CN108172588B - Manufacturing method of chip assembly of camera, camera and electronic equipment - Google Patents
Manufacturing method of chip assembly of camera, camera and electronic equipment Download PDFInfo
- Publication number
- CN108172588B CN108172588B CN201711377334.0A CN201711377334A CN108172588B CN 108172588 B CN108172588 B CN 108172588B CN 201711377334 A CN201711377334 A CN 201711377334A CN 108172588 B CN108172588 B CN 108172588B
- Authority
- CN
- China
- Prior art keywords
- chip
- optical filter
- camera
- manufacturing
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 33
- 230000003287 optical effect Effects 0.000 claims abstract description 68
- 239000000758 substrate Substances 0.000 claims abstract description 41
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000005530 etching Methods 0.000 claims abstract description 31
- 239000003292 glue Substances 0.000 claims abstract description 24
- 238000004806 packaging method and process Methods 0.000 claims abstract description 24
- 230000008569 process Effects 0.000 claims abstract description 23
- 239000010410 layer Substances 0.000 claims description 33
- 239000000463 material Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 5
- 239000012790 adhesive layer Substances 0.000 claims description 4
- 238000003754 machining Methods 0.000 claims description 4
- 238000005488 sandblasting Methods 0.000 claims description 4
- 238000000227 grinding Methods 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims description 2
- 230000005540 biological transmission Effects 0.000 claims description 2
- 239000008393 encapsulating agent Substances 0.000 claims 2
- 238000001259 photo etching Methods 0.000 claims 1
- 238000012545 processing Methods 0.000 abstract description 23
- 230000000694 effects Effects 0.000 abstract description 18
- 239000011248 coating agent Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 5
- 238000004891 communication Methods 0.000 description 8
- 230000006870 function Effects 0.000 description 8
- 238000003384 imaging method Methods 0.000 description 6
- 239000000428 dust Substances 0.000 description 4
- 238000005538 encapsulation Methods 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 230000001413 cellular effect Effects 0.000 description 3
- 238000001514 detection method Methods 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000007726 management method Methods 0.000 description 3
- 238000003860 storage Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000010892 electric spark Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- 230000005236 sound signal Effects 0.000 description 2
- 241001391944 Commicarpus scandens Species 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005422 blasting Methods 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 239000013078 crystal Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 238000009760 electrical discharge machining Methods 0.000 description 1
- 238000004146 energy storage Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000011165 process development Methods 0.000 description 1
- 238000010079 rubber tapping Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000010897 surface acoustic wave method Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14601—Structural or functional details thereof
- H01L27/14625—Optical elements or arrangements associated with the device
- H01L27/14629—Reflectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/14685—Process for coatings or optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/14—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation
- H01L27/144—Devices controlled by radiation
- H01L27/146—Imager structures
- H01L27/14683—Processes or apparatus peculiar to the manufacture or treatment of these devices or parts thereof
- H01L27/1469—Assemblies, i.e. hybrid integration
-
- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04N—PICTORIAL COMMUNICATION, e.g. TELEVISION
- H04N23/00—Cameras or camera modules comprising electronic image sensors; Control thereof
- H04N23/50—Constructional details
- H04N23/55—Optical parts specially adapted for electronic image sensors; Mounting thereof
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electromagnetism (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Multimedia (AREA)
- Signal Processing (AREA)
- Transforming Light Signals Into Electric Signals (AREA)
- Studio Devices (AREA)
Abstract
The application discloses manufacturing method, camera and electronic equipment of chip subassembly of camera, wherein the manufacturing method of the chip subassembly of camera includes: a chip; the substrate and the chip are arranged in a stacked mode; the packaging part is used for packaging the chip to the substrate and comprises a supporting part and an optical filter, and the manufacturing method comprises the following steps: arranging the chip on the substrate; selecting an optical filter; coating glue on the optical filter to form an etching layer, wherein the etching layer comprises a first part and a second part, the second part is constructed as a supporting part, and the supporting part encapsulates the chip to the substrate; etching the etching layer by using an etching process, wherein the first part is exposed out of the corresponding optical filter after being etched; and processing the surface of the supporting part corresponding to the light passing channel to form a rough surface. According to the manufacturing method of the chip assembly of the camera, the structural strength of the packaging part is enhanced, the overall height of the chip assembly is reduced, stray light incident on the chip is weakened, and the image processing effect is enhanced.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a manufacturing method of a chip assembly of a camera, the camera and the electronic equipment.
