CN108102601B - Organic silicon adhesive for packaging ultraviolet LED chip - Google Patents
Organic silicon adhesive for packaging ultraviolet LED chip Download PDFInfo
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- CN108102601B CN108102601B CN201711382929.5A CN201711382929A CN108102601B CN 108102601 B CN108102601 B CN 108102601B CN 201711382929 A CN201711382929 A CN 201711382929A CN 108102601 B CN108102601 B CN 108102601B
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
Abstract
The invention relates to an organic silicon adhesive for packaging an ultraviolet LED chip, which comprises the following components: 40-50 parts of methyl vinyl silicone resin, 0.01-0.03 part of platinum catalyst, 3-5 parts of binder, 20-30 parts of methyl hydrogen-containing MQ silicone resin, 10-20 parts of epoxy acrylic acid modified hydrogen-containing silicone oil and 0.1-0.2 part of inhibitor. The invention has the beneficial effects that: the high-temperature-resistant retention rate of the packaging glue provided by the invention can be kept above 90%, the ultraviolet resistance is 14-15% higher than that of the common glue, the ultraviolet-resistant effect can be better achieved, and the light attenuation of a light attenuation test of 1000H can meet the international lighting standard within 5%.
Description
Technical Field
The invention relates to an organic silicon adhesive, in particular to an organic silicon adhesive for packaging an ultraviolet LED chip, and belongs to the technical field of adhesives.
Background
Statistically, the domestic LED industry has attracted billions of capital in the past few years, and most of the investment has flooded the fields of blue-green and red-yellow. With excessive capital investment, the LED blue-green and red-yellow markets are rapidly becoming a competitive red ocean. Compared with blue LEDs, ultraviolet LEDs, although currently have low power efficiency, have rapidly developed technology and market growth in recent years, and are a high value-added point in the LED field.
The wavelength distribution of the ultraviolet light is between 100 nanometers and 400 nanometers, and further can be subdivided into three categories: UV-A (315-nm, also known as long-wave ultraviolet light), UV-B (280-315 nm, also known as medium-wave ultraviolet light), and UV-C (100-280 nm, also known as short-wave ultraviolet light, or deep ultraviolet light). Although ultraviolet light is potentially harmful to humans in daily life, it is a fact that ultraviolet light plays an important role in many areas in our production and life. Some important applications today include: optical sensors and instruments (230-.
The loss of photons generated by radiative recombination during the use of UV-LEDs upon emission consists mainly of three aspects: the chip internal structure defect and the absorption of materials, the reflection loss of photons at an emergent interface caused by the refractive index difference and the total reflection loss caused by the incident angle larger than the critical angle of total reflection. Therefore, many light rays cannot exit from the chip to the outside. By injecting a transparent adhesive layer (pouring sealant) with relatively high refractive index into the surface of the chip, the adhesive layer is positioned between the chip and the air, so that the loss of photons at the interface is effectively reduced, and the light extraction efficiency is improved. In addition, the UV-LED pouring sealant also has the functions of mechanical protection and stress release on the chip and is used as a light guide structure.
Therefore, the light emitting efficiency and the service life of the UV-LED device are directly influenced by the quality of the selected packaging adhesive and lens materials, and the requirements of the pouring sealant are high light transmittance, high refractive index, good thermal stability, good fluidity and easy spraying. In order to improve the reliability of the UV-LED package, it is also required to have characteristics of low moisture absorption, low stress, weather resistance, environmental protection, and the like. The conventional packaging adhesive can only be applied to the packaging field of UV-A (315-.
Disclosure of Invention
Aiming at the defects of the existing ultraviolet LED packaging adhesive, the invention provides an organic silicon adhesive for packaging an ultraviolet LED chip.
The technical scheme for solving the technical problems is as follows:
an organic silicon adhesive for packaging an ultraviolet LED chip comprises the following components in parts by weight: 40-50 parts of methyl vinyl silicone resin, 0.01-0.03 part of platinum catalyst, 3-5 parts of binder, 20-30 parts of methyl hydrogen-containing MQ silicone resin, 10-20 parts of epoxy acrylic acid modified hydrogen-containing silicone oil and 0.1-0.2 part of inhibitor.
