CN108167588B - Support, chip assembly, camera, electronic device and manufacturing method of main body part - Google Patents

Support, chip assembly, camera, electronic device and manufacturing method of main body part Download PDF

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Publication number
CN108167588B
CN108167588B CN201711376014.3A CN201711376014A CN108167588B CN 108167588 B CN108167588 B CN 108167588B CN 201711376014 A CN201711376014 A CN 201711376014A CN 108167588 B CN108167588 B CN 108167588B
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China
Prior art keywords
light
support
camera
main part
main body
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Expired - Fee Related
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CN201711376014.3A
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Chinese (zh)
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CN108167588A (en
Inventor
韦怡
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201711376014.3A priority Critical patent/CN108167588B/en
Publication of CN108167588A publication Critical patent/CN108167588A/en
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Publication of CN108167588B publication Critical patent/CN108167588B/en
Expired - Fee Related legal-status Critical Current
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    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F16ENGINEERING ELEMENTS AND UNITS; GENERAL MEASURES FOR PRODUCING AND MAINTAINING EFFECTIVE FUNCTIONING OF MACHINES OR INSTALLATIONS; THERMAL INSULATION IN GENERAL
    • F16MFRAMES, CASINGS OR BEDS OF ENGINES, MACHINES OR APPARATUS, NOT SPECIFIC TO ENGINES, MACHINES OR APPARATUS PROVIDED FOR ELSEWHERE; STANDS; SUPPORTS
    • F16M11/00Stands or trestles as supports for apparatus or articles placed thereon ; Stands for scientific apparatus such as gravitational force meters
    • F16M11/02Heads
    • F16M11/04Means for attachment of apparatus; Means allowing adjustment of the apparatus relatively to the stand
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29DPRODUCING PARTICULAR ARTICLES FROM PLASTICS OR FROM SUBSTANCES IN A PLASTIC STATE
    • B29D12/00Producing frames
    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03BAPPARATUS OR ARRANGEMENTS FOR TAKING PHOTOGRAPHS OR FOR PROJECTING OR VIEWING THEM; APPARATUS OR ARRANGEMENTS EMPLOYING ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ACCESSORIES THEREFOR
    • G03B17/00Details of cameras or camera bodies; Accessories therefor
    • G03B17/56Accessories
    • G03B17/561Support related camera accessories
    • GPHYSICS
    • G06COMPUTING; CALCULATING OR COUNTING
    • G06FELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16Constructional details or arrangements
    • G06F1/1613Constructional details or arrangements for portable computers
    • G06F1/1633Constructional details or arrangements of portable computers not specific to the type of enclosures covered by groups G06F1/1615 - G06F1/1626
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04MTELEPHONIC COMMUNICATION
    • H04M1/00Substation equipment, e.g. for use by subscribers
    • H04M1/02Constructional features of telephone sets
    • H04M1/0202Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
    • H04M1/026Details of the structure or mounting of specific components
    • H04M1/0264Details of the structure or mounting of specific components for a camera module assembly
    • HELECTRICITY
    • H04ELECTRIC COMMUNICATION TECHNIQUE
    • H04NPICTORIAL COMMUNICATION, e.g. TELEVISION
    • H04N23/00Cameras or camera modules comprising electronic image sensors; Control thereof
    • H04N23/57Mechanical or electrical details of cameras or camera modules specially adapted for being embedded in other devices

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  • Engineering & Computer Science (AREA)
  • General Engineering & Computer Science (AREA)
  • Signal Processing (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Multimedia (AREA)
  • Human Computer Interaction (AREA)
  • Studio Devices (AREA)

Abstract

The application discloses support, chip subassembly, camera, electronic equipment and manufacturing approach of main part, wherein the support of camera includes injection moulding's main part and coating film layer, and the middle part of main part forms logical light sheet body through the sculpture, and the coating film layer coats in the surface of main part. According to the support of camera of this application, form the logical light lamellar body through the middle part sculpture with the main part, and the main part is injection moulding, makes simply and production efficiency is high, leads to light lamellar body and main part and synthesizes into an organic whole, has replaced the structure that utilizes the plastic support among the correlation technique will lead to the light lamellar body and fix to the support, and then has reduced the main part and has led to the whole height of light lamellar body, has saved the space for the support is miniaturized. In addition, the main body part is coated with the film, so that the reflection of light on the light-transmitting sheet body can be reduced, and the imaging quality of the camera can be improved.