Background
In the related technology, when the camera assembly is packaged, firstly, a chip is packaged on a substrate in a mode of injection molding through a mold, then glue is drawn on an injection molding piece, and finally, an optical filter is bonded on the substrate, and in the process, the chip, the substrate and the optical filter are packaged independently. The camera component after being packaged is easy to delaminate and fall off under the impact of external force, and the error of the packaging process is large. In addition, the internal surface of injection mold base is comparatively smooth for when using camera subassembly to shoot, but light mirror surface reflection is to the chip, and then the parasitic light energy of incidenting on the chip is more, the ghost of glare appears easily, influences the effect of shooing.
Disclosure of Invention
The present application is directed to solving at least one of the problems in the prior art. Therefore, the application provides a manufacturing method of the chip assembly of the camera, the whole size of the camera manufactured by the manufacturing method of the chip assembly of the camera is small, and stray light energy can be effectively reduced.
The present application also provides a camera including a chip assembly manufactured by the method of manufacturing a chip assembly for a camera.
The application further provides an electronic device, and the electronic device comprises the camera.
According to the manufacturing method of the chip assembly of the camera, the manufacturing method comprises the following steps: a chip; the substrate and the chip are arranged in a stacked mode, and the substrate is located on one side of the chip; a packaging portion for packaging the chip to the substrate, the packaging portion including a supporting portion and an optical filter, the supporting portion having a light-passing channel, the optical filter being connected to the supporting portion and located in the light-passing channel, the optical filter being located at the other side of the chip, a gap being provided between the optical filter and the chip, a surface of the supporting portion corresponding to the light-passing channel being a rough surface, the manufacturing method including the steps of: arranging the chip on the substrate; selecting the optical filter; coating glue on the optical filter to form an etching layer, wherein the etching layer comprises a first part and a second part, the second part is configured as the supporting part, and the supporting part is used for packaging the chip to the substrate; etching the etching layer by using an etching process, wherein the first part is exposed out of the optical filter corresponding to the first part after being etched, and the second part is not etched; and processing the surface of the supporting part corresponding to the light passing channel to form a rough surface.
According to the manufacturing method of the chip assembly of the camera, the glue is coated on the surface of the optical filter, and the glue layer is etched, so that the supporting part and the optical filter form an integrated piece, the structural strength of the packaging part is enhanced, the assembly efficiency is improved, the overall height of the chip assembly is reduced, and the camera is miniaturized. In addition, the surface of the supporting part corresponding to the light-transmitting channel is a rough surface, and then light rays incident to the rough surface are converted into diffuse reflection through mirror reflection, so that stray light energy incident to the chip is weakened, and the image processing effect of the chip is enhanced.
According to this application embodiment's camera, include: a lens assembly; and the chip assembly manufactured by the manufacturing method of the chip assembly of the camera is positioned below the lens assembly, and the chip assembly is connected with the lens assembly.
According to the camera of the embodiment of the application, glue is coated on the surface of the optical filter, and the glue layer is etched, so that the supporting part and the optical filter form an integrated piece, the structural strength of the packaging part is enhanced, the assembly efficiency is improved, the overall height of the chip assembly is reduced, and the camera is miniaturized. In addition, the surface of the supporting part corresponding to the light-transmitting channel is a rough surface, and then light rays incident to the rough surface are converted into diffuse reflection through mirror reflection, so that stray light energy incident to the chip is weakened, and the image processing effect of the chip is enhanced.
The electronic equipment comprises the camera.
According to the electronic equipment of this application embodiment, through the surface coating glue at the light filter to carry out the etching to the glue layer and handle, make supporting part and light filter form integrative piece, thereby strengthen the structural strength of encapsulation portion, improved the efficiency of assembly, reduced the whole height of chip subassembly, make the camera miniaturized. In addition, the surface of the supporting part corresponding to the light-transmitting channel is a rough surface, and then light rays incident to the rough surface are converted into diffuse reflection through mirror reflection, so that stray light energy incident to the chip is weakened, and the image processing effect of the chip is enhanced.
Drawings
Fig. 1 is a schematic structural view of a chip assembly manufactured by a method of manufacturing a chip assembly using a camera according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a camera according to an embodiment of the present application;
fig. 3 is a rear view of an electronic device according to an embodiment of the application.
Reference numerals:
in the electronic device 1000, it is shown that,
the camera head 100, the chip assembly 1,
a chip 11, a substrate 12, a package portion 13, a filter 131, a support portion 132,
the electrical components 14 are provided in the form of electrical components,
a lens assembly 2.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present application and should not be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientation or position shown in the drawings
The relationship is for convenience in describing the application and simplicity of description only and is not intended to indicate or imply that the device or element so referred to must have a particular orientation, be constructed and operated in a particular orientation and is therefore not to be considered limiting of the application.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present application, "plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In this application, unless expressly stated or limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can include, for example, fixed connections, removable connections, or integral parts; may be mechanically coupled, may be electrically coupled or may be in communication with each other; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meaning of the above terms in the present application can be understood by those of ordinary skill in the art as appropriate.
