CN106497507A - A kind of UV that is used for encapsulates organic silicon packaging glue compositionss and preparation method thereof - Google Patents
A kind of UV that is used for encapsulates organic silicon packaging glue compositionss and preparation method thereof Download PDFInfo
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- CN106497507A CN106497507A CN201610890872.9A CN201610890872A CN106497507A CN 106497507 A CN106497507 A CN 106497507A CN 201610890872 A CN201610890872 A CN 201610890872A CN 106497507 A CN106497507 A CN 106497507A
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- component
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- methyl vinyl
- packaging glue
- organic silicon
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- 239000003292 glue Substances 0.000 title claims abstract description 16
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 15
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 15
- 239000010703 silicon Substances 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 9
- 238000002360 preparation method Methods 0.000 title description 13
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims abstract description 22
- 239000011347 resin Substances 0.000 claims abstract description 12
- 229920005989 resin Polymers 0.000 claims abstract description 12
- 239000003054 catalyst Substances 0.000 claims abstract description 11
- 239000003921 oil Substances 0.000 claims abstract description 11
- 239000003431 cross linking reagent Substances 0.000 claims abstract description 9
- 239000003112 inhibitor Substances 0.000 claims abstract description 9
- NCWQJOGVLLNWEO-UHFFFAOYSA-N methylsilicon Chemical compound [Si]C NCWQJOGVLLNWEO-UHFFFAOYSA-N 0.000 claims abstract description 9
- 239000002994 raw material Substances 0.000 claims abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 22
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Substances [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 14
- 239000000377 silicon dioxide Substances 0.000 claims description 11
- 229910004674 SiO0.5 Inorganic materials 0.000 claims description 10
- 229910052681 coesite Inorganic materials 0.000 claims description 10
- 229910052906 cristobalite Inorganic materials 0.000 claims description 10
- 229910052682 stishovite Inorganic materials 0.000 claims description 10
- 229910052905 tridymite Inorganic materials 0.000 claims description 10
- -1 platinum olefin Chemical class 0.000 claims description 9
- 229910052697 platinum Inorganic materials 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 5
- 239000001257 hydrogen Substances 0.000 claims description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims description 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 3
- 150000001875 compounds Chemical class 0.000 claims description 3
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 claims description 3
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 229910004723 HSiO1.5 Inorganic materials 0.000 claims description 2
- 239000002253 acid Substances 0.000 claims description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 claims 1
- 239000007788 liquid Substances 0.000 claims 1
- 239000000203 mixture Substances 0.000 abstract description 12
- 238000005538 encapsulation Methods 0.000 abstract description 11
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000006750 UV protection Effects 0.000 abstract description 3
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 16
- 239000012467 final product Substances 0.000 description 8
- 229910052757 nitrogen Inorganic materials 0.000 description 8
- 238000003756 stirring Methods 0.000 description 8
- QYLFHLNFIHBCPR-UHFFFAOYSA-N 1-ethynylcyclohexan-1-ol Chemical compound C#CC1(O)CCCCC1 QYLFHLNFIHBCPR-UHFFFAOYSA-N 0.000 description 4
- 229920002545 silicone oil Polymers 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 230000009974 thixotropic effect Effects 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- 239000005977 Ethylene Substances 0.000 description 1
- OGPNXGJLKXGASM-UHFFFAOYSA-N [Si].CC=C Chemical compound [Si].CC=C OGPNXGJLKXGASM-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001476 alcoholic effect Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- 150000001336 alkenes Chemical class 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- QRUDEWIWKLJBPS-UHFFFAOYSA-N benzotriazole Chemical compound C1=CC=C2N[N][N]C2=C1 QRUDEWIWKLJBPS-UHFFFAOYSA-N 0.000 description 1
- 239000012964 benzotriazole Substances 0.000 description 1
- 230000021615 conjugation Effects 0.000 description 1
- 239000013068 control sample Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000004313 glare Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 150000002431 hydrogen Chemical class 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 239000000047 product Substances 0.000 description 1
- 230000004224 protection Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000741 silica gel Substances 0.000 description 1
- 229910002027 silica gel Inorganic materials 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000005987 sulfurization reaction Methods 0.000 description 1
- 125000002769 thiazolinyl group Chemical group 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The present invention relates to a kind of encapsulate organic silicon packaging glue compositionss for UV, it is characterised in that be 1 by weight proportion:1 component A and B component composition；The component A is made up of the raw material of following weight portion：50～60 parts of methyl vinyl silicone, 30～40 parts of methyl vinyl silicon oil, 0.1～0.3 part of catalyst；The B component is made up of the raw material of following weight portion：50～60 parts of methyl silicon resin, methyl vinyl silicon oil 30～40,1～4 part of cross-linking agent, 0.4～0.5 part of inhibitor；The silicon composition of UV encapsulation of the present invention, component A provide special resin structure in system, it is ensured that while the uv-resistance energy of glue, having again increases its adhesive property and heat resistance well.
