CN108168732B - 一种测温样本制作冶具 - Google Patents
一种测温样本制作冶具 Download PDFInfo
- Publication number
- CN108168732B CN108168732B CN201711390000.7A CN201711390000A CN108168732B CN 108168732 B CN108168732 B CN 108168732B CN 201711390000 A CN201711390000 A CN 201711390000A CN 108168732 B CN108168732 B CN 108168732B
- Authority
- CN
- China
- Prior art keywords
- circuit board
- sliding
- fixedly connected
- rod
- side walls
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000009529 body temperature measurement Methods 0.000 title claims abstract description 14
- 238000002360 preparation method Methods 0.000 title claims description 8
- 238000003723 Smelting Methods 0.000 title claims description 4
- 238000003825 pressing Methods 0.000 claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 claims abstract description 11
- 230000000670 limiting effect Effects 0.000 claims abstract description 10
- 230000000149 penetrating effect Effects 0.000 claims abstract description 10
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01K—MEASURING TEMPERATURE; MEASURING QUANTITY OF HEAT; THERMALLY-SENSITIVE ELEMENTS NOT OTHERWISE PROVIDED FOR
- G01K13/00—Thermometers specially adapted for specific purposes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
- H05K3/361—Assembling flexible printed circuits with other printed circuits
- H05K3/365—Assembling flexible printed circuits with other printed circuits by abutting, i.e. without alloying process
Landscapes
- Engineering & Computer Science (AREA)
- Metallurgy (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Sampling And Sample Adjustment (AREA)
Abstract
Description
Claims (7)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711390000.7A CN108168732B (zh) | 2017-12-21 | 2017-12-21 | 一种测温样本制作冶具 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201711390000.7A CN108168732B (zh) | 2017-12-21 | 2017-12-21 | 一种测温样本制作冶具 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN108168732A CN108168732A (zh) | 2018-06-15 |
CN108168732B true CN108168732B (zh) | 2019-12-24 |
Family
ID=62523336
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201711390000.7A Active CN108168732B (zh) | 2017-12-21 | 2017-12-21 | 一种测温样本制作冶具 |
Country Status (1)
Country | Link |
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CN (1) | CN108168732B (zh) |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6725514B2 (en) * | 2002-05-31 | 2004-04-27 | Delphi Technologies, Inc. | Method of making thick film pressure and temperature sensors on a stainless steel diaphragm |
DE102006062115B4 (de) * | 2006-12-22 | 2010-08-19 | Sitronic Ges. für elektrotechnische Ausrüstung GmbH & Co. KG | Sensoranordnung zur Temperaturmessung |
CN101325192B (zh) * | 2008-06-13 | 2010-08-04 | 友达光电(苏州)有限公司 | 易于测量温度的基板及其制造方法 |
CN104048779B (zh) * | 2014-05-30 | 2016-07-06 | 合肥京东方光电科技有限公司 | 一种测温样本制作治具和制作设备 |
CN105352615A (zh) * | 2015-11-19 | 2016-02-24 | 中山德华芯片技术有限公司 | 一种用于调节外延片测温仪探头位置的无级可调装置 |
CN208420211U (zh) * | 2018-05-09 | 2019-01-22 | 青岛友邦保温有限公司 | 一种保温管生产用的发泡温度测定装置 |
-
2017
- 2017-12-21 CN CN201711390000.7A patent/CN108168732B/zh active Active
Also Published As
Publication number | Publication date |
---|---|
CN108168732A (zh) | 2018-06-15 |
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Legal Events
Date | Code | Title | Description |
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PB01 | Publication | ||
PB01 | Publication | ||
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SE01 | Entry into force of request for substantive examination | ||
TA01 | Transfer of patent application right |
Effective date of registration: 20191125 Address after: No. 118, Wangsheng Avenue, Huangshi City, Hubei Province Applicant after: Huangshiyong Xinglong Electronic Co.,Ltd. Address before: Suzhou City, Xiangcheng District province 215000 Jiangsu Yangchenghu town in the garden Applicant before: Jiang Li |
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TA01 | Transfer of patent application right | ||
GR01 | Patent grant | ||
GR01 | Patent grant | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A smelting tool for making temperature measurement samples Effective date of registration: 20220402 Granted publication date: 20191224 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2022420000097 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right |
Date of cancellation: 20230410 Granted publication date: 20191224 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2022420000097 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A Metallurgical Tool for Making Temperature Measurement Samples Effective date of registration: 20230414 Granted publication date: 20191224 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2023420000161 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20191224 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2023420000161 |
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PC01 | Cancellation of the registration of the contract for pledge of patent right | ||
PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of invention: A metallurgical tool for making temperature measurement samples Granted publication date: 20191224 Pledgee: Bank of China Limited Huangshi Branch Pledgor: Huangshiyong Xinglong Electronic Co.,Ltd. Registration number: Y2024980013795 |
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PE01 | Entry into force of the registration of the contract for pledge of patent right |