CN107189697A - A kind of water insoluble heat-conducting glue - Google Patents
A kind of water insoluble heat-conducting glue Download PDFInfo
- Publication number
- CN107189697A CN107189697A CN201710380810.8A CN201710380810A CN107189697A CN 107189697 A CN107189697 A CN 107189697A CN 201710380810 A CN201710380810 A CN 201710380810A CN 107189697 A CN107189697 A CN 107189697A
- Authority
- CN
- China
- Prior art keywords
- parts
- conducting glue
- water insoluble
- aluminum oxide
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J4/00—Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond ; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16
- C09J4/06—Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
- C09J9/02—Electrically-conducting adhesives
Abstract
The present invention relates to a kind of water insoluble heat-conducting glue, including nm-class boron nitride, calgon, Ludox, aluminum oxide, acrylic monomers, nano-silver powder and modified acrylic oligomer, its feed components by weight, 39 parts of 20 30 parts of the nm-class boron nitride, 15 18 parts of calgon, 8 15 parts of Ludox, 10 15 parts of aluminum oxide, 22 26 parts of acrylic monomers, 38 parts of nano-silver powder and modified acrylic oligomer.The problem of flexibility that heat-conducting glue of the present invention has solves conventional thermal conductive material fragility, and the product being made of heat-conducting glue of the present invention can greatly improve thermal diffusivity, its reliability is high, thermal conductivity is good, cementitiousness is strong, and wear-resisting, high temperature resistant, stability is good, it is nontoxic, environmental protection and the effect with energy-conserving and environment-protective.
Description
Technical field
The present invention relates to interface heat sink material field, more particularly to a kind of water insoluble heat-conducting glue.
Background technology
With microelectronic component integration density more and more higher, therefore the radiating requirements of microelectronic component also more and more higher, is opened
Sending out a kind of has the interface heat sink material of high thermal conductivity significant.Due to heat-conducting glue possess environment friendly and it is low into
This feature, gradually replaces conventional tin-lead solders interconnection material.However, the evolution of conventional pilot hot glue also runs into some bottlenecks,
As heat conductivility is not high, density is big, the problems such as stability is not high.
The content of the invention
The technical solution adopted for the present invention to solve the technical problems is：A kind of water insoluble heat-conducting glue is provided, it is special
Levying is：Including nm-class boron nitride, calgon, Ludox, aluminum oxide, acrylic monomers, nano-silver powder and modified acroleic acid
Oligomer, its feed components by weight, described nm-class boron nitride 20-30 parts, 15-18 parts of calgon, Ludox 8-
3-9 parts of 15 parts, 10-15 parts of aluminum oxide, 22-26 parts of acrylic monomers, 3-8 parts of nano-silver powder and modified acrylic oligomer.
Preferably, described water insoluble heat-conducting glue, it is characterized in that：Its feed components by weight, comprising receiving
Rice 20 parts of boron nitride, 15 parts of calgon, 8 parts of Ludox, 10 parts of aluminum oxide, 22 parts of acrylic monomers, 3 parts of nano-silver powder and
3 parts of modified acrylic oligomer.
Preferably, described water insoluble heat-conducting glue, it is characterized in that：The aluminum oxide is organic siliconresin, silane
Coupling agent, aminomethyl phenyl silicon are catalyzed the mixture formed by stirring.
Preferably, described water insoluble heat-conducting glue, it is characterized in that：Prepared by following methods：
(1) good various raw materials are configured by weight ratio；
(2) the various raw materials configured are added in stirred reactor one by one, is evacuated to 0.2MPa, be 60rpm in rotating speed
Under conditions of stir 2h, you can water insoluble heat-conducting glue is made.
The problem of flexibility that heat-conducting glue of the present invention has solves conventional thermal conductive material fragility, and use this hair
The product that bright described heat-conducting glue is made can greatly improve thermal diffusivity, and its reliability is high, and thermal conductivity is good, and cementitiousness is strong, wear-resisting,
High temperature resistant, stability is good, nontoxic, environmental protection and the effect with energy-conserving and environment-protective.
