CN106433538A - Visible light curing type frame seal adhesive composition - Google Patents

Visible light curing type frame seal adhesive composition Download PDF

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Publication number
CN106433538A
CN106433538A CN201610794568.4A CN201610794568A CN106433538A CN 106433538 A CN106433538 A CN 106433538A CN 201610794568 A CN201610794568 A CN 201610794568A CN 106433538 A CN106433538 A CN 106433538A
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CN
China
Prior art keywords
component
visible light
oligomer
compositionss according
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201610794568.4A
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Chinese (zh)
Inventor
李吉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
TCL China Star Optoelectronics Technology Co Ltd
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Shenzhen China Star Optoelectronics Technology Co Ltd
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Priority to CN201610794568.4A priority Critical patent/CN106433538A/en
Publication of CN106433538A publication Critical patent/CN106433538A/en
Pending legal-status Critical Current

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    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J163/00Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
    • C09J163/10Epoxy resins modified by unsaturated compounds
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00Use of inorganic substances as compounding ingredients
    • C08K3/34Silicon-containing compounds
    • C08K3/36Silica
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/06Ethers; Acetals; Ketals; Ortho-esters
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08KUse of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K5/00Use of organic ingredients
    • C08K5/04Oxygen-containing compounds
    • C08K5/10Esters; Ether-esters
    • C08K5/101Esters; Ether-esters of monocarboxylic acids
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/04Non-macromolecular additives inorganic
    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09JADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02Non-macromolecular additives
    • C09J11/06Non-macromolecular additives organic

Abstract

The invention provides a visible light curing type frame seal adhesive composition. The visible light curing type frame seal adhesive composition is prepared from an epoxy oligomer, a polyacrylate oligomer, a light initiator system, a heat curing agent, a filler and an additive; the visible light curing type frame seal composition adopts the visible light initiator system, the visible light initiator system comprises a component A, and the component A is a compound shown in formula 1; the visible light initiator system can generate free radical reaction under the action of visible light, an extinction coefficient is higher in the wave band of 500 to 600nm, and the higher initiation efficiency is guaranteed. The formula is shown in the description.

