CN108124406A - Radiator - Google Patents
Radiator Download PDFInfo
- Publication number
- CN108124406A CN108124406A CN201611075227.8A CN201611075227A CN108124406A CN 108124406 A CN108124406 A CN 108124406A CN 201611075227 A CN201611075227 A CN 201611075227A CN 108124406 A CN108124406 A CN 108124406A
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- Prior art keywords
- thermal column
- radiator
- heat
- jack
- thermal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
- H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff
- H05K7/20463—Filling compound, e.g. potted resin
Abstract
A kind of radiator, to solve the problems such as existing radiator height manufactures cost.The radiator of the present invention, to be installed in a fever object, which includes：One heat conducting base, the heat conducting base are equipped with multiple jacks, which contacts at the heat source of the fever object, and at least one hot zone is defined at the heat source；And multiple thermal columns, the plurality of thermal column are arranged on the hot zone, and the plurality of thermal column is planted be positioned in corresponding jack respectively, and the outer circumferential surface of each thermal column sets that there are one heat conduction silicones.
Description
Technical field
The present invention is on a kind of radiator, especially a kind of heat dissipation dress that thermal column can be set according to heat source generating region
It puts.
Background technology
Since the electronic building brick in electronic product can generate fever phenomenon in running, for a long time, many electronics
Radiator is all equiped in product, by way of heat transfer, generated thermal energy band when electronic product is operated by radiator
It walks, electronic product is made to be maintained stable running.Wherein, the radiator structure of general radiator is mostly radiating fin or thermal column,
But electronic product is lightening in recent years and high performance development trend so that heating temp when electronic product operates improves, and adds
Upper heat-dissipating space such as is limited at the factors, depends the radiating fin on radiator alone or thermal column has been not enough to effectively radiate, often result in heat
The phenomenon that siltation, makes electronic product easily generate the situation of functional lability, influences the reliability of electronic product or even heat occurs
When the machine the problems such as.
Fig. 1 is refer to, is a kind of existing radiator 9, there are one pedestals 91 and more for existing radiator 9 tool
A cooling fin 92, the end face of the pedestal 91 are convexly equipped with multiple thermal columns 911, and each cooling fin 92 is equipped with can be with the plurality of thermal column
911 be in the corresponding multiple perforates 921 of close-fitting, makes the plurality of cooling fin 92 that can sequentially match and is inserted in the plurality of thermal column 911；Cause
This, the plurality of cooling fin 92 can further increase the heat dissipation area of the radiator 9, the effect of reaching improving heat radiation efficiency.
TaiWan, China bulletin I 411383 is had been disclosed in " with cooling fin similar to one embodiment of the existing radiator 9
Pole-shaped radiator " patent document among.
However, the radiating efficiency of the existing radiator 9 will be got well, the quantity of cooling fin 92 is just had to more than enough, is made
The thickness for obtaining integral heat dissipation means 9 is difficult to thinning, and weight is also difficult to mitigate, and can not be suitable for the electronics of most of lightening designs
In product.Meanwhile multiple thermal columns 911 of the existing radiator 9 are integrally connected with the pedestal 91 and are arranged in array shape,
Therefore the heat distribution situation regardless of heat source, each component of the existing radiator 9 all do not have adjustability；That is,
The existing radiator 9 corresponds to the position that temperature is not high in electronic product, is there is no essence help to heat dissipation in fact
Waste sets the cost of those components.
In view of this, existing radiator still has improvedd necessity really.
The content of the invention
To solve the above problems, the present invention provides a kind of radiator, the radiating efficiency of each thermal column, nothing can be substantially improved
Cooling fin must be set to can reach good heat dissipation effect.
The present invention provides a kind of radiator, can set thermal column according to heat source distribution situation.
The radiator of the present invention, to be installed in a fever object, which includes：One heat conduction base
Seat, the heat conducting base are equipped with multiple jacks, which contacts at the heat source of the fever object, defined at least at the heat source
One hot zone；And multiple thermal columns, the plurality of thermal column is arranged on the hot zone, and the plurality of thermal column is planted be positioned at respectively
In corresponding jack, the outer circumferential surface of each thermal column sets that there are one heat conduction silicones.
