CN106433551A - Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof - Google Patents
Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof Download PDFInfo
- Publication number
- CN106433551A CN106433551A CN201610851840.8A CN201610851840A CN106433551A CN 106433551 A CN106433551 A CN 106433551A CN 201610851840 A CN201610851840 A CN 201610851840A CN 106433551 A CN106433551 A CN 106433551A
- Authority
- CN
- China
- Prior art keywords
- parts
- component
- thermal shock
- methyl phenyl
- glue composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims abstract description 47
- 239000003292 glue Substances 0.000 title claims abstract description 45
- 230000035939 shock Effects 0.000 title claims abstract description 34
- 238000002360 preparation method Methods 0.000 title claims abstract description 12
- 238000004806 packaging method and process Methods 0.000 title abstract description 19
- -1 methyl phenyl vinyl Chemical group 0.000 claims abstract description 99
- 239000003054 catalyst Substances 0.000 claims abstract description 21
- 229920002545 silicone oil Polymers 0.000 claims abstract description 21
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 14
- 239000003112 inhibitor Substances 0.000 claims abstract description 12
- 239000001257 hydrogen Substances 0.000 claims abstract description 4
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 4
- 229920001296 polysiloxane Polymers 0.000 claims description 38
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical group [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 34
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical group [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims description 31
- 238000005538 encapsulation Methods 0.000 claims description 28
- 150000001875 compounds Chemical class 0.000 claims description 19
- 239000003795 chemical substances by application Substances 0.000 claims description 17
- 229910052742 iron Inorganic materials 0.000 claims description 17
- 239000011347 resin Substances 0.000 claims description 16
- 229920005989 resin Polymers 0.000 claims description 16
- 229910052697 platinum Inorganic materials 0.000 claims description 14
- 239000011449 brick Substances 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 10
- 239000004305 biphenyl Substances 0.000 claims description 7
- 235000010290 biphenyl Nutrition 0.000 claims description 7
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N phenylbenzene Natural products C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 claims description 7
- 238000003756 stirring Methods 0.000 claims description 7
- 229920002554 vinyl polymer Polymers 0.000 claims description 7
- 238000006243 chemical reaction Methods 0.000 claims description 6
- 239000012467 final product Substances 0.000 claims description 6
- 238000000034 method Methods 0.000 claims description 6
- 239000000377 silicon dioxide Substances 0.000 claims description 6
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 claims description 4
- 239000005977 Ethylene Substances 0.000 claims description 4
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 claims description 4
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 claims description 4
- 125000003944 tolyl group Chemical group 0.000 claims description 4
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims description 3
- QXLPXWSKPNOQLE-UHFFFAOYSA-N methylpentynol Chemical group CCC(C)(O)C#C QXLPXWSKPNOQLE-UHFFFAOYSA-N 0.000 claims description 3
- 229960002238 methylpentynol Drugs 0.000 claims description 3
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims description 3
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 2
- KWYHDKDOAIKMQN-UHFFFAOYSA-N N,N,N',N'-tetramethylethylenediamine Chemical compound CN(C)CCN(C)C KWYHDKDOAIKMQN-UHFFFAOYSA-N 0.000 claims description 2
- ZPOLOEWJWXZUSP-WAYWQWQTSA-N bis(prop-2-enyl) (z)-but-2-enedioate Chemical compound C=CCOC(=O)\C=C/C(=O)OCC=C ZPOLOEWJWXZUSP-WAYWQWQTSA-N 0.000 claims description 2
- HIHIPCDUFKZOSL-UHFFFAOYSA-N ethenyl(methyl)silicon Chemical compound C[Si]C=C HIHIPCDUFKZOSL-UHFFFAOYSA-N 0.000 claims description 2
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 claims description 2
- FLKPEMZONWLCSK-UHFFFAOYSA-N diethyl phthalate Chemical compound CCOC(=O)C1=CC=CC=C1C(=O)OCC FLKPEMZONWLCSK-UHFFFAOYSA-N 0.000 claims 2
- 125000002769 thiazolinyl group Chemical group 0.000 claims 1
- 229920002050 silicone resin Polymers 0.000 abstract 3
- 230000035699 permeability Effects 0.000 abstract 1
- 239000011435 rock Substances 0.000 description 17
- 229920003023 plastic Polymers 0.000 description 12
- 239000004033 plastic Substances 0.000 description 12
- 230000000052 comparative effect Effects 0.000 description 10
- 239000000463 material Substances 0.000 description 10
- 230000000694 effects Effects 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- LDTAOIUHUHHCMU-UHFFFAOYSA-N 3-methylpent-1-ene Chemical compound CCC(C)C=C LDTAOIUHUHHCMU-UHFFFAOYSA-N 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 150000001345 alkine derivatives Chemical class 0.000 description 4
- 229910052796 boron Inorganic materials 0.000 description 4
- 238000002474 experimental method Methods 0.000 description 4
- 150000003376 silicon Chemical class 0.000 description 4
- 238000012360 testing method Methods 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 3
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 229910000062 azane Inorganic materials 0.000 description 3
- 239000000084 colloidal system Substances 0.000 description 3
- 238000009738 saturating Methods 0.000 description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 2
- UMVBXBACMIOFDO-UHFFFAOYSA-N [N].[Si] Chemical compound [N].[Si] UMVBXBACMIOFDO-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 230000018109 developmental process Effects 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- BDAGIHXWWSANSR-UHFFFAOYSA-N methanoic acid Natural products OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 2
