CN108169962A - The method and liquid crystal display device of friction matching - Google Patents
The method and liquid crystal display device of friction matching Download PDFInfo
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- CN108169962A CN108169962A CN201810016086.5A CN201810016086A CN108169962A CN 108169962 A CN108169962 A CN 108169962A CN 201810016086 A CN201810016086 A CN 201810016086A CN 108169962 A CN108169962 A CN 108169962A
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- array substrate
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1337—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers
- G02F1/13378—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation
- G02F1/133784—Surface-induced orientation of the liquid crystal molecules, e.g. by alignment layers by treatment of the surface, e.g. embossing, rubbing or light irradiation by rubbing
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/136204—Arrangements to prevent high voltage or static electricity failures
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- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Spectroscopy & Molecular Physics (AREA)
Abstract
The present invention relates to the methods and liquid crystal display device of a kind of friction matching.The method of above-mentioned friction matching carries out friction matching for array substrate, array substrate includes the white space in graphics field and isolation pattern region, graphics field includes graphics field ontology and closely the integrated circuit control position of graphics field ontology, the method for friction matching include：Array basal plate is provided, conductive film layer is reserved in the white space of array substrate；Reserved conductive film layer is performed etching, makes to be formed with pattern on conductive film layer；Array substrate is positioned on orientation platform；The conductive film layer of array substrate is grounded；It rubs from the friction starting point of array substrate to the inside of array substrate.Since the conductive film layer of array substrate is grounded in advance, the conductive film layer for avoiding array substrate generates electrostatic in friction process, solves the problems, such as that array substrate generates damage by static electricity in friction matching, thereby may be ensured that liquid crystal display device prepares yield.
Description
Technical field
The present invention relates to the technical field of the manufacture of liquid crystal display device, a kind of method more particularly to friction matching and
Liquid crystal display device.
Background technology
Allocating process in the processing procedure of liquid crystal display device is technique process very crucial together, it needs forming liquid
Orientation will be carried out on two pieces of substrates of crystalline substance screen, i.e., all needs to carry out orientation in colored filter substrate and array substrate.Orientation work
Skill is to determine one of important process of performance and quality of liquid crystal display.Allocating process includes：It is coated first on product poly-
Acid imide film；Then groove is processed in polyimide film by specific processing technology, make liquid crystal molecule along groove direction into
Row arrangement, in the external world to the certain electric field of liquid crystal molecule to be preferably anchored liquid crystal molecule, the display effect of liquid crystal display is
Can more fully it show.Wherein, there are mainly two types of the methods of specific processing technology：The first is rubbed using friction roller
Orientation；Second is to carry out orientation by light orientation directional technology.Since friction matching has, of low cost, stability is good, can
By property is good and the advantages that continuous production so that friction matching compares in allocating process to be favored, and becomes display device
Allocating process mainstream.
Friction matching is to wrap friction cloth or velveteen or artificial silk or nylon on a secondary friction roller, by certain direction
Friction treatment is carried out to polyimide film with angle, so that the surface of polyimide film is provided with along frictional direction to liquid crystal molecule
The ability of anchoring, and liquid crystal molecule has club shaped structure in itself so that and alignment film can act on rod shaped liquid crystal molecule well,
Achieve the purpose that arrange orientation.The substrate for carrying out the product of friction matching is large-size substrate, has processing on this large substrates
Graphics field and the white space for separating graph area, graph area are process by multiple tracks depositional coating technique, make graphics field
The thickness of thickness ratio white space is thicker, causes there are segment difference on substrate, and since white space area is bigger, substrate is made to exist
The problem of nicking is generated during friction matching and replicates strip striped, causes the orientation of substrate bad influences the orientation effect of product
Fruit, so as to influence the display performance of liquid crystal display device；Further, since there is electrostatic very during friction cloth and product friction
To there is the problem of by damage by static electricity, the electric property of product is affected；Especially for the array with display core technology
Substrate in the nicking generated during friction matching, replicates the problem of strip striped and damage by static electricity, affects product
Yield.
Invention content
Based on this, it is necessary to generate nicking in friction matching for array substrate, replicate strip striped and electrostatic
The problem of wounding provides the method and liquid crystal display device of a kind of friction matching.
