CN105176483B - A kind of LED of resistance to vulcanization packaging silicon rubbers of high index of refraction high tenacity - Google Patents
A kind of LED of resistance to vulcanization packaging silicon rubbers of high index of refraction high tenacity Download PDFInfo
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Abstract
The present invention relates to a kind of LED packaging silicon rubbers, and in particular to a kind of LED packaging silicon rubbers of high index of refraction, belongs to field of adhesive technology.The LED packaging silicon rubbers of the high index of refraction of the present invention, including component A and B component, the weight ratio of the component A and B component is 10:1；Wherein, the component A includes the raw material components of following parts by weight：80~90 parts of methyl phenyl vinyl polysiloxane, 8~18 parts of vinyl-dimethyl base diphenylpolysiloxane, 0.1~0.3 part of platinum group catalyst, 1~5 part of bonding agent；The B component includes the raw material components of following parts by weight：40~60 parts of the hydrogeneous silicones of aminomethyl phenyl, hold hydrogeneous 40~60 parts of diphenylpolysiloxane, 0.1~0.3 part of inhibitor.The LED packaging silicon rubbers of the high index of refraction of the present invention have high hardness, resistance to vulcanization, excellent in adhesion, and the beneficial effects such as cold-resistant thermal shock resistance properties is excellent.
Description
Technical field
The present invention relates to a kind of LED packaging silicon rubbers of high index of refraction, more particularly to a kind of high index of refraction, resistance to vulcanization, resistance to
The LED packaging silicon rubbers of thermal shock, belong to field of adhesive technology.
Background technology
As LED is using more and more extensive, requirement to LED encapsulation material also more and more higher.The presently used package materials of LED
Material mainly has epoxy resin and organosilicon material, and epoxy resin internal stress is excessive, and xanthochromia, high and low temperature resistance is poor, resistance to ag(e)ing
Can be poor, and organosilicon material, internal stress are small, high and low temperature resistance is good, non yellowing, and combination property is substantially better than epoxy resin, because
This rapid substituted epoxy resin, is widely used in LED encapsulation fields.And the organosilicon of high index of refraction of the refractive index higher than 1.50
Glue, it is growing with its higher efficiency of light extraction, dosage.
With industrial expansion, the sulfur content in air increasingly increases, if encapsulating material selects improper, the sulphur in air
The silver layer of support can be corroded through encapsulating material or its bonding interface, form black silver sulfide, cause light decay drastically to increase
Add.Therefore this just brings new challenge to encapsulating material, it is necessary to improves sulfidation-resistance energy.
Between although the LED packaging silicon rubbers refractive index of current domestic high index of refraction can reach 1.50~1.55, by
In, generally using the cooperation such as silicones, vinyl silicone oil, containing hydrogen silicone oil is contained, silicones relative amount is low, hands in formula design
It is low to join density, and adhesive effect is undesirable, so cause poor, the bonding interface destructible etc. of resistance to vulcanization, and high silicones content,
Although the LED packaging silicon rubbers sulfidation-resistance of high crosslink density can improve, because of its too high internal stress, the toughness of material can be caused
Reduce, react phenomena such as dead lamp of high/low temperature thermal shock in use, encapsulating material cracking, bonding interface fail.
The content of the invention
In view of the deficiencies of the prior art, the present invention provides a kind of LED packaging silicon rubbers of high index of refraction, have hardness high, resistance to
It is vulcanization, excellent in adhesion, and the beneficial effects such as cold-resistant thermal shock resistance properties is excellent.
The technical scheme that the present invention solves above-mentioned technical problem is as follows：A kind of high index of refraction LED packaging silicon rubbers, including A groups
Point and B component, the weight ratio of the component A and B component be 10:1；
Wherein, the raw material composition and ratio of the component A are as follows：
The raw material composition and ratio of the B component are as follows：
The hydrogeneous parts by weight of silicones 40~60 of aminomethyl phenyl；
Hold the hydrogeneous parts by weight of diphenylpolysiloxane 40~60；
The parts by weight of inhibitor 0.1~0.3.
On the basis of above-mentioned technical proposal, the present invention can also do following improvement.
Further, the molecular formula of the methyl phenyl vinyl polysiloxane is (ViMe2SiO1/2)x(PhSiO3/2)y, wherein,
The Me is methyl, and Vi is vinyl, and Ph is phenyl, x：Y=1:3.5~5.