- UHOVQNZJYSORNB-UHFFFAOYSA-N monobenzene Natural products C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 239000001301 oxygen Substances 0.000 description 2
- 229910052760 oxygen Inorganic materials 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000003786 synthesis reaction Methods 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- KAKZBPTYRLMSJV-UHFFFAOYSA-N vinyl-ethylene Natural products C=CC=C KAKZBPTYRLMSJV-UHFFFAOYSA-N 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OSWFIVFLDKOXQC-UHFFFAOYSA-N 4-(3-methoxyphenyl)aniline Chemical compound COC1=CC=CC(C=2C=CC(N)=CC=2)=C1 OSWFIVFLDKOXQC-UHFFFAOYSA-N 0.000 description 1
- ZDWQSEWVPQWLFV-UHFFFAOYSA-N C(CC)[Si](OC)(OC)OC.[O] Chemical compound C(CC)[Si](OC)(OC)OC.[O] ZDWQSEWVPQWLFV-UHFFFAOYSA-N 0.000 description 1
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 239000005864 Sulphur Substances 0.000 description 1
- HYLBVZVDIWDKJM-UHFFFAOYSA-N [O].C(CC)[Si](OC)(OC)OC.C(C1CO1)OCC1CO1 Chemical compound [O].C(CC)[Si](OC)(OC)OC.C(C1CO1)OCC1CO1 HYLBVZVDIWDKJM-UHFFFAOYSA-N 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 150000001335 aliphatic alkanes Chemical class 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- KGBXLFKZBHKPEV-UHFFFAOYSA-N boric acid Chemical compound OB(O)O KGBXLFKZBHKPEV-UHFFFAOYSA-N 0.000 description 1
- 239000004327 boric acid Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000003197 catalytic effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 235000019253 formic acid Nutrition 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000003301 hydrolyzing effect Effects 0.000 description 1
- FBAFATDZDUQKNH-UHFFFAOYSA-M iron chloride Chemical compound [Cl-].[Fe] FBAFATDZDUQKNH-UHFFFAOYSA-M 0.000 description 1
- UBJFKNSINUCEAL-UHFFFAOYSA-N lithium;2-methylpropane Chemical compound [Li+].C[C-](C)C UBJFKNSINUCEAL-UHFFFAOYSA-N 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 230000035882 stress Effects 0.000 description 1
- 230000001629 suppression Effects 0.000 description 1
- 238000004383 yellowing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J183/00—Adhesives based on macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon, with or without sulfur, nitrogen, oxygen, or carbon only; Adhesives based on derivatives of such polymers
- C09J183/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/06—Non-macromolecular additives organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/08—Macromolecular additives
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/08—Stabilised against heat, light or radiation or oxydation
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/03—Polymer mixtures characterised by other features containing three or more polymers in a blend
- C08L2205/035—Polymer mixtures characterised by other features containing three or more polymers in a blend containing four or more polymers in a blend
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
The invention discloses a thermal shock resistant high-refraction LED packaging glue composition and a preparation method thereof; the LED packaging glue composition is prepared from component A and component B at a weight ratio of 1:1; the component A is prepared from, by weight, 25-35 parts of methyl phenyl vinyl silicone resin, 10-20 parts of methyl phenyl vinyl silicone oil, 0.1-0.3 part of a catalyst, and 0.01-0.03 part of a heat resistant; the component B is prepared from, by weight, 5-15 parts of methyl phenyl vinyl silicone resin, 30-45 parts of methyl phenyl hydrogen-containing silicone resin, 0.02-0.1 part of an inhibitor, and 0.5-3 parts of an adhesion promoter. The invention belongs to the technical field of LED packaging and provides the LED packaging glue composition, having the excellent properties, such as adhesion, thermal shock resistance, permeability, refractivity and hardness, and capable of meeting the requirements of high-power LED packaging.
Description
Technical field
The invention belongs to the high refraction LED packaging plastic combination in LED encapsulation technology field, more particularly to a kind of cold-resistant thermal shock
Thing and preparation method thereof.
Background technology
LED is because having life-span length, energy-saving and environmental protection, it has also become the key project of global energy-saving and emission-reduction, highly energy-consuming
Electric filament lamp will be gradually backed out the arena of history.
At present, LED encapsulation material is mainly organosilicon material, and which has excellent thermostability, internal stress is little, do not turn yellow
Advantage.With the development of LED encapsulation technology, the requirement more and more higher to LED encapsulation material, the developing direction of LED encapsulation technology
Mainly include：North efficiency occurred frequently, high reliability, high heat-sinking capability and slimming.With high-power LED illuminating light source development and
Application, the requirement of high caloric value to aspects such as the intensity of package material profit, cold-resistant thermal shock, substrate bondings is gradually stepped up.
Cold-resistant thermal shock is the important indicator of the high refraction LED packaging plastic performance of assessment, the high refraction LED for putting goods on the market at present
The universal deviation of the cold-resistant thermal shock resistance properties of packaging plastic.Improve cold-resistant thermal shock method include to improve colloid to LED support base material and
The bonding force of reflective metal layer, and improve the heat resistance of colloid itself.
Chinese patent application CN104592932 discloses a kind of high power LED package glue composition, comprising component A have
Phenyl vinyl polysiloxane, MDQ resin, platinum catalyst are made, comprising B component hydrogeneous by high phenyl hydrogen-containing silicon oil or high phenyl
Silicones, viscosifier are made.Although LED encapsulation glue composition is with good refractive index and hardness, its saturating north property and resistance to
Thermal shock effect is still not ideal enough.