Further, the structural formula of the epoxy acrylic acid modified hydrogen-containing silicone oil is as follows:
wherein j is 1 to 5, k is 1 to 5, l is 10 to 15, and j + k + l is 10 to 20.
The further technical scheme has the advantages that Si-H bonds and Si-Vi bonds for crosslinking can be provided, and epoxy groups and acrylic acid groups with strong polarity can be provided; the structure has the advantages that the adhesive force of the glue to the base material can be improved, the existence of Si-H can participate in the curing and crosslinking of the glue, so that the glue becomes a whole, the use of a cross-linking agent containing hydrogen can be reduced, the compatibility of different components after curing can be improved, and the aging resistance of the glue is improved.
Further, the molecular structural formula of the methyl vinyl silicone resin is as follows:
(ViMe2SiO0.5)a(SiO2)b
wherein Me is methyl, Vi is vinyl, and a/b is 0.75-0.8.
The further scheme has the beneficial effects that as the matrix silicone resin contains vinyl, the strength and hardness of the product can be improved, and the vulcanization resistance is improved.
Further, the molecular structural formula of the methyl hydrogen-containing MQ silicon resin is as follows:
(HMe2SiO0.5)c(Me3SiO0.5)d(SiO2)e
wherein Me is methyl, c + d/e is 0.75-0.8, c is 0.01-0.1, d is 0.7-0.74, and e is 1.
The methyl hydrogen-containing MQ silicon resin has the beneficial effects that the methyl hydrogen-containing MQ silicon resin is used as a cross-linking agent, active hydrogen is provided to participate in a cross-linking reaction, the cross-linking density is improved, and a D chain link (Me) is adopted3SiO0.5) The high-viscosity polyurethane material has the advantages of improving the toughness of the whole system, improving the cold and heat shock resistance, having low viscosity, and having the effects of reducing the viscosity and improving the strength and the toughness of the whole system.
Further, the platinum catalyst is any one of alcohol solution of chloroplatinic acid, platinum-vinyl siloxane complex and platinum olefin complex, wherein the content of platinum is 10000 ppm.
Furthermore, the binder is one or a mixture of more of vinyltriethoxysilane, glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane (KH-570) and vinyltrimethoxysilane (KH-171).
Further, the inhibitor is any one of acetylene alcohol or tetramethyl tetravinylcyclotetrasiloxane, and the acetylene alcohol is any one of ethynylcyclohexanol and ethynylcyclopentanol.
The invention has the beneficial effects that:
the high-temperature-resistant retention rate of the packaging glue provided by the invention can be kept above 90%, the ultraviolet resistance is 14-15% higher than that of the common glue, the ultraviolet-resistant effect can be better achieved, and the light attenuation of a light attenuation test of 1000H can meet the international lighting standard within 5%.
Detailed Description
The principles and features of this invention are described below in conjunction with examples, which are set forth to illustrate, but are not to be construed to limit the scope of the invention.
Example 1:
an organic silicon adhesive for packaging an ultraviolet LED chip comprises the following components: 400g of vinyl silicon resin (a/b is 0.75), 0.1g of alcohol solution of chloroplatinic acid (platinum content is 10000ppm), 30g of adhesive vinyl triethoxysilane, 200g of methyl hydrogen-containing MQ silicon resin (structural formula is c + d/e is 0.75, c is 0.01, d is 0.74, and e is 1), 100g of epoxy acrylic acid modified hydrogen-containing silicone oil (structural formula is j + k + l is 20, wherein j is 5, k is 5, l is 10), and 1g of inhibitor acetylene alcohol.