A method of manufacturing the chip assembly 1 of the camera head 100 according to the embodiment of the present application and the chip assembly 1 manufactured by the present application are described below with reference to fig. 1 to 3.
As shown in fig. 1 to 3, a chip assembly 1 of a camera 100 according to an embodiment of the present application includes: chip 11, substrate 12, and package 13.
Specifically, as shown in fig. 1 and 2, the substrate 12 is provided by stacking the chips 11, and the substrate 12 is located on one side (lower side as viewed in fig. 1) of the chips 11. The chip 11 may be an image processor, such as a CMOS type or a CCD type, external light is transmitted to the chip 11, the chip 11 may convert the light into electric charges, and then the electric charges are converted into digital signals by an analog-to-digital converter, and finally the digital signals are compressed and stored in a memory.
As shown in fig. 1, the encapsulation portion 13 for encapsulating the chip 11 onto the substrate 12, the encapsulation portion 13 may include a support portion 132 and a filter 131, the support portion 132 has a light-passing channel, the filter 131 is connected to the support portion 132, the filter 131 is located in the light-passing channel, the filter 131 is located on the other side (the upper side shown in fig. 1) of the chip 11, a gap is formed between the filter 131 and the chip 11, and a surface of the support portion 132 corresponding to the light-passing channel is a rough surface. Therefore, the light rays incident to the rough surface are converted into diffuse reflection from mirror reflection, stray light inside the chip assembly 1 is scattered, the stray light energy incident to the chip 11 is weakened, and the image processing effect of the chip assembly 1 is improved. In addition, the optical filter 131, the chip 11 and the substrate 12 are packaged into an integrated structure by the packaging part 13, and then the optical filter 131 can be fixed and protected by the packaging part 13, so that the optical filter 131 can be effectively prevented from falling off under the impact of external force, and the working stability of the optical filter 131 is enhanced.
As shown in fig. 1 and 2, a method of manufacturing a chip assembly 1 of a camera head 100 according to an embodiment of the present application may include the steps of: the chip 11 is arranged on the substrate 12; selecting an optical filter 131; coating glue on the filter 131 to form an etching layer, the etching layer including a first portion and a second portion, the second portion configured as a support portion 132, the support portion 132 encapsulating the chip 11 to the substrate 12; etching the etching layer by using an etching process, wherein the first part is exposed out of the optical filter 131 corresponding to the etched first part, and the second part is not etched; the surface of the supporting part 132 corresponding to the light passing channel is processed to form a rough surface.
It should be noted that "etching" as referred to herein may refer to stripping, removing material by solution, reactive ion or other mechanical means to achieve the effect of processing the material. For example, a layer of glue is applied to the outer surface of the optical filter 131, then a photolithography exposure process is performed on the position of the optical filter 131 where the glue is applied, and finally, the portion to be removed is etched away by other means, so that the optical filter 131 is exposed.
According to the manufacturing method of the chip assembly 1 of the camera 100 in the embodiment of the application, the glue is coated on the surface of the optical filter 131, and the glue layer is etched, so that the supporting part 132 and the optical filter 131 are formed into an integrated piece, the structural strength of the packaging part 13 is enhanced, the assembly efficiency is improved, the overall height of the chip assembly 1 is reduced, and the camera 100 is miniaturized. In addition, the surface of the supporting portion 132 corresponding to the light-transmitting channel is a rough surface, and further, light incident on the rough surface is converted into diffuse reflection from mirror reflection, so that stray light energy incident on the chip 11 is weakened, and the image processing effect of the chip 11 is enhanced.
According to some embodiments of the present application, the matte surface is machined using a sanding, grit blasting, or spark erosion process. The grinding, sand blasting or electric spark process has the advantages of simple process, high processing efficiency, relatively mature process development and low manufacturing cost. The grinding or sand blasting is to perform impact and cutting treatment on the surface of the support part 132 corresponding to the light passing channel so that the surface of the support part 132 corresponding to the light passing channel obtains a certain roughness, and the electric spark process is to obtain a certain roughness on the surface of the support part 132 corresponding to the light passing channel by using a corrosion phenomenon generated during spark discharge.
According to some embodiments of the present disclosure, as shown in fig. 1, the etching layer is two layers, one layer is disposed on the upper surface of the filter 131, and the other layer is disposed on the lower surface of the filter 131. Therefore, the upper side and the lower side of the optical filter 131 positioned in the light passing channel can be exposed, so that the optical filter 131 positioned in the light passing channel can better filter the mixed colors and polarized light in the light, and a better processing effect is obtained.
