CN102676113A - Light-emitting diode (LED) packaging silica gel and preparation method thereof - Google Patents
Light-emitting diode (LED) packaging silica gel and preparation method thereof Download PDFInfo
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- CN102676113A CN102676113A CN2012101318722A CN201210131872A CN102676113A CN 102676113 A CN102676113 A CN 102676113A CN 2012101318722 A CN2012101318722 A CN 2012101318722A CN 201210131872 A CN201210131872 A CN 201210131872A CN 102676113 A CN102676113 A CN 102676113A
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Abstract
The invention relates to light-emitting diode (LED) packaging silica gel and a preparation method thereof. The LED packaging silica gel comprises a component A and a component B according to weight proportion as 1:1. The component A is composed of the following raw materials, by weight, 95-96 parts of vinyl resin, 0.1-0.3 part of catalyst and 3-5 parts of adhesive. The component B is composed of the following raw materials, by weight, 85-95 parts of vinyl resin, 5-15 parts of cross-linking agent, and 0.1-0.3 part of inhibitor. The LED packaging silica gel is good in adhesive performance on various LED base materials, exceeds 98% in transmissivity, and is convenient and easy to operate and good in storage stability.
Description
Technical field
The present invention relates to a kind of LED encapsulation silica gel and preparation method thereof, belong to the adhesive technology field.
Background technology
The led light source life-span is long, light efficiency is high, radiationless and reduce power consumption, and the backlight and the illumination that are widely used in various image displays, auto lamp and various electronic products are used etc., and the selection of its packaged material is most important to the performance impact of LED; Present used packaged material has high transparent materials such as epoxy resin, polymethylmethacrylate, glass, organosilicon, and epoxy resin and organosilicon material are as main packaged material, and the epoxy resin internal stress is excessive; Xanthochromia, high and low temperature resistance is poor, loss of properties on aging; And present organosilicon material, internal stress is little, and high and low temperature resistance is good; Xanthochromia not, transmittance also is higher than epoxy resin, but exist with substrate bonding property poor; Cause the encapsulation failure, perhaps the ageing-resistant performance degradation.
Summary of the invention
Technical problem to be solved by this invention provides a kind of LED encapsulation silica gel and preparation method thereof.
The technical scheme that the present invention solves the problems of the technologies described above is following: silica gel is used in a kind of LED encapsulation, is that 1: 1 A component and B component formed by weight proportion;
Said A component is made up of the raw material of following weight part: 95～96 parts of Vinylites, 0.1～0.3 part of catalyzer, 3～5 parts of caking agents;
Said B component is made up of the raw material of following weight part: 85～95 parts of Vinylites, 5～15 parts of linking agents, 0.1～0.3 part in suppressor factor;
The invention has the beneficial effects as follows: LED encapsulation silica gel of the present invention is made up of A, B component; The A component provides vinyl and special caking agent in reaction, the B component provides linking agent, and LED encapsulation silica gel of the present invention has sticking power such as metal, plastics, glass excellent; Transmittance surpasses 98%; Preparation technology is simple and easy to do, and excellent storage stability, is suitable for characteristics such as client's use.
On the basis of technique scheme, the present invention can also do following improvement.
Further, the viscosity of said Vinylite is 1000～20000 centipoises, and its structural formula is following:
Adopt the beneficial effect of above-mentioned further scheme to be:, can adjust different viscosity as matrix resin.
Further, said caking agent is the coupling agent that contains epoxy-functional, and its structural formula is following:
Structural formula one
Or
Structural formula two
Adopt the beneficial effect of above-mentioned further scheme to be: the adding of caking agent has improved the sticking power of silica gel to various LED base materials greatly;
Further, said linking agent is a polymethyl hydrogen siloxane, and its structural formula is following:
Further, said catalyzer is a platinum group catalyst; Said platinum group catalyst is any one in the alcoholic solution, platinum-vinyl siloxane complex, platinum-olefin(e)complex of Platinic chloride; The present invention is preferably platinum-vinyl siloxane complex, and content is 3000～7000ppm;
Further, said suppressor factor is alkynol class material, contain in alkylene annular siloxane oligopolymer, the benzotriazole any one, and the present invention is preferably the ethynylcyclohexanol in the alkynol class material.
