CN108129800A - The technique that a kind of quantum dot colloid curing molding prepares LED lens - Google Patents
The technique that a kind of quantum dot colloid curing molding prepares LED lens Download PDFInfo
- Publication number
- CN108129800A CN108129800A CN201711418267.2A CN201711418267A CN108129800A CN 108129800 A CN108129800 A CN 108129800A CN 201711418267 A CN201711418267 A CN 201711418267A CN 108129800 A CN108129800 A CN 108129800A
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- led lens
- technique
- packaging plastic
- curing molding
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Classifications
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F21—LIGHTING
- F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
- F21V5/00—Refractors for light sources
- F21V5/04—Refractors for light sources of lens shape
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B3/00—Simple or compound lenses
Abstract
The invention discloses the technique that a kind of quantum dot colloid curing molding prepares LED lens, including packaging plastic water removal, deoxygenation processing step：Dehumidizer will be added in packaging plastic or handle packaging plastic with high pure nitrogen, remove the water and oxygen in raw material；Mixing step：Above-mentioned packaging plastic in quantum dot powder is mixed, stirs evenly, obtains quantum dispensing；Curing molding step：Above-mentioned quantum dispensing is injected in lens die, is cured, obtains molding LED lens；Demoulding step：After above-mentioned LED lens demoulding after molding,.The curing of quantum dot colloid is directly fabricated to lens by the present invention, is not only relatively distant from heat source, also can packaging protection quantum dot avoid the influence of extraneous water oxygen, achieve the purpose that extend the service life of quantum dot.
Description
Technical field
The present invention relates to semi-conducting material manufacturing technology fields, are solidified into more specifically to a kind of quantum dot colloid
The technique that type prepares LED lens.
Background technology
Most of be uniformly mixed by acryl resin, silica gel or epoxy resin with remaining addition reagent of LED lens is solidified into
Type is all only absorbed in optical design for LED lens, and the luminous distribution of LED is mainly determined by LED chip and lamp bead reflector
It is fixed.The optical design of lens shape and the luminous distribution of lamp bead reflector and LED materials need perfect cooperation, can be only achieved
Good optical effect.
There are three types of the modes for applying quantum dot in the backlight module of LED at present：First method is replaced with quantum dot
Yellow fluorescent powder is directly encapsulated on blue-ray LED (On-Chip)；Second method is that quantum dot is encapsulated in glass tube with vacuum
It is interior, and mounted between side entering-type LED backlight and light guide plate (On-Edge)；The third is to produce the film containing quantum dot,
And the diffusion barrier (On-Surface) for attaching expensive aqueous vapor Obstruct membrane, replacing in backlight module lower thereon.
Present quantum dot shows that the mainstream scheme of screen in the market is long-range photoexcitation On-Surface modes, mainly
Because the thermal stability of quantum dot is bad at present, it is directly encapsulated on blue chip that (short distance is photic to swash according to On-Chip modes
Hair), it is constantly under hot environment, quantum dot aggravation decline failure can be caused, so that the quantum dot service life is reduced；Additionally due to
Quantum dot colloid is made of quantum dot and packaging plastic, and packaging plastic is by acryl resin, silica gel or epoxy resin and remaining addition
Reagent is uniformly mixed preparation, allocates production under general industry what atmospheric environment so that have a large amount of oxygen and Gao Shui in packaging plastic
Content can cause mixed quantum dot to be destroyed, and reduce service life.Therefore it is difficult to adopt On-Chip modes at present to reach
Quantum dot decline failure and service life is avoided to reduce, it is necessary to the occupation mode of On-Edge or On-Surface far from LED chip heat
Source, be not only added significantly in this way manufacture cost (such as：Glass tube with vacuum and aqueous vapor Obstruct membrane), also it can change or increase and is existing
The production procedure of LED producing lines.
Invention content
For the drawbacks described above of the prior art, the purpose of the present invention is to provide a kind of preparations of quantum dot colloid curing molding
The curing of quantum dot colloid is directly fabricated to lens by the technique of LED lens, also can packaging protection quantum not only mutually far from heat source
Point avoids the influence of extraneous water oxygen, achievees the purpose that extend the service life of quantum dot.