A kind of method of friction matching carries out friction matching for array substrate, and the array substrate includes graph area
Domain and the white space that the graphics field is isolated, the graphics field include graphics field ontology and the closely graphics field
The integrated circuit control position of ontology, the method for the friction matching includes：
Conductive film layer is reserved in the white space of the array substrate；
The reserved conductive film layer is performed etching, makes to be formed with pattern on conductive film layer；
The array substrate is positioned on orientation platform；
The conductive film layer of the array substrate is grounded；And
It rubs from the inside of friction starting point to the array substrate of the array substrate, wherein described rub
Initial point is located at the edge of the array substrate away from the side of the integrated circuit control position of graphics field.
Is film layer is laminated in the conductive film layer in one of the embodiments,.
The step of being performed etching in one of the embodiments, to the reserved conductive film layer be specially：
The surface layer of the reserved conductive film layer is performed etching, makes to be formed with pattern on the surface layer of conductive film layer, makes battle array
There is preferable leakproofness after row substrate package.
The step of being grounded in one of the embodiments, to the conductive film layer of the array substrate be specially：
The conductive film layer of the array substrate is grounded by conduct piece, makes conductive film layer during friction matching
The problem of electrostatic of generation is conducted by conduct piece, avoids charge accumulated causes conductive film layer to be produced in friction matching
Raw electrostatic or array substrate are by damage by static electricity.
The conduct piece is conductor wire or conducting terminal in one of the embodiments,.
In one of the embodiments, before the conductive film layer to the array substrate is grounded and by institute
It states after array substrate is positioned on orientation platform, further includes step：
The array substrate is positioned on orientation platform, avoid array substrate during friction matching is carried out relative to
Orientation platform moves, and improves the precision of the friction matching of array substrate.
It is carried out in one of the embodiments, from the friction starting point of the array substrate to the inside of the array substrate
The step of friction is specially：
It is rubbed by friction roller from the inside of friction starting point to the array substrate of the array substrate.
The traffic direction of the friction roller and the length direction of the array substrate mutually hang down in one of the embodiments,
Directly, the running orbit for making friction roller is shorter, shortens the time needed for friction matching.
In one of the embodiments, between the traffic direction of the friction roller and the length direction of the array substrate
Angle is acute angle, makes the distance between the friction paths of friction roller and the ground terminal of conductive film layer shorter, so as to make conductive friction
The charge generated during friction matching is quickly transferred on ground terminal.
A kind of liquid crystal display device is prepared using the method for friction matching described in any of the above-described embodiment.
The method and liquid crystal display device of above-mentioned friction matching, reserve conductive film in the white space of array substrate first
Layer, can be abundant since the conductive film layer of the white space in array substrate need not remove in subsequent friction matching technique
Using the material of white space, the waste of material of array substrate is avoided, while is reduced between graphics field and white space
Segment difference, avoid array substrate white space generated during subsequent friction matching nicking and replicate strip item
Line solves the problems, such as that the orientation of array substrate is bad；Then reserved conductive film layer is performed etching, makes shape on conductive film layer
Into there is pattern, contact area of the conductive film layer in encapsulation process can be increased, improve the sealing performance of the encapsulation of array substrate；
Then array substrate is positioned on orientation platform；Then the conductive film layer of array substrate is grounded；Finally from array substrate
Friction starting point rub to the inside of array substrate, it is described friction starting point be located at graphics field away from it is described integrate
The edge of the array substrate of the side of circuit control position since the conductive film layer of array substrate is grounded in advance, avoids array substrate
Conductive film layer electrostatic is generated in friction process, solve the problems, such as that array substrate generates damage by static electricity in friction matching,
Thereby may be ensured that liquid crystal display device prepares yield.
Description of the drawings
Fig. 1 is the flow chart of the method for the friction matching of an embodiment；
Fig. 2 is the schematic diagram of array substrate before processing；
Fig. 3 is the signal of step S103 processing of the array substrate shown in Fig. 2 by the method for friction matching shown in FIG. 1
Figure；
Fig. 4 is the schematic diagram that friction roller rubs to the array substrate on orientation platform；
Fig. 5 is the flow chart of the method for the friction matching of another embodiment.
Specific embodiment
For the ease of understanding the present invention, below with reference to relevant drawings to the method for friction matching and liquid crystal display device into
Row a more complete description.The method of friction matching and the preferred embodiment of liquid crystal display device are given in attached drawing.But it rubs
Many different forms may be used to realize in the method and liquid crystal display device of orientation, however it is not limited to implementation described herein
Example.On the contrary, the purpose for providing these embodiments is to make to the disclosure of the method for friction matching and liquid crystal display device more
Add thorough and comprehensive.