Chinese patent application CN103725249 discloses a kind of high index of refraction LED packaging silicon rubber, including the first component and
Two components, the first component is made up of methyl phenyl vinyl polysiloxane, methyl phenyl vinyl silicone oil, platinum group catalyst, and second
Component is made up of POSS modified silicon oil, methyl phenyl vinyl polysiloxane, methyl phenyl vinyl silicone oil and inhibitor.In encapsulation
Add a kind of addition of POSS modified silicon oil, POSS modified silicon oil both to effectively increase crosslink density in glue, improve to base again
Material bonding and thermostability, but the POSS modified silicon oil compatibility is poor, and reactivity is relatively low, seeks the saturating north for causing LED packaging plastic
Rate is low.
Therefore it provides a kind of while the high refraction LED packaging plastic with good bonding performance and cold-resistant thermal shock resistance properties has
Significant.
Content of the invention
For solving problems of the prior art, inventor is sieved to the component of LED packaging plastic by lot of experiments
Select and compounding, and corresponding adhesive property and cold-resistant thermal shock resistance properties etc. is investigated, it has been unexpectedly found that：By in component A
A small amount of iron content silazane coordination compound being added as heat-resistant agent, a small amount of Borosiloxane oligomer is added in B component as viscous
Accelerator is connect, obtained LED encapsulation glue composition has excellent adhesive property, cold-resistant thermal shock resistance properties, light transmittance, refractive index
With performances such as hardness, the requirement of high power LED package can be met.Based on above-mentioned discovery, so as to complete the present invention.
The purpose of the present invention will be further described in detail below reflect and description.
The present invention provides a kind of high refraction LED encapsulation glue composition of cold-resistant thermal shock, by component A and B component with 1: 1
Weight is than composition；Component A includes following component and its parts by weight：25～35 parts of methyl phenyl vinyl polysiloxane, methylbenzene
10～20 parts of base vinyl silicone oil, 0.1～0.3 part of catalyst, 0.01～0.03 part of heat-resistant agent；B component include following component and
Its parts by weight：30～45 parts of the hydrogeneous rock resin of 5～15 parts of methyl phenyl vinyl rock resin, aminomethyl phenyl, inhibitor 0.02
～0.1 part, 0.5～3 part of adhesion promoters.
Heat-resistant agent is used as by the iron content silazane coordination compound for adding a small amount of in component A, in B component, adds a small amount of boron
Silica a heatable brick bed oligomer significantly improves high refraction LED packaging plastic combination as adhesion promoters by the synergism of each component
The cementability of thing, cold-resistant thermal shock, the performance such as high temperature resistant, can meet the requirement of high power LED package.
Preferably, the component A includes following component and its parts by weight：Methyl phenyl vinyl polysiloxane 28～32
Part, 14～18 parts of methyl phenyl vinyl silicone oil, 0.1～0.3 part of catalyst, 0.01～0.03 part of heat-resistant agent；B component include as
Lower component and its parts by weight：32～40 parts of the hydrogeneous silicones of 8～12 parts of methyl phenyl vinyl polysiloxane, aminomethyl phenyl, suppression
0.02～0.08 part of preparation, 1～2 part of adhesion promoters.
It is highly preferred that the component A includes following component and its parts by weight：30 parts of methyl phenyl vinyl polysiloxane,
15 parts of methyl phenyl vinyl silicone oil, 0.2 part of catalyst, 0.02 part of heat-resistant agent；B component includes following component and its weight portion
Number：35 parts of the hydrogeneous silicones of 10 parts of methyl phenyl vinyl polysiloxane, aminomethyl phenyl, 0.05 part of inhibitor, adhesion promoters 1
Part.
Preferably, the heat-resistant agent is that iron content silazane coordination compound, its structural formula is：
The iron content silazane coordination compound is obtained with two silicon nitrogen a heatable brick bed of ring, iron chloride and tertiary butyl lithium as Material synthesis, with methyl phenyl vinyl
Base silicone oil has the good compatibility.
Iron content rock azane coordination compound is added to be used as heat-resistant agent, iron content rock nitrogen by encapsulating in glue composition in high refraction LED
Alkane coordination compound has gone up the organo-functional group of long-chain due to grafting, has the preferable compatibility with organosilicon systems, in pyroprocess
The middle free radical that can be quenched produced by polysiloxanes oxidation, suppresses the oxidation of side chain, significantly improves high refraction LED packaging plastic
Cold-hot impact effect.By many experiments, inventor has found that a small amount of iron content silazane coordination compound is remarkably improved high refraction
The cold-hot impact effect of LED packaging plastic, when the addition of iron content silazane coordination compound is more than 0.03 part, with 0.02 part of interpolation
When compare cold-hot impact effect improve limited, but light transmittance occur decline；When the addition of iron content silazane coordination compound is more than
When 0.2 part, the catalytic degradation due to excessive metal is acted on, and the cold-hot impact effect of high refraction LED packaging plastic can be caused to be deteriorated.
