CN107603561A - A kind of water proof type heat-conducting glue - Google Patents
A kind of water proof type heat-conducting glue Download PDFInfo
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- CN107603561A CN107603561A CN201710824357.5A CN201710824357A CN107603561A CN 107603561 A CN107603561 A CN 107603561A CN 201710824357 A CN201710824357 A CN 201710824357A CN 107603561 A CN107603561 A CN 107603561A
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- parts
- conducting glue
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- proof type
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Abstract
The present invention relates to a kind of water proof type heat-conducting glue, including graphite powder, neoprene, graphite, organic silica gel, heat-conducting glue matrix, magnesia and modified acrylic oligomer, its feed components by weight, 39 parts of 20 30 parts of the graphite powder, 15 18 parts of neoprene, 8 15 parts of graphite, 10 15 parts of organic silica gel, 22 26 parts of heat-conducting glue matrix, 38 parts of magnesia and modified acrylic oligomer.The flexibility that heat-conducting glue of the present invention has solves the problems, such as conventional thermal conductive material fragility, and product made of heat-conducting glue of the present invention is used to greatly improve thermal diffusivity, its reliability is high, thermal conductivity is good, cementitiousness is strong, wear-resisting, high temperature resistant, and stability is good, it is nontoxic, environmental protection and the effect with energy-conserving and environment-protective.
Description
Technical field
The present invention relates to interface heat sink material field, more particularly to a kind of water proof type heat-conducting glue.
Background technology
With microelectronic component integration density more and more higher, the radiating requirements of microelectronic component also more and more higher, therefore, open
Sending out a kind of has the interface heat sink material of high thermal conductivity significant.Due to heat-conducting glue possess environment friendly and it is low into
This feature, gradually substitute conventional tin-lead solders interconnection material.However, the evolution of conventional pilot hot glue also runs into some bottlenecks,
Such as the problems such as heat conductivility is not high, density is big, and stability is not high.
The content of the invention
The technical solution adopted for the present invention to solve the technical problems is：A kind of water proof type heat-conducting glue is provided, it is characterized in that：
It is each including graphite powder, neoprene, zinc powder, organic silica gel, heat-conducting glue matrix, magnesia and modified acrylic oligomer, its raw material
Composition by weight, described graphite powder 20-30 parts, neoprene 15-18 parts, zinc powder 8-15 parts, organic silica gel 10-15 parts, heat conduction
Matrix body 22-26 parts, magnesia 3-8 parts and modified acrylic oligomer's 3-9 parts.
Preferably, described water proof type heat-conducting glue, it is characterized in that：Its feed components by weight, includes graphite powder
20 parts, 15 parts of neoprene, 8 parts of zinc powder, 10 parts of organic silica gel, 22 parts of heat-conducting glue matrix, 3 parts of magnesia and modified acroleic acid are oligomeric
3 parts of thing.
Preferably, described water proof type heat-conducting glue, it is characterized in that：The organic silica gel is organic siliconresin, acetylene carbon
Black, aminomethyl phenyl silicon is catalyzed the mixture formed by stirring.
Preferably, described water proof type heat-conducting glue, it is characterized in that：Prepared by following methods：
(1) good various raw materials are configured by weight ratio；
(2) the various raw materials configured are added in stirred reactor one by one, is evacuated to 0.2MPa, be 60rpm in rotating speed
Under conditions of stir 2h, you can water proof type heat-conducting glue is made.
The flexibility that heat-conducting glue of the present invention has solves the problems, such as conventional thermal conductive material fragility, and uses this hair
Product made of bright described heat-conducting glue can greatly improve thermal diffusivity, and its reliability is high, and thermal conductivity is good, and cementitiousness is strong, wear-resisting,
High temperature resistant, stability is good, nontoxic, environmental protection and the effect with energy-conserving and environment-protective.
Embodiment
A kind of water proof type heat-conducting glue of the present invention, there is provided a kind of water proof type heat-conducting glue, including graphite powder, neoprene,
Zinc powder, organic silica gel, heat-conducting glue matrix, magnesia and modified acrylic oligomer, its feed components by weight, the stone
Ink powder 20-30 parts, neoprene 15-18 parts, zinc powder 8-15 parts, organic silica gel 10-15 parts, heat-conducting glue matrix 22-26 parts, magnesia
3-8 parts and modified acrylic oligomer's 3-9 parts.