Description

Support, chip assembly, camera, electronic device and manufacturing method of main body part
Technical Field
The present application relates to the field of electronic device technologies, and in particular, to a method for manufacturing a bracket, a chip assembly, a camera, an electronic device, and a main body portion.
Background
In the related art, a plastic holder is used to support and fix a lens and a filter of a camera. Wherein, the plastic support is for satisfying the intensity requirement, and its thickness is great relatively, and the inner space that occupies the camera is more for the whole volume and the size of camera are great, and then have restricted the thickness of the electronic equipment who has the camera, can't satisfy the demand that the user is to the ultra-thin of electronic equipment.
Content of application
The present application is directed to solving at least one of the problems in the prior art. For this reason, this application provides a support of camera, the support of camera has small, the strong advantage of stability.
The application also provides a chip assembly of the camera, the chip assembly comprises the support of the camera.
The application also provides a camera, the camera includes the chip subassembly of above-mentioned camera.
The application further provides an electronic device, and the electronic device comprises the camera.
The application also provides a manufacturing method of the main body part of the camera, and the manufacturing method of the main body part of the camera has the advantages of simple flow and easiness in implementation.
According to this application embodiment's support of camera includes: the light-transmitting sheet body is formed in the middle of the main body part through etching; and the coating layer is coated on the outer surface of the main body part.
According to the support of camera of this application embodiment, form the logical light lamellar body through the middle part sculpture with the main part, and the main part is injection moulding, makes simply and production efficiency is high, leads to light lamellar body and main part and synthesizes into an organic whole, has replaced the structure that utilizes the plastic support to lead to the light lamellar body to fix on the support among the correlation technique, and then has reduced the overall height of main part and logical light lamellar body, has saved the space for the support is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
According to this application of embodiment's chip subassembly of camera, include: a circuit board; the chip is arranged on the circuit board and is electrically connected with the circuit board; and the support is connected with the circuit board, and the chip is opposite to the light-transmitting sheet body.
According to the chip subassembly of camera of this application embodiment, form the logical light lamellar body through the middle part sculpture with the main part, and the main part is injection moulding, and it is simple and production efficiency high to make, leads to light lamellar body and main part and synthesizes into an organic whole, has replaced the structure that utilizes the plastic support to lead to the light lamellar body to fix on the support among the correlation technique, and then has reduced the main part and has led to the whole height of light lamellar body, has saved the space for the support is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
According to the camera of the embodiment of the application, the chip assembly of the camera is included.
According to the camera of this application embodiment, form logical light lamellar body through the middle part sculpture with the main part, and the main part is injection moulding, makes simply and production efficiency is high, leads to light lamellar body and main part and synthesizes into an organic whole, has replaced the structure that utilizes the plastic support to lead to the light lamellar body to fix on the support among the correlation technique, and then has reduced the whole height of main part and logical light lamellar body, has saved the space for the support is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
The electronic equipment comprises the camera.
According to the electronic equipment of this application embodiment, form logical light lamellar body through the middle part sculpture with the main part, and the main part is injection moulding, makes simply and production efficiency is high, leads to light lamellar body and main part and synthesizes into an organic whole, has replaced the structure that utilizes the plastic support among the correlation technique will lead to light lamellar body and fix to the support, and then has reduced the main part and has led to the whole height of light lamellar body, has saved the space for the support is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
According to the manufacturing method of the main body part of the camera of the embodiment of the application, the main body part comprises a support part and an optical filter, the support part is positioned at the periphery of the optical filter to support the optical filter, the middle part of the main body part is configured into the optical filter, and the manufacturing method comprises the following steps: manufacturing a substrate by injection molding; forming the supporting part by a cutting process; etching the substrate to construct the optical filter on the substrate; and coating a film on the outer surface of the base material to further form the main body part.