Description

A kind of visible light curable sealant composition
Technical field
The invention belongs to liquid crystal cell sealed plastic box field is and in particular to a kind of visible light curable sealant composition.
Background technology
The sealed plastic box of liquid crystal cell plays sealing liquid crystal cell, and provides the certain box thickness of liquid crystal cell and the mechanical strength of box.Logical Normal liquid crystal cell sealed plastic box is by epoxy resin oligomer, acrylic resin oligomer, light trigger, thermal initiator, filling material The mixture of the compositions such as material, additive, conventional manufacturing process is coating sealed plastic box on Array substrate or CF substrate, will be upper Lower basic laminating, then sealed plastic box is carried out with ultraviolet light (UV) irradiation makes sealed plastic box carry out photocuring, subsequently again in certain height Make the further heat cure of sealed plastic box under warm manufacturing process, make sealed plastic box have preferable bond propertiess.
But there is problems with the sealed plastic box of existing ultraviolet curing type:1st, in order to avoid ultraviolet light breaks to liquid crystal Bad, when carrying out ultraviolet light to sealed plastic box, need using light shield (UV Mask), liquid crystal to be gone to block;2nd, ultraviolet source And non-clean light source.Due to being improved using light shield cost so during ultraviolet light polymerization, and recently as narrow side The development of frame, it is also proposed higher requirement to the precision of light shield.
Content of the invention
In order to solve the problems, such as prior art, the invention provides a kind of visible light curable sealant composition, Used in this sealant composition, light initiation system can cause radical reaction under visible light, and this initiator system exists There are higher extinction coefficient, using this sealed plastic box, it is not necessary to use purple after liquid crystal cell laminating in 500-600nm wave band Outer light is irradiated, and gets final product curing reaction under the visible ray of cleaning, and meanwhile, photo curing stage, it is not necessary to use light shield, saves Cost-saving.
In order to achieve the above object, the present invention adopts the following technical scheme that:
A kind of visible light curable sealant composition, draws including epoxy oligomer, polyacrylate quasi-oligomer, light Send out agent system, thermal curing agents, filler and additive, wherein, described photoinitiator system includes component A, the structure of described component A As shown in formula I:
In formula I, X is connected with phenyl ring therein in the way of ortho position, meta or para position replace, the side preferably being replaced with ortho position Formula is connected with phenyl ring therein, and X represents COO (CH2)n- R, n be 2-6 in integer, R be selected from methyl,R is preferably R1And R2It is independently selected from C1-C4Alkyl.Preferably, R1And R2It is methyl.
According to the present invention, Formulas I includes
3 kinds of structures.
According to the preferred embodiment of the present invention, described light trigger also includes component B containing structure shown in formula II
In formula II, R3And R4It is connected with phenyl ring therein in the way of ortho position, para-position or meta replace, preferably taken with para-position The mode in generation is connected with phenyl ring therein, R3And R4It is independently selected from H or C1-C4Alkyl is it is preferable that described R3And R4It is H.
According to the preferred embodiment of the present invention, described R is methyl, and described photoinitiator system also includes component C, Described component C is selected from
In at least one, It is preferablyWherein, R5、R6It is independently selected from C1-C4Alkyl, R7For C1-C4Alkyl.Preferably, R5、R6 It is methyl, R7For ethyl.
According to a preferred embodiment, the described compound containing B be selected from diphenyliodonium fluoride iodine, diphenyliodonium chloride, two At least one in phenyl IBr, diphenyl tetrafluoride boron iodine and diphenyl phosphorus hexafluoride iodine.
According to the preferred embodiment of the present invention, described photoinitiator system preferably (1), (2), (3) or (4) in any one Kind,
⑴:
⑵:Combination,
⑶:Combination,
⑷:Combination.
Described component A is 1 with the mol ratio of component B:(0.5-2), preferably 1:1.
The mol ratio of described component A, component B and component C is 1:(0.5-2):(0.5-2), preferably 1:1:1.
Epoxy oligomer of the present invention, polyacrylate quasi-oligomer, thermal curing agents, filler and additive are selected from Material commonly used in the art, the preparation method of described compositionss is selected from the preparation method of compositionss commonly used in the art.
According to the embodiment of the present invention, described epoxy oligomer is selected from epoxy acrylic resin or bisphenol-A epoxy tree Fat.
According to the embodiment of the present invention, described polyacrylate quasi-oligomer is selected from polymethyl methacrylate or poly- first Base ethyl acrylate.
According to the embodiment of the present invention, described thermal curing agents are selected from 3,5- dimethylaniline or 1,8- diaminourea -3,6- Dioxaoctane.
According to the embodiment of the present invention, described filler is selected from SiO 2 powder or alumina powder.
According to the embodiment of the present invention, described additive is selected from defoamer, levelling agent, wetting dispersing agent and polymerization inhibitor At least one.
A kind of described visible light curable sealant composition includes, according to mass fraction meter, epoxy oligomer 5-35 Part, polyacrylate quasi-oligomer 5-35 part, light trigger 1-5 part, thermal curing agents 1-5 part, filler 5-20 part, additive 0.2- 3 parts.
Another object of the present invention is to provide a kind of described visible-light curing dosage form sealant composition in thin film field Application in effect transistor LCD (TFT-LCD).
The invention has the advantages that:
A kind of visible light curable sealant composition that the present invention provides, said composition uses a kind of new light trigger System, this initiator can cause radical reaction, and have relatively in 500-600nm wave band in the presence of visible ray High extinction coefficient, thus ensure there is higher efficiency of initiation.
In photoinitiator system, traditional light trigger and aided initiating are combined in same molecular structure, so have There is more preferable radical conversion efficiency, efficiency of initiation is higher.
The visible light curable sealed plastic box that the present invention provides, it is not necessary to be shone using ultraviolet light after liquid crystal cell laminating Penetrate, and i.e. curable being conveniently easy to get, under the visible ray that cleans, and in photo curing stage it is not necessary to use light shield, save light Cover cost and para-position processing procedure.
Specific embodiment
The present invention is described in detail with reference to embodiments, but the present invention is not limited by following embodiments.
Embodiment 1
A kind of visible light curable sealant composition, including the component of following parts by weight, 5 parts of epoxy acrylic trees Fat, 5 parts of polymethyl methacrylates, 1 part of photoinitiator system, 1 part of 3,5- dimethylaniline, 5 parts of SiO 2 powders, 0.2 Part MEHQ, in the present embodiment light trigger be:
Embodiment 2
A kind of visible light curable sealant composition, including the component of following parts by weight, 35 parts of epoxy acrylic trees Fat, 35 parts of polymethyl methacrylates, 5 parts of photoinitiator systems, 5 parts of 3,5- dimethylanilines, 20 parts of SiO 2 powders, 3 Part MEHQ, in the present embodiment, light initiation system is:
Combination, therebetween mole Than for 1:1.
Embodiment 3
A kind of visible light curable sealant composition, including the component of following parts by weight, 20 parts of epoxy acrylic trees Fat, 15 parts of polymethyl methacrylates, 3 parts of photoinitiator systems, 2 parts of 3,5- dimethylanilines, 12 parts of SiO 2 powders, 2 Part MEHQ, in the present embodiment light trigger be:
Combination, mol ratio therebetween is 1: 1.
Embodiment 4
A kind of visible light curable sealant composition, including the component of following parts by weight, 15 parts of epoxy acrylic trees Fat, 23 parts of polymethyl methacrylates, 3 parts of photoinitiator systems, 2 parts of 3,5- dimethylanilines, 15 parts of SiO 2 powders, 1.5 parts of MEHQ, in the present embodiment light trigger be:
Rubbing between three That ratio is 1:1:1.
Comparative example 1
Using the compositionss composition described in embodiment 3, replace photoinitiator system, light trigger adopts the positive fourth of triphenyl Base boron.
By the compositionss of embodiment 1-4 and comparative example 1 respectively liquid crystal cell laminating after it is not necessary to be shone using ultraviolet light Penetrate, and i.e. curable being conveniently easy to get, under the visible ray that cleans, and in photo curing stage it is not necessary to use light shield, save light Cover cost and para-position processing procedure.
Although invention has been described hereinbefore to have been made with reference to some embodiments, but without departing from the present invention In the case of scope, exemplary embodiment can be carried out with many modifications, prepare numerous compositions, not right in the present invention These compositionss carry out the description of exhaustive merely for the sake of omitting length and the consideration economizing on resources, and therefore, the present invention is not It is limited to specific embodiment disclosed herein, and fall into all technical schemes of the scope of claim.