It should be noted that when element is referred to as " being fixed on " another element, it can be directly on another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it can be directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
For illustrative purposes only, it is unique embodiment to be not offered as " right side " and similar statement.
Unless otherwise defined, all of technologies and scientific terms used here by the article is with belonging to technical field of the invention
The normally understood meaning of technical staff is identical.Made in the specification of the method for friction matching and liquid crystal display device herein
Term is intended merely to the purpose of description specific embodiment, it is not intended that in the limitation present invention.Term as used herein
" and/or " include the arbitrary and all combinations of one or more relevant Listed Items.
For example, a kind of method of friction matching carries out friction matching for array substrate；For example, the array substrate packet
It includes graphics field and the white space of the graphics field is isolated；For example, the graphics field is including graphics field ontology and tightly
Suffer the integrated circuit control position of the graphics field ontology；For example, the method for the friction matching includes：For example, in the array
The white space of substrate reserves conductive film layer；For example, performing etching the reserved conductive film layer, make to be formed on conductive film layer
There is pattern；For example, the array substrate is positioned on orientation platform；For example, the conductive film layer of the array substrate is connect
Ground；For example, it rubs from the inside of friction starting point to the array substrate of the array substrate, wherein described rub
Initial point is located at the edge of the array substrate away from the side of the integrated circuit control position of graphics field.For example, a kind of friction is matched
To method carry out friction matching for array substrate, the array substrate includes graphics field and the graphics field is isolated
White space, the graphics field includes graphics field ontology and the closely integrated circuit control position of the graphics field ontology,
The method of the friction matching includes：Conductive film layer is reserved in the white space of the array substrate；To the reserved conduction
Film layer performs etching, and makes to be formed with pattern on conductive film layer；The array substrate is positioned on orientation platform；To the array base
The conductive film layer of plate is grounded；It rubs from the inside of friction starting point to the array substrate of the array substrate,
Wherein described friction starting point is located at the edge of the array substrate away from the side of the integrated circuit control position of graphics field.
As shown in Figure 1, the method for the friction matching of an embodiment carries out friction matching for array substrate 10.Join simultaneously
See Fig. 2, the array substrate 10 includes graphics field 100 and the white space 200 of the graphics field is isolated.The graph area
Domain includes graphics field ontology 100a and closely the integrated circuit control position 100b of the graphics field ontology.For example, graphics field
Number to be multiple, multiple graphics fields are in array distribution, and multiple graphics fields are separated by white space.For another example, figure
The rectangular shape in region, the making for making the graphics field of array substrate is relatively simple, and in other embodiments, graphics field can be with
Square-shaped or elliptical shape or round.For example, array substrate, the rectangular shape in integrated circuit control position and graphics field, battle array
The extending direction of the length of the extending direction of the length of row substrate, the extending direction of the length of integrated circuit control position and graphics field
All same, integrated circuit control position closely graphics field ontology and positioned at graphics field ontology long side side, make array substrate
Structure it is relatively low compared with simple and manufacture difficulty.For another example, the midpoint of the long side of the neighbouring integrated circuit control position of graphics field ontology with
The midpoint of the long side of the neighbouring graphics field ontology of integrated circuit control position overlaps, and the structure for making array substrate is more compact.
The method of the friction matching includes：
S101 reserves conductive film layer 220, due to the white space in array substrate in the white space of the array substrate
Conductive film layer in subsequent friction matching technique without removal, the material of white space can be made full use of, avoid battle array
The waste of material of row substrate, while reduce the segment difference between graphics field and white space, avoid the blank of array substrate
Region leads to the problem of nicking during subsequent friction matching and replicates strip striped, solves the orientation of array substrate
The problem of bad.For example, it is further included before being the step of white space of the array substrate reserves conductive film layer：There is provided one
The array substrate.
Referring also to Fig. 3, S103 perform etching the reserved conductive film layer, make to be formed with pattern on conductive film layer
222, contact area of the conductive film layer in encapsulation process can be increased, make that there is preferable sealing after array substrate encapsulation
Property.For example, the pattern is regular figure, the etching difficulty for making pattern on conductive film layer is relatively low, reduces array substrate
Cost needed for friction matching technique reduces the manufacture cost of liquid crystal display device.For example, the conduction that white space is reserved
Film layer is rabbeted with graphics field, is made the segment difference between graphics field and white space smaller, is avoided the clear area of array substrate
Domain leads to the problem of nicking during subsequent friction matching and replicates strip striped, solves the orientation of array substrate not
The problem of good.