According to some embodiments of the present application, as shown in fig. 1, the support portion 132 is formed on the second portion by using a nano-imprint process after the etching process. The nanoimprint process has high machining precision and machining strength, the supporting portion 132 formed by machining through the nanoimprint process has high structural strength and small thickness, and the optical filter 131 can be fixed and protected well, so that the optical filter 131 is not easy to break or fall off under the impact of external force, and the chip assembly 1 is miniaturized while the working stability of the optical filter 131 is improved.
According to some embodiments of the present application, as shown in fig. 2, an electrical component 14 may be disposed on the substrate 12, and the electrical component 14 is encapsulated in the encapsulation portion 13. The electrical component 14 can provide current and voltage to the chip 11 to assist the chip 11 in processing optical signals, electrical signals, and digital signals. The electrical element 14 is packaged in the packaging part 13, and the packaging part 13 has a protection effect on the electrical element 14, so that the electrical element 14 is prevented from being impacted by external force to influence the normal operation of the chip assembly 1. In addition, by packaging the electrical component 14, the substrate 12, the chip 11 and the optical filter 131 together, not only the volume and size of the camera 100 can be reduced, but also the assembly process of the camera 100 can be reduced, and the assembly precision of the chip assembly 1 can be improved.
Further, as shown in fig. 1 and 2, at least a portion of the edge of the filter 131 extends beyond the edge of the chip 11. Light with a certain incident angle passes through the wider edge of the optical filter 131, and all parts of the chip 11 can receive the light passing through the optical filter 131, so that the luminous flux of the chip assembly 1 is improved, the imaging effect is better, noise in the light is reduced, and the imaging definition and resolution are improved.
Further, as shown in fig. 1, the electric element 14 is located between the substrate 12 and the filter 131. In order to obtain a good imaging effect, the substrate 12 and the optical filter 131 need to be spaced apart, and the electrical element 14 is disposed in the space between the substrate 12 and the optical filter 131, so that no additional space needs to be allocated to place the electrical element 14, the size of the chip assembly 1 is reduced, and the miniaturized design of the chip assembly 1 is realized.
According to some embodiments of the present application, the enclosure 13 is made of an adhesive enclosure 13 of a material having adhesive properties. Therefore, part of dust or small particles falling into the chip assembly 1 can be adsorbed by the viscous packaging part 13, and further the dust or small particles are prevented from falling on the chip 11 to influence the imaging effect. In addition, the sticky packaging part 13 enables the chip 11 and the optical filter 131 to have better structural strength, and the chip 11 or the optical filter 131 is not easy to displace or shake under the action of external force, so that a better imaging effect is ensured.
According to some embodiments of the present disclosure, as shown in fig. 1, the light-transmitting region of the filter 131 is an active region, the rest is a non-active region, and the surface of the filter 131 in the non-active region is coated with an adhesive layer. Therefore, part of dust or small particles falling into the chip assembly 1 can be adsorbed by the adhesive layer, and further the dust or small particles are prevented from falling on the chip 11 to influence the imaging effect.
The following describes a camera head 100 according to an embodiment of the present application with reference to fig. 1 to 3.
As shown in fig. 2, the camera head 100 according to the embodiment of the present application includes: lens assembly 2 and chip assembly 1.
As shown in fig. 2, the chip assembly 1 is located below the lens assembly 2 (below as shown in fig. 2), and the chip assembly 1 is connected to the lens assembly 2. The lens assembly 2 can concentrate the incident light on the same plane, which is convenient for further processing in the next stage. In addition, lens subassembly 2 can also realize the regulation of focus, and then obtains comparatively clear formation of image.
According to the camera 100 of the embodiment of the application, the glue is coated on the surface of the optical filter 131, and the glue layer is etched, so that the supporting part 132 and the optical filter 131 are formed into an integrated piece, the structural strength of the packaging part 13 is enhanced, the assembly efficiency is improved, the overall height of the chip assembly 1 is reduced, and the camera 100 is miniaturized. In addition, the surface of the supporting portion 132 corresponding to the light-transmitting channel is a rough surface, and further, light incident on the rough surface is converted into diffuse reflection from mirror reflection, so that stray light energy incident on the chip 11 is weakened, and the image processing effect of the chip 11 is enhanced.
An electronic device 1000 according to an embodiment of the application is described below with reference to fig. 1-3.