Preferably, the adhesion promoters are that Borosiloxane oligomer, its structural formula is：
The Borosiloxane oligomer is obtained with phenyltrimethoxysila,e, boric acid, phenol, hydrochloric acid as Material synthesis.The boron
Silica a heatable brick bed oligomer has the excellent compatibility, and its non-hydrolytic group has good affinity with polymer, PPA；Hydrolyzable
Group can be reacted with material with LED support reflection gold, solve a difficult problem for system cementability.Meanwhile, low by the Borosiloxane
Polymers is used cooperatively with iron content silicon nitrogen a heatable brick bed coordination compound, is further increased the resistance to elevated temperatures of colloid and is resisted cold-resistant thermal impact
Energy.
Add borosilicate oxygen a heatable brick bed oligomer to be used as adhesion promoters by encapsulating in glue composition in high refraction LED, solve
The problem of LED packaging plastic and substrate bonding, and water white transparency.
Preferably, the molecular formula of the methyl phenyl vinyl polysiloxane is (ViMeSiO1/2)a(ViPhSiO3/2)b, viscosity
For 500～20000cps, contents of ethylene 5%～8%, wherein, it is vinyl that Me is methyl, Vi, Ph be phenyl, a be 10～
30, b is 10～30.More preferably：It is 12～25 that a is 15～25, b..
Preferably, the molecular formula of the methyl phenyl vinyl silicone oil is (ViMe2PhSiO1/2)c(MePhSiO)d, viscosity
For 1000～30000cps, it is 10～50 for 5～12, b that contents of ethylene is 1%～5%, wherein a.It is highly preferred that b be 20～
45.
Preferably, the molecular formula of the hydrogeneous silicones of the aminomethyl phenyl is Me3SiO(PhHSiO)n(Me2SiO)mSiMe3, glue
Spend for 40～2000cps, hydrogen content is that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10～30 that 0.1%～0.5%, wherein it is 10.It is highly preferred that n be 8～
10, m is 15～20.
Preferably, the catalyst is platinum group catalyst, selected from 1,3- dimethyl -1,3- diphenyl -1,3- divinyl
Silica a heatable brick bed platinum complex, the platinum catalyst of tetrahydrofuran coordination, the platinum catalyst of methyl vinyl silicone coordination and adjacent benzene two
One or more in the platinum catalyst of formic acid diethylester coordination；
The inhibitor be methylpentynol, N, N, N, N- tetramethylethylenediamine, diallyl maleate and
1,3,5,7- tetravinyl -1, one or more in 3,5,7- tetramethyl cyclotetrasiloxane silica a heatable brick bed.
Correspondingly, present invention also offers the high refraction LED of cold-resistant thermal shock encapsulates the preparation method of glue composition, including
Following steps：
S1 prepares component A：Methyl phenyl vinyl rock resin and methyl phenyl vinyl silicone oil are weighed in reaction vessel,
Stir, heat-resistant agent and catalyst is added, is stirred, then vacuumizing and defoaming, obtain final product component A；
S2 prepares B component：The hydrogeneous rock resin of aminomethyl phenyl, methyl phenyl vinyl resin are weighed in another reaction vessel
In, stir, adhesion promoters and inhibitor is added, is stirred, then vacuumizing and defoaming, obtain final product B component；
Component A and B component are mixed by S3, vacuum defoamation, obtain the high refraction LED encapsulation glue composition of cold-resistant thermal shock.
During use, by the high refraction LED encapsulation glue composition dispensing of cold-resistant thermal shock or encapsulating in components and parts to be packaged
On, first 80 DEG C of heating 1h, transfer to 150 DEG C of heating 3h.
Compared with prior art, the invention has the beneficial effects as follows：The present invention is by adding a small amount of iron content silicon in component A
Nitrogen a heatable brick bed coordination compound adds a small amount of Borosiloxane oligomer as adhesion promoters, by each group as heat-resistant agent in B component
The synergism for dividing, the LED encapsulation glue composition for obtaining has excellent adhesive property, cold-resistant thermal shock resistance properties, heat-resisting quantity
Can, the saturating performance such as north rate, refractive index and hardness, the requirement of high power LED package can be met, specifically included：1. prepared by the present invention
High refraction LED encapsulation glue composition solidification after, the high-temperature baking of 300 DEG C/24h can be born, non yellowing is not cracked；2. solidify
Afterwards, after the sulphur ageing experiment of 80 DEG C/24h, light decay ＜ 3%；3., after solidifying, standing the impact experiment (- 40 of 600 bouts
DEG C/0.5h～100 DEG C/0.5h) after will not peel off from base material, invariant color, do sem observation using aobvious, becoming does not occur in gold thread
Shape, lights rear light decay ＜ 3%；4. after solidifying, 24h being heated in 260 DEG C of heating platforms, puts in 0 DEG C of frozen water rapidly and soak
10min, can also light after taking-up；5., after solidifying, 2h is boiled in red ink solution, not ink feed, not unsticking.
Specific embodiment
Below by specific embodiment, the present invention is described in further detail.
In the embodiment of the present invention, methyl phenyl vinyl polysiloxane, methyl phenyl vinyl silicone oil and aminomethyl phenyl are hydrogeneous
In rock resin corresponding a be 8, b be 25, c be 9, d be 20, m be 18, n be 9.
The high refraction LED encapsulation glue composition of embodiment one
High refraction LED encapsulation glue composition, is made up of with 1: 1 weight ratio component A and B component；Component A is included as the following group
Divide and its parts by weight：30 parts of methyl phenyl vinyl polysiloxane, 15 parts of methyl phenyl vinyl silicone oil, 1,3- dimethyl -1,
3- diphenyl -1,0.2 part of 3- divinyl silica a heatable brick bed platinum complex, 0.02 part of iron content rock azane coordination compound；B component includes as follows
Component and its parts by weight：35 parts of the hydrogeneous rock resin of 10 parts of methyl phenyl vinyl rock resin, aminomethyl phenyl, 3- methyl-1-pentene
0.05 part of alkynes -3- alcohol, 1 part of Borosiloxane oligomer.