Embodiment
There is provided a kind of water insoluble heat-conducting glue, including nanometer nitrogen for a kind of water insoluble heat-conducting glue of the present invention
Change boron, calgon, Ludox, aluminum oxide, acrylic monomers, nano-silver powder and modified acrylic oligomer, its raw material is each
Composition by weight, described nm-class boron nitride 20-30 parts, 15-18 parts of calgon, 8-15 parts of Ludox, aluminum oxide 10-15
Part, 22-26 parts of acrylic monomers, 3-8 parts of nano-silver powder and 3-9 parts of modified acrylic oligomer.
Preferably, described water insoluble heat-conducting glue, it is characterized in that：Its feed components by weight, comprising receiving
Rice 20 parts of boron nitride, 15 parts of calgon, 8 parts of Ludox, 10 parts of aluminum oxide, 22 parts of acrylic monomers, 3 parts of nano-silver powder and
3 parts of modified acrylic oligomer.
Preferably, described water insoluble heat-conducting glue, it is characterized in that：The aluminum oxide is organic siliconresin, silane
Coupling agent, aminomethyl phenyl silicon are catalyzed the mixture formed by stirring.
Preferably, described water insoluble heat-conducting glue, it is characterized in that：Prepared by following methods：
(1) good various raw materials are configured by weight ratio；
(2) the various raw materials configured are added in stirred reactor one by one, is evacuated to 0.2MPa, be 60rpm in rotating speed
Under conditions of stir 2h, you can water insoluble heat-conducting glue is made.
Described above is only the preferred embodiment of the present invention, is not intended to limit the invention, it is noted that for this
For the those of ordinary skill of technical field, without departing from the technical principles of the invention, some improvement can also be made
And modification, these improvement and modification also should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of water insoluble heat-conducting glue, it is characterized in that：Including nm-class boron nitride, calgon, Ludox, aluminum oxide,
Acrylic monomers, nano-silver powder and modified acrylic oligomer, its feed components by weight, the nm-class boron nitride 20-
30 parts, 15-18 parts of calgon, 8-15 parts of Ludox, 10-15 parts of aluminum oxide, 22-26 parts of acrylic monomers, nano-silver powder
3-8 parts and 3-9 parts of modified acrylic oligomer.
2. water insoluble heat-conducting glue as claimed in claim 1, it is characterized in that：Its feed components by weight, comprising receiving
Rice 20 parts of boron nitride, 15 parts of calgon, 8 parts of Ludox, 10 parts of aluminum oxide, 22 parts of acrylic monomers, 3 parts of nano-silver powder and
3 parts of modified acrylic oligomer.
3. the water insoluble heat-conducting glue as described in claim 1-2, it is characterized in that：The aluminum oxide is organic siliconresin, silicon
Alkane coupling agent, aminomethyl phenyl silicon are catalyzed the mixture formed by stirring.
4. the water insoluble heat-conducting glue as described in claim 1-2, it is characterized in that：Prepared by following methods：
(1) good various raw materials are configured by weight ratio；
(2) the various raw materials configured are added in stirred reactor one by one, is evacuated to 0.2MPa, be 60rpm in rotating speed
Under conditions of stir 2h, you can water insoluble heat-conducting glue is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710380810.8A CN107189697A (en) | 2017-05-25 | 2017-05-25 | A kind of water insoluble heat-conducting glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710380810.8A CN107189697A (en) | 2017-05-25 | 2017-05-25 | A kind of water insoluble heat-conducting glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107189697A true CN107189697A (en) | 2017-09-22 |
Family
ID=59874511
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710380810.8A Pending CN107189697A (en) | 2017-05-25 | 2017-05-25 | A kind of water insoluble heat-conducting glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107189697A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885776A (en) * | 2016-05-22 | 2016-08-24 | 周淑华 | Water-insoluble heat conduction adhesive |
| CN106010374A (en) * | 2016-07-14 | 2016-10-12 | 强新正品（苏州）环保材料科技有限公司 | Heat-conducting glue |
-
2017
- 2017-05-25 CN CN201710380810.8A patent/CN107189697A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885776A (en) * | 2016-05-22 | 2016-08-24 | 周淑华 | Water-insoluble heat conduction adhesive |
| CN106010374A (en) * | 2016-07-14 | 2016-10-12 | 强新正品（苏州）环保材料科技有限公司 | Heat-conducting glue |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20170922 |