Description
Technical field
The present invention relates to a kind of silicon composition of UV encapsulation and preparation method thereof, belongs to field of adhesive technology.
Background technology
So-called UV encapsulation, refers to LED of the wavelength of encapsulation chip between 365nm-390nm.It is mainly used to special lighting
With special source, can be radiated with dispersed chip, improve light efficiency, colleague improves the glare effect of LED, people are reduced to LED
The sense of discomfort of lamp dazzle.
UV LED are more and more to be received by LED producer, using the problem that UV is most commonly encountered is, so big power is concentrated
In the area of very little, the problem of radiating is than more serious challenge.Because UV etc. is during use, the length of ultraviolet wavelength
Time irradiation can cause to encapsulate the decline of glue light decay, reduce its service life.UV is in radiating, resistance to sulfuration, conjugation, light transmittance
Etc. in a series of problem, glue is put forward higher requirement.
Content of the invention
In order to solve above-mentioned technical problem, it is an object of the present invention to provide a kind of UV encapsulation silicon composition and its
Preparation method, said composition are that a kind of light decay performance is good, and uv-resistance can be strong, yellowing-resistant, the encapsulation that sealing and durability can be good
Compositionss.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of silicon composition of UV encapsulation, by weight
Proportioning is 1:1 component A and B component composition；
The component A is made up of the raw material of following weight portion：50～60 parts of methyl vinyl silicone, methyl ethylene silicon
Oily 30～40 parts, 0.1～0.3 part of catalyst；
The B component is made up of the raw material of following weight portion：50～60 parts of methyl silicon resin, methyl vinyl silicon oil 30～
40,1～4 part of cross-linking agent, 0.4～0.5 part of inhibitor.
The invention has the beneficial effects as follows：The silicon composition of COB encapsulation of the present invention, it is special that component A is provided in system
Resin structure, having again increases its adhesive property and heat resistance on the basis of above-mentioned technical proposal well, and the present invention is also
Following improvement can be done.
The methyl vinyl silicone, it is characterised in that selectively combination is constituted by M, D, Q chain link in molecular structure
Main chain；Its structure is as follows：
(RMe2SiO0.5)a(ViMe2SiO0.5)b(Me2SiO)c(SiO2)d(molecular formula 1)
Wherein a+b+c/d=0.75-1.5, a=0～1.5, b=0～1.5, c=0～1.5.
It can be following group in molecular formula R：
The group is preferably
Described methyl silicon resin, the polysiloxane that its structure is made up of M chain links and Q links, its molecular structure
As follows：
(MeSiO0.5)a(SiO2)b(molecular formula 3)
Wherein：Between a/b=1.0～2.0；
The methyl vinyl silicon oil, it is characterised in that its structural formula of a step is as follows：
Wherein (n+m)/k=1；N=10～20, m=10～20
Described catalyst is platinum group catalyst；Alcoholic solution, platinum-vinyl silica of the platinum group catalyst for chloroplatinic acid
Any one in alkane coordination compound, platinum olefin complex；The present invention is preferably platinum-vinyl siloxane coordination compound, platinum content
500-1000ppm；
The inhibitor is alkynes alcohols material, olefin-containing base cyclic siloxane oligomer, any one in benzotriazole,
The present invention is preferably the ethynylcyclohexanol in alkynes alcohols material
The cross-linking agent, is the organic hydrogen polysiloxanes containing pendant hydrogen, and structural formula is as follows：
(Me3Si0.5)h(MeSiO1.5)i(HSiO1.5)l(molecular formula 5)
H=0.5～1.0, i=0.5～1.0, l=0.5～1.0
Another technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of silicon composition of UV encapsulation
Preparation method is as follows：
The preparation process of component A is as follows：：50～60 parts of methyl vinyl silicone, 30～40 parts of methyl vinyl silicon oil,
0.1～0.3 part of catalyst, sequentially adds in blender, and is filled with nitrogen, and mixing and stirring obtains final product the component A；
The preparation process of B component is as follows：50～60 parts of methyl silicon resin, methyl vinyl silicon oil 30～40, cross-linking agent 1～
4 parts, 0.4～0.5 part of inhibitor is sequentially added in blender, and is filled with nitrogen, and mixing and stirring obtains final product the B component.