For the conductive film layer for film layer is laminated, i.e. conductive film layer is multilayered structure and multilayer in one of the embodiments,
Structure is stacked.It is appreciated that in other embodiments, the conductive film layer can also be individual layer film layer, make conductive film layer
Thinner thickness.
The step S103 performed etching in one of the embodiments, to the reserved conductive film layer is specially：
The surface layer of the reserved conductive film layer is performed etching, makes to be formed with pattern on the surface layer of conductive film layer, makes sky
The thickness of white region differs smaller with the thickness of graphics field, i.e. segment difference between white space and graphics field is smaller, in this way
It can preferably solve the problems, such as that array substrate generates nicking in friction matching, replicates strip striped and damage by static electricity.
For example, the surface layer of the conductive film layer is one layer away from the bottom of array substrate of conductive film layer, the i.e. top layer of conductive film layer.
The array substrate is positioned on orientation platform 20 by referring also to Fig. 4, S105.
S107 is grounded the conductive film layer of the array substrate.
The step S107 being grounded in one of the embodiments, to the conductive film layer of the array substrate is specially：
As shown in figure 4, being grounded by conduct piece 30 to the conductive film layer of the array substrate, conductive film layer is made to rub
The problem of electrostatic generated in process of alignment is conducted by conduct piece, avoids charge accumulated is wiped, conductive film layer is caused to exist
Electrostatic or array substrate are generated during friction matching by damage by static electricity.The conduct piece is conductor wire in one of the embodiments,
Or conducting terminal.In the present embodiment, the conduct piece is conductor wire.
For example, is film layer is laminated in the conductive film layer；Have to the step S103 that the reserved conductive film layer performs etching
Body is：The surface layer of the reserved conductive film layer is performed etching, makes to be formed with pattern on the surface layer of conductive film layer, makes clear area
The thickness in domain differs smaller with the thickness of graphics field, i.e. segment difference between white space and graphics field is smaller, in this way can be with
Preferably solve the problems, such as that array substrate generates nicking in friction matching, replicates strip striped and damage by static electricity；To institute
Stating the step S107 that the conductive film layer of array substrate is grounded is specially：By conduct piece to the conductive film of the array substrate
Layer is grounded, and the electrostatic that conductive film layer generates during friction matching is made to pass through conduct piece and is conducted, avoids charge
The problem of accumulation, causes conductive film layer to generate electrostatic or array substrate in friction matching by damage by static electricity.
As shown in figure 5, in one of the embodiments, before the conductive film layer to the array substrate is grounded,
And after the array substrate is positioned on orientation platform, further include step：
The array substrate is positioned on orientation platform by S106, avoids array substrate during friction matching is carried out
It is moved relative to orientation platform, improves the precision of the friction matching of array substrate.For example, the array substrate is positioned at orientation
Step S106 on platform is specially：Array substrate is positioned on orientation platform by vacuum absorption device, array substrate is avoided to exist
Moved during friction matching relative to orientation platform, array substrate is made to be fixed on orientation platform.For another example, the orientation platform
On offer multiple through-holes, multiple through-holes are connected with vacuum absorption device, vacuum absorption device be used for multiple through-holes
It is vacuumized, array substrate is positioned on orientation platform.For another example, multiple through-holes are distributed in matrix form on orientation platform, are made
Array substrate is preferably adsorbed on orientation platform.
For example, the step S103 performed etching to the reserved conductive film layer is specially：To the reserved conductive film
The surface layer of layer performs etching, and makes to be formed with pattern on the surface layer of conductive film layer, increases the surface area on the surface layer of conductive film layer, make
There is preferable leakproofness after array substrate encapsulation；Before the conductive film layer to the array substrate is grounded and
After the array substrate is positioned on orientation platform, step is further included：The array substrate is positioned at orientation platform by S106
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, the friction for improving array substrate is matched
To precision.For example, it is specially by the step S106 that the array substrate is positioned on orientation platform：It will by vacuum absorption device
Array substrate is positioned on orientation platform, and array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, is made
Array substrate is fixed on orientation platform.