To achieve the above object, the technical solution adopted in the present invention is as follows：
A kind of quantum dot colloid curing molding prepares the technique of LED lens, including
Packaging plastic water removal, deoxygenation processing step：Dehumidizer will be added in packaging plastic or handle packaging plastic with high pure nitrogen,
Remove the water and oxygen in raw material；
Mixing step：Above-mentioned packaging plastic in quantum dot powder is mixed, stirs evenly, obtains quantum dispensing；
Curing molding step：Above-mentioned quantum dispensing is injected in lens die, is cured, obtains molding LED lens；
Demoulding step：After above-mentioned LED lens demoulding after molding,.
As further embodiment, packaging plastic of the present invention includes the following components being calculated in mass percent：
Tackifying resin：10%-80%,
Reactive diluent：5%-70%,
Initiator：0.5%-5%,
Auxiliary agent：2%-15%.
As further embodiment, tackifying resin of the present invention is acrylate, in silicones, epoxy resin
One kind or above-mentioned three kinds of tackifying resins in two or more mutually modified resin.
As further embodiment, the reactive diluent of the present invention for acrylate monomer, siloxanyl monomers,
Two or more mutually modified product of one kind or three's monomer in epoxy monomer.
As further embodiment, initiator of the present invention is one or both of thermal initiator or photoinitiator
Mixing.The auxiliary agent is the mixing of one or both of demoulding auxiliary agent, thixotropic agents.
As further embodiment, it is of the present invention it is described by packaging plastic with high pure nitrogen handle detailed process be：It will
Packaging plastic is put among glove box, leads to the high pure nitrogen of more than 99.9% people 1-24 hours.
As further embodiment, the weight of quantum dot powder is total for quantum dispensing in the quantum dispensing of the present invention
The 0.5%-25% of weight.
As further embodiment, in curing molding step of the present invention, cured mode is heat cure or ultraviolet
Photocuring is ultraviolet light curing and the alternate curing mode of heat cure.
Compared with prior art, the invention has the advantages that：
1. the technique that the quantum dot colloid curing molding of the present invention prepares LED lens is by quantum dot and packaging plastic
Mixed quantum dot adhesive curing is fabricated to lens, not only can also effectively packaging protection quantum dot be avoided far from heat source with respect to what
The influence of extraneous water oxygen significantly extends the service life of quantum dot；
2. the technique that the quantum dot colloid curing molding of the present invention prepares LED lens further removes chemical original
Aqueous vapor and oxygen in material so that packaging plastic is extremely low water oxygen content.
In the following, with reference to specific embodiment, the present invention is described further.
Specific embodiment
In the present invention, if not refering in particular to, all parts, mass percent are unit of weight, used equipment and original
Material etc. is commercially available or commonly used in the art.Method in following embodiments is this field unless otherwise instructed
Conventional method.
A kind of quantum dot colloid curing molding prepares the technique of LED lens, including
Packaging plastic water removal, deoxygenation processing step：Dehumidizer will be added in packaging plastic or handle packaging plastic with high pure nitrogen,
Remove the water and oxygen in raw material；The aqueous vapor and oxygen in chemical raw material can be removed by the step so that packaging plastic is
Extremely low water oxygen content, is blended into quantum dot powder, and most Hou significantly extends the service life of quantum dot；
Mixing step：Above-mentioned packaging plastic in quantum dot powder is mixed, stirs evenly, obtains quantum dispensing；
Curing molding step：Above-mentioned quantum dispensing is injected in lens die, is cured, obtains molding LED lens；
Quantum dot is fabricated to lens with the mixed quantum dot adhesive curing of packaging plastic, not only can also effectively be encapsulated far from heat source with respect to what
Protection quantum dot avoids the influence of extraneous water oxygen, significantly extends the service life of quantum dot；
Demoulding step：After above-mentioned LED lens demoulding after molding,.
As further embodiment, packaging plastic of the present invention includes the following components being calculated in mass percent：
Tackifying resin：10%-80%,
Reactive diluent：5%-70%,
Initiator：0.5%-5%,
Auxiliary agent：2%-15%.
As further embodiment, tackifying resin of the present invention is acrylate, in silicones, epoxy resin
One kind or above-mentioned three kinds of tackifying resins in two or more mutually modified resin.