The beneficial effect of scheme is, as matrix resin, is a kind of silicones using above-mentioned further, containing vinyl,
Product strength and hardness are improved, improves sulfidation-resistance energy.
Further, the molecular formula of the vinyl-dimethyl base diphenylpolysiloxane is：(ViMe2SiO1/2)a
(ViMePh2SiO1/2)b, wherein, the Me is methyl, and Vi is vinyl, and Ph is phenyl, 10≤a≤70,10≤b≤70, and
a：B=1:1.
Beneficial effect using above-mentioned further scheme is that the addition of vinyl-dimethyl base diphenylpolysiloxane provides
The vinyl of reaction can be participated in, reduces the stress after system solidification, improves the performance of cold-resistant thermal shock.
Further, the structural formula of described bonding agent is：
The bonding agent of the present invention contains epoxy radicals and alkoxy-functional, and its structural formula is as implied above.The addition of bonding agent,
Encapsulating material is improved to plastics and the cementability of metal base, and the presence of ring body, further increase polymer resistant to sulfur
Change performance.
Further, the platinum group catalyst is platinum-methyl phenyl silicone complex or platinum-olefin complex.
Preferably, the platinum group catalyst is platinum-methyl phenyl silicone complex, and platinum content be 3000~
10000ppm。
Further, the molecular formula of the hydrogeneous silicones of the aminomethyl phenyl is：(HMe2SiO1/2)3(MePhSiO1/2)n
(PhSiO3/2)4, wherein, the Me is methyl, and Ph is phenyl, 4≤n≤6.
Be using the above-mentioned further beneficial effect of scheme, the hydrogeneous silicones of aminomethyl phenyl of the invention as crosslinking agent,
And a kind of hydrogeneous silicones, it provide not only active hydrogen and participate in cross-linking reaction, improve crosslink density, D chain links
(MePhSiO1/2) presence, improve the toughness of whole system, improve cold-resistant thermal shock resistance properties, and viscosity is low, for whole
Individual system plays viscosity reduction, the effect that intensity, toughness improve.
Further, the molecular formula of the hydrogeneous diphenylpolysiloxane in the end is：(HMe2SiO1/2)1(Ph2SiO1/2)m, its
In, the Me is methyl, and Ph is phenyl, 4≤m≤6.
Beneficial effect using above-mentioned further scheme is that the hydrogeneous diphenylpolysiloxane in end of the invention is as chain extension
Agent, it provide not only active hydrogen and participate in chain extending reaction, improve crosslink density, improve the toughness of polymer, improve cold-resistant
Thermal shock resistance properties, and viscosity is low, and viscosity reduction, the effect that intensity, toughness improve are played for whole system.
Further, the inhibitor is selected from ethynylcyclohexanol or 1,1,3- triphenyl -2- propine -1- alcohol.
Preferably, the inhibitor is 1,1,3- triphenyl -2- propine -1- alcohol, and its structural formula is：
Second aspect of the present invention discloses the method for preparing foregoing high index of refraction LED packaging silicon rubbers, includes the preparation of component A
The preparation process of step and B component；Wherein,
1) preparation process of the component A is as follows：By 80~90 parts of methyl phenyl vinyl polysiloxane, vinyl-dimethyl base
8~18 parts of diphenylpolysiloxane, 0.1~0.3 part of platinum group catalyst, 1~5 part of bonding agent are sequentially added in mixer, stirring 3
~5h, it is well mixed and obtains component A；
2) preparation process of the B component is as follows：By 40~60 parts of the hydrogeneous silicones of aminomethyl phenyl, hydrogeneous diphenyl is held to gather
40~60 parts of siloxanes, 0.1~0.3 part of inhibitor are sequentially added in mixer, stir 3~5h, are well mixed and are obtained B component.
Third aspect present invention discloses the application method of foregoing high index of refraction LED encapsulation silicon, for by the component A and B
Component is 10 by weight:1 proportioning is well mixed, vacuum defoamation 20~40 minutes, and dispensing or encapsulating are on part to be packaged, first
Heat 0.5~1.5 hour, then heated 3~5 hours at 100~200 DEG C, solidification at 100~120 DEG C.