Example 2:
an organic silicon adhesive for packaging an ultraviolet LED chip comprises the following components: 500g of vinyl silicone resin (a/b is 0.8), 0.3g of platinum-vinylsiloxane complex (platinum content is 10000ppm), 20g of adhesives KH-570 and KH-171, 300g of methyl hydrogen-containing MQ silicone resin (structural formula is c + D/e is 0.8, c is 0.1, D is 0.7, e is 1), 200g of epoxy acrylic acid modified hydrogen-containing silicone oil (structural formula is j + k + l is 15, wherein j is 1k is 1, l is 12), and 2g of inhibitor vinyl D4.
Example 3:
an organic silicon adhesive for packaging an ultraviolet LED chip comprises the following components: 450g of vinyl silicone resin (a/b is 0.78), 0.2g of catalyst platinum olefin complex (platinum content is 10000ppm), 15g of adhesive vinyl triethoxysilane and KH-570, 200g of methyl hydrogen-containing MQ silicone resin (structural formula is c + d/e is 0.8, c is 0.05, d is 0.75, e is 1), 150g of epoxy acrylic acid modified hydrogen-containing silicone oil (structural formula is j + k + l is 18; wherein j is 4k is 4, l is 10), and 1.5g of inhibitor acetylene alcohol.
Example 4:
an organic silicon adhesive for packaging an ultraviolet LED chip comprises the following components: 450g of vinyl silicone resin (a/b is 0.8), 0.2g of platinum-vinyl siloxane complex (platinum content is 10000ppm) as catalyst, 15g of adhesive vinyl triethoxysilane and glycidoxypropyl trimethoxysilane respectively, 250g of methyl hydrogen-containing MQ silicone resin (structural formula is c + D/e is 0.78, c is 0.03, D is 0.75, e is 1, 180g of epoxy acrylic acid modified hydrogen-containing silicone oil (structural formula is j + k + l is 20; wherein j is 2k is 3, l is 15), and 1g of inhibitor vinyl D4 by weight.
The silicone adhesives of examples 1-4 above were prepared as follows: and sequentially adding the vinyl silicon resin, the catalyst, the binder, the methyl hydrogen-containing MQ silicon resin, the epoxy acrylic acid modified hydrogen-containing silicone oil and the inhibitor into a 1.5L stirrer, and uniformly mixing and stirring in an inert gas atmosphere to obtain the catalyst.
Comparative example 1:
in order to verify the technical effect of the silicone adhesive obtained by the present invention, the performance of the products obtained by using the shinyleaf gum 2600 as comparative example 1 and examples 1-4 was tested in each aspect, and the specific results are shown in table 1.
TABLE 1 results of basic Performance test of the products obtained in examples 1 to 4 and comparative example 1
The experimental data in table 1 show that the organosilicon adhesive provided by the invention can maintain excellent hardness, tensile strength and elongation at break of the conventional organosilicon adhesive, and simultaneously has improved 14-15% in the aspects of medium-wave ultraviolet light resistance and short-wave ultraviolet light resistance compared with the common glue, so that the organosilicon adhesive has better ultraviolet resistance effect.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents, improvements and the like that fall within the spirit and principle of the present invention are intended to be included therein.