According to the manufacturing method of the main body part of the camera, the supporting part and the optical filter are formed on the base material by utilizing the cutting process and the etching process to form the main body part, the whole manufacturing process is simple, the application technology is mature, the production efficiency of the main body part can be improved, the supporting part and the optical filter are integrated, the process of setting the supporting part for the optical filter is saved, the occupied space of the main body part can be reduced, and the main body part is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
Drawings
The above and/or additional aspects and advantages of the present application will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a camera according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a camera according to an embodiment of the present application;
fig. 3 is a rear view of an electronic device according to an embodiment of the application.
Reference numerals:
in the electronic device 1000, it is shown that,
the number of the cameras 100 is such that,
a support 1, a main body part 11, a light transmission sheet body 111, a supporting part 11a, a filter 11b,
the combination of the lens 131, the filter 132,
the chip assembly 2 is provided with a plurality of chips,
the number of the circuit boards 21 is such that,
the number of chips 22 is such that,
lens assembly 3, motor 31.
Detailed Description
Reference will now be made in detail to embodiments of the present application, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary only for the purpose of explaining the present application and are not to be construed as limiting the present application.
In the description of the present application, it is to be understood that the terms "thickness", "upper", "lower", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are only for convenience in describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present application. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present application, "a plurality" means two or more unless otherwise specified.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
As shown in fig. 1, a bracket 1 of a camera 100 according to an embodiment of the present disclosure includes a main body 11 and a coating layer (not shown), a light-transmitting sheet 111 is formed in a middle portion of the main body 11 by etching, and the main body 11 is formed by injection molding. The coating layer is coated on the outer surface of the main body part 11.
As shown in fig. 1, the filter 11 may be a filter, a lens, or a partition, and the filter 11 may filter stray light in the incident light, so as to facilitate further processing of the incident light in the next stage, thereby obtaining an imaging effect with low noise and high definition. The main part 11 can be a glass piece, and the middle part of the main part 11 is etched to form the filter piece 11, so that the filter piece 11 and the main part 11 form an integrated piece, thereby avoiding the delamination and falling off of the filter piece 11 and the main part 11 in the use process and improving the working stability of the camera 100. The injection molding process is mature, the main body part 11 manufactured by accurately controlling the injection molding temperature, the injection molding pressure and the injection molding time during injection molding has accurate size and small error, the production efficiency of the injection molding process is high, and the product yield is high.
According to the support 1 of the camera 100 of the embodiment of the application, the light-transmitting sheet body 111 is formed by etching the middle of the main body part 11, the main body part 11 is formed by injection molding, the manufacturing is simple, the production efficiency is high, the light-transmitting sheet body 111 and the main body part 11 are integrated, a structure that the light-transmitting sheet body is fixed on the support by using a plastic support in the related art is replaced, the overall height of the main body part 11 and the light-transmitting sheet body 111 is reduced, the space is saved, and the support 1 is miniaturized. In addition, the main body 11 is coated with a film to reduce the reflection of light on the light-transmitting sheet 111 and improve the amount of light passing through the light-transmitting sheet 111, so that the light transmittance of the light-transmitting sheet 111 can be improved, and the imaging quality of the camera 100 can be improved.
The chip assembly 2 of the camera head 100 according to an embodiment of the present application is described below with reference to fig. 1 to 3.