Preparation method comprises the steps：Prepare component A：Weigh methyl phenyl vinyl polysiloxane and methyl phenyl vinyl
Base silicone oil is stirred in reaction vessel, is added heat-resistant agent and catalyst, is stirred, then vacuumizing and defoaming, obtain final product A
Component；Prepare B component：The hydrogeneous rock resin of aminomethyl phenyl, methyl phenyl vinyl resin are weighed in another reaction vessel, stirring
Uniformly, adhesion promoters and inhibitor is added, stirs, then vacuumizing and defoaming, obtain final product B component；By component A and B component
Mix, vacuum defoamation, obtain the high refraction LED encapsulation glue composition of cold-resistant thermal shock.
The high refraction LED encapsulation glue composition of embodiment two
High refraction LED encapsulation glue composition, is made up of with 1: 1 weight ratio component A and B component；Component A is included as the following group
Divide and its parts by weight：32 parts of methyl phenyl vinyl polysiloxane, 18 parts of methyl phenyl vinyl silicone oil, 1,3- dimethyl -1,
3- diphenyl -1,0.3 part of 3- divinylsiloxanes platinum complex, 0.02 part of iron content silazane coordination compound；B component includes as follows
Component and its parts by weight：40 parts of the hydrogeneous silicones of 12 parts of methyl phenyl vinyl polysiloxane, aminomethyl phenyl, 3- methyl-1-pentene
0.08 part of alkynes -3- alcohol, 1.5 parts of Borosiloxane oligomer.
Preparation method is with embodiment one.
Embodiment three-hypers refraction LED encapsulation glue composition
High refraction LED encapsulation glue composition, is made up of with 1: 1 weight ratio component A and B component；Component A is included as the following group
Divide and its parts by weight：28 parts of methyl phenyl vinyl polysiloxane, 14 parts of methyl phenyl vinyl silicone oil, 1,3- dimethyl -1,
3- diphenyl -1,0.2 part of 3- divinylsiloxanes platinum complex, 0.01 part of iron content rock azane coordination compound；B component includes as follows
Component and its parts by weight：32 parts of the hydrogeneous silicones of 8 parts of methyl phenyl vinyl polysiloxane, aminomethyl phenyl, 3- methyl-1-pentene
0.03 part of alkynes -3- alcohol, 1 part of Borosiloxane oligomer.
Preparation method is with embodiment one.
One LED of comparative example encapsulates glue composition
High refraction LED encapsulation glue composition, is made up of with 1: 1 weight ratio component A and B component；Component A is included as the following group
Divide and its parts by weight：30 parts of methyl phenyl vinyl polysiloxane, 15 parts of methyl phenyl vinyl silicone oil, 1,3- dimethyl -1,
3- diphenyl -1,0.2 part of 3- divinylsiloxanes platinum complex, 0.02 part of copper oxide；B component includes following component and its weight
Amount number：35 parts of the hydrogeneous rock resin of 10 parts of methyl phenyl vinyl rock resin, aminomethyl phenyl, methylpentynol 0.05
Part, 1 part of Borosiloxane oligomer.
Preparation method is with embodiment one.
Comparative example one is with the difference of embodiment one：In component A, iron content silazane coordination compound is changed into copper oxide.
Two LED of comparative example encapsulates glue composition
High refraction LED encapsulation glue composition, is made up of with 1: 1 weight ratio component A and B component；Component A is included as the following group
Divide and its parts by weight：30 parts of methyl phenyl vinyl polysiloxane, 15 parts of methyl phenyl vinyl silicone oil, 1,3- dimethyl -1,
3- diphenyl -1,0.2 part of 3- divinylsiloxanes platinum complex, 0.02 part of iron content silazane coordination compound；B component includes as follows
Component and its parts by weight：35 parts of the hydrogeneous rock resin of 10 parts of methyl phenyl vinyl rock resin, aminomethyl phenyl, 3- methyl-1-pentene
0.05 part of alkynes -3- alcohol, γ -1 part of glycidyl ether oxygen propyl trimethoxy silicon a heatable brick bed.
Preparation method is with embodiment one.
Comparative example two is with the difference of embodiment one：In B component, boron rock oxygen alkane oligomer is changed into γ-glycidyl ether
Oxygen propyl trimethoxy silicon a heatable brick bed.
Three LED of comparative example encapsulates glue composition
Will the encapsulation of LED as obtained in embodiment in CN103725249 three glue composition as a comparison case three.
Test example：The test effect of LED encapsulation glue composition
The LED packaging plastic group for respectively embodiment one, embodiment three, comparative example one, comparative example two and comparative example three being obtained
Compound dispensing or encapsulating are on components and parts to be packaged, and first 80 DEG C of heating 1h, transfer to 150 DEG C of heating 3h.Carry out northern rate,
The dead lamp rate of refractive index, thermal shock, the test of the aspect such as high temperature resistant, as a result as shown in table 1.
The thoroughly detection of the index such as north rate, refractive index, using relevant criterion method or industry conventional process, such as：Light transmittance
Determine with reference to the method in GB/T 2410-2008；The method for determining in reference GB/T6488-2008 of refractive index.