Therefore, radiator of the invention, by being set in the outer circumferential surface of each thermal column there are one heat conduction silicone, with significantly
The radiating efficiency of each thermal column is promoted, very good heat dissipation effect, therefore integral heat sink are can reach without cooling fin is set
The thickness of device will be able to thinning, and weight is also mitigated, and be applicable in the electronic product of lightening design.Additionally, originally
The radiator of invention utilizes dismountable thermal column, according to the distribution situation of heat source, just for the position for needing reinforcement heat dissipation
Thermal column is installed, can avoid setting thermal column on unnecessary position and increasing cost on foot, therefore integral heat sink dress can be reduced
The manufacture cost and weight put improve heat sinking benefit.
Wherein, set in each jack there are one engaging portion, at least one end of each thermal column is set there are one assembled portion, the plurality of to dissipate
Plume is inserted into corresponding jack by the assembled portion respectively and is bound to the engaging portion；The structure can promote the plurality of thermal column and insert
Put the stability for being positioned at the heat conducting base.
Wherein, the engaging portion of the jack is internal thread, which is the external screw thread arranged on the thermal column outer circumferential surface；The knot
The simple and easy to process shaping of structure, and each thermal column is made rapidly can to combine or separate with the heat conducting base, having reduces manufacture
Cost and promotion assembling convenience and other effects.
Wherein, which is a magnetic assembly in the jack, which is arranged on the thermal column end face
One by the structure of magnetic or can be reversed, each thermal column is made rapidly can to combine or separate with the heat conducting base,
Convenience and other effects is assembled with being promoted.
Wherein, which is completely coated on the outer circumferential surface of the thermal column and avoids the assembled portion, avoids the heat conduction
Layer of silica gel influences the linking steady character of the thermal column and the heat conducting base, and the heat conduction silicone is enable to play most the thermal column
Good heat dissipation effect.
Wherein, the both ends of each thermal column are respectively equipped with an assembled portion, make the thermal column and can be used as two heat conduction of concatenation
The component of pedestal has and promotes practicability and other effects.
Wherein, the depth of each jack is less than the half of the thermal column axial length, makes between the heat conducting base mutually concatenated
Air passage can be formed, to take away the thermal energy that thermal column absorbed by air-flow, there is improving heat radiation efficiency and other effects.
Wherein, which has opposite a first end face and a second end face and connects the first end
Face and a circumferential surface of the second end face, plurality of jack are arranged on the first end face, also have multiple jacks to be arranged on ring week
Face；The structure makes multiple heat conducting bases that can longitudinally concatenate or horizontal-extending concatenation, to adapt to the demand of different heat dissipation areas.
Wherein, the depth arranged on the jack of the circumferential surface is greater than or equal to the half of the thermal column axial length, makes arbitrary
The circumferential surface of two adjacent heat conducting bases can abut against, to be suitable in the limited fever object of assembling space.
Wherein, the heat conduction silicone of each thermal column has micro-structure, to increase the total heat dissipation area of the heat conduction silicone,
Reach further improving heat radiation efficiency and other effects.
Wherein, a graphene layer is additionally provided with outside the heat conduction silicone of each thermal column, is effectively increased respectively by the graphene layer
The radiating efficiency of thermal column is reduced the total quantity of thermal column, with the manufacture cost for reducing integral heat dissipation means and again
Amount and other effects.
Wherein, the graphene layer of each thermal column has micro-structure, to increase the total heat dissipation area of the graphene layer, reaches
Further improving heat radiation efficiency and other effects.
The beneficial effects of the invention are as follows：
In conclusion the radiator of the present invention, sets by the outer circumferential surface in each thermal column there are one heat conduction silicone, with significantly
The radiating efficiency of each thermal column is promoted, very good heat dissipation effect, therefore integral heat sink are can reach without cooling fin is set
The thickness of device will be able to thinning, and weight is also mitigated, and be applicable in the electronic product of lightening design.Additionally, originally
The radiator of invention has dismountable thermal column, and can strengthen heat dissipation just for needs according to heat source distribution situation
Position sets thermal column, can avoid setting thermal column on unnecessary position and increasing cost on foot, therefore can reduce integral heat sink
The manufacture cost and weight of device improve heat sinking benefit.
