CN108134309A - Microflute group is heat sink liquid supply device - Google Patents
Microflute group is heat sink liquid supply device Download PDFInfo
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- CN108134309A CN108134309A CN201810144000.7A CN201810144000A CN108134309A CN 108134309 A CN108134309 A CN 108134309A CN 201810144000 A CN201810144000 A CN 201810144000A CN 108134309 A CN108134309 A CN 108134309A
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- 230000008569 process Effects 0.000 abstract description 5
- 230000006866 deterioration Effects 0.000 abstract description 3
- 238000010438 heat treatment Methods 0.000 description 20
- 238000001704 evaporation Methods 0.000 description 17
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- 230000005684 electric field Effects 0.000 description 12
- 238000009833 condensation Methods 0.000 description 7
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- 230000005494 condensation Effects 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 6
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- 238000011161 development Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
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- 229910045601 alloy Inorganic materials 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20218—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant without phase change in electronic enclosures
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/02—Constructional details
- H01S3/04—Arrangements for thermal management
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
- H01S5/02407—Active cooling, e.g. the laser temperature is controlled by a thermo-electric cooler or water cooling
- H01S5/02423—Liquid cooling, e.g. a liquid cools a mount of the laser
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- Engineering & Computer Science (AREA)
- Electromagnetism (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Optics & Photonics (AREA)
- Thermal Sciences (AREA)
- Plasma & Fusion (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Infusion, Injection, And Reservoir Apparatuses (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
Present disclose provides a kind of heat sink liquid supply device of microflute group, including：It is heat sink to evaporate microflute group, including multiple micro-channels, on the side or bottom surface of a radiator or the cavity body structure of evaporator, and each micro-channel is extended on the side of the cavity body structure or bottom surface by an extending direction；And multiple electrodes, including high-field electrode and grounding electrode, for applying the directed driven power along the extending direction for the liquid in micro-channel, to increase liquid wet length in the micro-channel.Disclosure microflute group is heat sink liquid supply device, avoid microflute group it is heat sink it is interior it is dry too early caused by heat transfer deterioration, simple in structure, reliable and stable, be convenient to process and mount, cost is relatively low, there is good application value.
Description
Technical field
This disclosure relates to cooling technical field, more particularly to a kind of heat sink liquid supply device of microflute group, can be applied to electricity
Heat dissipation and thermal control system under sub- appliance component and other opto-electronic device high heat flux densities.
Background technology
With the high speed development of electronics miniaturization, high-power and large scale integrated circuit, unit volume electronics device
The calorific value of part is significantly increased, if fever cannot exclude to make a big impact to the use of electronic device in time, even
Destructive damage.And traditional radiating mode is for example air-cooled, water cooling etc. is since own efficiency is low, the factors such as dangerous gradually cannot
Adapt to more harsh cooling requirements.Therefore, the development of efficient heat dissipation technology is extremely urgent.
Micro slot group composite phase change heat transfer technology is with the features such as its coefficient of heat transfer is high, the operation is stable as current heat sinking
Means.By taking open rectangle capillary slot is heat sink as an example, it utilizes evaporation thin film region near three-phase line of contact in microflute
High intensity is evaporated and the composite phase-change mechanism of thick liquid film region liquid refrigerant nucleate boiling, can realize very high exchange capability of heat.
Patent 200720103514.5 gives a kind of thermal control system, in traditional evaporation-condensation heat-exchange system, is steaming
Microflute group is all arranged in hair device and condenser, becoming the characteristics of heat transfer technology heat transfer intensity is high using microflute faciation makes the steaming of working medium
Hair heat exchange and condensation are all more efficient, so as to which consolidation system exchanges heat.
Patent 201310111572.2 discloses a kind of Microgroove group composite phase change radiator, is set on radiating surface in the lumen
It is equipped with the microflute group structure being made of the micro-channel of a plurality of micron order of magnitude.
But above-mentioned micro capillary groove evaporator easily occurs to dry up that heat exchange is caused to be worse off under higher thermal current density.
Invention content
(1) technical problems to be solved
In view of above-mentioned technical problem, present disclose provides a kind of heat sink liquid supply devices of microflute group, and it is heat sink to avoid microflute group
It is interior it is dry too early caused by heat transfer deterioration, simple in structure, reliable and stable, be convenient to process and mount, cost is relatively low, well should have
With value.