Adopt the beneficial effect of above-mentioned further scheme to be: the adding of suppressor factor has improved the package stability of this LED encapsulation silica gel;
Another technical scheme that the present invention solves the problems of the technologies described above is following: a kind of preparation method of LED encapsulation silica gel comprises the preparation process of said A component and the preparation process of said B component; Wherein,
The preparation process of said A component is following: with parts by weight is 95～96 parts Vinylite, 0.1～0.3 part catalyzer, 3～5 parts caking agent, adds in the stirrer successively, and charges into nitrogen, and mixing and stirring promptly gets said A component;
The preparation process of said B component is following: with parts by weight is 85～95 parts Vinylite, 5～15 parts linking agent, 0.1～0.3 part suppressor factor, adds in the stirrer successively, and charges into nitrogen, and mixing and stirring promptly gets said B component;
During use, said A component, B component are mixed by weight the proportioning that is 1: 1, vacuum defoamation, some glue or encapsulating are heating and curing on to be packaged, get final product.
On the basis of technique scheme, the present invention can also do following improvement.
Further, the said nitrogen that charges into is: nitrogenous gas amasss the gas of percentage concentration more than 99%;
Further, the said vacuum defoamation time is 20～40 minutes, is preferably 30 minutes;
Further, the said condition that is heating and curing,, is preferably earlier 80 ℃ of heating 1 hour, again 150 ℃ of heating 2 hours again 100～200 ℃ of heating 1.5～2.5 hours 70～90 ℃ of heating 0.5～1.5 hour for earlier.
Embodiment
Below principle of the present invention and characteristic are described, institute gives an actual example and only is used to explain the present invention, is not to be used to limit scope of the present invention.
Embodiment 1
The preparation of A component: take by weighing vinyl polydisiloxane 95g, caking agent 5g (structural formula one), catalyzer platinum-vinyl siloxane complex 0.1g; Content 7000ppm adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen; Mixing and stirring promptly gets said A component;
The preparation of B component: take by weighing vinyl polydisiloxane 85g, linking agent polymethyl hydrogen siloxane 15g, suppressor factor ethynylcyclohexanol 0.2g adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen, and mixing and stirring promptly gets said B component;
During use, said A component, B component are mixed by weight the proportioning that is 1: 1, vacuum defoamation 20 minutes, some glue or encapsulating earlier 90 ℃ of heating 1.5 hours, 100 ℃ of heating 2.5 hours, get final product on to be packaged again.
Embodiment 2
The preparation of A component: take by weighing vinyl polydisiloxane 96g, caking agent 3g (structural formula two), catalyzer platinum-vinyl siloxane complex 0.3g; Content 3000ppm adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen; Mixing and stirring promptly gets said A component;
The preparation of B component: take by weighing vinyl polydisiloxane 95g, linking agent polymethyl hydrogen siloxane 5g, suppressor factor ethynylcyclohexanol 0.3g adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen, and mixing and stirring promptly gets said B component;
During use, said A component, B component are mixed by weight the proportioning that is 1: 1, vacuum defoamation 40 minutes, some glue or encapsulating earlier 70 ℃ of heating 0.5 hour, 200 ℃ of heating 1.5 hours, get final product on to be packaged again.