In the present invention, reactive diluent can participate in curing reaction, become one of the cross-linked network structure of solidfied material
Point, reactive diluent is carried out by radical photopolymerization or free radical thermal polymerization, can not only be reduced system viscosity and can also be joined and passes through
Curing reaction maintains the performance of cured product.As further embodiment, the reactive diluent of the present invention is third
Two or more mutually modified production of one kind or three's monomer in olefin(e) acid ester monomer, siloxanyl monomers, epoxy monomer
Object.
As further embodiment, initiator of the present invention is one or both of thermal initiator or photoinitiator
Mixing.Specifically, the thermal initiator can be selected from AIBN (azodiisobutyronitrile) or AIBME (azo-bis-iso-dimethyl)
Deng；The photoinitiator can be selected from the product type of BASF AG's production for 184,1173,754,907,4265,819,
2100th, 250 it, one kind in the photoinitiator of TPO etc. or is used in mixed way.The auxiliary agent is one in demoulding auxiliary agent, thixotropic agents
Kind or two kinds of mixing.Wherein demoulding auxiliary agent can be silicone oil or modified silicon oil etc..Thixotropic agents can be aerosil etc..
In the present invention, nitrogen can effectively exclude aqueous vapor contained in raw material and oxygen as chemically inert gas.
It is of the present invention to be with high pure nitrogen processing detailed process by packaging plastic as further embodiment：Packaging plastic is put into hand
Among casing, lead to the high pure nitrogen of more than 99.9% people 1-24 hours.
As further embodiment, the weight of quantum dot powder is total for quantum dispensing in the quantum dispensing of the present invention
The 0.5%-25% of weight.
As further embodiment, in curing molding step of the present invention, cured mode is heat cure or ultraviolet
Photocuring is ultraviolet light curing and the alternate curing mode of heat cure.
Embodiment 1
A kind of quantum dot colloid curing molding prepares the technique of LED lens, including
Packaging plastic water removal, deoxygenation processing step：Water and oxygen in dehumidizer removal raw material will be added in packaging plastic；
Mixing step：Above-mentioned packaging plastic in quantum dot powder is mixed, stirs evenly, obtains quantum dispensing；The encapsulation
Glue includes the following components being calculated in mass percent：
Epoxy resin：60%th,
Acrylic glycidol ether：30%th,
TPO：5%th,
Silicone oil：5%；
Curing molding step：Above-mentioned quantum dispensing is injected in lens die, is cured, obtains molding LED lens；
Demoulding step：After above-mentioned LED lens demoulding after molding,.
Embodiment 2
A kind of quantum dot colloid curing molding prepares the technique of LED lens, including
Packaging plastic water removal, deoxygenation processing step：Among packaging plastic is put into glove box, lead to the high pure nitrogen 24 of people 99.9%
Hour, remove the water and oxygen in raw material；
Mixing step：Above-mentioned packaging plastic in quantum dot powder is mixed, stirs evenly, obtains quantum dispensing；The encapsulation
Glue includes the following components being calculated in mass percent：
Silicones：40%th,
Acrylic glycidol ether：40%th,
TPO：5%th,
Aerosil：15%；
Curing molding step：Above-mentioned quantum dispensing is injected in lens die, is cured, obtains molding LED lens；
Demoulding step：After above-mentioned LED lens demoulding after molding,.
It will be apparent to those skilled in the art that can technical solution and design as described above, make other various phases
The change and deformation answered, and all these change and deformation should all belong to the claims in the present invention protection domain it
It is interior.
Claims (9)
1. a kind of technique that quantum dot colloid curing molding prepares LED lens, which is characterized in that including
Packaging plastic water removal, deoxygenation processing step：Dehumidizer will be added in packaging plastic or handle packaging plastic with high pure nitrogen, remove
Water and oxygen in raw material；
Mixing step：Above-mentioned packaging plastic in quantum dot powder is mixed, stirs evenly, obtains quantum dispensing；
Curing molding step：Above-mentioned quantum dispensing is injected in lens die, is cured, obtains molding LED lens；
Demoulding step：After above-mentioned LED lens demoulding after molding,.
2. the technique that quantum dot colloid curing molding as described in claim 1 prepares LED lens, which is characterized in that the envelope
Dress glue includes the following components being calculated in mass percent：
Tackifying resin：10%-80%,
Reactive diluent：5%-70%,
Initiator：0.5%-5%,
Auxiliary agent：2%-15%.