Description of the drawings
The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.
Fig. 1：A kind of dimensional decomposition structure diagram of existing radiator；
Fig. 2：The dimensional structure diagram of first embodiment of the invention；
Fig. 2 a：The overlooking the structure diagram of first embodiment of the invention；
Fig. 3：The broken section dimensional decomposition structure diagram of first embodiment of the invention；
Fig. 4：Cut open structure diagram in the side of first embodiment of the invention；
Fig. 5：The cross-sectional structure diagram of the thermal column of first embodiment of the invention；
Fig. 6：The thermal column of first embodiment of the invention is equipped with the cross-sectional structure diagram of micro-structure in heat conduction silicone；
Fig. 7：Cut open structure diagram in the side of second embodiment of the invention；
Fig. 8：The cross-sectional structure diagram of the thermal column of second embodiment of the invention；
Fig. 9：The thermal column of second embodiment of the invention is equipped with the cross-sectional structure diagram of micro-structure in graphene layer；
Figure 10：Dimensional decomposition structure diagram when third embodiment of the invention is concatenated with elongated thermal column；
Figure 11：Combination dimensional structure diagram when third embodiment of the invention is concatenated with elongated thermal column；
Figure 12：Dimensional decomposition structure diagram when third embodiment of the invention is concatenated with short thermal column；
Figure 13：Combination dimensional structure diagram when third embodiment of the invention is concatenated with short thermal column.
Reference sign
1 heat conducting base 1a first end faces
1b second end face 1c circumferential surfaces
11 jack, 111 engaging portion
2 thermal column, 21 assembled portion
22 heat conduction silicone, 221 micro-structure
3 thermal column, 31 assembled portion
32 heat conduction silicone, 33 graphene layer
331 micro-structures
4 thermal column, 41 assembled portion
42 heat conduction silicones
H hot zones
﹝ Xian You Ji Shu ﹞
9 radiator, 91 pedestal
911 thermal column, 92 cooling fin
921 perforates.
Specific embodiment
It is hereafter special according to the present invention for above and other objects, features and advantages of the invention is enable to be clearer and more comprehensible
Preferred embodiment, and attached drawing appended by cooperation, are described in detail below：
Fig. 2, the first embodiment of radiator of the present invention are refer to, which generally includes a heat conducting base 1
And multiple thermal columns 2, the plurality of plant of thermal column 2 are positioned at the heat conducting base 1.
Fig. 2,2a are refer to, the heat conducting base 1 is by the good material of thermal conductivity（Such as copper or carborundum etc.）It is made, to
One fever object of contact（Figure does not illustrate）Heat source, by the thermal energy at heat source quickly conduction to the plurality of thermal column 2；In addition
Ground, the heat conducting base 1 are contacted at the heat source of the fever object, and at least one hot zone H can be correspondingly formed at the heat source.
Fig. 2,3 are refer to, which is equipped with multiple jacks 11, and the cross-sectional shape of each jack 11 is unlimited, so as to
It is positioned as principle for the plant of single thermal column 2.The heat conducting base 1 has opposite a first end face 1a and a second end face
A 1b and circumferential surface 1c for connecting first end face 1a and second end face 1b；In the present embodiment, each jack 11 from this
First end face 1a extends towards second end face 1b, but is not through to second end face 1b and forms blind hole form.