For example, it is placed before the conductive film layer to the array substrate is grounded and by the array substrate
After on orientation platform, step is further included：The array substrate is positioned on orientation platform by S106, avoid array substrate into
It is moved during row friction matching relative to orientation platform, improves the precision of the friction matching of array substrate.For example, by described in
The step S106 that array substrate is positioned on orientation platform is specially：Array substrate is positioned at by orientation platform by vacuum absorption device
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, array substrate is made to be fixed on orientation platform
On；The step S107 being grounded to the conductive film layer of the array substrate is specially：By conduct piece to the array substrate
Conductive film layer be grounded, the electrostatic that conductive film layer generates during friction matching is made to pass through conduct piece and is conducted, is kept away
The problem of having exempted from charge accumulated causes conductive film layer to generate electrostatic or array substrate in friction matching by damage by static electricity.
For example, the step S103 performed etching to the reserved conductive film layer is specially：To the reserved conductive film
The surface layer of layer performs etching, and makes to be formed with pattern on the surface layer of conductive film layer, increases the surface area on the surface layer of conductive film layer, make
There is preferable leakproofness after array substrate encapsulation；Before the conductive film layer to the array substrate is grounded and
After the array substrate is positioned on orientation platform, step is further included：The array substrate is positioned at orientation platform by S106
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, the friction for improving array substrate is matched
To precision.For example, it is specially by the step S106 that the array substrate is positioned on orientation platform：It will by vacuum absorption device
Array substrate is positioned on orientation platform, and array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, is made
Array substrate is fixed on orientation platform；The step S107 being grounded to the conductive film layer of the array substrate is specially：Pass through
Conduct piece is grounded the conductive film layer of the array substrate, leads to the electrostatic that conductive film layer generates during friction matching
The problem of conduct piece is conducted, avoids charge accumulated is crossed, conductive film layer is caused to generate electrostatic or array in friction matching
Substrate is by damage by static electricity.
S109 rubs from the inside of friction starting point to the array substrate of the array substrate, wherein described
Friction starting point is located at the edge of the array substrate away from the side of the integrated circuit control position of graphics field, i.e. array substrate
Long side on.For example, array substrate, the rectangular shape in integrated circuit control position and graphics field, the extension of the length of array substrate
Direction, integrated circuit control position length extending direction and graphics field length extending direction all same, integrated circuit control
The position closely side of graphics field ontology and the long side positioned at graphics field ontology, makes the structure of array substrate relatively simple and manufactures
Difficulty is relatively low, and friction starting point is located at the side of the array substrate away from the side of the integrated circuit control position of graphics field ontology
One long side of edge, i.e. white space.For another example, it is carried out from the friction starting point of the array substrate to the inside of the array substrate
The step of friction is specially：It rubs from the inside of friction starting point to the array substrate of the array substrate, until
It rubs to the rubbing ends point of array substrate.For example, the rubbing ends point is located at the neighbouring integrated circuit of graphics field
Control another long side at the edge, i.e. white space of the array substrate of the side of position.
For example, the step S103 performed etching to the reserved conductive film layer is specially：To the reserved conductive film
The surface layer of layer performs etching, and makes to be formed with pattern on the surface layer of conductive film layer, increases the surface area on the surface layer of conductive film layer, make
There is preferable leakproofness after array substrate encapsulation；Before the conductive film layer to the array substrate is grounded and
After the array substrate is positioned on orientation platform, step is further included：The array substrate is positioned at orientation platform by S106
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, the friction for improving array substrate is matched
To precision；S109 rubs from the inside of friction starting point to the array substrate of the array substrate, wherein described
Friction starting point is located at the edge of the array substrate away from the side of the integrated circuit control position of graphics field, i.e. array substrate
Long side on.For example, it is specially by the step S106 that the array substrate is positioned on orientation platform：It will by vacuum absorption device
Array substrate is positioned on orientation platform, and array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, is made
Array substrate is fixed on orientation platform..