The beneficial effects of the invention are as follows：The LED packaging silicon rubbers of high index of refraction of the present invention are made up of A, B component, and component A is anti-
Resin, vinyl, catalyst and the bonding agent of high intensity are provided in answering, B component provides resin, crosslinking agent, the chain extension of high intensity
Agent and inhibitor, the LED packaging silicon rubbers of high index of refraction of the invention, in addition to vinyl polysiloxane, its curing agent is methyl
The hydrogeneous silicones of phenyl is with holding hydrogeneous diphenylpolysiloxane to be engaged, the content increase of silicones, meanwhile, add silicones
In phenyl content；In addition, further increasing crosslink density, the hardness of product is improved, improves sulfidation-resistance energy, and
The bonding agent of special construction is with the addition of, so as to excellent to base material adhesive force after solidifying.Using silicones and suitable polysiloxanes phase
With reference to crosslinking agent is combined with chain extender, is reduced the internal stress of the material after solidification, good interfacial adhesion, is improved production
The performance and resistance to elevated temperatures of the cold-resistant thermal shock of product.
Embodiment
The principles and features of the present invention are described below, and the given examples are served only to explain the present invention, is not intended to limit
Determine the scope of the present invention.
Embodiment 1
1. raw material
Methyl phenyl vinyl polysiloxane：(ViMe2SiO1/2)(PhSiO3/2)5；
Vinyl-dimethyl base diphenylpolysiloxane：(ViMe2SiO1/2)10(ViMePh2SiO1/2)10；
Platinum group catalyst is platinum-methyl phenyl silicone complex；
The hydrogeneous silicones of aminomethyl phenyl：(HMe2SiO1/2)3(MePhSiO1/2)5(PhSiO3/2)4；
Hold hydrogeneous diphenylpolysiloxane：(HMe2SiO1/2)1(Ph2SiO1/2)4；
Inhibitor is ethynylcyclohexanol.
2. preparation method
The preparation of component A：Weigh 80 parts of methyl phenyl vinyl polysiloxane, vinyl-dimethyl base diphenylpolysiloxane 18
Part, 0.1 part of platinum group catalyst, 2.9 parts of bonding agent sequentially adds mixing 3h in mixer and stirred, and produces the component A；
The preparation of B component：40 parts of the hydrogeneous silicones of dimethyl diphenyl is weighed, holds hydrogeneous diphenylpolysiloxane 59.8
Part, inhibitor 1,1,0.2 part of 3- triphenyl -2- propine -1- alcohol.Sequentially add in mixer, mixing 3h stirs, and produces institute
State B component；
In use, it is 10 by weight by the component A, B component:1 proportioning is well mixed, vacuum defoamation 20 minutes,
Dispensing or encapsulating first heat 1 hour, then heated 4 hours at 150 DEG C on part to be packaged at 120 DEG C, you can.
Embodiment 2
1. raw material
Methyl phenyl vinyl polysiloxane：(ViMe2SiO1/2)(PhSiO3/2)3.5；
Vinyl-dimethyl base diphenylpolysiloxane：(ViMe2SiO1/2)70(ViMePh2SiO1/2)70；
Platinum group catalyst is platinum-olefin complex；
The hydrogeneous silicones of aminomethyl phenyl：(HMe2SiO1/2)3(MePhSiO1/2)4(PhSiO3/2)4；
Hold hydrogeneous diphenylpolysiloxane：(HMe2SiO1/2)1(Ph2SiO1/2)5；
Inhibitor is 1,1,3- triphenyl -2- propine -1- alcohol.
2. preparation method
The preparation of component A：Weigh 90 parts of methyl phenyl vinyl polysiloxane, vinyl-dimethyl base diphenylpolysiloxane 8
Part, 0.3 part of platinum group catalyst, 1.0 parts of bonding agent sequentially adds mixing 5h in mixer and stirred, and produces the component A；
The preparation of B component：60 parts of the hydrogeneous silicones of dimethyl diphenyl is weighed, holds hydrogeneous diphenylpolysiloxane 39.7
Part, 0.3 part of inhibitor.Sequentially add in mixer, mixing 5h stirs, and produces the B component；
In use, it is 10 by weight by the component A, B component:1 proportioning is well mixed, vacuum defoamation 40 minutes,
Dispensing or encapsulating first heat 1.5 hours, then heated 5 hours at 100 DEG C on part to be packaged at 100 DEG C, you can.