(2) technical solution
Present disclose provides a kind of heat sink liquid supply device of microflute group, including：It is heat sink to evaporate microflute group, including multiple microflutes
Road, on the side or bottom surface of a radiator or the cavity body structure of evaporator, and each micro-channel is in the cavity body structure
Side or bottom surface on by an extending direction extend；And multiple electrodes, including high-field electrode and grounding electrode, for for microflute
Liquid in road applies the directed driven power along the extending direction, to increase liquid wet length in the micro-channel.
In some embodiments, the cavity body structure is cylinder, and the multiple micro-channel is located at the cavity body structure
On side, the extending direction of each micro-channel is parallel with the axial direction of the cavity body structure；The high-field electrode is arranged on the cavity
The top surface of structure, the grounding electrode are arranged on the cavity body structure bottom surface；Or the high-field electrode is arranged on the cavity knot
Region on the side of structure and between micro-channel and the top surface, the grounding electrode are arranged on the cavity body structure
Region on side and between micro-channel and the bottom surface.
In some embodiments, the cavity body structure is cylinder, and the multiple micro-channel is located at the cavity body structure
On bottom surface, the extending direction of each micro-channel is axially vertical with the cavity body structure, and the high-field electrode is arranged on the cavity
On the bottom surface of structure and positioned at micro-channel one end, the grounding electrode is arranged on the bottom surface of the cavity body structure and positioned at described
The other end of micro-channel.
In some embodiments, the section of the micro-channel be triangle, it is rectangle, trapezoidal or U-shaped；The width of the micro-channel
Degree and depth are in the range of 0.01-10mm, and the spacing between adjacent micro-channel is in the range of 0.01-10mm.
In some embodiments, the high-field electrode and micro-channel close to the distance of high-field electrode one end 1-100mm's
In the range of, the grounding electrode and micro-channel close to grounding electrode one end distance in the range of 1-100mm.
In some embodiments, the high-field electrode is plate electrode, cylindrical electrode, needle electrode or wire electrode, is made
For anode, the grounding electrode is plate electrode, cylindrical electrode, needle electrode or wire electrode, as cathode.
In some embodiments, the plate electrode length and width are in the range of 1-100mm, and thickness is in 0.1-10mm ranges
It is interior；The cylindrical electrode radius is in the range of 1-50mm；The needle electrode needle point radius of curvature is in the range of 0.01-5mm；Institute
Wire electrode radius is stated in the range of 0.01-1mm, length is in the range of 1-500mm.
In some embodiments, the heat sink liquid supply device of microflute group further includes insulating device；Wherein described high-voltage electricity
It is insulated by the insulating device and the cavity body structure pole.
In some embodiments, the heat sink liquid supply device of microflute group further includes high-tension apparatus, with the high-voltage electricity
Pole connects, for providing high pressure.
In some embodiments, the material of the insulating device is ceramics or organic plastics；The high-tension apparatus is
High voltage power supply or transformer.
(3) advantageous effect
It can be seen from the above technical proposal that the heat sink liquid supply device of disclosure microflute group at least has the advantages that it
One of：
(1) the heat sink liquid supply device of disclosure microflute group, microflute group heat sink interior liquid flow when can prevent higher thermal current density
It is dynamic to be obstructed and gradually dry up, the heat sink evaporation and heat-exchange ability of microflute group under high heat flux density is improved, effectively prevents evaporating
Heat exchange is unstable caused by dry and heat exchange is worse off.
(2) the heat sink liquid supply device of disclosure microflute group, light simple, safe and reliable, cost is relatively low.
Description of the drawings
By the way that shown in attached drawing, above and other purpose, the feature and advantage of the disclosure will be more clear.In whole attached drawings
Identical reference numeral indicates identical part, does not deliberately draw attached drawing by actual size equal proportion scaling, it is preferred that emphasis is show
Go out the purport of the disclosure.
Fig. 1 is according to one embodiment liquid supply device structure diagram of the disclosure.
Fig. 2 is according to another embodiment liquid supply device structure diagram of the disclosure.
Fig. 3 is according to another embodiment liquid supply device structure diagram of the disclosure.