3. the technique that quantum dot colloid curing molding as claimed in claim 2 prepares LED lens, which is characterized in that described viscous
Property resin be two kinds or two kinds in acrylate, silicones, one kind in epoxy resin or above-mentioned three kinds of tackifying resins
Mutually modified resin above.
4. the technique that quantum dot colloid curing molding as claimed in claim 2 prepares LED lens, which is characterized in that the work
Property diluent be acrylate monomer, siloxanyl monomers, one kind in epoxy monomer or three's monomer two or more
Mutually modified product.
5. the technique that quantum dot colloid curing molding as claimed in claim 2 prepares LED lens, which is characterized in that described to draw
Hair agent is the mixing of one or both of thermal initiator or photoinitiator.
6. the technique that quantum dot colloid curing molding as claimed in claim 2 prepares LED lens, which is characterized in that described to help
Agent is the mixing of one or both of demoulding auxiliary agent, thixotropic agents.
7. the technique that quantum dot colloid curing molding as described in claim 1 prepares LED lens, which is characterized in that described to incite somebody to action
Packaging plastic handles detailed process with high pure nitrogen：Among packaging plastic is put into glove box, it is passed through more than 99.9% High Purity Nitrogen
Gas 1-24 hours.
8. the technique that quantum dot colloid curing molding as described in claim 1 prepares LED lens, which is characterized in that the amount
The weight of quantum dot powder is the 0.5%-25% of quantum dispensing total weight in sub- dispensing.
9. the technique that quantum dot colloid curing molding as described in claim 1 prepares LED lens, which is characterized in that described solid
Change in forming step, cured mode is heat cure or ultraviolet light curing or is that ultraviolet light curing and heat cure are alternate curing
Mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711418267.2A CN108129800A (en) | 2017-12-25 | 2017-12-25 | The technique that a kind of quantum dot colloid curing molding prepares LED lens |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201711418267.2A CN108129800A (en) | 2017-12-25 | 2017-12-25 | The technique that a kind of quantum dot colloid curing molding prepares LED lens |
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| CN108129800A true CN108129800A (en) | 2018-06-08 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201711418267.2A Pending CN108129800A (en) | 2017-12-25 | 2017-12-25 | The technique that a kind of quantum dot colloid curing molding prepares LED lens |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205112A (en) * | 2019-05-31 | 2019-09-06 | 苏州星烁纳米科技有限公司 | The preparation method of perovskite quantum dot composite membrane and product prepared therefrom |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516501A (en) * | 2011-11-22 | 2012-06-27 | 中国科学院上海有机化学研究所 | Photo-curing material for manufacturing light-emitting diode (LED) lens |
| CN103030822A (en) * | 2012-12-20 | 2013-04-10 | 杭州纳晶科技有限公司 | Quantum dots powder and preparation method thereof, silicone lens and manufacture method thereof and LED lamp |
| CN103131190A (en) * | 2013-02-05 | 2013-06-05 | 广州市爱易迪新材料科技有限公司 | Double-component self-molding lens silica gel for light-emitting diode (LED) package and package process of double-component self-molding lens silica gel |
| US20160084472A1 (en) * | 2014-09-19 | 2016-03-24 | Hon Hai Precision Industry Co., Ltd. | Light diffusion member, and light emitting device, and display device using the same |
-
2017
- 2017-12-25 CN CN201711418267.2A patent/CN108129800A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102516501A (en) * | 2011-11-22 | 2012-06-27 | 中国科学院上海有机化学研究所 | Photo-curing material for manufacturing light-emitting diode (LED) lens |
| CN103030822A (en) * | 2012-12-20 | 2013-04-10 | 杭州纳晶科技有限公司 | Quantum dots powder and preparation method thereof, silicone lens and manufacture method thereof and LED lamp |
| CN103131190A (en) * | 2013-02-05 | 2013-06-05 | 广州市爱易迪新材料科技有限公司 | Double-component self-molding lens silica gel for light-emitting diode (LED) package and package process of double-component self-molding lens silica gel |
| US20160084472A1 (en) * | 2014-09-19 | 2016-03-24 | Hon Hai Precision Industry Co., Ltd. | Light diffusion member, and light emitting device, and display device using the same |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110205112A (en) * | 2019-05-31 | 2019-09-06 | 苏州星烁纳米科技有限公司 | The preparation method of perovskite quantum dot composite membrane and product prepared therefrom |
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Application publication date: 20180608 |
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