As shown in FIG. 3, AN electronic device 1000 according to embodiments of the present application, including the aforementioned camera 100, it is noted that "electronic device 1000" as used herein includes, but is not limited to, devices configured to receive/transmit communication signals via a wireline connection (e.g., via the Public Switched Telephone Network (PSTN), a digital subscriber line (DS L), a digital cable, a direct cable connection, and/or another data connection/network) and/or via a wireless interface (e.g., with respect to a cellular network, a wireless local area network (W L AN), a digital television network such as a DVB-H network, a satellite network, AN AM-FM broadcast transmitter, and/or another communications electronic device 1000). examples of mobile terminals that are configured to communicate via a wireless interface include, but are not limited to, satellites or cellular telephones, personal communication system (PDA) terminals that may combine cellular radiotelephones with data processing, facsimile and data communication capabilities, and/or "mobile terminals", personal communication system (PDA) terminals that may include, a radiotelephone, a pager, a browser, a Web-enabled phone, and other global positioning system (e.g., a laptop) receiver, including a conventional wireless radiotelephone (PDA) and/or other handheld radio receiver.
According to the electronic device 1000 of the embodiment of the application, the glue is coated on the surface of the optical filter 131, and the glue layer is etched, so that the supporting portion 132 and the optical filter 131 are formed into an integrated piece, the structural strength of the packaging portion 13 is enhanced, the assembly efficiency is improved, the overall height of the chip assembly 1 is reduced, and the camera 100 is miniaturized. In addition, the surface of the supporting portion 132 corresponding to the light-transmitting channel is a rough surface, and further, light incident on the rough surface is converted into diffuse reflection from mirror reflection, so that stray light energy incident on the chip 11 is weakened, and the image processing effect of the chip 11 is enhanced.
In the embodiment of the present application, the electronic device 1000 may be various devices capable of acquiring and processing data from the outside, or the electronic device 1000 may be various devices which have a built-in battery and can acquire and charge the battery from the outside, such as a mobile phone, a tablet computer, a computing device, an information display device, or the like.
An electronic device 1000 according to a particular embodiment of the present application is described below with reference to fig. 1-3. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting.
A description will be given of the electronic device 1000 to which the present application is applied by taking a mobile phone as an example. In the embodiment of the present application, the electronic device 1000 may include a camera 100, a radio frequency circuit, a memory, an input unit, a wireless fidelity (WiFi) module, a sensor, a display unit, an audio circuit, a processor, a fingerprint identification component, a battery, and other components.
As shown in fig. 1 and fig. 2, a camera 100 according to an embodiment of the present application includes: lens assembly 2 and chip assembly 1 of camera head 100. Wherein, the chip assembly 1 is located below the lens assembly 2 (below as shown in fig. 2), and the chip assembly 1 is connected with the lens assembly 2.
As shown in fig. 2, the chip module 1 includes a chip 11, an optical filter 131, a substrate 12, a package 13, and an electric element 14. The encapsulating portion 13 is made of a material having an adhesive property, the encapsulating portion 13 encapsulates the chip 11 on the substrate 12, a part of the edge of the optical filter 131 is wrapped by the encapsulating portion 13, and the electric component 14 is encapsulated in the encapsulating portion 13.
As shown in fig. 1 and 2, the package portion 13 includes a support portion 132 and a filter 131, the support portion 132 has a light passing channel, the filter 131 is connected to the support portion 132, the filter 131 is located in the light passing channel, the filter 131 is located on the other side of the chip 11, a gap is formed between the filter 131 and the chip 11, and a surface of the support portion 132 corresponding to the light passing channel is a rough surface.
As shown in fig. 1 and 2, the substrate 12, the chip 11, and the filter 131 are stacked, the substrate 12 is located on the lower side of the chip 11 (the lower side shown in fig. 1), the filter 131 is located on the upper side of the chip 11 (the upper side shown in fig. 1), and a gap is provided between the filter 131 and the chip 11. The light-transmitting area of the filter 131 is a working area, the rest is a non-working area, and the surface of the filter 131 in the non-working area is coated with an adhesive layer.
As shown in fig. 1 and 2, the electrical component 14 is disposed on the substrate 12, the electrical component 14 is located between the substrate 12 and the optical filter 131, the electrical component 14 is connected to the chip 11, and the electrical components 14 are disposed in two groups and respectively distributed on the left side (the left side shown in fig. 1) and the right side (the right side shown in fig. 1) of the chip 11.
Specifically, as shown in fig. 1, the manufacturing method of the chip assembly 1 of the camera head 100 includes five steps as follows:
the first step is as follows: the chip 11 is arranged on the substrate 12;
the second step is that: selecting an optical filter 131;
the third step: coating glue on the filter 131 to form an etching layer, the etching layer further including a first portion and a second portion, the second portion being configured as a support portion 132, the support portion 132 encapsulating the chip 11 to the substrate 12;
the fourth step: etching the etching layer by using an etching process, wherein the first part is exposed out of the optical filter 131 corresponding to the etched first part, and the second part is not etched;
the fifth step: the surface of the support part 132 corresponding to the light passage is processed by sand blasting to form a rough surface.