Plant to promote the plurality of thermal column 2 and be positioned at the stability of the heat conducting base 1, can be set in each jack 11 there are one
Engaging portion 111, at least one end of each thermal column 2 are then set there are one assembled portion 21, and the plurality of thermal column 2 is respectively by the assembled portion 21
It is inserted into corresponding jack 11 and is bound to the engaging portion 111.Such as but without limitation, the engaging portion 111 of the jack 11 can be
Internal thread, the assembled portion 21 can then be provided at the external screw thread of 2 outer circumferential surface of thermal column；Or as shown in fig. 7, engaging portion
111 may be selected to be a magnetic assembly in the jack 11（Such as magnet）, which is then provided at the heat dissipation styletable
One of face can be by the structure of magnetic（Such as iron plate）Or it is reversed.In addition, the engaging portion 111 and the assembled portion
Combination can also be the arbitrary integrated structure such as close-fitting or fixing.
Fig. 3,4 are refer to, the outer circumferential surface of each thermal column 2 is set there are one heat conduction silicone 22, each thermal column 2 is substantially improved
Radiating efficiency, even if not setting cooling fin separately, can also reach good heat dissipation effect.Wherein, have after heat conductive silica gel is heated
Stickiness, therefore it is not used in the glutinous agent of outer circumferential surface coating of each thermal column 2, you can firm combine of the heat conduction silicone 22 is made to be dissipated at this
The outer circumferential surface of plume 2.Additionally, which is preferably completely coated on the outer circumferential surface of the thermal column 2 and avoids the group
Dress portion 21 avoids the heat conduction silicone 22 from influencing the linking steady character of the thermal column 2 and the heat conducting base 1, and makes the thermal conductive silicon
Glue-line 22 can play optimal heat dissipation effect to the thermal column 2；In other embodiments, which can also be such as glue
Wound on the outer circumferential surface of the thermal column as band.
It is noted that in the manufacturing process of LED, extra heat conductive silica gel can be considered as waste material, and the present invention can
It those heat conductive silica gels to be recycled, and is incorporated into the outer circumferential surface of each thermal column 2, each thermal column 2 can not only be substantially improved
Radiating efficiency, moreover it is possible to recycle waste material to meet environmentally friendly concept, and compared to multiple cooling fins 92 are separately set in the past, be dissipated multiple
Backing 92 is sleeved on multiple thermal columns 911 in a manner of improving heat radiation efficiency（It please coordinate with reference to Fig. 1）, thermal column 2 of the invention
Manufacture cost can relative reduction it is very much.
In addition, referring again to Fig. 2,2a, the present invention can be with prefabricated multiple identical heat conducting bases 1, and make each heat conduction base
Jack 11 is abound on seat 1, with this applicable different radiating requirements；As long as it that is, in use, to be installed according to when secondary
The heat source distribution situation of fever object select an appropriate number of thermal column 2, and the plurality of thermal column 2 is made to be inserted in the heat conduction base
It can be aligned to the hot zone H of the heat conducting base 1 after seat 1, and the quantity of the thermal column 2 can also be increased and decreased at any time or change it and inserted
Seated position has and promotes packaging efficiency and ease of use and other effects, and the simultaneous weight that can mitigate the heat conducting base 1.It alternatively, should
Heat conducting base 1 can also come customized according to the heat source distribution situation of the fever object to be installed, and accurate selection opens up jack 11
Position and quantity, make the plurality of thermal column 2 assemble after just can to being located at high fever, effectively to play good heat dissipation effect,
The cost of shaping jack 11 and the plurality of thermal column 2 will not be wasted again.
To sum up, radiator of the invention makes each thermal column 2 using the heat conducting base 1 being not integrally connected and thermal column 2
The heat conducting base 1 is removably incorporated into, to adapt to different radiating requirements, the plurality of 2 accurate contraposition of thermal column is being needed
Strengthen the position of heat dissipation, can avoid setting thermal column 2 on unnecessary position and increasing cost on foot, therefore integral heat sink can be reduced
The manufacture cost and weight of device improve heat sinking benefit.
Fig. 4,5 are refer to, the outer surface of the heat conduction silicone 22 of each thermal column 2 can be set to shiny surface form；Or such as
Shown in Fig. 6, handled in a manner of laser processing etc., the heat conduction silicone 22 is made to generate micro-structure 221, to increase the heat conduction silicone
The surface area of 22 outer surfaces so as to increase the total heat dissipation area of the heat conduction silicone 22, reaches further heat radiation effect
Rate and other effects.