For example, it is placed before the conductive film layer to the array substrate is grounded and by the array substrate
After on orientation platform, step is further included：The array substrate is positioned on orientation platform by S106, avoid array substrate into
It is moved during row friction matching relative to orientation platform, improves the precision of the friction matching of array substrate.For example, by described in
The step S106 that array substrate is positioned on orientation platform is specially：Array substrate is positioned at by orientation platform by vacuum absorption device
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, array substrate is made to be fixed on orientation platform
On；The step S107 being grounded to the conductive film layer of the array substrate is specially：By conduct piece to the array substrate
Conductive film layer be grounded, the electrostatic that conductive film layer generates during friction matching is made to pass through conduct piece and is conducted, is kept away
The problem of having exempted from charge accumulated causes conductive film layer to generate electrostatic or array substrate in friction matching by damage by static electricity.S109,
It rubs from the inside of friction starting point to the array substrate of the array substrate, wherein the friction starting point is located at
The edge of the array substrate away from the side of the integrated circuit control position of graphics field, i.e., in the long side of array substrate.
For example, it is placed before the conductive film layer to the array substrate is grounded and by the array substrate
After on orientation platform, step is further included：The array substrate is positioned on orientation platform by S106, avoid array substrate into
It is moved during row friction matching relative to orientation platform, improves the precision of the friction matching of array substrate.For example, by described in
The step S106 that array substrate is positioned on orientation platform is specially：Array substrate is positioned at by orientation platform by vacuum absorption device
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, array substrate is made to be fixed on orientation platform
On；The step S107 being grounded to the conductive film layer of the array substrate is specially：By conduct piece to the array substrate
Conductive film layer be grounded, the electrostatic that conductive film layer generates during friction matching is made to pass through conduct piece and is conducted, is kept away
The problem of having exempted from charge accumulated causes conductive film layer to generate electrostatic or array substrate in friction matching by damage by static electricity.S109,
It rubs from the inside of friction starting point to the array substrate of the array substrate, wherein the friction starting point is located at
The edge of the array substrate away from the side of the integrated circuit control position of graphics field, i.e., in the long side of array substrate.
For example, the step S103 performed etching to the reserved conductive film layer is specially：To the reserved conductive film
The surface layer of layer performs etching, and makes to be formed with pattern on the surface layer of conductive film layer, increases the surface area on the surface layer of conductive film layer, make
There is preferable leakproofness after array substrate encapsulation；Before the conductive film layer to the array substrate is grounded and
After the array substrate is positioned on orientation platform, step is further included：The array substrate is positioned at orientation platform by S106
On, array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, the friction for improving array substrate is matched
To precision.For example, it is specially by the step S106 that the array substrate is positioned on orientation platform：It will by vacuum absorption device
Array substrate is positioned on orientation platform, and array substrate is avoided to be moved during friction matching is carried out relative to orientation platform, is made
Array substrate is fixed on orientation platform；The step S107 being grounded to the conductive film layer of the array substrate is specially：Pass through
Conduct piece is grounded the conductive film layer of the array substrate, leads to the electrostatic that conductive film layer generates during friction matching
The problem of conduct piece is conducted, avoids charge accumulated is crossed, conductive film layer is caused to generate electrostatic or array in friction matching
Substrate is by damage by static electricity.S109 rubs from the inside of friction starting point to the array substrate of the array substrate,
Described in friction starting point be located at graphics field the array substrate away from the side of the integrated circuit control position edge, i.e. battle array
In the long side of row substrate.
It is carried out in one of the embodiments, from the friction starting point of the array substrate to the inside of the array substrate
The step S109 of friction is specially：
It is rubbed by friction roller from the inside of friction starting point to the array substrate of the array substrate.Again
Such as, the step of being rubbed by friction roller from the inside of friction starting point to the array substrate of the array substrate is specific
For：It is rubbed by friction roller from the inside of friction starting point to the array substrate of the array substrate, until friction
To the rubbing ends point of the array substrate.
As shown in figure 4, in order to shorten the time needed for friction matching, the friction roller in one of the embodiments,
Traffic direction (direction of arrow 40 shown in Fig. 4) and the length direction of the array substrate are mutually perpendicular to, and make the fortune of friction roller
Row track is shorter, shortens the time needed for friction matching.
In one of the embodiments, between the traffic direction of the friction roller and the length direction of the array substrate
Angle is acute angle, makes the distance between the friction paths of friction roller and the ground terminal of conductive film layer shorter, so as to make conductive friction
The charge generated during friction matching is quickly transferred on ground terminal.For example, traffic direction (Fig. 4 of the friction roller
The direction of shown arrow 50) angle between the length direction of the array substrate is 60 °, make the friction paths of friction roller
The distance between the ground terminal of conductive film layer is most short, makes the charge that conductive friction generates during friction matching more rapidly
Ground is transferred on ground terminal.For another example, the angle between the traffic direction of the friction roller and the length direction of the array substrate
It is 45 °, makes the distance between the friction paths of friction roller and the ground terminal of conductive film layer shorter.