<Symbol description>
The cavity body structure of 1- radiators, 2- grounding electrodes, 3- microflute groups are heat sink, 4- micro-channels, 5- high-field electrodes, 6- heat preservations
Hose, 7- condensers, 8- condensation return pipts, the micro- check-valves of 9-, the cavity body structure of 10- evaporators.
Specific embodiment
Purpose, technical scheme and advantage to make the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
It should be noted that in attached drawing or specification description, similar or identical part all uses identical figure number.It is attached
The realization method for not being painted or describing in figure is form known to a person of ordinary skill in the art in technical field.In addition, though this
Text can provide the demonstration of the parameter comprising particular value, it is to be understood that parameter is worth accordingly without being definitely equal to, but can connect
The error margin received is similar to be worth accordingly in design constraint.The direction term mentioned in embodiment, such as " on ", " under ",
"front", "rear", "left", "right" etc. are only the directions of refer to the attached drawing.Therefore, the direction term used is for illustrating not to use
To limit the protection domain of the disclosure.
The disclosure provides a kind of heat sink liquid supply device of microflute group, avoids the heat sink interior caused heat transfer dry too early of microflute group
The situation of deterioration, simple in structure, reliable and stable, be convenient to process and mount, cost is relatively low, there is good application value.
Specifically, the heat sink liquid supply device of disclosure microflute group, including：It is heat sink to evaporate microflute group, including multiple micro-channels, position
On the side or bottom surface of a radiator or the cavity body structure of evaporator, and each micro-channel is in the side of the cavity body structure
Or extend on bottom surface by an extending direction；And multiple electrodes, including high-field electrode and grounding electrode, for in micro-channel
Liquid applies the directed driven power along the extending direction, to increase liquid wet length in the micro-channel.
Using the liquid supply device of the disclosure, the mechanism of the electric field-enhanced heat sink interior fluid infusion of microflute group is specially：In fever member
When the heating power of device is larger, the heat flow density being applied on the heat sink heating surface of microflute group is larger, heated liquid in micro-channel
Evaporation aggravation, liquid film is gradually thinning, and flow resistance increases, and wet length reduces, and heat-sinking capability declines.Applying and microflute group heat
After the parallel orientation electric field of heavy extending direction, electric field is applied with directed driven power for liquid in micro-channel so that identical hot-fluid is close
The lower heat sink interior liquid working substance wet length of microflute of degree increases, and liquid wage is endlessly replenished in time, and evaporation and heat-exchange intensity carries
It is high.
More specifically, the cavity body structure can be cylinder, and the multiple micro-channel can be located at the cavity body structure
On side, the extending direction of each micro-channel is parallel with the axial direction of the cavity body structure；The high-field electrode is arranged on the cavity
The top surface of structure, the grounding electrode are arranged on the cavity body structure bottom surface；Or the high-field electrode is arranged on the cavity knot
Region on the side of structure and between micro-channel and the top surface, the grounding electrode are arranged on the cavity body structure
Region on side and between micro-channel and the bottom surface.In addition, the multiple micro-channel may be alternatively located at the cavity knot
On the bottom surface of structure, the extending direction of each micro-channel is axially vertical with the cavity body structure, and the high-field electrode is arranged on described
On the bottom surface of cavity body structure and positioned at micro-channel one end, the grounding electrode is arranged on the bottom surface of the cavity body structure and is located at
The other end of the micro-channel.The disclosure by microflute group it is heat sink be applied around orientation high voltage electric field, acted on using electric field force
The heat sink interior liquid working substance of microflute group is made to remain to endlessly supplement under higher thermal current density, microflute group is heat sink to be answered so as to enhance
Evaporative heat loss ability during to more high heat flux density.
It should be noted that the cavity body structure may be cuboid or cube, micro-channel and electrode are set at this time
The mode of putting is similar when can be cylinder with cavity body structure, can also suitably adjust, details are not described herein again.