As shown in fig. 1, a chip assembly 2 of a camera head 100 according to an embodiment of the present application includes: circuit board 21, chip 22 and holder 1 described above. The chip 22 is arranged on the circuit board 21, and the chip 22 is electrically connected with the circuit board 21; the main body 11 is connected to the circuit board 21, and the chip 22 faces the light transmitting sheet 111. The chip 22 may be an image sensor, and the light passing through the light-transmitting sheet 111 and incident on the chip 22 can be processed by the chip 22 to obtain a clear and bright image.
According to the chip subassembly 2 of camera 100 of this application embodiment, form logical light sheet 111 through the middle part sculpture with main part 11, and main part 11 is injection moulding, and it is simple to make and production efficiency is high, leads to light sheet 111 and main part 11 and is an organic whole, has replaced the structure that utilizes the plastic support to lead to the light sheet and fix on the support among the correlation technique, and then has reduced main part 11 and the whole height of leading to light sheet 111, has saved the space for support 1 is miniaturized. In addition, the main body 11 is coated with a film to reduce the reflection of light on the light-transmitting sheet 111 and improve the light quantity of light passing through the light-transmitting sheet 111, so that the light transmittance of the light-transmitting sheet 111 can be improved, and the imaging quality of the camera can be improved.
According to some embodiments of the present application, the bracket 1 is bonded to the circuit board 21. The bonding process is mature, the connection strength of the support 1 and the circuit board 21 can be guaranteed, good sealing performance is achieved between the support 1 and the circuit board 21 which are connected through the bonding process, dust or small particles can be prevented from entering the support 1 and the circuit board 21, and the working stability of the camera 100 is improved.
According to some embodiments of the present application, the circuit board 21 is integrally formed with the bracket 1 by injection molding, as shown in fig. 1-2. Therefore, the circuit board 21 and the support 1 are integrally formed through injection molding by adopting an injection molding process, the circuit board 21 and the support 1 which are subjected to injection molding at one time are high in precision and small in error during injection molding, and an integrated piece formed after injection molding is high in stability and not prone to relative displacement or dislocation.
The following describes a camera head 100 according to an embodiment of the present application with reference to fig. 1 to 3.
As shown in fig. 1 to 2, a camera 100 according to an embodiment of the present application includes: lens subassembly 3 and above-mentioned chip subassembly 2, lens subassembly 3 is connected with chip subassembly 2's support 1. The light passing through the lens assembly 3 is converged on the chip 22 of the chip assembly 2, and the chip 22 can process the light, thereby obtaining an image of the photographed subject.
According to the camera 100 of the embodiment of the application, the light-transmitting sheet body 111 is formed by etching the middle of the main body part 11, the main body part 11 is injection molded, the manufacturing is simple, the production efficiency is high, the light-transmitting sheet body 111 and the main body part 11 are integrated, a structure that the light-transmitting sheet body is fixed on a support through a plastic support in the related art is replaced, the overall height of the main body part 11 and the light-transmitting sheet body 111 is reduced, the space is saved, and the support 1 is miniaturized. In addition, the main body 11 is coated with a film to reduce the reflection of light on the light-transmitting sheet 111 and improve the light quantity of light passing through the light-transmitting sheet 111, so that the light transmittance of the light-transmitting sheet 111 can be improved, and the imaging quality of the camera can be improved.
According to some embodiments of the present application, the lens assembly 3 is bonded to the frame 1, as shown in fig. 1. The bonding process is mature, the connection strength of the lens assembly 3 and the support 1 can be guaranteed, good sealing performance is achieved between the lens assembly 3 and the support 1 which are connected through the bonding process, dust or small particles can be prevented from entering the lens assembly 3 and the support 1, and the working stability of the camera 100 is improved.
An electronic device 1000 according to an embodiment of the application is described below with reference to fig. 1-3.