Embodiment 3
1. raw material
Methyl phenyl vinyl polysiloxane：(ViMe2SiO1/2)2(PhSiO3/2)8；
Vinyl-dimethyl base diphenylpolysiloxane：(ViMe2SiO1/2)40(ViMePh2SiO1/2)40；
Platinum group catalyst is platinum-methyl phenyl silicone complex；
The hydrogeneous silicones of aminomethyl phenyl：(HMe2SiO1/2)3(MePhSiO1/2)6(PhSiO3/2)4；
Hold hydrogeneous diphenylpolysiloxane：(HMe2SiO1/2)1(Ph2SiO1/2)6；
Inhibitor is 1,1,3- triphenyl -2- propine -1- alcohol.
2. preparation method
The preparation of component A：Weigh 85 parts of methyl phenyl vinyl polysiloxane, vinyl-dimethyl base diphenylpolysiloxane
9.8 parts, 0.2 part of platinum group catalyst, 5 parts of bonding agent is sequentially added in mixer, and mixing 4h, which stirs, produces the component A；
The preparation of B component：50 parts of the hydrogeneous silicones of dimethyl diphenyl is weighed, holds hydrogeneous diphenylpolysiloxane 49.9
Part, 0.1 part of inhibitor.Sequentially add in mixer, mixing 4h stirs, and produces the B component；
In use, it is 10 by weight by the component A, B component:1 proportioning is well mixed, vacuum defoamation 20 minutes,
Dispensing or encapsulating first heat 0.5 hour, then heated 3 hours at 200 DEG C on part to be packaged at 120 DEG C, you can.
Comparative example 1
1. raw material forms
Methyl phenyl vinyl polysiloxane：(ViMe2SiO1/2)(PhSiO3/2)5；
Platinum group catalyst is platinum-methyl phenyl silicone complex；
Bonding agent (bonding agent of the present invention)
The hydrogeneous silicones of aminomethyl phenyl：(HMe2SiO1/2)3(MePhSiO1/2)5(PhSiO3/2)4；
Inhibitor is ethynylcyclohexanol.
2. preparation method
The preparation of component A：Weigh 97 parts of methyl phenyl vinyl polysiloxane, 0.2 part of platinum group catalyst, 2.8 parts of bonding agent
Sequentially add in mixer, be mixed evenly and produce the component A；
The preparation of B component：Weigh 98.8 parts of the hydrogeneous silicones of dimethyl diphenyl, 0.2 part of inhibitor.Sequentially add stirring
In machine, it is mixed evenly, produces the B component；
In use, it is 10 by weight by the component A, B component:1 proportioning is well mixed, vacuum defoamation 20 minutes,
Dispensing or encapsulating first heat 1 hour, then heated 4 hours at 150 DEG C on part to be packaged at 120 DEG C, you can.
Comparative example 2
1. raw material forms
Vinyl-dimethyl base diphenylpolysiloxane：(ViMe2SiO1/2)70(ViMePh2SiO1/2)70；
Platinum group catalyst is platinum-olefin complex；
Bonding agent (bonding agent of the present invention)
Hold hydrogeneous diphenylpolysiloxane：(HMe2SiO1/2)1(Ph2SiO1/2)5；
Inhibitor is 1,1,3- triphenyl -2- propine -1- alcohol.
2. preparation method
The preparation of component A：Weigh 97 parts of vinyl-dimethyl base diphenylpolysiloxane, 0.2 part of platinum group catalyst, bonding agent
2.8 parts sequentially add in mixer, are mixed evenly and produce the component A；
The preparation of B component：Weigh hydrogeneous 98.8 parts of the diphenylpolysiloxane in end, 0.2 part of inhibitor.Sequentially add mixer
It is interior, it is mixed evenly, produces the B component；
In use, it is 10 by weight by the component A, B component:1 proportioning is well mixed, vacuum defoamation 20 minutes,
Dispensing or encapsulating first heat 1 hour, then heated 4 hours at 150 DEG C on part to be packaged at 120 DEG C, you can.
Comparative example 3
1. raw material forms
Methyl phenyl vinyl polysiloxane：(ViMe2SiO1/2)2(PhSiO3/2)8；
Vinyl-dimethyl base diphenylpolysiloxane：(ViMe2SiO1/2)40(ViMePh2SiO1/2)10；
Platinum group catalyst is platinum-methyl phenyl silicone complex；
The hydrogeneous silicones of aminomethyl phenyl：(HMe2SiO1/2)3(MePhSiO1/2)6(PhSiO3/2)4；
Hold hydrogeneous diphenylpolysiloxane：(HMe2SiO1/2)1(Ph2SiO1/2)6；
Inhibitor is 1,1,3- triphenyl -2- propine -1- alcohol.