Fig. 7 is refer to, is the second embodiment of radiator of the present invention, the second embodiment of the present invention is generally same as
Above-mentioned first embodiment, the main distinction are：A graphite is all additionally provided with outside each thermal column 3 of second embodiment of the invention
Alkene layer 33.
In detail, each thermal column 3 of the present embodiment can at least one end be set there are one assembled portion 31, to be led according to this at it
Corresponding jack 11 on heat conducting base 1 is inserted into hot zone on hot radical seat 1 by the assembled portion 31, and with the knot in the jack 11
Conjunction portion 111 combines.The outer circumferential surface of each thermal column 3 is again provided with a heat conduction silicone 32, and is also set outside the heat conduction silicone 32
There are one foregoing graphene layer 33, to be effectively increased the radiating efficiency of each thermal column 3 by the graphene layer 33；Therefore, this reality
The radiating efficiency identical with aforementioned first embodiment can be reached with lesser amount of thermal column 3 by applying the radiator of example, and by
The total quantity of thermal column 3 is reduced, reduces the manufacture cost and weight of integral heat dissipation means.Such as but without limitation, may be selected will
Graphene is coated on the outer surface of the heat conduction silicone 32 of each thermal column 3, to form the graphene layer 33.
Fig. 8 is refer to, the outer surface of each 3 outermost graphene layer 33 of thermal column can be set to shiny surface form；Or
As shown in figure 9, being handled in a manner of laser processing etc., the graphene layer 33 is made to generate micro-structure 331, to increase the graphene layer 33
The surface area of outer surface so as to increase the total heat dissipation area of the graphene layer 33, reaches further improving heat radiation efficiency etc.
Effect.
Figure 10 is refer to, is the 3rd embodiment of radiator of the present invention, the third embodiment of the present invention is generally same
In above-mentioned first embodiment, the main distinction is：Third embodiment of the invention can be respectively equipped at the both ends of thermal column 4
One assembled portion 41 makes the thermal column 4 is simultaneous can be as the component of two heat conducting bases 1 of concatenation.
In detail, the present embodiment may be selected each heat conducting base 1 being considered as a cell cube, make by multiple thermal columns 4
Longitudinal direction concatenation or horizontal-extending concatenation, to be combined into the radiator for meeting different heat dissipation area demands.That is, the present embodiment is led
Hot radical seat 1 is also equipped with multiple jacks in addition to being equipped with multiple jacks 11 in first end face 1a in the circumferential surface 1c of heat conducting base 1
11, it sets in each jack 11 there are one engaging portion 111, is combined for the assembled portion 41 of the either end of the thermal column 4.
Wherein, when the depth of each jack 11 is less than the half of 4 axial length of thermal column, if making two heat conducting bases
1 longitudinal direction concatenation, then can be opposite by the first end face 1a of two heat conducting bases 1, so that multiple thermal columns 4 are respectively by the group at both ends
Dress portion 41 is inserted into opposite jack 11 and is bound to the engaging portion 111, and two heat conduction bases are supported jointly by the plurality of thermal column 4
Seat 1 makes the first end face 1a of two heat conducting bases 1 longitudinally concatenated maintain separately to form an air passage, obtains air-flow
Between circulating in two heat conducting bases 1, to take away the thermal energy that the plurality of thermal column 4 is absorbed.