Embodiment 3
The preparation of A component: take by weighing vinyl polydisiloxane 95.8g, caking agent 4g (structural formula one), catalyzer platinum-vinyl siloxane complex 0.2g; Content 6000ppm adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen; Mixing and stirring promptly gets said A component;
The preparation of B component: take by weighing vinyl polydisiloxane 89.8g, linking agent polymethyl hydrogen siloxane 10g, suppressor factor ethynylcyclohexanol 0.1g adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen, and mixing and stirring promptly gets said B component;
Embodiment 4
The preparation of A component: take by weighing vinyl polydisiloxane 95.8g, caking agent 4g (structural formula two), catalyzer platinum-vinyl siloxane complex 0.2g; Content 6000ppm adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen; Mixing and stirring promptly gets said A component;
The preparation of B component: take by weighing vinyl polydisiloxane 89.8g, linking agent polymethyl hydrogen siloxane 10g, suppressor factor ethynylcyclohexanol 0.2g adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen, and mixing and stirring promptly gets said B component;
The comparative example 1
The preparation of A component: take by weighing vinyl polydisiloxane 98.8g, catalyzer platinum-vinyl siloxane complex 0.2g, content 6000ppm adds in the stirrer successively, and to charge into concentration be 99.9% nitrogen, and mixing and stirring promptly gets said A component;
The preparation of B component: take by weighing vinyl polydisiloxane 89.8g, linking agent polymethyl hydrogen siloxane 10g, suppressor factor ethynylcyclohexanol 0.2g, and to charge into concentration be 99.9% nitrogen, mixing and stirring promptly gets said B component;
With embodiment 3,4 and comparative example's 1 A, B component ratio weighing by weight 1: 1, mix then, deaeration 30 minutes, the one, mixture is coated onto on the PPA sheet; The 2nd, respectively 45# steel disc, aluminium flake, PPA (polypropylene adipate(PPA)) sheet are carried out the gluing overlap joint.Condition of cure: earlier 80 ℃ of heating 1 hour, again 150 ℃ of heating 2 hours.Test sticking power with scraper; The shearing resistance of test 45# steel disc, aluminium flake, PPA (polypropylene adipate(PPA)) sheet, testing method is with reference to GB/T7124-2008.
Table 1 performance index table
| Performance index sample | Embodiment 3 | Embodiment 4 | Comparative Examples 1 |
| Shearing resistance (the 45# steel, MPa) | 2.43 | 2.98 | 0.58 |
| Shearing resistance (aluminium flake, MPa) | 2.31 | 2.94 | 0.61 |
| Shearing resistance (the PPA sheet, MPa) | 2.26 | 2.85 | 0.45 |
| Transmittance (%) | 98.3 | 98.2 | 98.3 |
Show with scraper test sticking power experimental result; Adding the LED encapsulation silica gel of caking agent and the contact surface of scraper destroys serious; The LED encapsulation silica gel of adhesive-free and the contact surface of scraper are level and smooth, do not have and destroy, and explain that the adding of caking agent makes LED encapsulation silica gel sticking power of the present invention stronger.
Can find out that through table 1 adding of embodiment 3 and 4 two kinds of caking agents of embodiment has improved the sticking power of this LED encapsulation silica gel to each base material, with respect to the Comparative Examples of adhesive-free, its advantage is obvious, and transmittance is all above 98%.
The above is merely preferred embodiment of the present invention, and is in order to restriction the present invention, not all within spirit of the present invention and principle, any modification of being done, is equal to replacement, improvement etc., all should be included within protection scope of the present invention.
Claims (10)
1. LED encapsulation silica gel is characterized in that, is that 1: 1 A component and B component formed by weight proportion;
Said A component is made up of the raw material of following weight part: 95～96 parts of Vinylites, 0.1～0.3 part of catalyzer, 3～5 parts of caking agents;
Said B component is made up of the raw material of following weight part: 85～95 parts of Vinylites, 5～15 parts of linking agents, 0.1～0.3 part in suppressor factor.
2. LED encapsulation silica gel according to claim 1 is characterized in that the viscosity of said Vinylite is 1000～20000 centipoises, and its structural formula is following:
3. LED encapsulation silica gel according to claim 1 is characterized in that said caking agent is the coupling agent that contains epoxy-functional, and its structural formula is following:
Structural formula one
Or
Structural formula two.
4. LED encapsulation silica gel according to claim 1 is characterized in that said linking agent is a polymethyl hydrogen siloxane, and its structural formula is following:
5. LED encapsulation silica gel according to claim 1 is characterized in that said catalyzer is a platinum group catalyst; Said suppressor factor is alkynol class material, contain in alkylene annular siloxane oligopolymer, the benzotriazole any one.