As shown in fig. 3, an electronic device 1000 according to an embodiment of the present application includes the camera 100 described above. It is noted that "electronic device 1000" as used herein includes, but is not limited to, apparatus that is configured to receive/transmit communication signals via a wireline connection, such as via a Public Switched Telephone Network (PSTN), a Digital Subscriber Line (DSL), a digital cable, a direct cable connection, and/or another data connection/network, and/or via a wireless interface (e.g., for a cellular network, a Wireless Local Area Network (WLAN), a digital television network such as a DVB-H network, a satellite network, an AM-FM broadcast transmitter, and/or another communications electronic device 1000). The communication electronic device 1000 arranged to communicate over a wireless interface may be referred to as a "wireless communication terminal", a "wireless terminal" and/or a "mobile terminal". Examples of mobile terminals include, but are not limited to, satellite or cellular telephones; a Personal Communications System (PCS) terminal that may combine a cellular radiotelephone with data processing, facsimile and data communications capabilities; PDAs that may include radiotelephones, pagers, internet/intranet access, Web browsers, notepads, calendars, and/or Global Positioning System (GPS) receivers; and a conventional laptop and/or palmtop receiver or other electronic device 1000 that includes a radiotelephone transceiver.
According to the electronic equipment 1000 of the embodiment of the application, the light-transmitting sheet body 111 is formed by etching the middle of the main body part 11, the main body part 11 is injection molded, the manufacturing is simple, the production efficiency is high, the light-transmitting sheet body 111 and the main body part 11 are integrated, a structure that the light-transmitting sheet body is fixed on a support through a plastic support in the related art is replaced, the overall height of the main body part 11 and the light-transmitting sheet body 111 is reduced, the space is saved, and the support 1 is miniaturized. In addition, the main body 11 is coated with a film to reduce the reflection of light on the light-transmitting sheet 111 and improve the light quantity of light passing through the light-transmitting sheet 111, so that the light transmittance of the light-transmitting sheet 111 can be improved, and the imaging quality of the camera can be improved.
According to some embodiments of the present application, as shown in fig. 3, the camera head 100 is plural. Therefore, more shooting possibilities are provided under the condition that the thickness of the camera 100 is not increased, the multiple cameras 100 can be a mixture of wide-angle cameras and optical zoom cameras, the view area can be drawn close, the definition of a picture is kept, namely lossless zooming is achieved, the cameras 100 with different focal lengths can be switched during shooting, and lossless zooming is achieved to achieve the best image quality.
In the embodiment of the present application, the electronic device 1000 may be various devices capable of acquiring and processing data from the outside, or the electronic device 1000 may be various devices which have a built-in battery and can acquire and charge the battery from the outside, such as a mobile phone, a tablet computer, a computing device, an information display device, or the like.
As shown in fig. 2, according to the method of manufacturing the main body portion of the camera head according to the embodiment of the present application, the main body portion includes a support portion and an optical filter, the support portion is located at a peripheral edge of the optical filter to support the optical filter, and a middle portion of the main body portion is configured as the optical filter. The manufacturing method comprises the following steps: manufacturing a substrate by injection molding; forming a supporting part by cutting process; etching the substrate to construct the optical filter on the substrate; and coating a film on the outer surface of the base material to further form the main body part.
For example, the support portion may extend along a circumferential direction of the filter, and the support portion and the filter are integrally formed. The supporting portion and the optical filter may be formed by different processes on the manufacturing substrate so that different positions of the manufacturing substrate form different effects to form the supporting portion and the optical filter, specifically, the optical filter may be formed by an etching process in a middle region of the manufacturing substrate so as to form a filter capable of filtering light, and the supporting portion may be formed by a cutting process in an edge region of the manufacturing substrate so as to facilitate connection and installation. Finally, the outer surface of the base material forming the supporting part and the optical filter can be coated with a film, the coating can reduce the reflection of light, increase the light transmittance of the optical filter and inhibit the glare and ghost; the coating films with different colors can also ensure that the imaging color balance of the optical filter is different.
