is 0.12kg, UV light absorber UV-327 is 0.08kg, filler 44kg, after the component except filler is stirred at 25 DEG C ~ 30 DEG C, filler is slowly added and be stirred well to mix stand-by;
First component and second component are inserted in mould after stirring after the ratio mixing of 1: 1, at 100 DEG C, places imperial mould after 1 hour namely make scatterer.
Preferably, be respectively charged in airtight vessel stand-by after can first, second component having been prepared in advance, its validity period is more than half a year.
The invention has the beneficial effects as follows: preparation process and moulding process are all fairly simple, and cost is low, lightweight, and heat conduction rate is high, the scatterer made with this formula can at 200 DEG C life-time service, aging life-span is greater than 8 years.
The foregoing is only embodiments of the invention; not thereby the scope of the claims of the present invention is limited; every utilize description of the present invention to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present invention.
Claims (4)
1. polymer LED heat sink material, is characterized in that: this formula comprises the first component and second component that ratio is 1:1, and composition and the mass fraction of described first component are as follows:
665 organosilicon epoxy resins 75 ~ 85 parts
FB heat-resistant fireproof heat-reactive phenolic resin 15 ~ 25 parts
Filler 15 ~ 25 parts
Composition and the mass fraction of described second component are as follows:
2. polymer LED heat sink material according to claim 1, is characterized in that: described filler be selected from Graphite Powder 99, ultra tiny ferrophosphorus powder, Shawinigan black, polybenzoate powder one or more.
3. polymer LED heat sink material according to claim 2, is characterized in that: described filler is dry more than 30 minutes and the filler obtained after being cooled to 20 DEG C ~ 35 DEG C at 110 DEG C ~ 120 DEG C.
4. the preparation method of polymer LED heat sink material, it is characterized in that: the raw material preparing described polymer LED heat sink material comprises raw material first and raw material second, described raw material first comprises 75 ~ 85 part of 665 organosilicon epoxy resin, 15 ~ 25 parts of FB heat-resistant fireproof heat-reactive phenolic resins and 15 ~ 25 parts of fillers, described raw material second comprises 15 ~ 25 parts of 200# Versamids, 10 ~ 14 parts of polyethylene polyamines, 35 ~ 40 parts of N-303 trihydroxy-polyether glycols, 2 ~ 4 parts of DMP-302, 4, 6-tri-(dimethylamino methyl) phenol, 0.4 ~ 0.6 part of KH-550 coupling agent, 0.9 ~ 1.1 part of zinc powder, 0.08 ~ 0.12 part of antioxidant 1010, 0.08 ~ 0.12 part of UV light absorber UV-327 and 44 ~ 48 part filler, described filler comprises Graphite Powder 99, ultra tiny ferrophosphorus powder, one or more of Shawinigan black and polybenzoate powder, its preparation method comprises following steps:
A. 665 organosilicon epoxy resins and FB heat-resistant fireproof heat-reactive phenolic resin are stirred at 25 DEG C ~ 30 DEG C, then filler is added and is stirred well to and mix;
B. other raw materials in raw material second except filler are stirred at 25 DEG C ~ 30 DEG C, then filler is added and is stirred well to and mix;
C. by raw material first and raw material second with 1: 1 ratio mix and insert in mould after stirring, at 100 DEG C, place mould unloading after 1 hour.
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| CN201310073934.3A CN103131136B (en) | 2013-03-08 | 2013-03-08 | Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material |
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| CN201310073934.3A CN103131136B (en) | 2013-03-08 | 2013-03-08 | Formula and preparation method of high-molecular LED (Light Emitting Diode) radiation material |
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| CN103131136B true CN103131136B (en) | 2015-06-17 |
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Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103402342B (en) * | 2013-07-29 | 2015-07-08 | 江西祥能科技有限公司 | Cooling material |
| CN104327669B (en) * | 2014-11-05 | 2016-12-07 | 于天荣 | A kind of high adhesion force heat resistant and wear resistant anticorrosive paint |
| CN106280274A (en) * | 2016-08-10 | 2017-01-04 | 袁春华 | A kind of preparation method of high thermally conductive LED fin |
| CN107603128B (en) * | 2017-08-25 | 2019-03-26 | 四川依菲兰科技有限公司 | A kind of nonmetallic composite Nano heat sink material and preparation method thereof |
| CN108587048A (en) * | 2018-04-03 | 2018-09-28 | 商洛学院 | A kind of LED lamp bead pedestal |
| CN109370158A (en) * | 2018-10-26 | 2019-02-22 | 杭州如墨科技有限公司 | A kind of preparation method of LED lamp cup heat sink material |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1072196A (en) * | 1991-11-10 | 1993-05-19 | 赵兴宏 | Heat-conducting daub |
| CN102634167A (en) * | 2011-02-10 | 2012-08-15 | 台光电子材料股份有限公司 | Resin composition |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1072196A (en) * | 1991-11-10 | 1993-05-19 | 赵兴宏 | Heat-conducting daub |
| CN102634167A (en) * | 2011-02-10 | 2012-08-15 | 台光电子材料股份有限公司 | Resin composition |
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