Specific embodiment
In order that those skilled in the art more fully understand technical scheme, and make the above-mentioned mesh of the present invention
, feature and advantage can become apparent from understandable, the present invention is described in further detail with reference to embodiment.
Embodiment 1
The preparation process of the component A is as follows：Methyl vinyl silicone structural formula is (RMe2SiO0.5)0.5
(ViMe2SiO0.5)0.5(Me2SiO)0.5(SiO2)1, R group is300g, methyl vinyl silicon oil (point
Son 4), wherein (n+m)/k=1；N=10, m=10, k=20,150g, catalyst platinum-vinyl siloxane complex, platinum content
500ppm 50g, sequentially add in blender, and are filled with nitrogen, and mixing and stirring obtains final product the component A；
The preparation process of the B component is as follows：Methyl silicon resin structural formula is (MeSiO0.5)2(SiO2)1300g, methyl
Vinyl silicone oil (molecule 4), wherein (n+m)/k=1；N=15, m=15, k=30 160g, cross-linking agent structure such as (molecular formula 5)
H=0.5, i=0.5, l=0.5 30g, inhibitor ethynylcyclohexanol 5g.Sequentially add in blender, and be filled with nitrogen, mix
Conjunction stirs, and obtains final product the B component.
Embodiment 2
The preparation process of the component A is as follows：Methyl vinyl silicone structural formula is (RMe2SiO0.5)0.5
(ViMe2SiO0.5)0.5(Me2SiO)0.5(SiO2)2, R group is250g, ethylene methacrylic
Base silicone oil (molecule 4), wherein (n+m)/k=1；N=20, m=20, k=40,100g, catalyst platinum-vinyl siloxane coordinate
Thing, platinum content 1000ppm 20g, sequentially adds in blender, and is filled with nitrogen, and mixing and stirring obtains final product the component A；
The preparation process of the B component is as follows：Methyl silicon resin structural formula is (MeSiO0.5)1.5(SiO2)1250g, methyl
Vinyl silicone oil (molecule 4), wherein (n+m)/k=1；N=15, m=10, k=25160g, cross-linking agent structure such as (molecular formula 5) h
=1.0, i=1.0, l=1.0 35g, inhibitor ethynylcyclohexanol 5g.Sequentially add in blender, and be filled with nitrogen, mix
Stir, obtain final product the B component；
Embodiment 3
The preparation process of the component A is as follows：Methyl vinyl silicone structural formula is (RMe2SiO0.5)0.5
(ViMe2SiO0.5)0.5(Me2SiO)0.5(SiO2)1.5, R group is
270g, methyl vinyl silicon oil (molecule 4), wherein (n+m)/k=1；N=10, m=15, k=25 160g, catalyst platinum-second
Alkenylsiloxane complexes, platinum content 750ppm 25g, sequentially add in blender, and be filled with nitrogen, mixing and stirring,
Obtain final product the component A；
The preparation process of the B component is as follows：Methyl silicon resin structural formula is (MeSiO0.5)1(SiO2)1270g, methyl second
Thiazolinyl silicone oil (molecule 4), wherein (n+m)/k=1；N=20, m=10, k=30 260g, cross-linking agent structure such as (molecular formula 5) h
=0.75, i=0.75, l=0.75 80g, inhibitor ethynylcyclohexanol 6g.Sequentially add in blender, and be filled with nitrogen,
Mixing and stirring, obtains final product the B component；
Comparative example
Comparative example uses the glue for being commercially available for UV encapsulation.