Figure 11 is refer to, it, can be by any two if making two or more 1 horizontal-extending concatenations of heat conducting base
The circumferential surface 1c of adjacent heat conducting base 1 is opposite, so that the assembled portion 41 at both ends is inserted into opposite insert by multiple thermal columns 4 respectively
Hole 11 is simultaneously bound to the engaging portion 111, and two or more heat conducting bases 1 are concatenated jointly by the plurality of thermal column 4, with
Form the radiator of a larger piece.Additionally, since the depth of each jack 11 is less than the one of 4 axial length of thermal column
Half, therefore can be separately with shape between the circumferential surface 1c of two or more heat conducting bases 1 of horizontal-extending concatenation
Into an air passage, air-flow is enable to circulate between the adjacent heat conducting base 1 of any two, to take away the plurality of thermal column 4
The thermal energy absorbed.Wherein, the first end face 1a of each heat conducting base 1 can be again according to when time warm of the fever object to be installed
Source distribution situation plants an appropriate number of thermal column 4 in appropriate place, makes each thermal column 4 that can align to the fever of the heat conducting base 1
Area H, to be directed to rapid cooling at the high fever of fever object；And the thermal column 4 of the first end face 1a of each heat conducting base 1 is plugged on,
Can assembled portion 41 only be equipped with equipped with assembled portion 41 or both ends in one end, the present invention is not any limitation as.
Figure 12,13 are refer to, when the depth of each jack 11 is greater than or equal to the half of 4 axial length of thermal column, level
When extension concatenates two or more heat conducting bases 1, to concatenate the thermal column 4 of the adjacent heat conducting base 1 of any two
It can submerge completely in two opposite jacks 11 so that the circumferential surface 1c of the adjacent heat conducting base 1 of any two can be abutted against, compared with
It is adapted for use in the limited fever object of assembling space.
Wherein, the outer circumferential surface of each thermal column 4 is all at least provided with a heat conduction silicone 42 in Figure 10-13, and the thermal conductive silicon
A graphene layer can be also additionally provided with outside glue-line 42（Figure does not illustrate）, therefore the thermal column 4 of third embodiment of the invention still has
Good radiating efficiency.
In conclusion the radiator of the present invention, sets by the outer circumferential surface in each thermal column there are one heat conduction silicone, with
The radiating efficiency of each thermal column is substantially improved, very good heat dissipation effect, therefore entirety are can reach without cooling fin is set
The thickness of radiator will be able to thinning, and weight is also mitigated, and be applicable in the electronic product of lightening design.In addition
Ground, radiator of the invention have dismountable thermal column, and can be scattered just for needing to strengthen according to heat source distribution situation
The position of heat sets thermal column, can avoid setting thermal column on unnecessary position and increasing cost on foot, therefore can reduce entirety
The manufacture cost and weight of radiator improve heat sinking benefit.
Content described above is only present pre-ferred embodiments, it is clear that described embodiment is only the one of the present invention
Section Example, instead of all the embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not doing
Go out all other embodiments obtained under the premise of creative work, belong to the scope of protection of the invention.
Claims (12)
1. a kind of radiator, to be installed in a fever object, which is characterized in that the radiator includes：
One heat conducting base, the heat conducting base are equipped with multiple jacks, which contacts at the heat source of the fever object, the heat
At least one hot zone is defined at source；And
Multiple thermal columns, the plurality of thermal column is arranged on the hot zone, and the plurality of thermal column is planted be positioned at corresponding insert respectively
Kong Zhong, the outer circumferential surface of each thermal column set that there are one heat conduction silicones.
2. radiator as described in claim 1, it is characterised in that：It is set in each jack there are one engaging portion, each thermal column
At least one end is set there are one assembled portion, and the plurality of thermal column is inserted into corresponding jack by the assembled portion respectively and is bound to the knot
Conjunction portion.
3. radiator as claimed in claim 2, it is characterised in that：The engaging portion of the jack is internal thread, which is
Arranged on the external screw thread of the thermal column outer circumferential surface.
4. radiator as claimed in claim 2, it is characterised in that：The engaging portion is a magnetic group in the jack
Part, the assembled portion are that by the structure of magnetic or can be reversed arranged on one of the thermal column end face.
5. radiator as claimed in claim 2, it is characterised in that：The heat conduction silicone is completely coated on the outer of the thermal column
Circumferential surface and avoid the assembled portion.
6. radiator as claimed in claim 2, it is characterised in that：The both ends of each thermal column are respectively equipped with an assembled portion.
7. radiator as claimed in claim 6, it is characterised in that：The depth of each jack is less than the thermal column axial length
Half.