When liquid is in boiling situation, although the coefficient of heat transfer is relatively high, there is unstability, such as liquid boils
Rising can cause to dry up suddenly under many situations, and heat exchanging generates very big thermal resistance and makes heat transfer boundary condition extreme.The disclosure proposes
A kind of radiating mode that more high heat flux density can be born under pure evaporation issues makes heat transfer process be in the range that can be controlled
Within.After heat flow density increasing, liquid film is gradually thinning, and thermal resistance increase, wet length reduces.But it is fluid in addition after electric field
Directed driven power is applied with, increases mass flow, reduces thermal resistance, so that the heat sink interior wet length of microflute group increases, is risen
To the effect for improving pure evaporation and heat-exchange intensity.
Specifically, the outer surface of heating element and a heat sink outer surface of microflute group fit closely or directly as
The part on the surface is equipped with micro-channel, and in the heat sink heating surface of microflute group on the internal face of the heat sink heating surface of microflute group
Both ends arrange one or two electrode.Wherein, the distance of the one end of microflute group that two electrodes are adjacent to respectively is in 1-
In the range of 100mm.
Micro-channel section on the heat sink heating surface of microflute group is triangle, rectangle, trapezoidal or U-shaped, and conduit is indulged
It is arranged to parallel distribution, the width and depth and microflute spacing of conduit are in the range of 0.01-10mm.
The material of the microflute heating surface is the preferable material of the thermal conductivity such as metal and its alloy.
The electrode is made of high-voltage positive electrode or high voltage negative and grounding electrode.Electrode is plate electrode or cylindricality electricity
Pole or needle electrode or wire electrode.Wherein, plate electrode length and width are in the range of 1-100mm, and thickness is in the range of 0.5-10mm；
Needle electrode needle point radius of curvature is in the range of 0.01-5mm；Cylindrical electrode radius is in the range of 1-50mm；Wire electrode radius
In the range of 0.01-1mm, length is in the range of 1-500mm.
The high-field electrode is either mechanically connected by welding or is adhesively fixed on a heat sink, and passes through insulator
Part insulate with radiator outer surface, and high-tension apparatus is connected after radiator extraction.
The grounding electrode is connected with heat sink cavity, passes through ground connection.
The insulating device material is the preferable materials of insulating properties such as ceramics or organic plastics.
The high-tension apparatus is the equipment that high voltage power supply or transformer etc. can provide high pressure.
The disclosure is further described with reference to the accompanying drawings and examples：
Embodiment 1
As shown in Figure 1, the cavity body structure 1 of radiator is approximately cylinder, evaporation microflute group heat sink 3 is provided on side
(lateral side regions where evaporating microflute group heat sink 3 are plane)；Specifically, liquid supply device side is as the heat sink heating surface of microflute group
It is closely connected with heating element, rectangular micro-channel is provided in heated inner surface, form evaporation microflute group heat sink 3, conduit ruler
It is very little to be：Groove width 0.3mm, groove depth 0.7mm, separation 0.4mm.In the heat sink heating surface 3 of microflute group up and down respectively apart from micro-channel two
Arrangement planar high voltage electrode 5 and grounding electrode 2 at 5mm are held, wherein high-field electrode 5 connects high voltage power supply, grounding electrode and high pressure
Power cathode generates the high voltage electric field along micro-channel axial direction altogether, between two electrodes.When heating element adstante febre, liquid working substance
It climbs in micro-channel 4 under the driving of electric field force and capillary force, forms certain moistening height, with the increase of heating power,
Evaporation is further strong, and liquid working substance is endlessly supplemented under the action of electric field force because evaporator section caused by by thermal evaporation is done
It dries up, and becomes steam under high intensity evaporation.Steam condenses on the internal face in unmanaged face, condensate liquid flow back fluid working medium
In.The heat of steam condensation by free convection or air-cooled is lost in the external world.
Embodiment 2
As shown in Fig. 2, the cavity body structure 1 of radiator is cylinder, evaporation microflute group heat sink 3 is provided on bottom surface；Tool
Body, heating element is fitted closely with bottom surface heating surface outer surface, and heating surface inner surface arrangement rectangular micro-channel 4 is formed and steamed
Heat sink 3 evaporating surface of microflute group is sent out, conduit size is：Groove width 0.3mm, groove depth 0.6mm, separation 0.4mm.It is heated that microflute group is heat sink
On the same face in face respectively high-field electrode and ground connection are respectively arranged at the 5mm of micro-channel both ends along micro-channel axially open both sides
Electrode so that microflute group is heat sink, and heating surface is completely disposed in the field regime between two electrodes.A small amount of liquid is injected, when fever member
During device heating, liquid working substance is flowed in conduit by the driving of electric field force, and enhanced water evaporation and boiling, steam is in side inner walls face
Upper condensation, condensate liquid are flowed back in working medium.The heat of steam condensation by free convection or air-cooled is lost in the external world.