During use, it is 1 by weight by the component A, B component:1 proportioning mix homogeneously, vacuum defoamation 20 minutes are surveyed
Examination viscosity and thixotropic index, subsequent dispensing are first heated 1.5 hours at 90 DEG C on part to be packaged, then little in 150 DEG C of heating 2.5
When, you can.
The present invention has investigated the various performances of silica gel, physical property (outward appearance, viscosity, thixotropic index), optical property (printing opacity
Rate, refractive index).
GB/T2410-80 is pressed using ultraviolet-uisible spectrophotometer instrument and determines light transmittance；
GB/T529-1988 shear strength tests, test record data are pressed using rubber measurer for pulling force.
By experimental data as can be seen that its shear strength will be significantly better than control sample using the UV glue of new type resin system
Product, illustrate that the adhesive property of glue is greatly improved, another important performance uv-resistance can result show, pass through
The ultra violet lamp of 1000h, the conservation rate of glue can be applied to the encapsulation of UV lamp more than 90% well.
Presently preferred embodiments of the present invention is the foregoing is only, scope is not intended to limit the invention, every in the present invention
Spirit and principle within, any modification, equivalent substitution and improvements that is done etc., this is included in protection scope of the present invention
Within.
Claims (6)
1. a kind of organic silicon packaging glue compositionss are encapsulated for UV, it is characterised in that be 1 by weight proportion:1 component A and B groups
It is grouped into；
The component A is made up of the raw material of following weight portion：50～60 parts of methyl vinyl silicone, methyl vinyl silicon oil 30
～40 parts, 0.1～0.3 part of catalyst；
The B component is made up of the raw material of following weight portion：50～60 parts of methyl silicon resin, methyl vinyl silicon oil 30～40,
1～4 part of cross-linking agent, 0.4～0.5 part of inhibitor；
The methyl vinyl silicone structural formula is as follows：(RMe2SiO0.5)a(ViMe2SiO0.5)b(Me2SiO)c(SiO2)d；
Wherein a+b+c/d=0.75-1.5, a=0～1.5, b=0～1.5, c=0～1.5；
In molecular formula, R can be following group：
2. organic silicon packaging glue compositionss according to claim 1, it is characterised in that the methyl silicon resin structural formula is such as
Under：(MeSiO0.5)a(SiO2)b, wherein：Between a/b=1.0～2.0.
3. organic silicon packaging glue compositionss according to claim 1, it is characterised in that the methyl vinyl silicon oil structural formula
As follows：
Wherein (n+m)/k=1；N=10～20, m=10～20.
4. organic silicon packaging glue compositionss according to claim 1, it is characterised in that the catalyst is molten for the alcohol of chloroplatinic acid
Any one in liquid, platinum-vinyl siloxane coordination compound, platinum olefin complex, platinum content 500-1000ppm.
5. organic silicon packaging glue compositionss according to claim 1, it is characterised in that the inhibitor is acetenyl hexamethylene
Alcohol.
6. organic silicon packaging glue compositionss according to claim 1, it is characterised in that the cross-linking agent is containing pendant hydrogen
Organic hydrogen polysiloxanes, structural formula are (Me3Si0.5)h(MeSiO1.5)i(HSiO1.5)l；Wherein h=0.5～1.0, i=0.5～
1.0th, l=0.5～1.0.
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108102601A (en) * | 2017-12-20 | 2018-06-01 | 烟台德邦先进硅材料有限公司 | A kind of organic silicon adhesive for UV LED chip encapsulation |
| CN108913089A (en) * | 2018-07-23 | 2018-11-30 | 深圳天鼎新材料有限公司 | Two-component packaging plastic, preparation method and application method and application |
| CN110396295A (en) * | 2019-08-02 | 2019-11-01 | 北京化工大学 | A kind of room temperature vulcanization organosilicon foaming sealant of high temperature resistant heat insulation and preparation method thereof |
| CN110922937A (en) * | 2019-11-19 | 2020-03-27 | 烟台德邦科技有限公司 | Organosilicon heat-conducting encapsulating silica gel with excellent performance |
| CN113881395A (en) * | 2021-11-15 | 2022-01-04 | 湖南亿福照明科技有限公司 | Pouring sealant for LED packaging |
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| CN102898648A (en) * | 2012-05-11 | 2013-01-30 | 杭州师范大学 | Chemical crosslinking-curable phenyl MDQ-type silicone resin and preparation method thereof |
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