8. radiator as claimed in claim 6, it is characterised in that：The heat conducting base have an opposite first end face and
One second end face and connect the first end face and a circumferential surface of the second end face, plurality of jack be arranged on this
End face also has multiple jacks to be arranged on the circumferential surface.
9. radiator as claimed in claim 8, it is characterised in that：Depth arranged on the jack of the circumferential surface is greater than or equal to
The half of the thermal column axial length.
10. radiator as claimed in any one of claims 1-9 wherein, it is characterised in that：The heat conduction silicone tool of each thermal column
There is micro-structure.
11. radiator as claimed in any one of claims 1-9 wherein, it is characterised in that：Outside the heat conduction silicone of each thermal column
It is additionally provided with a graphene layer.
12. radiator as claimed in claim 11, it is characterised in that：The graphene layer of each thermal column has micro-structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611075227.8A CN108124406A (en) | 2016-11-29 | 2016-11-29 | Radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611075227.8A CN108124406A (en) | 2016-11-29 | 2016-11-29 | Radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN108124406A true CN108124406A (en) | 2018-06-05 |
Family
ID=62225875
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611075227.8A Pending CN108124406A (en) | 2016-11-29 | 2016-11-29 | Radiator |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109246982A (en) * | 2018-09-05 | 2019-01-18 | 广东德瑞源新材料科技有限公司 | Automobile-used graphene radiator and electrical equipment |
| CN112303073A (en) * | 2020-10-20 | 2021-02-02 | 深圳市诺丰电子科技有限公司 | Heat conduction silica gel sheet that suitability is strong |
| CN112543580A (en) * | 2020-11-17 | 2021-03-23 | 河北北方学院 | Production process of high-thermal-conductivity graphene-metal copper composite layer radiator |
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| CN2750631Y (en) * | 2004-11-22 | 2006-01-04 | 陈莉珍 | Radiator |
| CN101539282A (en) * | 2008-03-19 | 2009-09-23 | 富准精密工业(深圳)有限公司 | Light-emitting diode module |
| CN102620268A (en) * | 2012-03-14 | 2012-08-01 | 重庆邮电大学 | Non-uniformly distributed semiconductor illumination radiator |
| CN103702541A (en) * | 2012-09-28 | 2014-04-02 | 鸿富锦精密工业（深圳）有限公司 | Electronic device and radiator thereof |
| CN103929925A (en) * | 2013-01-16 | 2014-07-16 | 欧司朗有限公司 | Radiation device, electronic device comprising same and lighting device comprising same |
| CN203691842U (en) * | 2013-12-19 | 2014-07-02 | 深圳市超频三科技有限公司 | Heat radiation assembly |
| CN104100952A (en) * | 2014-08-07 | 2014-10-15 | 东莞市闻誉实业有限公司 | Interconnected radiating device and light-emitting diode (LED) lamp using same |
| CN204345584U (en) * | 2015-01-04 | 2015-05-20 | 安徽华夏显示技术股份有限公司 | A kind of LED light source heat abstractor |
| CN105161472A (en) * | 2015-08-05 | 2015-12-16 | 沈阳理工大学 | Pin-column type mini-size radiator having end face with phyllotaxy structure |
| CN204929523U (en) * | 2015-09-02 | 2015-12-30 | 深圳市领德辉科技有限公司 | Aluminium base board with novel heat radiation structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109246982A (en) * | 2018-09-05 | 2019-01-18 | 广东德瑞源新材料科技有限公司 | Automobile-used graphene radiator and electrical equipment |
| CN112303073A (en) * | 2020-10-20 | 2021-02-02 | 深圳市诺丰电子科技有限公司 | Heat conduction silica gel sheet that suitability is strong |
| CN112543580A (en) * | 2020-11-17 | 2021-03-23 | 河北北方学院 | Production process of high-thermal-conductivity graphene-metal copper composite layer radiator |
| CN112543580B (en) * | 2020-11-17 | 2022-04-15 | 河北北方学院 | Production process of high-thermal-conductivity graphene-metal copper composite layer radiator |
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Application publication date: 20180605 |