Embodiment 3
As shown in figure 3, the cavity body structure 10 that a cuboid cavity forms evaporator, in the cavity portion one is made with stainless steel
Rectangular micro-channel is provided on a side heating surface, forms evaporation microflute group heat sink 3, conduit size is：Groove width 0.3mm, groove depth
0.7mm, separation 0.4mm.Tablet is respectively arranged at the heat sink both ends 5mm of microflute group up and down in heat sink 3 heating surface of microflute group
High-field electrode 5 and grounding electrode 2, wherein high-field electrode 5 connect high voltage power supply by the vacuum electrode of arrangement on an evaporator, and
Completely cut off by ceramic thermal insulation element and evaporator metal cavity；Grounding electrode 2 is welded on evaporator cavity, and and high-field electrode
Cathode altogether, generates the high voltage electric field parallel with micro-channel between two electrodes.It is vacuumized in cavity, liquid working substance R123.When
Heating element adstante febre, liquid working substance climb under the driving of electric field force and capillary force in micro-channel, form certain wetting
Highly, and in the case where high intensity is evaporated and is boiled become steam.The one end for the polyurethane heat-insulation hose 6 that 1 internal diameter is 10mm and steaming
Hair device steam (vapor) outlet connects, and the other end connects with condenser vapor import.Steam along heat-preserving hose 6 via condenser vapor into
Mouth, which is entered in condenser 7, to be condensed.Enter condensation return pipt 8, and via micro- check-valves 9 after condensate liquid outflow condenser 7
The inlet of the cavity body structure 10 of evaporator is returned to, is so moved in circles.
To sum up, the heat sink liquid supply device of disclosure microflute group, efficiently, it is safe and reliable, small power consumption, take up little area, solve existing
Evaporation and heat-exchange scarce capacity existing for radiator, the problems such as boiling is dry suddenly, heat transfer process is unstable.
So far, attached drawing is had been combined the embodiment of the present disclosure is described in detail.According to above description, art technology
Personnel should have clear understanding to the heat sink liquid supply device of disclosure microflute group.
It should be noted that in attached drawing or specification text, the realization method that is not painted or describes is affiliated technology
Form known to a person of ordinary skill in the art in field, is not described in detail.In addition, the above-mentioned definition to each element and method is simultaneously
Various concrete structures, shape or the mode mentioned in embodiment are not limited only to, those of ordinary skill in the art can carry out letter to it
It singly changes or replaces.
Similarly, it should be understood that in order to simplify the disclosure and help to understand one or more of each open aspect,
Above in the description of the exemplary embodiment of the disclosure, each feature of the disclosure is grouped together into single implementation sometimes
In example, figure or descriptions thereof.However, the method for the disclosure should be construed to reflect following intention：I.e. required guarantor
The disclosure of shield requires features more more than the feature being expressly recited in each claim.More precisely, as following
Claims reflect as, open aspect is all features less than single embodiment disclosed above.Therefore,
Thus the claims for following specific embodiment are expressly incorporated in the specific embodiment, wherein each claim is in itself
All as the separate embodiments of the disclosure.
Particular embodiments described above has carried out the purpose, technical solution and advantageous effect of the disclosure further in detail
It describes in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, is not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the guarantor of the disclosure
Within the scope of shield.
Claims (10)
1. a kind of heat sink liquid supply device of microflute group, including：
It is heat sink to evaporate microflute group, including multiple micro-channels, positioned at the side or bottom surface of a radiator or the cavity body structure of evaporator
On, and each micro-channel is extended on the side of the cavity body structure or bottom surface by an extending direction；And
Multiple electrodes, including high-field electrode and grounding electrode, for applying for the liquid in micro-channel along the extending direction
Directed driven power, to increase liquid wet length in the micro-channel.