According to the manufacturing method of the main body part of the camera, the supporting part and the optical filter are formed on the base material by utilizing the cutting process and the etching process to form the main body part, the whole manufacturing process is simple, the application technology is mature, the production efficiency of the main body part can be improved, the supporting part and the optical filter are integrated, the process of setting the supporting part for the optical filter is saved, the occupied space of the main body part can be reduced, and the main body part is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
An electronic device 1000 according to a particular embodiment of the present application is described below with reference to fig. 1-3. It is to be understood that the following description is illustrative only and is not intended to be in any way limiting.
As shown in fig. 1 to fig. 3, an electronic device 1000 to which the present application is applied is described by taking a mobile phone as an example. In the embodiment of the present application, the electronic device 1000 may include a camera 100, a radio frequency circuit, a memory, an input unit, a wireless fidelity (WiFi) module, a sensor, a display unit, an audio circuit, a processor, a fingerprint identification component, a battery, and other components.
As shown in fig. 1 to 3, the camera head 100 includes: the lens assembly 3 comprises a plurality of lens 131 and a filter sheet 132 which are arranged at intervals in a layered mode, the motor 31 is connected to the outer side of the lens assembly 3, and the distance between the lens 131 and the filter sheet 132 can be adjusted through the motor 31. In addition, two cameras 100 are provided, two cameras 100 are arranged side by side at intervals, and the size and occupied volume of the two cameras 100 are the same, and the two cameras 100 are a wide-angle camera and an optical zoom camera respectively.
As shown in fig. 1-2, the chip assembly 2 includes a circuit board 21, a chip 22, and a support 1. The chip 22 and the circuit board 21 are packaged into a whole by injection molding, the chip 22 is arranged on the circuit board 21, the chip 22 is electrically connected with the circuit board 21, the bracket 1 is connected with the circuit board 21, and the chip 22 is opposite to the light-transmitting sheet 111.
As shown in fig. 1-2, the bracket 1 includes a main body 11 and a coating layer, and a light-transmitting sheet 111 is formed in the middle of the main body 11 by etching. The coating layer is coated on the outer surface of the main body part 11. The light-transmitting sheet 111 is a filter, the light-transmitting sheet 111 and the lens assembly 3 are arranged at intervals in a layered manner, and the filter 132 is located downstream (below as shown in fig. 1) of the lens assembly 3 in the optical path transmission direction.
The electronic equipment 1000 of this application embodiment, form logical light lamellar body through the middle part sculpture with the main part, and the main part is injection moulding, and it is simple and production efficiency is high to make, leads to light lamellar body and main part and synthesizes into an organic whole, has replaced the structure that utilizes the plastic support among the correlation technique will lead to light lamellar body and fix to the support, and then has reduced the main part and has led to the whole height of light lamellar body, has saved the space for the support is miniaturized. In addition, the coating film can reduce the reflection of the glazing of the light-transmitting sheet body on the main body part, and the light quantity of light passing through the light-transmitting sheet body is improved, so that the light transmittance of the light-transmitting sheet body can be improved, and the imaging quality of the camera can be improved.
The radio frequency circuit can be used for receiving and sending signals in the process of receiving and sending information or calling, and particularly, the radio frequency circuit receives the downlink information of the base station and then processes the downlink information; in addition, uplink data of the electronic device 1000 is transmitted to the base station. Typically, the radio frequency circuitry includes, but is not limited to, an antenna, at least one amplifier, a transceiver, a coupler, a low noise amplifier, a duplexer, and the like. In addition, the radio frequency circuitry may also communicate with networks and other devices via wireless communications.
The memory may be used to store software programs and modules, and the processor executes various functional applications and data processing of the electronic device 1000 by operating the software programs and modules stored in the memory. The memory can mainly comprise a program storage area and a data storage area, wherein the program storage area can store an operating system, application programs (such as a sound playing function and an image playing function) required by at least one function and the like; the storage data area may store data (e.g., audio data, a phonebook, etc.) created according to the use of the electronic apparatus 1000, and the like. Further, the memory may include high speed random access memory, and may also include non-volatile memory, such as at least one magnetic disk storage device, flash memory device, or other volatile solid state storage device.