The test result of 1 difference LED of table encapsulation glue composition
As known from Table 1, the embodiment of the present invention one and LED encapsulation glue composition obtained in embodiment three have excellent bonding
The performance such as performance, cold-resistant thermal shock resistance properties, light transmittance, refractive index and hardness, can meet the requirement of high power LED package, cold
The dead lamp rate of thermal shock, the aspect such as high temperature resistant are better than comparative example one to comparative example three.Wherein, the resultant effect of embodiment one is optimal,
Therefore, embodiment one is highly preferred embodiment of the present invention.
Above content is further description made for the present invention with reference to specific preferred implementation, it is impossible to assert
Being embodied as of the present invention is confined to these explanations.For general technical staff of the technical field of the invention,
On the premise of present inventive concept, some simple deduction or replace can also be made, portion should be considered as belonging to the present invention's
Protection domain.
Claims (10)
1. the high refraction LED of cold-resistant thermal shock encapsulates glue composition, it is characterised in that：By component A and B component with 1: 1 weight
Than composition；Component A includes following component and its parts by weight：25～35 parts of methyl phenyl vinyl polysiloxane, aminomethyl phenyl second
10～20 parts of thiazolinyl silicone oil, 0.1～0.3 part of catalyst, 0.01～0.03 part of heat-resistant agent；B component includes following component and its weight
Amount number：30～45 parts of the hydrogeneous silicones of 5～15 parts of methyl phenyl vinyl polysiloxane, aminomethyl phenyl, inhibitor 0.02～0.1
Part, 0.5～3 part of adhesion promoters.
2. the high refraction LED of cold-resistant thermal shock according to claim 1 encapsulates glue composition, it is characterised in that：The A group
Dividing includes following component and its parts by weight：28～32 parts of methyl phenyl vinyl polysiloxane, methyl phenyl vinyl silicone oil 14
～18 parts, 0.1～0.3 part of catalyst, 0.01～0.03 part of heat-resistant agent；B component includes following component and its parts by weight：Methyl
32～40 parts of the hydrogeneous silicones of 8～12 parts of phenyl vinyl polysiloxane, aminomethyl phenyl, 0.02～0.08 part of inhibitor, bonding promote
Enter 1～2 part of agent.
3. the high refraction LED of cold-resistant thermal shock according to claim 2 encapsulates glue composition, it is characterised in that：The A group
Dividing includes following component and its parts by weight：30 parts of methyl phenyl vinyl polysiloxane, 15 parts of methyl phenyl vinyl silicone oil, urge
0.2 part of agent, 0.02 part of heat-resistant agent；B component includes following component and its parts by weight：Methyl phenyl vinyl polysiloxane 10
Part, 35 parts of the hydrogeneous silicones of aminomethyl phenyl, 0.05 part of inhibitor, 1 part of adhesion promoters.
4. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 3 encapsulates glue composition, and its feature exists
In：The heat-resistant agent is iron content silazane coordination compound, and its structural formula is：
5. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 3 encapsulates glue composition, it is characterised in that：
The adhesion promoters are Borosiloxane oligomer, and its structural formula is：
6. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 3 encapsulates glue composition, its feature
It is：The molecular formula of the methyl phenyl vinyl polysiloxane is (ViMeSiO1/2)a(ViPhSiO3/2)b, viscosity be 500～
20000cps, contents of ethylene 5%～8%, wherein, it is vinyl that Me is methyl, Vi, and it is 10 for 10～30, b that Ph is phenyl, a
～30.
7. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 3 encapsulates glue composition, its feature
It is：The methyl phenyl vinyl silicone oil molecular formula is (ViMe2PhSiO1/2)c(MePhSiO)d, viscosity be 1000～
30000cps, it is 10～50 for 5～12, d that contents of ethylene is 1%～5%, wherein c.
8. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 3 encapsulates glue composition, its feature
It is：The molecular formula of the hydrogeneous silicones of the aminomethyl phenyl is Me3SiO(PhHSiO)n(Me2SiO)mSiMe3, viscosity be 40～
2000cps, hydrogen content is that 0.1%～0.5%, wherein it is 10～30 that n is 5～12, m.
9. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 3 encapsulates glue composition, its feature
It is：The catalyst is platinum group catalyst, and selected from 1,3- dimethyl -1,3- diphenyl -1,3- divinylsiloxanes platinum is joined
Compound, the platinum catalyst of tetrahydrofuran coordination, the platinum catalyst of methyl vinyl silicone coordination and diethyl phthalate
One or more in the platinum catalyst of coordination；
The inhibitor is methylpentynol, N, N, N, N- tetramethylethylenediamine, diallyl maleate and 1,3,
5,7- tetravinyl -1, one or more in 3,5,7- tetramethyl cyclotetrasiloxane silica a heatable brick bed.