2. preparation method
The preparation of component A：Weigh 85 parts of methyl phenyl vinyl polysiloxane, vinyl-dimethyl base diphenylpolysiloxane
14.8 parts, 0.2 part of platinum group catalyst is sequentially added in mixer, is mixed evenly and is produced the component A；
The preparation of B component：50 parts of the hydrogeneous silicones of dimethyl diphenyl is weighed, holds hydrogeneous diphenylpolysiloxane 49.8
Part, 0.2 part of inhibitor.Sequentially add in mixer, be mixed evenly, produce the B component；
In use, it is 10 by weight by the component A, B component:1 proportioning is well mixed, vacuum defoamation 20 minutes,
Dispensing or encapsulating first heat 1 hour, then heated 4 hours at 150 DEG C on part to be packaged at 120 DEG C, you can.
Test method：First, test piece is made according to GB2411-1980 (1989) plastics shore hardness test method；2nd, encapsulate
2835 supports, reference color temperature is kept between 5500~6000K.Condition of cure：First heated 1 hour at 120 DEG C, then at 150 DEG C
Heating 4 hours.Test one：Specimen hardness is tested according to GB2411-1980 (1989) plastics shore hardness test method；Test
Two：With 50% ethanol solution red ink, 2835 supports that package curing finishes are put into, after 80 DEG C are placed 2 hours, observe red ink
Water penetration phenomenon；Test three：2835 supports that package curing finishes are placed in closed glass jar bottom 2g sulphur powders, bottle center, test
80 DEG C of luminous fluxes before and after 8 hours, calculate luminous flux conservation rate；Test four：2835 supports that package curing finishes are put into cold and hot punching
Case is hit, temperature -40~125 DEG C, 3min/30min, 1 circulation per hour, tests dead lamp rate after 200 circulations.
The performance indications table of table 1
It can be seen from Table 1 that although embodiment 1,2,3 can be seen that compared with comparative example 1, resin content is high to be carried
High hardness, improves resistance to vulcanization, but cold-resistant thermal shock resistance properties declines；Embodiment 1,2,3 can be with compared with comparative example 2
Find out, although cold-resistant thermal shock resistance properties is excellent for pure polymeric siloxane systems, but sulfidation-resistance can be very poor；Embodiment 1,2,3 with it is right
Compare than embodiment 3 as can be seen that being not added with bonding agent, encapsulating material is poor to substrate bonding, can cause red ink seepage, resistant to sulfur
Change and decline.
The foregoing is only presently preferred embodiments of the present invention, be not intended to limit the invention, it is all the present invention spirit and
Within principle, any modification, equivalent substitution and improvements made etc., it should be included in the scope of the protection.
Claims (2)
1. a kind of high index of refraction LED packaging silicon rubbers, including component A and B component, the weight ratio of the component A and B component is 10:
1；Wherein,
The raw material composition and ratio of the component A are as follows：
The raw material composition and ratio of the B component are as follows：
The hydrogeneous parts by weight of silicones 40~60 of aminomethyl phenyl；
Hold the hydrogeneous parts by weight of diphenylpolysiloxane 40~60；
The parts by weight of inhibitor 0.1~0.3.
The molecular formula of the methyl phenyl vinyl polysiloxane is (ViMe2SiO1/2)x(PhSiO3/2)y, wherein, the Me is first
Base, Vi are vinyl, and Ph is phenyl, x：Y=1:3.5~5；
The molecular formula of the vinyl-dimethyl base diphenylpolysiloxane is：(ViMe2SiO1/2)a(ViMePh2SiO1/2)b, wherein,
The Me is methyl, and Vi is vinyl, and Ph is phenyl, 10≤a≤70,10≤b≤70, and a：B=1:1；
The platinum group catalyst is platinum-methyl phenyl silicone complex or platinum-olefin complex；Platinum-the aminomethyl phenyl
Platinum content is 3000~10000ppm in polysiloxanes complex；
The structural formula of described bonding agent is：
The molecular formula of the hydrogeneous silicones of aminomethyl phenyl is：(HMe2SiO1/2)3(MePhSiO1/2)n(PhSiO3/2)4, wherein, institute
It is methyl to state Me, and Ph is phenyl, 4≤n≤6；
The molecular formula of the hydrogeneous diphenylpolysiloxane in end is：(HMe2SiO1/2)1(Ph2SiO1/2)m, wherein, the Me is first
Base, Ph are phenyl, 4≤m≤6；
The inhibitor is selected from ethynylcyclohexanol or 1,1,3- triphenyl -2- propine -1- alcohol.