Preferably, described water proof type heat-conducting glue, it is characterized in that：Its feed components by weight, includes graphite powder
20 parts, 15 parts of neoprene, 8 parts of zinc powder, 10 parts of organic silica gel, 22 parts of heat-conducting glue matrix, 3 parts of magnesia and modified acroleic acid are oligomeric
3 parts of thing.
Preferably, described water proof type heat-conducting glue, it is characterized in that：The organic silica gel is organic siliconresin, acetylene carbon
Black, aminomethyl phenyl silicon is catalyzed the mixture formed by stirring.
Preferably, described water proof type heat-conducting glue, it is characterized in that：Prepared by following methods：
(1) good various raw materials are configured by weight ratio；
(2) the various raw materials configured are added in stirred reactor one by one, is evacuated to 0.2MPa, be 60rpm in rotating speed
Under conditions of stir 2h, you can water proof type heat-conducting glue is made.
Described above is only the preferred embodiment of the present invention, is not intended to limit the invention, it is noted that for this
For the those of ordinary skill of technical field, without departing from the technical principles of the invention, some improvement can also be made
And modification, these improvement and modification also should be regarded as protection scope of the present invention.
Claims (4)
1. a kind of water proof type heat-conducting glue, it is characterized in that：Including graphite powder, neoprene, zinc powder, organic silica gel, heat-conducting glue matrix, oxygen
Change magnesium and modified acrylic oligomer, its feed components by weight, described graphite powder 20-30 parts, neoprene 15-18 parts,
Zinc powder 8-15 parts, organic silica gel 10-15 parts, heat-conducting glue matrix 22-26 parts, magnesia 3-8 parts and modified acrylic oligomer 3-9
Part.
2. water proof type heat-conducting glue as claimed in claim 1, it is characterized in that：Its feed components by weight, includes graphite powder
20 parts, 15 parts of neoprene, 8 parts of zinc powder, 10 parts of organic silica gel, 22 parts of heat-conducting glue matrix, 3 parts of magnesia and modified acroleic acid are oligomeric
3 parts of thing.
3. the water proof type heat-conducting glue as described in claim 1-2, it is characterized in that：The heat-conducting glue matrix is organic siliconresin, second
Alkynes carbon black, aminomethyl phenyl silicon are catalyzed the mixture formed by stirring.
4. the water proof type heat-conducting glue as described in claim 1-2, it is characterized in that：Prepared by following methods：
(1) good various raw materials are configured by weight ratio；
(2) the various raw materials configured are added in stirred reactor one by one, is evacuated to 0.2MPa, be 60rpm in rotating speed
Under conditions of stir 2h, you can water proof type heat-conducting glue is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710824357.5A CN107603561A (en) | 2017-09-13 | 2017-09-13 | A kind of water proof type heat-conducting glue |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710824357.5A CN107603561A (en) | 2017-09-13 | 2017-09-13 | A kind of water proof type heat-conducting glue |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107603561A true CN107603561A (en) | 2018-01-19 |
Family
ID=61063734
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710824357.5A Pending CN107603561A (en) | 2017-09-13 | 2017-09-13 | A kind of water proof type heat-conducting glue |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107603561A (en) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885776A (en) * | 2016-05-22 | 2016-08-24 | 周淑华 | Water-insoluble heat conduction adhesive |
| CN106010374A (en) * | 2016-07-14 | 2016-10-12 | 强新正品（苏州）环保材料科技有限公司 | Heat-conducting glue |
-
2017
- 2017-09-13 CN CN201710824357.5A patent/CN107603561A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105885776A (en) * | 2016-05-22 | 2016-08-24 | 周淑华 | Water-insoluble heat conduction adhesive |
| CN106010374A (en) * | 2016-07-14 | 2016-10-12 | 强新正品（苏州）环保材料科技有限公司 | Heat-conducting glue |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20180119 |