6. LED according to claim 5 encapsulation silica gel is characterized in that, said platinum group catalyst is any one in the alcoholic solution, platinum-vinyl siloxane complex, platinum-olefin(e)complex of Platinic chloride; Said suppressor factor is an alkynol class material.
7. LED encapsulation silica gel according to claim 6 is characterized in that said platinum group catalyst is platinum-vinyl siloxane complex, and content is 3000～7000ppm; Said alkynol class material is an ethynylcyclohexanol.
8. the preparation method of a LED encapsulation silica gel is characterized in that, comprises the preparation process of A component and the preparation process of B component; Wherein,
The preparation process of said A component is following: with parts by weight is 95～96 parts Vinylite, 0.1～0.3 part catalyzer, 3～5 parts caking agent, adds in the stirrer successively, and charges into nitrogen, and mixing and stirring promptly gets said A component;
The preparation process of said B component is following: with parts by weight is 85～95 parts Vinylite, 5～15 parts linking agent, 0.1～0.3 part suppressor factor, adds in the stirrer successively, and charges into nitrogen, and mixing and stirring promptly gets said B component;
During use, said A component, B component are mixed by weight the proportioning that is 1: 1, vacuum defoamation, some glue or encapsulating are heating and curing on to be packaged, get final product.
9. the preparation method of LED encapsulation silica gel according to claim 8; It is characterized in that; The said nitrogen that charges into is: nitrogenous gas amasss the gas of percentage concentration more than 99%; The said vacuum defoamation time is 20～40 minutes, and the said condition that is heating and curing, heated 1.5～2.5 hours at 100～200 ℃ 70～90 ℃ of heating 0.5～1.5 hour for earlier again.
10. the preparation method of LED encapsulation silica gel according to claim 9 is characterized in that the said vacuum defoamation time is 30 minutes, and the said condition that is heating and curing, heated 2 hours at 150 ℃ 80 ℃ of heating 1 hour for earlier again.
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| CN102965069A (en) * | 2012-11-16 | 2013-03-13 | 烟台德邦先进硅材料有限公司 | Vulcanization-proof LED (light-emitting diode) packaging silica gel |
| CN103013491A (en) * | 2012-12-20 | 2013-04-03 | 杭州纳晶科技有限公司 | Silica gel fitting and fabrication method thereof, and LED lamp provided with silica gel fitting |
| CN103454049A (en) * | 2013-09-04 | 2013-12-18 | 东莞兆舜有机硅新材料科技有限公司 | Method for detecting sealing performance of LED packing glue |
| CN103627365A (en) * | 2013-11-26 | 2014-03-12 | 烟台德邦先进硅材料有限公司 | High-viscosity high-strength optical transparent organic silicon adhesive and preparation method thereof |
| CN103740274A (en) * | 2013-12-26 | 2014-04-23 | 惠州市永卓科技有限公司 | Automobile air bag restraint system coating material and preparation method thereof |
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| CN104531056A (en) * | 2015-01-22 | 2015-04-22 | 烟台德邦先进硅材料有限公司 | Organosilicone packaging glue for packaging LED lamp filament |
| CN104710964A (en) * | 2013-12-11 | 2015-06-17 | 佛山市新翔星化工有限公司 | LED packaged silica gel and preparation method thereof |
| CN104877623A (en) * | 2015-06-05 | 2015-09-02 | 烟台德邦先进硅材料有限公司 | High-adhesion and high-resilience organic silicone adhesive special for EMI (Electro Magnetic Interference) interface |
| CN106433551A (en) * | 2016-09-25 | 2017-02-22 | 肇庆皓明有机硅材料有限公司 | Thermal shock resistant high-refraction LED packaging glue composition and preparation method thereof |
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| CN109054732A (en) * | 2018-09-18 | 2018-12-21 | 烟台德邦先进硅材料有限公司 | A kind of LED packaging silicon rubber and preparation method thereof that adhesive property is excellent |
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| CN115667408A (en) * | 2020-05-26 | 2023-01-31 | 信越化学工业株式会社 | Two-liquid addition curing type silicone rubber composition |
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