10. the high refraction LED of cold-resistant thermal shock according to any one of claim 1 to 9 encapsulates the preparation of glue composition
Method, it is characterised in that：Comprise the steps：
S1 prepares component A：Methyl phenyl vinyl polysiloxane and methyl phenyl vinyl silicone oil are weighed in reaction vessel, stirring
Uniformly, heat-resistant agent and catalyst is added, stirs, then vacuumizing and defoaming, obtain final product component A；
S2 prepares B component：The hydrogeneous silicones of aminomethyl phenyl, methyl phenyl vinyl resin are weighed in another reaction vessel, stir
Mix uniformly, adhesion promoters and inhibitor is added, is stirred, then vacuumizing and defoaming, obtain final product B component；
Component A and B component are mixed by S3, vacuum defoamation, obtain the high refraction LED encapsulation glue composition of cold-resistant thermal shock.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610851840.8A CN106433551A (en) | 2016-09-25 | 2016-09-25 | Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610851840.8A CN106433551A (en) | 2016-09-25 | 2016-09-25 | Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106433551A true CN106433551A (en) | 2017-02-22 |
Family
ID=58169679
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610851840.8A Pending CN106433551A (en) | 2016-09-25 | 2016-09-25 | Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106433551A (en) |
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286898A (en) * | 2017-05-19 | 2017-10-24 | 合肥市惠科精密模具有限公司 | A kind of resistance to vulcanization TFT LCD packaging silicon rubbers of high index of refraction |
| CN107353870A (en) * | 2017-07-26 | 2017-11-17 | 烟台德邦先进硅材料有限公司 | A kind of high folding LED packaging silicon rubbers with high air barrier |
| CN107722920A (en) * | 2017-11-08 | 2018-02-23 | 深圳市超硕电子有限公司 | A kind of bi-component heat conductive flame-retarding gel and preparation method thereof |
| CN109280536A (en) * | 2018-09-12 | 2019-01-29 | 烟台德邦先进硅材料有限公司 | A kind of LED packaging silicon rubber and preparation method thereof with high-adhesion and high sulfidation-resistance |
| CN110317556A (en) * | 2018-03-31 | 2019-10-11 | 深圳新宙邦科技股份有限公司 | A kind of LED packaging plastic and LED lamp bead |
| CN110511722A (en) * | 2019-08-23 | 2019-11-29 | 复旦大学 | A kind of resistance to TRANSIENT HIGH TEMPERATURE flexibility adhesive and preparation method thereof |
| CN110607162A (en) * | 2019-09-29 | 2019-12-24 | 烟台德邦科技有限公司 | LED packaging silica gel with high adhesion and high refractive index and preparation method thereof |
| CN112322251A (en) * | 2020-10-27 | 2021-02-05 | 复旦大学 | Thermosetting yellowing-resistant full-lamination special material and preparation method and application thereof |
| CN113265222A (en) * | 2021-05-27 | 2021-08-17 | 河南守真电子科技有限公司 | Polymer moisture-proof fireproof plugging composite material and use method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1443769A (en) * | 2002-03-08 | 2003-09-24 | 中国科学院化学研究所 | Polysilazane containing Zr and its preparation method |
| CN101230245A (en) * | 2007-12-20 | 2008-07-30 | 宁波安迪光电科技有限公司 | Gluewater for packaging light-emitting diode and uses thereof |
| CN102676113A (en) * | 2012-04-28 | 2012-09-19 | 烟台德邦先进硅材料有限公司 | Light-emitting diode (LED) packaging silica gel and preparation method thereof |
| CN103013431A (en) * | 2012-12-03 | 2013-04-03 | 烟台德邦先进硅材料有限公司 | High-refractivity LED (Light-Emitting Diode) package silica gel |
| CN103725249A (en) * | 2013-12-24 | 2014-04-16 | 烟台德邦先进硅材料有限公司 | LED (Light Emitting Diode) packaging silica gel with high refraction index |
| CN104151556A (en) * | 2013-05-13 | 2014-11-19 | 北京化工大学 | Preparation of polyborosiloxane and phenolic resin heat resistant modification method |
| CN104232009A (en) * | 2014-09-19 | 2014-12-24 | 中科院广州化学有限公司南雄材料生产基地 | Preparation method and application of vinyl MQ resin modified organosilicone packaging adhesive |
| CN104762057A (en) * | 2015-04-03 | 2015-07-08 | 肇庆皓明有机硅材料有限公司 | Organic silicon electronic packaging material and preparation method thereof |
| CN105111750A (en) * | 2015-09-09 | 2015-12-02 | 蓝星（成都）新材料有限公司 | Organosilicon sealant for LED (light-emitting diode) packaging |
-
2016
- 2016-09-25 CN CN201610851840.8A patent/CN106433551A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1443769A (en) * | 2002-03-08 | 2003-09-24 | 中国科学院化学研究所 | Polysilazane containing Zr and its preparation method |
| CN101230245A (en) * | 2007-12-20 | 2008-07-30 | 宁波安迪光电科技有限公司 | Gluewater for packaging light-emitting diode and uses thereof |
| CN102676113A (en) * | 2012-04-28 | 2012-09-19 | 烟台德邦先进硅材料有限公司 | Light-emitting diode (LED) packaging silica gel and preparation method thereof |
| CN103013431A (en) * | 2012-12-03 | 2013-04-03 | 烟台德邦先进硅材料有限公司 | High-refractivity LED (Light-Emitting Diode) package silica gel |
| CN104151556A (en) * | 2013-05-13 | 2014-11-19 | 北京化工大学 | Preparation of polyborosiloxane and phenolic resin heat resistant modification method |
| CN103725249A (en) * | 2013-12-24 | 2014-04-16 | 烟台德邦先进硅材料有限公司 | LED (Light Emitting Diode) packaging silica gel with high refraction index |
| CN104232009A (en) * | 2014-09-19 | 2014-12-24 | 中科院广州化学有限公司南雄材料生产基地 | Preparation method and application of vinyl MQ resin modified organosilicone packaging adhesive |