2. the preparation method of high index of refraction LED packaging silicon rubbers described in claim 1, including the preparation process of component A and B component
Preparation process；Wherein,
1) preparation of component A：By 80~90 parts of methyl phenyl vinyl polysiloxane, vinyl-dimethyl base diphenylpolysiloxane 8
~18 parts, 0.1~0.3 part of platinum group catalyst, 1~5 part of bonding agent is sequentially added in mixer, stirs 3~5h, well mixed to obtain
Obtain component A；
2) preparation of B component：By 40~60 parts of the hydrogeneous silicones of aminomethyl phenyl, hydrogeneous 40~60 parts of diphenylpolysiloxane is held,
0.1~0.3 part of inhibitor is sequentially added in mixer, stirs 3~5h, is well mixed and is obtained B component.
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| CN201510497925.6A CN105176483B (en) | 2015-08-14 | 2015-08-14 | A kind of LED of resistance to vulcanization packaging silicon rubbers of high index of refraction high tenacity |
| TW105114089A TWI595052B (en) | 2015-08-14 | 2016-05-06 | A?led silicone encapsulant with high refractive index |
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| CN201510497925.6A CN105176483B (en) | 2015-08-14 | 2015-08-14 | A kind of LED of resistance to vulcanization packaging silicon rubbers of high index of refraction high tenacity |
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| CN105567105B (en) * | 2015-12-30 | 2018-03-16 | 天津德高化成光电科技有限责任公司 | High index of refraction wafer-level package LED white chips fluorescent coating and preparation method |
| KR102473676B1 (en) * | 2016-01-21 | 2022-12-01 | 삼성전자주식회사 | Composition for optical film, optical films, antireflection films and display device |
| CN106010427B (en) * | 2016-06-28 | 2019-03-29 | 烟台德邦科技有限公司 | A kind of resistance to vulcanization LED packaging silicon rubber of high refractive index high tenacity |
| CN106784270A (en) * | 2016-11-21 | 2017-05-31 | 深圳市佑明光电有限公司 | A kind of method of the resistance to vulcanization uv-resistance energy of the organosilicon material of raising LED encapsulation |
| CN108285644B (en) * | 2017-01-09 | 2021-03-16 | 青岛科技大学 | LED packaging liquid silicone rubber composition and preparation method thereof |
| CN106978133A (en) * | 2017-04-21 | 2017-07-25 | 广州惠利电子材料有限公司 | LED packaging silicon rubbers and its preparation method and application |
| CN107353870B (en) * | 2017-07-26 | 2020-08-14 | 烟台德邦科技有限公司 | High-folding LED packaging silica gel with high gas barrier property |
| CN109280536B (en) * | 2018-09-12 | 2021-05-04 | 烟台德邦科技股份有限公司 | LED packaging silica gel with high cohesiveness and high sulfuration resistance and preparation method thereof |
| CN109628061B (en) * | 2018-11-12 | 2021-07-13 | 烟台德邦科技股份有限公司 | Medium-refractive-index vulcanization-resistant LED packaging silica gel |
| CN109536125B (en) * | 2018-12-07 | 2021-05-04 | 烟台德邦科技股份有限公司 | Organic silicon LED packaging adhesive and preparation method thereof |
| TWI724932B (en) * | 2020-06-24 | 2021-04-11 | 朱宥豪 | Glue for molding and packaging led and method for using the same (一) |
| CN112251190B (en) * | 2020-09-10 | 2022-08-19 | 烟台德邦科技股份有限公司 | LED packaging adhesive composition |
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| CN103805128A (en) * | 2012-11-15 | 2014-05-21 | 烟台德邦先进硅材料有限公司 | Adhesive for high-refractive index LED (Light Emitting Diode) package glue and adhesive synthesizing method |
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| CN103013431A (en) * | 2012-12-03 | 2013-04-03 | 烟台德邦先进硅材料有限公司 | High-refractivity LED (Light-Emitting Diode) package silica gel |
| CN103980714A (en) * | 2014-06-04 | 2014-08-13 | 烟台利诺电子科技有限公司 | High-refraction-index LED (Light Emitting Diode) organic silicon packaging material and preparation method thereof |
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| CN105176483A (en) | 2015-12-23 |
| TW201706366A (en) | 2017-02-16 |
| TWI595052B (en) | 2017-08-11 |
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