2. the heat sink liquid supply device of microflute group according to claim 1, wherein, the cavity body structure is cylinder, described more
A micro-channel is located on the side of the cavity body structure, and the extending direction of each micro-channel is parallel with the axial direction of the cavity body structure；
The high-field electrode is arranged on the top surface of the cavity body structure, and the grounding electrode is arranged on the cavity body structure bottom surface；Or institute
It states high-field electrode and is arranged on region on the side of the cavity body structure and between micro-channel and the top surface, it is described to connect
Ground electrode is arranged on the region on the side of the cavity body structure and between micro-channel and the bottom surface.
3. the heat sink liquid supply device of microflute group according to claim 1, wherein, the cavity body structure is cylinder, described more
A micro-channel is located on the bottom surface of the cavity body structure, and the extending direction of each micro-channel is axially vertical with the cavity body structure,
The high-field electrode is arranged on the bottom surface of the cavity body structure and positioned at micro-channel one end, and the grounding electrode is arranged on described
On the bottom surface of cavity body structure and positioned at the other end of the micro-channel.
4. the heat sink liquid supply device of microflute group according to claim 1, wherein, the section of the micro-channel is triangle, square
It is shape, trapezoidal or U-shaped；In the range of 0.01-10mm, the spacing between adjacent micro-channel exists the width and depth of the micro-channel
In the range of 0.01-10mm.
5. the heat sink liquid supply device of microflute group according to claim 1, wherein, the high-field electrode is with micro-channel close to high pressure
In the range of 1-100mm, the grounding electrode exists the distance of electrode one end with distance of the micro-channel close to grounding electrode one end
In the range of 1-100mm.
6. the heat sink liquid supply device of microflute group according to claim 1, wherein, the high-field electrode is plate electrode, cylindricality
Electrode, needle electrode or wire electrode, as anode, the grounding electrode is plate electrode, cylindrical electrode, needle electrode or line
Shape electrode, as cathode.
7. the heat sink liquid supply device of microflute group according to claim 6, wherein, the plate electrode length and width are in 1-
In the range of 100mm, thickness is in the range of 0.1-10mm；The cylindrical electrode radius is in the range of 1-50mm；The needle electrode
Needle point radius of curvature is in the range of 0.01-5mm；The wire electrode radius is in the range of 0.01-1mm, and length is in 1-500mm models
In enclosing.
8. the heat sink liquid supply device of microflute group according to claim 1, further includes insulating device；Wherein described high-field electrode leads to
The insulating device is crossed to insulate with the cavity body structure.
9. the heat sink liquid supply device of microflute group according to claim 8, further includes high-tension apparatus, connect with the high-field electrode
It connects, for providing high pressure.
10. the heat sink liquid supply device of microflute group according to claim 9, wherein, the material of the insulating device is ceramics
Or organic plastics；The high-tension apparatus is high voltage power supply or transformer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810144000.7A CN108134309B (en) | 2018-02-11 | 2018-02-11 | Micro-groove group heat sink fluid supplementing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810144000.7A CN108134309B (en) | 2018-02-11 | 2018-02-11 | Micro-groove group heat sink fluid supplementing device |
Publications (2)
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| CN201810144000.7A Active CN108134309B (en) | 2018-02-11 | 2018-02-11 | Micro-groove group heat sink fluid supplementing device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108645640A (en) * | 2018-06-21 | 2018-10-12 | 南方电网科学研究院有限责任公司 | A kind of heating plate device and the test system that radiates |
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| CN101252822A (en) * | 2008-04-11 | 2008-08-27 | 北京工业大学 | EHD intensification minitype heat radiating device |
| EP2896926A1 (en) * | 2014-01-17 | 2015-07-22 | Alcatel Lucent | A heat transfer apparatus |
| CN207884061U (en) * | 2018-02-11 | 2018-09-18 | 中国科学院工程热物理研究所 | Microflute group is heat sink liquid supply device |
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| CN101252822A (en) * | 2008-04-11 | 2008-08-27 | 北京工业大学 | EHD intensification minitype heat radiating device |
| EP2896926A1 (en) * | 2014-01-17 | 2015-07-22 | Alcatel Lucent | A heat transfer apparatus |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN108645640A (en) * | 2018-06-21 | 2018-10-12 | 南方电网科学研究院有限责任公司 | A kind of heating plate device and the test system that radiates |
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| CN108134309B (en) | 2024-04-26 |
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