As shown in fig. 1, the etching layer has two layers, one layer is disposed on the upper surface of the filter 131, and the other layer is disposed on the lower surface of the filter 131. After the etching process, the second portion is processed to form the supporting portion 132 using a nano-imprinting process.
As shown in fig. 1 to 3, in the method for manufacturing the chip assembly 1 of the camera 100 according to the embodiment, the glue is coated on the surface of the optical filter 131, and the glue layer is etched, so that the supporting portion 132 and the optical filter 131 are formed into an integral piece, thereby enhancing the structural strength of the packaging portion 13, improving the assembly efficiency, reducing the overall height of the chip assembly 1, and miniaturizing the camera 100. In addition, the surface of the supporting portion 132 corresponding to the light-transmitting channel is a rough surface, and further, light incident on the rough surface is converted into diffuse reflection from mirror reflection, so that stray light energy incident on the chip 11 is weakened, and the image processing effect of the chip 11 is enhanced.
The radio frequency circuit can be used for receiving and sending signals in the process of receiving and sending information or calling, and particularly, the radio frequency circuit receives the downlink information of the base station and then processes the downlink information; in addition, uplink data of the electronic device 1000 is transmitted to the base station. Typically, the radio frequency circuitry includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency circuitry may also communicate with networks and other devices via wireless communications.
The memory may be used to store software programs and modules, and the processor executes various functional applications and data processing of the electronic device 1000 by operating the software programs and modules stored in the memory. The memory can mainly comprise a program storage area and a data storage area, wherein the program storage area can store an operating system, application programs (such as a sound playing function and an image playing function) required by at least one function and the like; the storage data area may store data (e.g., audio data, a phonebook, etc.) created according to the use of the electronic apparatus 1000, and the like. Further, the memory may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The input unit may be used to receive input numeric or character information and generate key signals related to user settings and function control of the electronic device 1000. Specifically, the input unit may include a touch panel and other input devices. The touch panel, also called a touch screen, may collect touch operations of a user (for example, operations of the user on or near the touch panel using any suitable object or accessory such as a finger, a stylus, etc.) and drive the corresponding connection device according to a preset program.
Alternatively, the touch panel may include two parts, a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor, and can receive and execute commands sent by the processor. In addition, the touch panel may be implemented in various types such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. The input unit may include other input devices in addition to the touch panel. In particular, other input devices may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.
WiFi belongs to short-distance wireless transmission technology, and the electronic equipment 1000 can help a user to receive and send e-mails, browse webpages, access streaming media and the like through a WiFi module, and provides wireless broadband internet access for the user. It is understood that the WiFi module is not an essential component of the electronic device 1000 and may be omitted entirely as needed within the scope of not changing the nature of the application.
In addition, the handset may also include at least one sensor, such as an attitude sensor, a light sensor, and other sensors.
Specifically, the attitude sensor may also be referred to as a motion sensor, and as one of the motion sensors, a gravity sensor may be cited, which uses an elastic sensing element to make a cantilever-type displacer and uses an energy storage spring made of the elastic sensing element to drive an electrical contact, thereby realizing conversion of a change in gravity into a change in an electrical signal.
Another example of the motion sensor is an accelerometer sensor, which can detect the magnitude of acceleration in each direction (generally, three axes), detect the magnitude and direction of gravity when stationary, and can be used for applications for recognizing the posture of a mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like.
In the embodiment of the present application, the motion sensors listed above may be used as elements for obtaining "attitude parameters" described later, but the present application is not limited thereto, and other sensors capable of obtaining "attitude parameters" fall within the protection scope of the present application, such as a gyroscope and the like, and the operation principle and data processing procedure of the gyroscope may be similar to those of the prior art, and the detailed description thereof is omitted here for avoiding redundancy.
In addition, in this embodiment of the application, as the sensor, other sensors such as a barometer, a hygrometer, a thermometer, and an infrared sensor may also be configured, which are not described herein again.
The light sensor may include an ambient light sensor that adjusts the brightness of the display panel according to the brightness of ambient light, and a proximity sensor that turns off the display panel and/or the backlight when the mobile phone is moved to the ear.
The display unit may include a display panel, and optionally, the display panel may be configured in the form of a liquid crystal display unit (L CD, &lTtTtranslation = L "&gTtL &lTt/T &gTtiquid crystal display), an Organic light Emitting Diode (O L ED, Organic L light-Emitting Diode), and the like.
The audio circuitry, speaker, and microphone may provide an audio interface between a user and the electronic device 1000. The audio circuit can transmit the electric signal converted from the received audio data to the loudspeaker, and the electric signal is converted into a sound signal by the loudspeaker to be output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit and converted into audio data, which is then output to the processor for processing, and then transmitted to another electronic device 1000 via the rf circuit, or output to the memory for further processing.