The input unit may be used to receive input numeric or character information and generate key signals related to user settings and function control of the electronic device 1000. Specifically, the input unit may include a touch panel and other input devices. The touch panel, also called a touch screen, may collect touch operations of a user (for example, operations of the user on or near the touch panel using any suitable object or accessory such as a finger, a stylus, etc.) and drive the corresponding connection device according to a preset program.
Alternatively, the touch panel may include two parts of a touch detection device and a touch controller. The touch detection device detects the touch direction of a user, detects a signal brought by touch operation and transmits the signal to the touch controller; the touch controller receives touch information from the touch detection device, converts the touch information into touch point coordinates, sends the touch point coordinates to the processor, and can receive and execute commands sent by the processor. In addition, the touch panel may be implemented in various types such as a resistive type, a capacitive type, an infrared ray, and a surface acoustic wave. The input unit may include other input devices in addition to the touch panel. In particular, other input devices may include, but are not limited to, one or more of a physical keyboard, function keys (such as volume control keys, switch keys, etc.), a trackball, a mouse, a joystick, and the like.
WiFi belongs to short-distance wireless transmission technology, and the electronic equipment 1000 can help a user to receive and send e-mails, browse webpages, access streaming media and the like through a WiFi module, and provides wireless broadband internet access for the user. It is understood that the WiFi module is not an essential component of the electronic device 1000 and may be omitted entirely as needed within the scope of not changing the nature of the application.
In addition, the handset may also include at least one sensor, such as an attitude sensor, a light sensor, and other sensors.
Specifically, the attitude sensor may also be referred to as a motion sensor, and as one of the motion sensors, a gravity sensor may be cited, which uses an elastic sensing element to make a cantilever-type displacer and uses an energy storage spring made of the elastic sensing element to drive an electrical contact, thereby realizing conversion of a change in gravity into a change in an electrical signal.
Another example of the motion sensor is an accelerometer sensor, which can detect the magnitude of acceleration in each direction (generally, three axes), detect the magnitude and direction of gravity when stationary, and can be used for applications for recognizing the posture of a mobile phone (such as horizontal and vertical screen switching, related games, magnetometer posture calibration), vibration recognition related functions (such as pedometer and tapping), and the like.
In the embodiment of the present application, the motion sensors listed above may be used as elements for obtaining "attitude parameters" described later, but the present application is not limited thereto, and other sensors capable of obtaining "attitude parameters" fall within the protection scope of the present application, such as a gyroscope and the like, and the operation principle and data processing procedure of the gyroscope may be similar to those of the prior art, and the detailed description thereof is omitted here for avoiding redundancy.
In addition, in this embodiment of the application, as the sensor, other sensors such as a barometer, a hygrometer, a thermometer, and an infrared sensor may also be configured, which are not described herein again.
The light sensor may include an ambient light sensor that adjusts the brightness of the display panel according to the brightness of ambient light, and a proximity sensor that turns off the display panel and/or the backlight when the mobile phone is moved to the ear.
The display unit may be used to display information input by the user or information provided to the user and various menus of the mobile phone. The Display unit may include a Display panel, and optionally, the Display panel may be configured in the form of a Liquid Crystal Display (LCD), an Organic Light-Emitting Diode (OLED), or the like. Further, the touch panel may cover the display panel, and when the touch panel detects a touch operation thereon or nearby, the touch panel transmits the touch operation to the processor to determine the type of the touch event, and then the processor provides a corresponding visual output on the display panel according to the type of the touch event.
The audio circuitry, speaker, and microphone may provide an audio interface between a user and the electronic device 1000. The audio circuit can transmit the electric signal converted from the received audio data to the loudspeaker, and the electric signal is converted into a sound signal by the loudspeaker to be output; on the other hand, the microphone converts the collected sound signal into an electrical signal, which is received by the audio circuit and converted into audio data, which is then output to the processor for processing, and then transmitted to another electronic device 1000 via the rf circuit, or output to the memory for further processing.