| CN104762057A (en) * | 2015-04-03 | 2015-07-08 | 肇庆皓明有机硅材料有限公司 | Organic silicon electronic packaging material and preparation method thereof |
| CN105111750A (en) * | 2015-09-09 | 2015-12-02 | 蓝星（成都）新材料有限公司 | Organosilicon sealant for LED (light-emitting diode) packaging |
Non-Patent Citations (2)
| Title |
|---|
| 卓昌明，等: "《塑料应用技术手册》", 31 May 2013, 机械工业出版社 * |
| 王孟钟，等主编: "《胶黏剂应用手册》", 30 November 1987, 化学工业出版社 * |
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107286898A (en) * | 2017-05-19 | 2017-10-24 | 合肥市惠科精密模具有限公司 | A kind of resistance to vulcanization TFT LCD packaging silicon rubbers of high index of refraction |
| CN107353870A (en) * | 2017-07-26 | 2017-11-17 | 烟台德邦先进硅材料有限公司 | A kind of high folding LED packaging silicon rubbers with high air barrier |
| CN107353870B (en) * | 2017-07-26 | 2020-08-14 | 烟台德邦科技有限公司 | High-folding LED packaging silica gel with high gas barrier property |
| CN107722920A (en) * | 2017-11-08 | 2018-02-23 | 深圳市超硕电子有限公司 | A kind of bi-component heat conductive flame-retarding gel and preparation method thereof |
| CN110317556A (en) * | 2018-03-31 | 2019-10-11 | 深圳新宙邦科技股份有限公司 | A kind of LED packaging plastic and LED lamp bead |
| CN110317556B (en) * | 2018-03-31 | 2021-01-01 | 深圳新宙邦科技股份有限公司 | LED packaging adhesive and LED lamp bead |
| CN109280536A (en) * | 2018-09-12 | 2019-01-29 | 烟台德邦先进硅材料有限公司 | A kind of LED packaging silicon rubber and preparation method thereof with high-adhesion and high sulfidation-resistance |
| CN110511722A (en) * | 2019-08-23 | 2019-11-29 | 复旦大学 | A kind of resistance to TRANSIENT HIGH TEMPERATURE flexibility adhesive and preparation method thereof |
| CN110607162A (en) * | 2019-09-29 | 2019-12-24 | 烟台德邦科技有限公司 | LED packaging silica gel with high adhesion and high refractive index and preparation method thereof |
| CN112322251A (en) * | 2020-10-27 | 2021-02-05 | 复旦大学 | Thermosetting yellowing-resistant full-lamination special material and preparation method and application thereof |
| CN112322251B (en) * | 2020-10-27 | 2021-12-07 | 复旦大学 | Thermosetting yellowing-resistant full-lamination special material and preparation method and application thereof |
| CN113265222A (en) * | 2021-05-27 | 2021-08-17 | 河南守真电子科技有限公司 | Polymer moisture-proof fireproof plugging composite material and use method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN106433551A (en) | Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof | |
| CN101880396B (en) | Preparation method of organic silicon rubber for encapsulating LED being convenient for vacuum defoamation | |
| CN102627859B (en) | Organosilicon resin composition and the optical semiconductor device prepared by said composition | |
| CN103013431B (en) | High-refractivity LED (Light-Emitting Diode) package silica gel | |
| CN101544833B (en) | Curable silicone rubber composition and semiconductor devices | |
| CN101107324B (en) | Silicone composition for encapsulating luminescent element and luminescent device | |
| CN102965069B (en) | A kind of resistance to sulfuration LED silica gel | |
| CN105176483B (en) | A kind of LED of resistance to vulcanization packaging silicon rubbers of high index of refraction high tenacity | |
| CN105400446B (en) | A kind of high refractive index LED liquid casting glue tackifier and preparation method thereof | |
| CN102532900B (en) | Organosilicon lens material for power type light-emitting diode (LED) packaging | |
| CN105315675A (en) | Ultraviolet light-curing composition | |
| CN102532915A (en) | Low gas permeable silicone resin composition and optoelectronic device | |
| JP2016529331A (en) | Curable silicone composition, cured product thereof, and optical semiconductor device | |
| WO2017028008A1 (en) | High-refractive-index, high-toughness and vulcanization-resistant led packaging silicone | |
| CN103881388A (en) | Curable Silicone Resin Composition, Cured Product Thereof And Photosemiconductor Apparatus | |
| CN102010598A (en) | Silicone composition and cured product thereof | |
| CN101475689A (en) | Preparation of methyl phenyl vinyl silicon resin | |
| CN102070996A (en) | Light emitting diode (LED) high-power encapsulation silica gel | |
| CN104761872A (en) | Organic silicon modified epoxy resin encapsulating material and preparation method thereof | |
| CN106010427A (en) | High-refractive-index high-toughness vulcanization-resistant LED packaging silica gel | |
| CN109762167A (en) | A kind of LED small-size chips heat conductive insulating die bond material and preparation method thereof | |
| CN103289096A (en) | Preparation method and application of polyhedral oligomeric silsesquioxane skeleton containing vinyl silicone oil | |
| CN109355059A (en) | A kind of the add-on type LED filament packaging silicon rubber and preparation method of high thixotropic | |
| CN106675504A (en) | Organic silicon rubber compound for large-power integral light-emitting diode (LED) packaging | |
| CN101665572A (en) | Organic silicon resin for encapsulating LED and preparation method thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170222 |
|
| RJ01 | Rejection of invention patent application after publication |