The present invention also provides a kind of liquid crystal display devices.Liquid crystal display device is matched using rubbing described in any of the above-described embodiment
To method prepared.
The method and liquid crystal display device of above-mentioned friction matching, reserve conductive film in the white space of array substrate first
Layer, can be abundant since the conductive film layer of the white space in array substrate need not remove in subsequent friction matching technique
Using the material of white space, the waste of material of array substrate is avoided, while is reduced between graphics field and white space
Segment difference, avoid array substrate white space generated during subsequent friction matching nicking and replicate strip item
Line solves the problems, such as that the orientation of array substrate is bad；Then reserved conductive film layer is performed etching, makes shape on conductive film layer
Into there is pattern, contact area of the conductive film layer in encapsulation process can be increased, improve the sealing performance of the encapsulation of array substrate；
Then array substrate is positioned on orientation platform；Then the conductive film layer of array substrate is grounded；Finally from array substrate
Friction starting point rub to the inside of array substrate, it is described friction starting point be located at graphics field away from it is described integrate
The edge of the array substrate of the side of circuit control position since the conductive film layer of array substrate is grounded in advance, avoids array substrate
Conductive film layer electrostatic is generated in friction process, solve the problems, such as that array substrate generates damage by static electricity in friction matching,
Thereby may be ensured that liquid crystal display device prepares yield.
Each technical characteristic of embodiment described above can be combined arbitrarily, to make description succinct, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, it is all considered to be the range of this specification record.
Embodiment described above only expresses the several embodiments of the present invention, and description is more specific and detailed, but simultaneously
It cannot therefore be construed as limiting the scope of the patent.It should be pointed out that those of ordinary skill in the art are come
It says, without departing from the inventive concept of the premise, various modifications and improvements can be made, these belong to the protection of the present invention
Range.Therefore, the protection domain of patent of the present invention should be determined by the appended claims.
Claims (10)
1. a kind of method of friction matching carries out friction matching for array substrate, the array substrate includes graphics field
With the white space that the graphics field is isolated, the graphics field includes graphics field ontology and closely the graphics field sheet
The integrated circuit control position of body, which is characterized in that the method for the friction matching includes：
Conductive film layer is reserved in the white space of the array substrate；
The reserved conductive film layer is performed etching, makes to be formed with pattern on conductive film layer；
The array substrate is positioned on orientation platform；
The conductive film layer of the array substrate is grounded；And
It rubs from the inside of friction starting point to the array substrate of the array substrate, wherein the friction starting point
Positioned at the edge of the array substrate away from the side of the integrated circuit control position of graphics field.
2. the method for friction matching according to claim 1, which is characterized in that is film layer is laminated in the conductive film layer.
3. the method for friction matching according to claim 2, which is characterized in that carved to the reserved conductive film layer
The step of erosion is specially：
The surface layer of the reserved conductive film layer is performed etching, makes to be formed with pattern on the surface layer of conductive film layer.
4. the method for friction matching according to claim 1, which is characterized in that the conductive film layer of the array substrate into
Row ground connection the step of be specially：
The conductive film layer of the array substrate is grounded by conduct piece.
5. the method for friction matching according to claim 4, which is characterized in that the conduct piece is conductor wire or conducting end
Son.
6. the method for friction matching according to claim 1, which is characterized in that in the conductive film layer to the array substrate
Before being grounded and after the array substrate is positioned on orientation platform, step is further included：
The array substrate is positioned on orientation platform.
7. the method for friction matching according to claim 1, which is characterized in that from the friction starting point of the array substrate
The step of being rubbed to the inside of the array substrate be specially：
It is rubbed by friction roller from the inside of friction starting point to the array substrate of the array substrate.
8. the method for friction matching according to claim 7, which is characterized in that the traffic direction of the friction roller with it is described
The length direction of array substrate is mutually perpendicular to.
9. the method for friction matching according to claim 7, which is characterized in that the traffic direction of the friction roller with it is described
Angle between the length direction of array substrate is acute angle.
10. a kind of liquid crystal display device, which is characterized in that using the method for any one of claim 1 to 9 friction matching
It is prepared.
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