The processor is a control center of the electronic device 1000, is installed on the circuit board 21, connects various parts of the entire electronic device 1000 using various interfaces and lines, and performs various functions of the electronic device 1000 and processes data by running or executing software programs and/or modules stored in the memory and calling data stored in the memory, thereby performing overall monitoring of the electronic device 1000. Alternatively, the processor may include one or more processing units; preferably, the processor may integrate an application processor, which mainly handles operating systems, user interfaces, application programs, etc., and a modem processor, which mainly handles wireless communications.
The power supply can be logically connected with the processor through the power management system, so that the functions of managing charging, discharging, power consumption management and the like are realized through the power management system. Although not shown, the electronic device 1000 may further include a bluetooth module, a sensor (e.g., an attitude sensor, a light sensor, other sensors such as a barometer, a hygrometer, a thermometer, an infrared sensor, etc.), etc., which are not described herein.
It should be noted that the mobile phone is only an example of the electronic device 1000, and the application is not particularly limited, and the application may be applied to the electronic device 1000 such as a mobile phone and a tablet computer, and the application is not limited thereto.
In the description herein, reference to the description of the terms "one embodiment," "some embodiments," "an illustrative embodiment," "an example," "a specific example," or "some examples" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the application, the scope of which is defined by the claims and their equivalents.

Claims (4)

1. A camera, comprising:
a lens assembly;
the chip subassembly, the chip subassembly includes circuit board, chip and support, the chip is located the circuit board, the chip with the circuit board electricity is connected, the support includes coating film layer and injection moulding's main part, the main part is glass spare, through right the middle part of main part carries out the sculpture and forms the light filter, light filter and main part form to an organic whole, the coating film layer coat in the surface of main part, the main part with the circuit board is connected, the chip with the light filter is relative, the lens subassembly with the chip subassembly the leg joint, the circuit board through mould plastics with support integrated into one piece, the lens subassembly with the support bonds, the chip with the circuit board is as an organic whole through the encapsulation of moulding plastics.
2. An electronic device, comprising:
a camera head according to claim 1.
3. The electronic device according to claim 2, wherein the camera is plural.
4. A manufacturing method of a main body portion of a camera head according to claim 1, the main body portion including a support portion at a peripheral edge of the optical filter to support the optical filter and an optical filter, the main body portion being a glass member, a middle portion of the main body portion being configured as the optical filter, the manufacturing method comprising the steps of:
manufacturing a substrate by injection molding;
forming the supporting part by a cutting process;
etching the substrate to construct the optical filter on the substrate;
and coating a film on the outer surface of the base material to further form the main body part.
CN201711376014.3A 2017-12-19 2017-12-19 Support, chip assembly, camera, electronic device and manufacturing method of main body part Expired - Fee Related CN108167588B (en)

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US8934052B2 (en) * 2010-11-02 2015-01-13 Stmicroelectronics Pte Ltd Camera module including an image sensor and a laterally adjacent surface mount device coupled at a lower surface of a dielectric material layer
CN203278999U (en) * 2013-05-27 2013-11-06 南昌欧菲光电技术有限公司 Camera module
CN104597550B (en) * 2015-02-02 2017-05-31 上海理工大学 A kind of preparation method of linear variable filter intermediate wedge resonant cavity layer
CN205067775U (en) * 2015-09-22 2016-03-02 浙江水晶光电科技股份有限公司 Electronic equipment and camera module thereof
CN105137564B (en) * 2015-09-24 2019-11-12 南昌欧菲光电技术有限公司 Camera module
CN205081864U (en) * 2015-11-19 2016-03-09 江西芯创光电有限公司 Camera module
CN107422444B (en) * 2017-08-25 2023-07-14 Oppo广东移动通信有限公司 Terminal, optical filter assembly, camera module and manufacturing method

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