Claims (1)
1. An organic silicon adhesive for packaging an ultraviolet LED chip is characterized by comprising the following components in parts by weight: 40-50 parts of methyl vinyl silicone resin, 0.01-0.03 part of platinum catalyst, 3-5 parts of binder, 20-30 parts of methyl hydrogen-containing MQ silicone resin, 10-20 parts of epoxy acrylic acid modified hydrogen-containing silicone oil and 0.1-0.2 part of inhibitor;
the structural formula of the epoxy acrylic acid modified hydrogen-containing silicone oil is as follows:
wherein j is 1-5, k is 1-5, l is 10-15, and j + k + l is 10-20;
the molecular structural formula of the methyl vinyl silicone resin is as follows:
(ViMe2SiO0.5)a(SiO2) b, wherein Me is methyl, Vi is vinyl, and a/b is 0.75-0.8;
the molecular structural formula of the methyl hydrogen-containing MQ silicon resin is as follows:
(HMe2SiO0.5)c(Me3SiO0.5)d(SiO2) e, wherein Me is methyl, c + d/e is 0.75-0.8, c is 0.01-0.1, d is 0.7-0.74, and e is 1;
the platinum catalyst is any one of alcohol solution of chloroplatinic acid, platinum-vinyl siloxane complex and platinum olefin complex, wherein the content of platinum is 10000 ppm;
the binder is one or a mixture of more of vinyl triethoxysilane, glycidoxypropyltrimethoxysilane, gamma-methacryloxypropyltrimethoxysilane and vinyl trimethoxysilane;
the inhibitor is any one of ethynyl cyclohexanol, ethynyl cyclopentanol and tetramethyl tetravinylcyclotetrasiloxane.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201711382929.5A CN108102601B (en) | 2017-12-20 | 2017-12-20 | Organic silicon adhesive for packaging ultraviolet LED chip |
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| CN201711382929.5A CN108102601B (en) | 2017-12-20 | 2017-12-20 | Organic silicon adhesive for packaging ultraviolet LED chip |
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| CN108102601A CN108102601A (en) | 2018-06-01 |
| CN108102601B true CN108102601B (en) | 2020-11-10 |
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| CN109354828A (en) * | 2018-10-30 | 2019-02-19 | 徐州晶迪电子有限公司 | A kind of encapsulating material for light emitting diode |
| CN111732930A (en) * | 2020-06-11 | 2020-10-02 | 南京艾布纳密封技术股份有限公司 | Self-adhesive silicone gel composition |
| CN115678015A (en) * | 2021-07-29 | 2023-02-03 | 华为技术有限公司 | Modified organic silicon resin, conductive adhesive and preparation method thereof |
| CN114276778A (en) * | 2021-12-30 | 2022-04-05 | 烟台德邦科技股份有限公司 | Organic silicon adhesive for packaging LED chip |
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| JP2011086844A (en) * | 2009-10-19 | 2011-04-28 | Shin-Etsu Chemical Co Ltd | Die bonding material for light emitting diode |
| CN101717584B (en) * | 2009-11-20 | 2012-01-25 | 陈俊光 | Organic silica gel packaging material of large-power LED and preparation method thereof |
| CN103834356B (en) * | 2012-11-26 | 2016-06-01 | 中化蓝天集团有限公司 | A kind of carbon base white light emitting material packaging plastic |
| CN104130741B (en) * | 2014-06-29 | 2016-03-02 | 惠州市永卓科技有限公司 | A kind of COB-LED embedding transparent organic silicon glue and preparation method thereof |
| CN104789186B (en) * | 2015-04-28 | 2017-01-04 | 杭州福斯特光伏材料股份有限公司 | A kind of one-component does not go out oil type LED filament thixotrope and preparation method thereof |
| CN106675504A (en) * | 2015-11-09 | 2017-05-17 | 北京科化新材料科技有限公司 | Organic silicon rubber compound for large-power integral light-emitting diode (LED) packaging |
| CN106497507A (en) * | 2016-10-12 | 2017-03-15 | 烟台德邦先进硅材料有限公司 | A kind of UV that is used for encapsulates organic silicon packaging glue compositionss and preparation method thereof |
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Effective date of registration: 20190202 Address after: 264006 No. 3-26 Kaifeng Road Renewable Resource Processing Demonstration Zone, Yantai Development Zone, Shandong Province Applicant after: Yantai Darbond Technology Co., Ltd. Address before: 264006 Kaifeng Road 3-3 Resource Regeneration and Processing Demonstration Zone, Yantai Development Zone, Shandong Province Applicant before: Yantai Debang Advanced Silicon Materials Co.,Ltd. |
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Address after: No.3-3, Kaifeng Road, Yantai Economic and Technological Development Zone, Shandong Province 264006 Patentee after: Yantai Debang Technology Co.,Ltd. Address before: 264006 No. 3-26 Kaifeng Road Renewable Resource Processing Demonstration Zone, Yantai Development Zone, Shandong Province Patentee before: DARBOND TECHNOLOGY Co.,Ltd. |