The processor is a control center of the electronic device 1000, is installed on the circuit board assembly, connects various parts of the whole electronic device 1000 by using various interfaces and lines, and performs various functions of the electronic device 1000 and processes data by operating or executing software programs and/or modules stored in the memory and calling data stored in the memory, thereby performing overall monitoring of the electronic device 1000. Alternatively, the processor may include one or more processing units; preferably, the processor may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications.
The power supply can be logically connected with the processor through the power management system, so that the functions of managing charging, discharging, power consumption management and the like are realized through the power management system. Although not shown, the electronic device 1000 may further include a bluetooth module, a sensor (e.g., an attitude sensor, a light sensor, other sensors such as a barometer, a hygrometer, a thermometer, an infrared sensor, etc.), etc., which are not described herein.
It should be noted that the mobile phone is only an example of the electronic device 1000, and the application is not particularly limited, and the application may be applied to the electronic device 1000 such as a mobile phone and a tablet computer, and the application is not limited thereto.
In the description herein, reference to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present application have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present application, and that variations, modifications, substitutions and alterations may be made to the above embodiments by those of ordinary skill in the art within the scope of the present application.
Claims (11)
1. A method of manufacturing a chip assembly (1) for a camera head (100), comprising:
a chip (11);
a substrate (12), wherein the substrate (12) and the chip (11) are arranged in a stacked manner, and the substrate (12) is positioned on one side of the chip (11);
a packaging part (13) for packaging the chip (11) to the substrate (12), wherein the packaging part (13) comprises a supporting part (132) and an optical filter (131), the supporting part (132) is provided with a light-transmitting channel, the optical filter (131) is connected with the supporting part (132), the optical filter (131) is positioned in the light-transmitting channel, the optical filter (131) is positioned at the other side of the chip (11), a gap is arranged between the optical filter (131) and the chip (11), the surface of the supporting part (132) corresponding to the light-transmitting channel is a rough surface, and the manufacturing method comprises the following steps:
-providing said chip (11) to said substrate (12);
selecting the optical filter (131);
applying glue on the optical filter (131) to form an etch layer, the etch layer comprising a first portion and a second portion, the second portion being configured as the support (132), the support (132) encapsulating the chip (11) to the substrate (12);
etching the etching layer by using an etching process, wherein the first part is exposed out of the optical filter (131) corresponding to the first part after being etched, and the second part is not etched;
the surface of the supporting part (132) corresponding to the light passing channel is processed to form a rough surface,
a layer of glue is coated on the outer surface of the optical filter (131), then photoetching exposure treatment is carried out on the position of the optical filter (131) coated with the glue, the part needing to be removed is corroded, and therefore the optical filter (131) is exposed, and the supporting portion (132) and the optical filter (131) are integrated.
2. Method for manufacturing a chip assembly (1) for a camera head (100) according to claim 1, characterized in that the rough surface is machined by means of grinding, sandblasting or electro-discharge machining.
3. The method of manufacturing a chip assembly (1) for a camera head (100) according to claim 1, wherein the etching layer is two layers, one layer being provided on an upper surface of the optical filter (131) and the other layer being provided on a lower surface of the optical filter (131).
4. The method for manufacturing a chip assembly (1) for a camera head (100) according to claim 1, wherein the support portion (132) is machined on the second part using a nanoimprint process after the etching process.
5. The method for manufacturing the chip assembly (1) of the camera (100) according to claim 1, wherein an electrical component (14) is provided on the substrate (12), and the electrical component (14) is packaged in the packaging part (13).
6. Method for manufacturing a chip assembly (1) for a camera head (100) according to claim 5, characterized in that at least part of the edge of the filter (131) extends beyond the edge of the chip (11).
7. Method for manufacturing a chip assembly (1) for a camera head (100) according to claim 6, characterized in that the electrical element (14) is located between the substrate (12) and the filter (131).
8. Method for manufacturing a chip assembly (1) for a camera head (100) according to claim 1, characterized in that the encapsulant (13) is an adhesive encapsulant (13) made of a material having an adhesive property.
9. The method for manufacturing the chip assembly (1) of the camera (100) according to claim 1, wherein the light transmission region of the optical filter (131) is an active region, and the rest is a non-active region, and the surface of the optical filter (131) in the non-active region is coated with an adhesive layer.
10. A camera (100), comprising:
a lens assembly (2); and
chip assembly (1), the chip assembly (1) being manufactured with a method of manufacturing a chip assembly (1) for a camera head (100) according to any one of claims 1 to 9, the chip assembly (1) being located below the lens assembly (2), the chip assembly (1) being connected with the lens assembly (2).