Claims (10)

1. a kind of visible light curable sealant composition, including epoxy oligomer, polyacrylate quasi-oligomer, light-initiated Agent system, thermal curing agents, filler and additive, wherein, described photoinitiator system includes component A, and the structure of described component A is such as Shown in formula I:
In Formulas I, X is connected with phenyl ring therein in the way of ortho position, meta or para position replace, and X represents COO (CH2)n- R, n are 2-6 In integer, R be selected from methyl,OrR1And R2 It is independently selected from C1-C4Alkyl.
2. compositionss according to claim 1 are it is characterised in that described light trigger is also included containing structure shown in Formula II Component B,
In Formula II, R3And R4It is connected with phenyl ring therein in the way of ortho position, para-position or meta replace, and be independently selected from H or C1-C4 Alkyl.
3., it is characterised in that R is methyl, and described photoinitiator system is also for compositionss according to claim 1 and 2 Including component C, described component C is selected fromWith In at least one, wherein, R5、R6It is independently selected from C1-C4Alkyl, R7For C1-C4Alkyl.
4. compositionss according to claim 1 it is characterised in that described photoinitiator system be selected from (1), (2), (3) or (4) in At least one,
⑴:
⑵:WithCombination,
⑶:WithCombination,
⑷:WithCombination.
5. compositionss according to claim 2 are it is characterised in that component A is 1 with the mol ratio of component B:(0.5-2).
6. compositionss according to claim 2 are it is characterised in that component A is 1 with the mol ratio of component B:1.
7. compositionss according to claim 3 are it is characterised in that the mol ratio of component A, component B and component C is 1: (0.5-2):(0.5-2).
8. compositionss according to claim 3 are it is characterised in that the mol ratio of component A, component B and component C is 1:1: 1.
9. compositionss according to claim 1 are it is characterised in that described visible light curable sealant composition includes, According to mass fraction meter, epoxy oligomer 5-35 part, polyacrylate quasi-oligomer 5-35 part, light trigger 1-5 part, thermosetting Agent 1-5 part, filler 5-20 part, additive 0.2-3 part, wherein, described epoxy oligomer be selected from epoxy acrylic resin or Bisphenol A epoxide resin;Described polyacrylate quasi-oligomer is selected from polymethyl methacrylate or polyethyl methacrylate;Institute State thermal curing agents and be selected from 3,5- dimethylaniline or 1,8- diaminourea -3,6- dioxaoctane;Described filler is selected from silicon dioxide Powder or alumina powder;And/or described additive is selected from defoamer, levelling agent, wetting dispersing agent and polymerization inhibitor at least A kind of.
10. the visible-light curing dosage form sealant composition any one of a kind of claim 1-9 is brilliant in thin film field-effect Application in body pipe LCD.
CN201610794568.4A 2016-08-31 2016-08-31 Visible light curing type frame seal adhesive composition Pending CN106433538A (en)

Priority Applications (1)

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Application Number Priority Date Filing Date Title
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Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107239002A (en) * 2017-07-07 2017-10-10 深圳市华星光电技术有限公司 UV curing powder light resistance compositions and preparation method thereof, the preparation method of color membrane substrates
CN107722885A (en) * 2017-10-26 2018-02-23 东莞市科惠工业材料有限公司 A kind of acrylic bathtub docking adhesive and its application
CN112280504A (en) * 2020-10-16 2021-01-29 武汉华星光电技术有限公司 Frame sealing adhesive and liquid crystal display panel
CN113355028A (en) * 2021-07-09 2021-09-07 深圳市华星光电半导体显示技术有限公司 Light-cured material, display panel and preparation method thereof

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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107239002A (en) * 2017-07-07 2017-10-10 深圳市华星光电技术有限公司 UV curing powder light resistance compositions and preparation method thereof, the preparation method of color membrane substrates
CN107239002B (en) * 2017-07-07 2019-12-06 深圳市华星光电技术有限公司 UV curing powder photoresist composition, manufacturing method thereof and manufacturing method of color film substrate
CN107722885A (en) * 2017-10-26 2018-02-23 东莞市科惠工业材料有限公司 A kind of acrylic bathtub docking adhesive and its application
CN112280504A (en) * 2020-10-16 2021-01-29 武汉华星光电技术有限公司 Frame sealing adhesive and liquid crystal display panel
CN113355028A (en) * 2021-07-09 2021-09-07 深圳市华星光电半导体显示技术有限公司 Light-cured material, display panel and preparation method thereof

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