11. An electronic device (1000), comprising:
a camera (100), the camera (100) being a camera (100) according to claim 10.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711377334.0A CN108172588B (en) | 2017-12-19 | 2017-12-19 | Manufacturing method of chip assembly of camera, camera and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711377334.0A CN108172588B (en) | 2017-12-19 | 2017-12-19 | Manufacturing method of chip assembly of camera, camera and electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN108172588A CN108172588A (en) | 2018-06-15 |
| CN108172588B true CN108172588B (en) | 2020-08-07 |
Family
ID=62522476
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201711377334.0A Expired - Fee Related CN108172588B (en) | 2017-12-19 | 2017-12-19 | Manufacturing method of chip assembly of camera, camera and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN108172588B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110650269A (en) | 2018-06-27 | 2020-01-03 | 三赢科技（深圳）有限公司 | Camera module and forming method thereof |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105573020A (en) * | 2016-02-22 | 2016-05-11 | 宁波舜宇光电信息有限公司 | Camera module with dust catching structure |
| CN206339766U (en) * | 2016-12-10 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Camera lens module |
| CN107121191A (en) * | 2016-12-23 | 2017-09-01 | 中国电子科技集团公司信息科学研究院 | A kind of self-adapting tuning infrared multispectral detects micro-system |
| CN107422444A (en) * | 2017-08-25 | 2017-12-01 | 广东欧珀移动通信有限公司 | Terminal, optical filter box, camera module and preparation method |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9036231B2 (en) * | 2010-10-20 | 2015-05-19 | Tiansheng ZHOU | Micro-electro-mechanical systems micromirrors and micromirror arrays |
-
2017
- 2017-12-19 CN CN201711377334.0A patent/CN108172588B/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105573020A (en) * | 2016-02-22 | 2016-05-11 | 宁波舜宇光电信息有限公司 | Camera module with dust catching structure |
| CN206339766U (en) * | 2016-12-10 | 2017-07-18 | 瑞声科技(新加坡)有限公司 | Camera lens module |
| CN107121191A (en) * | 2016-12-23 | 2017-09-01 | 中国电子科技集团公司信息科学研究院 | A kind of self-adapting tuning infrared multispectral detects micro-system |
| CN107422444A (en) * | 2017-08-25 | 2017-12-01 | 广东欧珀移动通信有限公司 | Terminal, optical filter box, camera module and preparation method |
Also Published As
| Publication number | Publication date |
|---|---|
| CN108172588A (en) | 2018-06-15 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20190265461A1 (en) | Camera module and terminal device | |
| US11490550B2 (en) | Electronic device including heat radiating structure | |
| CN108076271B (en) | Lens assembly, camera with same and electronic equipment | |
| CN108172588B (en) | Manufacturing method of chip assembly of camera, camera and electronic equipment | |
| CN108174064B (en) | Lens assembly of camera, camera and electronic equipment | |
| CN208112683U (en) | Camera module and electronic device with it | |
| WO2019120061A1 (en) | Chip component of camera, camera and electronic device | |
| CN107864325B (en) | Lens assembly of camera, camera and electronic equipment | |
| EP3716606B1 (en) | Electronic device | |
| CN108076272B (en) | Lens assembly, camera with same and electronic equipment | |
| CN107872610B (en) | Lens assembly of camera, camera with lens assembly and electronic equipment with lens assembly | |
| CN107948481B (en) | Lens assembly of camera, camera and electronic equipment | |
| CN207782943U (en) | Chip assembly, camera and the electronic equipment of camera | |
| CN108167588B (en) | Support, chip assembly, camera, electronic device and manufacturing method of main body part | |
| CN108111721B (en) | Bracket component, chip component, camera and electronic equipment of camera | |
| CN108174065B (en) | Lens assembly of camera, camera with lens assembly and electronic equipment with lens assembly | |
| CN108153377B (en) | Camera of electronic equipment and electronic equipment with camera | |
| CN108040196B (en) | Lens assembly of camera, camera and electronic equipment | |
| CN107920194B (en) | Lens assembly of camera, camera and electronic equipment | |
| CN108040197B (en) | Lens assembly of camera, camera and electronic equipment | |
| CN207543218U (en) | Lens assembly, camera and the electronic equipment of camera | |
| CN107948483B (en) | Lens assembly of camera, camera and electronic equipment | |
| CN108024044A (en) | Camera and there is its electronic equipment | |
| CN108111720A (en) | The camera of electronic equipment and with its electronic equipment | |
| CN108174062B (en) | Camera and electronic equipment with same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information |
Address after: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant after: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. Address before: Changan town in Guangdong province Dongguan 523860 usha Beach Road No. 18 Applicant before: GUANGDONG OPPO MOBILE TELECOMMUNICATIONS Corp.,Ltd. |
|
| CB02 | Change of applicant information | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200807 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |